A Molecular Dynamics Method to Identify the Liquidus and Solidus in a Binary Phase Diagram
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Low Temperature Soldering Using Sn-Bi Alloys
LOW TEMPERATURE SOLDERING USING SN-BI ALLOYS Morgana Ribas, Ph.D., Anil Kumar, Divya Kosuri, Raghu R. Rangaraju, Pritha Choudhury, Ph.D., Suresh Telu, Ph.D., Siuli Sarkar, Ph.D. Alpha Assembly Solutions, Alpha Assembly Solutions India R&D Centre Bangalore, KA, India [email protected] ABSTRACT package substrate and PCB [2-4]. This represents a severe Low temperature solder alloys are preferred for the limitation on using the latest generation of ultra-thin assembly of temperature-sensitive components and microprocessors. Use of low temperature solders can substrates. The alloys in this category are required to reflow significantly reduce such warpage, but available Sn-Bi between 170 and 200oC soldering temperatures. Lower solders do not match Sn-Ag-Cu drop shock performance [5- soldering temperatures result in lower thermal stresses and 6]. Besides these pressing technical requirements, finding a defects, such as warping during assembly, and permit use of low temperature solder alloy that can replace alloys such as lower cost substrates. Sn-Bi alloys have lower melting Sn-3Ag-0.5Cu solder can result in considerable hard dollar temperatures, but some of its performance drawbacks can be savings from reduced energy cost and noteworthy reduction seen as deterrent for its use in electronics devices. Here we in carbon emissions [7]. show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics In previous works [8-11] we have showed how the use of industry specific needs. The physical properties and drop micro-additives in eutectic Sn-Bi alloys results in significant shock performance of various alloys are evaluated, and their improvement of its thermo-mechanical properties. -
The Basics of Soldering
TECH SOLUTION: SOLDER The Basics of Soldering SUmmARY BY Chris Nash, INDIUM CORPORATION IN In this article, I will present a basic overview of soldering for those Soldering uses a filler metal and, in who are new to the world of most cases, an appropriate flux. The soldering and for those who could filler metals are typically alloys (al- though there are some pure metal sol- use a refresher. I will discuss the ders) that have liquidus temperatures below 350°C. Elemental metals com- definition of soldering, the basics monly alloyed in the filler metals or of metallurgy, how to choose the solders are tin, lead, antimony, bis- muth, indium, gold, silver, cadmium, proper alloy, the purpose of a zinc, and copper. By far, the most flux, soldering temperatures, and common solders are based on tin. Fluxes often contain rosin, acids (or- typical heating sources for soldering ganic or mineral), and/or halides, de- operations. pending on the desired flux strength. These ingredients reduce the oxides on the solder and mating pieces. hroughout history, as society has evolved, so has the need for bond- Basic Solder Metallurgy ing metals to metals. Whether the As heat is gradually applied to sol- need for bonding metals is mechani- der, the temperature rises until the Tcal, electrical, or thermal, it can be accom- alloy’s solidus point is reached. The plished by using solder. solidus point is the highest temper- ature at which an alloy is completely Metallurgical Bonding Processes solid. At temperatures just above Attachment of one metal to another can solidus, the solder is a mixture of be accomplished in three ways: welding, liquid and solid phases (analogous brazing, and soldering. -
Niobium Doped BGO Glasses: Physical, Thermal and Optical Properties
IOSR Journal of Applied Physics (IOSR-JAP) e-ISSN: 2278-4861. Volume 3, Issue 5 (Mar. - Apr. 2013), PP 80-87 www.iosrjournals.org Niobium doped BGO glasses: Physical, Thermal and Optical Properties Khair-u-Nisa1, Ejaz Ahmed2, M. Ashraf Chaudhry3 1,2,3Department of Physics, Bahauddin Zakariya University, Multan (60800), Pakistan. Abstract: IR- transparent niobium substituted heavy metal oxide glass system in formula composition (100-x) BGO75- xNb2O5; 5 ≤ x ≤ 25 was fabricated by quenching and press molding technique. Glassy state was confirmed by XRD. Density ρexp varied 6.381 g/cc-7.028 g/cc ±0.06%. Modifying behavior of Nb2O5 was corroborated by rate of increase in theoretical volume Vth, measured volume Vexp and oxygen molar volume -2 5+ 4+ VMO . Nb had larger cation radius and greater polarizing strength as compared to Ge ions. It replaced 4+ o Ge sites introducing more NBOs in the network. Transformation temperatures Tg, Tx and Tp1 were 456 -469 C ±2 oC, 516 -537 oC ±2 oC and 589 -624 oC ±2 oC respectively. In the range from room temperature to 400 oC -6 -1 -6 -1 the coefficient of linear thermal expansion α was 5.431±0.001*10 K to 7.333±0.001*10 K . ΔT = Tx-Tg and ΔTP1 = TP1-Tg varied collinearly with increase in niobium concentration and revealed thermal stability against devitrification. The direct bandgap Eg values lay in 3.24 -2.63 eV ±0.01 eV range and decreased due to impurity states of Nb5+ within the forbidden band. Mobility edges obeyed Urbach law verifying amorphousness of the compositions. -
Robust High-Temperature Heat Exchangers (Topic 2A Gen 3 CSP Project; DE-EE0008369)
Robust High-Temperature Heat Exchangers (Topic 2A Gen 3 CSP Project; DE-EE0008369) Illustrations of: (left) porous WC preform plates, (middle) dense-wall ZrC/W plates with horizontal channels and vertical vias. (Right) Backscattered electron image of the dense microstructure of a ZrC/W cermet. Team: Ken H. Sandhage1 (PI), Kevin P. Trumble1 (Co-PI), Asegun Henry2 (Co-PI), Aaron Wildberger3 (Co-PI) 1School of Materials Engineering, Purdue University, W. Lafayette, IN 2Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 3Vacuum Process Engineering, Inc., Sacramento, CA Concentrated Solar Power Tower “Concentrating Solar Power Gen3 Demonstration Roadmap,” M. Mehos, C. Turchi, J. Vidal, M. Wagner, Z. Ma, C. Ho, W. Kolb, C. Andraka, A. Kruizenga, Technical Report NREL/TP-5500-67464, National Renewable Energy Laboratory, 2017 Concentrated Solar Power Tower Heat Exchanger “Concentrating Solar Power Gen3 Demonstration Roadmap,” M. Mehos, C. Turchi, J. Vidal, M. Wagner, Z. Ma, C. Ho, W. Kolb, C. Andraka, A. Kruizenga, Technical Report NREL/TP-5500-67464, National Renewable Energy Laboratory, 2017 State of the Art: Metal Alloy Printed Circuit HEXs Current Technology: • Printed Circuit HEXs: patterned etching of metallic alloy plates, then diffusion bonding • Metal alloy mechanical properties degrade significantly above 600oC D. Southall, S.J. Dewson, Proc. ICAPP '10, San Diego, CA, 2010; R. Le Pierres, et al., Proc. SCO2 Power Cycle Symposium 2011, Boulder, CO, 2011; D. Southall, et al., Proc. ICAPP '08, Anaheim, -
MICROALLOYED Sn-Cu Pb-FREE SOLDER for HIGH TEMPERATURE APPLICATIONS
As originally published in the SMTA Proceedings. MICROALLOYED Sn-Cu Pb-FREE SOLDER FOR HIGH TEMPERATURE APPLICATIONS Keith Howell1, Keith Sweatman1, Motonori Miyaoka1, Takatoshi Nishimura1, Xuan Quy Tran2, Stuart McDonald2, and Kazuhiro Nogita2 1 Nihon Superior Co., Ltd., Osaka, Japan 2 The University of Queensland, Brisbane, Australia [email protected] require any of the materials or substances listed in Annex II (of the Directive) ABSTRACT • is scientifically or technical impracticable While the search continues for replacements for the • the reliability of the substitutes is not ensured highmelting-point, high-Pb solders on which the • the total negative environmental, health and electronics industry has depended for joints that maintain consumer safety impacts caused by substitution are their integrity at high operating temperatures, an likely to outweigh the total environmental, health investigation has been made into the feasibility of using a and safety benefits thereof.” hypereutectic Sn-7Cu in this application. While its solidus temperature remains at 227°C the microstructure, which A recast of the Directive issued in June 2011 includes the has been substantially modified by stabilization and grain statement that for such exemptions “the maximum validity refining of the primary Cu6Sn5 by microalloying additions period which may be renewed shall… be 5 years from 21 July of Ni and Al, makes it possible for this alloy to maintain its 2011”. The inference from this statement is that there is an integrity and adequate strength even after long term expectation that alternatives to the use of solders with a lead exposure to temperatures up to 150°C. In this paper the content of 85% or more will be found before 21st July 2016. -
Characterization of Solidus-Liquidus Range and Semi-Solid Processing of Advanced Steels and Aluminum Alloy
Characterization of solidus-liquidus range and semi-solid processing of advanced steels and aluminum alloy Łukasz Rogal Institute of Metallurgy and Materials Science of the Polish Academy of Sciences, 25 Reymonta St., 30-059 Krakow, Poland e-mail: [email protected] 1. Introduction Semi-Solid Metal processing (SSM) of steel is a method of producing near-net shape products [1]. This technology utilizes the thixotropic flow of metal suspension [2]. Metal alloys are suitable for thixoforming if they have globular microstructure in a wide solidus-liquidus range [3]. The thixo-route is a two-step process, which involves the preparation of a feedstock material of thixotropic characteristics and reheating the feedstock material to semisolid temperature to produce the SSM slurry, subsequently used for component shaping [4]. The goal of the applied thixoforming technology is to improve the properties of elements manufactured in one-step operation, ensuring their high structure integrity, superior to casting and similar to that of wrought parts. Nowadays, rheoforming and thixoforming of Al-based and Mg-based alloys are commonly applied in the industry [3-6]. In the case of high melting alloys, such as steels, this technology is in the implementation stage [4]. Several kinds of steels e.g. 100C6, X210CrW12, M2, C38, C45, 304 stainless steels have been investigated for the application for SSM processing [4-9, 11-13]. A globular microstructure is mainly obtained by Strain Induced and Melting Activation (SIMA), Recrystallization and Partial Melting (RAP) and the modification of chemical composition by grain refiners methods [4, 10-12]. 2. Thixoforming procedure The thixo-casts were produced using a specially build prototype device. -
Lecture 4 (Pdf)
GFD 2006 Lecture 4: Interfacial instability in two-component melts Grae Worster; notes by Shane Keating and Takahide Okabe March 15, 2007 So far, we have looked at some of the fundamentals associated with solidification of pure melts. When we try to solidify a solution of two or more components, salt and water, for example, the character of the solidification changes considerably. In particular, the presence of salt can depress the temperature at which ice and salt water can coexist in thermal equilibrium. This has an important consequence for the growth of sea ice: unless there is some other mechanism for the transport of the salt field, such as convection, the growth of the ice is limited by the rate at which excess salt can diffuse away from the interface. Finally, we will discuss the morphological instability in two-component melts. We shall see that the solute field is destabilizing and can give rise to morphological instability even when the liquid phase is not initially supercooled. 1 Two-component melts 1.1 A simple demonstration We shall begin with a simple demonstration. Crushed ice at 0◦C is placed in a cup with a thermometer. We add a handful of salt at room temperature and stir briskly. The ice begins to melt, but what happens to the temperature? We notice that there is some melt water in the cup, which helps bring the ice and salt into contact, and see a fairly rapid decrease in the temperature measured by the thermometer: after a few minutes, it reads almost 10 C. -
Fluidized Bed Chemical Vapor Deposition of Zirconium Nitride Films
INL/JOU-17-42260-Revision-0 Fluidized Bed Chemical Vapor Deposition of Zirconium Nitride Films Dennis D. Keiser, Jr, Delia Perez-Nunez, Sean M. McDeavitt, Marie Y. Arrieta July 2017 The INL is a U.S. Department of Energy National Laboratory operated by Battelle Energy Alliance INL/JOU-17-42260-Revision-0 Fluidized Bed Chemical Vapor Deposition of Zirconium Nitride Films Dennis D. Keiser, Jr, Delia Perez-Nunez, Sean M. McDeavitt, Marie Y. Arrieta July 2017 Idaho National Laboratory Idaho Falls, Idaho 83415 http://www.inl.gov Prepared for the U.S. Department of Energy Under DOE Idaho Operations Office Contract DE-AC07-05ID14517 Fluidized Bed Chemical Vapor Deposition of Zirconium Nitride Films a b c c Marie Y. Arrieta, Dennis D. Keiser Jr., Delia Perez-Nunez, * and Sean M. McDeavitt a Sandia National Laboratories, Albuquerque, New Mexico 87185 b Idaho National Laboratory, Idaho Falls, Idaho 83401 c Texas A&M University, Department of Nuclear Engineering, College Station, Texas 77840 Received November 11, 2016 Accepted for Publication May 23, 2017 Abstract — – A fluidized bed chemical vapor deposition (FB-CVD) process was designed and established in a two-part experiment to produce zirconium nitride barrier coatings on uranium-molybdenum particles for a reduced enrichment dispersion fuel concept. A hot-wall, inverted fluidized bed reaction vessel was developed for this process, and coatings were produced from thermal decomposition of the metallo-organic precursor tetrakis(dimethylamino)zirconium (TDMAZ) in high- purity argon gas. Experiments were executed at atmospheric pressure and low substrate temperatures (i.e., 500 to 550 K). Deposited coatings were characterized using scanning electron microscopy, energy dispersive spectroscopy, and wavelength dis-persive spectroscopy. -
Phase Diagrams
Module-07 Phase Diagrams Contents 1) Equilibrium phase diagrams, Particle strengthening by precipitation and precipitation reactions 2) Kinetics of nucleation and growth 3) The iron-carbon system, phase transformations 4) Transformation rate effects and TTT diagrams, Microstructure and property changes in iron- carbon system Mixtures – Solutions – Phases Almost all materials have more than one phase in them. Thus engineering materials attain their special properties. Macroscopic basic unit of a material is called component. It refers to a independent chemical species. The components of a system may be elements, ions or compounds. A phase can be defined as a homogeneous portion of a system that has uniform physical and chemical characteristics i.e. it is a physically distinct from other phases, chemically homogeneous and mechanically separable portion of a system. A component can exist in many phases. E.g.: Water exists as ice, liquid water, and water vapor. Carbon exists as graphite and diamond. Mixtures – Solutions – Phases (contd…) When two phases are present in a system, it is not necessary that there be a difference in both physical and chemical properties; a disparity in one or the other set of properties is sufficient. A solution (liquid or solid) is phase with more than one component; a mixture is a material with more than one phase. Solute (minor component of two in a solution) does not change the structural pattern of the solvent, and the composition of any solution can be varied. In mixtures, there are different phases, each with its own atomic arrangement. It is possible to have a mixture of two different solutions! Gibbs phase rule In a system under a set of conditions, number of phases (P) exist can be related to the number of components (C) and degrees of freedom (F) by Gibbs phase rule. -
Technical Glasses
Technical Glasses Physical and Technical Properties 2 SCHOTT is an international technology group with 130 years of ex perience in the areas of specialty glasses and materials and advanced technologies. With our highquality products and intelligent solutions, we contribute to our customers’ success and make SCHOTT part of everyone’s life. For 130 years, SCHOTT has been shaping the future of glass technol ogy. The Otto Schott Research Center in Mainz is one of the world’s leading glass research institutions. With our development center in Duryea, Pennsylvania (USA), and technical support centers in Asia, North America and Europe, we are present in close proximity to our customers around the globe. 3 Foreword Apart from its application in optics, glass as a technical ma SCHOTT Technical Glasses offers pertinent information in terial has exerted a formative influence on the development concise form. It contains general information for the deter of important technological fields such as chemistry, pharma mination and evaluation of important glass properties and ceutics, automotive, optics, optoelectronics and information also informs about specific chemical and physical character technology. Traditional areas of technical application for istics and possible applications of the commercial technical glass, such as laboratory apparatuses, flat panel displays and glasses produced by SCHOTT. With this brochure, we hope light sources with their various requirements on chemical to assist scientists, engineers, and designers in making the physical properties, have led to the development of a great appropriate choice and make optimum use of SCHOTT variety of special glass types. Through new fields of appli products. cation, particularly in optoelectronics, this variety of glass types and their modes of application have been continually Users should keep in mind that the curves or sets of curves enhanced, and new forming processes have been devel shown in the diagrams are not based on precision measure oped. -
Section 1 Introduction to Alloy Phase Diagrams
Copyright © 1992 ASM International® ASM Handbook, Volume 3: Alloy Phase Diagrams All rights reserved. Hugh Baker, editor, p 1.1-1.29 www.asminternational.org Section 1 Introduction to Alloy Phase Diagrams Hugh Baker, Editor ALLOY PHASE DIAGRAMS are useful to exhaust system). Phase diagrams also are con- terms "phase" and "phase field" is seldom made, metallurgists, materials engineers, and materials sulted when attacking service problems such as and all materials having the same phase name are scientists in four major areas: (1) development of pitting and intergranular corrosion, hydrogen referred to as the same phase. new alloys for specific applications, (2) fabrica- damage, and hot corrosion. Equilibrium. There are three types of equili- tion of these alloys into useful configurations, (3) In a majority of the more widely used commer- bria: stable, metastable, and unstable. These three design and control of heat treatment procedures cial alloys, the allowable composition range en- conditions are illustrated in a mechanical sense in for specific alloys that will produce the required compasses only a small portion of the relevant Fig. l. Stable equilibrium exists when the object mechanical, physical, and chemical properties, phase diagram. The nonequilibrium conditions is in its lowest energy condition; metastable equi- and (4) solving problems that arise with specific that are usually encountered inpractice, however, librium exists when additional energy must be alloys in their performance in commercial appli- necessitate the knowledge of a much greater por- introduced before the object can reach true stabil- cations, thus improving product predictability. In tion of the diagram. Therefore, a thorough under- ity; unstable equilibrium exists when no addi- all these areas, the use of phase diagrams allows standing of alloy phase diagrams in general and tional energy is needed before reaching meta- research, development, and production to be done their practical use will prove to be of great help stability or stability. -
The Correlation Between Reduced Glass Transition Temperature and Glass Forming Ability of Bulk Metallic Glasses Z.P
http://www.paper.edu.cn Scripta mater. 42 (2000) 667–673 www.elsevier.com/locate/scriptamat THE CORRELATION BETWEEN REDUCED GLASS TRANSITION TEMPERATURE AND GLASS FORMING ABILITY OF BULK METALLIC GLASSES Z.P. Lu, H. Tan, Y. Li* and S.C. Ngϩ Department of Materials Science, National University of Singapore, Singapore 119260, People’s Republic of China ϩDepartment of Physics, National University of Singapore, Singapore 119260, People’s Republic of China (Received October 4, 1999) (Accepted November 9, 1999) Keywords: Differential thermal analysis (DTA); Metallic glasses; Melt-spinning; Glass forming ability (GFA) 1. Introduction Based on theoretical work on crystal nucleation in undercooled liquid metals, Turnbull [1] proposed that the glass-forming tendency should increase with the reduced glass transition temperature, Trg, which was defined by Tg/Tl. Here, Tg is the glass transition temperature and Tl is the liquidus temperature. Later work of Uhlmann, Davies and others on the crystal nucleation further identified this dimension- less parameter as a crucial figure of merit in determining glass forming ability (GFA) [2–4]. There are many reported values of Trg in the literature [5], but unfortunately most of them were calculated using Tg/Tm (Tm: onset melting point) with minimal report of Tg/Tl [6,7]. Tg/Tm and Tg/Tl were used for evaluation of Trg interchangeably by most of researchers. Also many used crystallization temperature Tx instead of Tg, since for most of the metallic glass, these two were regarded as the same [3]. In this study, onset temperature (solidus), Tm and offset temperature (liquidus) Tl of melting of a series of bulk glass forming alloys based on Zr, La, Mg, Pd and rare-earth elements were measured by studying systematically the melting behaviour of these alloys using DTA or DSC.