How to Solder – Beginners Guide
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Treatise on Combined Metalworking Techniques: Forged Elements and Chased Raised Shapes Bonnie Gallagher
Rochester Institute of Technology RIT Scholar Works Theses Thesis/Dissertation Collections 1972 Treatise on combined metalworking techniques: forged elements and chased raised shapes Bonnie Gallagher Follow this and additional works at: http://scholarworks.rit.edu/theses Recommended Citation Gallagher, Bonnie, "Treatise on combined metalworking techniques: forged elements and chased raised shapes" (1972). Thesis. Rochester Institute of Technology. Accessed from This Thesis is brought to you for free and open access by the Thesis/Dissertation Collections at RIT Scholar Works. It has been accepted for inclusion in Theses by an authorized administrator of RIT Scholar Works. For more information, please contact [email protected]. TREATISE ON COMBINED METALWORKING TECHNIQUES i FORGED ELEMENTS AND CHASED RAISED SHAPES TREATISE ON. COMBINED METALWORKING TECHNIQUES t FORGED ELEMENTS AND CHASED RAISED SHAPES BONNIE JEANNE GALLAGHER CANDIDATE FOR THE MASTER OF FINE ARTS IN THE COLLEGE OF FINE AND APPLIED ARTS OF THE ROCHESTER INSTITUTE OF TECHNOLOGY AUGUST ( 1972 ADVISOR: HANS CHRISTENSEN t " ^ <bV DEDICATION FORM MUST GIVE FORTH THE SPIRIT FORM IS THE MANNER IN WHICH THE SPIRIT IS EXPRESSED ELIEL SAARINAN IN MEMORY OF MY FATHER, WHO LONGED FOR HIS CHILDREN TO HAVE THE OPPORTUNITY TO HAVE THE EDUCATION HE NEVER HAD THE FORTUNE TO OBTAIN. vi PREFACE Although the processes of raising, forging, and chasing of metal have been covered in most technical books, to date there is no major source which deals with the functional and aesthetic requirements -
Sn95/Sb5 – Organic Acid 3% Core
Technical Data Sheet Sn95/Sb5 – Organic Acid 3% Core NOMINAL COMPOSITION Tin 94% Min Lead 0.1% Max Arsenic 0.01% Max Antimony 4.5% 5.5 Cadmium 0.005% Max Iron 0.04% Max Copper 0.08% Max Aluminum 0.005% Max Zinc 0.005% Max Silver 0.015% Max Bismuth 0.15% Max Flux – 3% Organic Acid Core by weight PHYSICAL PROPERTIES Solder Alloy Color White Melting Point (Solidus) 450°F (233°C) Flow Point (Liquidus) 464°F (240°C) Specific Gravity 7.26 Density (Lbs/in3) 0.263 Bulk Room Temperature Tensile Strength (PSI) 5,900 Flux Type Water Soluble Organic Acid Physical State Solid Melting Point 250°F (120°C) Chloride Content 4% SOLDERING CHARACTERISTICS Sn95/Sb5 is a general-purpose solder used in applications involving soldering of copper and copper alloys and/or ferrous base alloys where use of lead containing solder is not permitted. This soft solder may be used in applications involving higher service temperatures. Typical applications for this alloy include copper components in air conditioning industry. This alloy is also recommended in applications involving food handling or drinking water components where use of lead containing alloys is not permitted. Antimony bearing alloys are not recommended in soldering of brass parts due to formation of a brittle Sb-Zn inter-metallic. This flux-cored solder can be used on difficult to solder materials where rosin based fluxes and electronic grade organic fluxes are not strong enough. It has been used effectively in many non-electronic applications such as lamps, fuses, and jewelry. The flux is active on copper, brass, bronze, steel, nickel, and stainless steel. -
Weller Pyropen GB 08 04
Weller Pyropens provide temperature variable soldering without the need for an electrical supply. Pyropens are lightweight and user friendly. A choice from 5 versions with a wide range of tips and nozzles makes them an ideal tool for maintenance and field service jobs in out of the way places. Convenient push Hot blow function, Powered by Butane gas, Pyropens offer solde- button piezo heat shrinking and ignition.* reflow soldering ring iron, hot gas blow and blowtorch and desoldering, options. They have a short heat up time and max. temperature are refuelled in seconds from a refill cylinder. 650°C A sight glass shows the level of gas in the *only Pyropen Piezo reservoir. Soldering iron Blow torch func- Heat is generated by gas passing over a cata- function, max. tion, max. tempe- temperature rature 1300°C lyst in the soldering tip or the hot air nozzle. 500°C Temperature variation is obtained by increa- sing respectively decreasing the gas flow. Pyropen WP 60 Kit An ergonomic Butane gas operated soldering iron with solder, hot blow and blow torch functions. Offers maxi- mum flexibility for use in many applications. It is tempera- ture variable within the range of 500°C to 1300°C depen- dant upon the function used. Refilling takes only a few seconds and it operates approx. 1 hour with one filling. An integral sight glass shows the level of the gas in the tank. Ignition of the gas requires an external source and the long life tips deliver rapid heat up. The hot blow nozzle supplies inert hot gas to prevent oxi- dation of non contact solder joints and is therefore suita- ble for use in solder paste applications, heat shrink and on vinyl chloride boards. -
Low Melting Temperature Sn-Bi Solder
metals Review Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics Hyejun Kang, Sri Harini Rajendran and Jae Pil Jung * Department of Materials Science and Engineering, University of Seoul, 163, Seoulsiripdae-ro, Dongdaemun-gu, Seoul 02504, Korea; [email protected] (H.K.); [email protected] (S.H.R.) * Correspondence: [email protected] Abstract: Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutectic Sn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed. Keywords: low-temperature solder; Sn-58wt%Bi; melting temperature; microstructure; mechani- Citation: Kang, H.; Rajendran, S.H.; cal property Jung, J.P. Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical 1. Introduction Characteristics. Metals 2021, 11, 364. -
Major Causes of Solder Cracks Applications and Boards That Specially Require Solder Crack Countermeasures Comparison of 2 Soluti
Solder Crack Countermeasures in MLCCs Outline This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Fig. 1: Appearance of a solder crack Ceramic Chip Capacitors). (cross-section) Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile. TDK offers following MLCC products as solder crack countermeasures. 1) Metal terminals “disperse” thermal shock : 2) Equipped with resin layers that absorb stress applied on solder MEGACAP joints and resistant to dropping: Soft termination Comparison of 2 solutions: Summary of “Solder Crack Countermeasures in MLCCs” Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions Fig. 2: Major causes of solder cracks and their impact after going on the market and during manufacturing processes such as soldering. The following causes can be listed as the major cause of solder cracks. (1) Thermal shock (heat shock), heat fatigue caused by temperature cycle Solder cracks occur when heat stress is applied to a solder joint due to the difference in the thermal coefficients of the MLCC and PCB, in an environment in which changes between high temperatures and low temperatures are repeated. In addition, it can also occur when temperature control is insufficient during the process of soldering. (2) Lead-free solder Lead-free solder, which started to be used due to environmental considerations, has properties of being rigid and fragile, and has a higher risk of solder cracks compared to conventional eutectic solder; therefore, caution is required when using it. -
Galvalume Facts
GALVALUME FACTS Soldering Although GALVALUME® steel sheet can be soldered, the presence of a thin film of aluminum oxide on the surface makes soldering more difficult than when soldering galvanized products. When soldering is necessary, the techniques and fluxes used to solder aluminum should be used. Welding GALVALUME® steel sheet can be welded by conventional resistance and arc welding processes. The safety precautions are similar to those for hot-dip galvanized sheet. Because the surface contact resistance is low when compared with uncoated sheet, resistance welding of GALVALUME® steel sheet requires welding currents, welding times and electrode forces higher than those required for similar thicknesses of uncoated cold rolled steel. These welding parameters are similar to those normally used on galvanized steel. However, experience has shown that even more frequent electrode dressing is required, as compared with galvanized sheet, to achieve good welds. There is less fuming when welding GALVALUME® steel sheet than when welding galvanized sheet. The coating contains less zinc than a comparably thick galvanized coating. Nevertheless, adequate ventilation is required to remove the zinc oxide fumes. Fastening From a mechanical standpoint, any style of fastener suitable for use with sheet metal can be used to join GALVALUME® steel sheet to itself or to other parts, provided the fastener design is appropriate for the structural requirement of the application. The list of acceptable devices includes common fasteners like nuts and bolts, screws and rivets of all types, and special types like clamp fasteners, clips and blind screws. Corrosion characteristics of the fastener material should be carefully considered from two standpoints. -
Procedure 4.0—Hot Work Program (Hwp)
Hamilton College Occupational Health and Safety Procedures PROCEDURE 4.0—HOT WORK PROGRAM (HWP) 4.1 INTRODUCTION Purpose Regulations promulgated by the Occupational Safety and Health Administration (OSHA—29 CFR 1910.252— Welding, Cutting and Brazing) and the NYS Fire Code (Code Chapter 26—Hot Work) require facilities to develop procedures to protect both human health and welfare, and the facility itself, from the hazards posed by hot work in the workplace. This program is intended to provide the Hamilton College community with the guidance necessary to comply with these regulations. Scope Hamilton College is committed to providing a safe and healthful work environment for its students, employees and the greater college community. The following Hot Work Program (HWP) has been developed to eliminate or minimize risks to personnel, students, and campus facilities. While the greatest hot work risks arise from spark/slag producing activity (welding, cutting, brazing), other forms of hot work (pipe soldering, pipe thawing, etc.) may also present risks in the form of radiant heat and/or open flame. As such, certain elements of this program will pertain to all types of hot work activity, and others will only address the more dangerous activities that produce sparks. This HWP includes: • Identification of Responsibilities • Prohibited Hot Work Areas/Activities • Welding/Cutting/Brazing Authorization Process • Hot Work Permits • Special Considerations for Soldering/Other Hot Work Activities • Fire Watch • Contractors Applicability The Director of Environmental Protection, Safety & Sustainability (EPS&S) will maintain and update the College’s written Hot Work Program, and will work primarily with other relevant parties (the Physical Plant and certain academic departments) for training and compliance purposes. -
Soldering to Gold Films
Soldering to Gold Films THE IMPORTANCE OF LEAD-INDIUM ALLOYS Frederick G. Yost Sandia Laboratories, Albuquerque, New Mexico, U.S.A. Reliable solder joints can be made on gold metallised microcircuits using lead-indium solders providing certain important conditions are understood and carefully controlled. This paper reviews the three fundamental concepts of scavenging, wetting, and ageing, which are relevant when soldering to gold films. Alloys containing indium have been used for solder- sition and a body centred tetragonal space lattice. ing electronic components to thin gold films and wires Although considerable work has been addressed for at least 14 years. Braun (1, 2) investigated the to the question of clustering and phase separation potential of several multicomponent alloys based in the a field below 20°C (7, 8, 9) the practical signifi- upon the lead-tin-indium ternary alloy system. cance of this phenomenon has not yet materialised. More recently, work on lead-indium binary alloys The most commonly used alloy is the 50 weight has been reported by Jackson (3) and Yost, et al per cent indium composition which has a liquidus (4, 5, 6). In this paper we intend to define, to discuss, temperature of approximately 210°C and a solidus and to illustrate three fundamental concepts relevant temperature of approximately 185°C. Alloys in the to soldering to gold films using lead-indium solders. lead rich phase field, a, freeze dendritically by The lead-indium phase diagram, shown in Figure forming lead rich stalks. The formation of these 1, contains a wealth of useful solder alloys having dendrites causes a surface rumpling which gives the solidus temperatures which range from 156.6°C solder surface a somewhat frosty rather than a shiny (pure indium) to 327.5 °C (pure lead). -
Catalog Ersa Soldering Irons, Soldering and Desoldering Stations, Solder Fume Extractions, Hybrid Rework Equipment and Accessori
Catalog Ersa soldering irons, soldering and desoldering stations, solder fume extractions, hybrid rework equipment and accessories Quickfinder – the alphanumerical product index Order no. page Order no. page Order no. page Order no. page 00 – 03 0C 0ICV2000HP ................21 1E035VDA068 ................5 0003B ...................... 33 0CA10-001 .................. 28 0ICV403A ...................21 1HR200-HP0A67 ............. 24 0004G ...................... 33 0CA10-002 ................. 28 0ICV4000A ..................21 1HR2000000A67 ............. 24 0006G .................... 9, 33 0CA10-1002/04. 28 0ICV4000AI .................21 1IC1100A0CA67 ..............18 0008M ........... 17 – 18, 33, 37 0CA10-2002 ................ 28 0ICV4000AIC ................21 1IC1100A00A67 ..............18 0015BDH ....................6 0CA10-4001 ................ 28 0ICV4000AICXV .............21 1IC1100VCVA67 ..............18 0045BDG ....................6 0CA10-4002 ................ 28 0IRHP100A-03 .............. 30 1IC1100V0CA67 ..............18 0055JD ......................7 0CA10-4003 ................ 28 0IRHP100A-04 .............. 30 1IC1100V00A67 ..............18 0085JD ......................7 0CA10-4004 ................ 28 0IRHP200 ................... 30 1IC1100VXTA67 ..............18 0100CDJ ............. 18 – 19, 21 0CA10-4005 ................ 28 0IRHR100A-14 ............... 24 1IC1200A00A67 .............. 17 0120CDK ................... 17 0CA10-5001. 28 0IRHR100A. 24 1IC1300000A67 .............. 17 0130CDK ................... 17 0CA10-5002 ............... -
Photochemical Machining
Design Guide to Photochemical Machining A World Apart in a World of Parts This “Design Guide to Photochemical Machining” was cre- ated for those involved with the designing or purchasing of Fotofab uses a special process called Photochemical Machining. Also known as chemical etching, acid etching, or milling, this process metal parts. While it provides general guidelines, Fotofab’s offers many advantages over traditional metal fabrication methods: Technical Sales Staff is available to assist Speed you with your specifi c requirements. • Tooling can be produced rapidly. • Parts can be produced and shipped within hours of receiving a print. By designing with an awareness of our process capabilities, you will minimize Flexibility • Many intricate part geometries, like those found in fi ne resolution the cost and delivery time of your metal screens, can be photochemically machined easily and economically. parts. We are ready to work with you, • Revisions to part designs are implemented quickly and inexpensively. • Brittle metals, which often fracture during conventional stamping, are machined without diffi culty. Just tell us what you need! Repeatability • Prototype and production quantities can be made using the same process and tooling. Contents • Extremely thin metal can be machined without distortion; dimensional accuracy actually increases as metal thickness decreases. The Fotofab Process • page 4 • Physical properties of the metal, such as hardness, strength and formability, are not changed by the process. Value-Added Services • page 7 • Magnetically soft materials can be fabricated while retaining their optimum permeability. Applications • page 8 • Parts are inherently free of burrs. Material Selection • page 10 Cost Effectiveness • Tooling and set-up costs are extremely low compared to hard tooling. -
Temperature Cycling and Fatigue in Electronics
Temperature Cycling and Fatigue in Electronics Gilad Sharon, Ph.D. [email protected] 9000 Virginia Manor Road, Suite 290, Beltsville, Maryland 20705 | Phone: (301) 474-0607 | Fax: (866) 247-9457 | www.dfrsolutions.com ABSTRACT The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials. CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a “board level” CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating. Key words: temperature cycling, thermal cycling, fatigue, reliability, solder joint reliability. INTRODUCTION The excessive difference in coefficients of thermal expansion between the components and the printed board cause a large enough strain in solder and embedded copper structures to induce a fatigue failure mode. This paper discusses the solder fatigue failure mechanism and the associated PTH (plated through hole) fatigue failure. The solder fatigue failure is more complicated due to the many solder materials and different solder shapes. Figure 1 shows an example of a solder fatigue failure in a cross section of a ball grid array (BGA) solder ball with the corresponding finite element model. The predicted location of maximum strain corresponds to the same location of solder fatigue crack initiation. Discussion CTE Mismatch Any time two different materials are connected to one another in electronics assemblies, there is a potential for CTE mismatch to occur. -
Roofinox Soldering
Roofinox Soldering Soldering is the creation of a durable but detachable joining of two metals by melting a filling metal into a joint. This soft soldering process requires temperatures below 842°F, the typical soldering temperature for stainless steel tin-sol- der is around 480°F. Due to its specific surface Roofinox® stainless steel is readily solderable. The surfaces to be joined must be free of grease, dirt or other foreign matter. Stainless steel requires some adaptations such as a different flux than for copper and zinc. With the use of proper flux, techniques and tools Roofinox is easily solderable and provides durable water- proofing joints. By observing the following points, you will achieve an outstanding soldering quality. For durable and clean soldering joints the following tools are required: • Soldering iron with soldering bit • Solder (30 %, 40 %, 50 % solder possible) • Soldering stone / ammoniac stone (pure ammoniac, no tinned ammoniac stone) • Flux - Roofinox FLM • Flux brush • Cleaning tissue • Fresh water Flux For Roofinox and Roofinox tin-plated fluxes based on phosphoric acid are suitable. Not suitable are fluxes based on hydro- chloric acid or dilute hydrochloric acid or containing chloride ions. The industry offers a range of soldering fluxes suitable for stainless steel. Best results are achieved with Roofinox FLM. Roofinox FLM guarantees sufficient removal of the thin passive layer and prevents its renewed formation during soldering. They provide optimal wetting and cleanliness of the soldering area. If the soldered joint will be subjected to particular stress, please contact us. Conducting a solder test is recommended before beginning the job to ensure that the desired result will be achieved.