-Based Platforms

● Cloud Platforms ● HPC / GPU Platforms ● Embedded & SMB Platforms

MITAC INTERNATIONAL CORP. TYAN® Business Unit

USA 3288 Laurelview Court, Fremont, CA 94538 United States Tel: +1-510-651-8868 Pre-Sales: +1-510-651-8868 x5120 Fax: +1-510-651-7688 Email:[email protected]

Taiwan 5F, Building B, No. 209, Sec. 1, Nan Gang Rd., Nan Gang Dist., 11568, Tel:+886-2-2652-5888 Fax:+886-2-2652-5805 Email:[email protected]

Japan Yasuda 8th Building 6F Kaigan 3-chome 3-8, Minato-ku , Tokyo, 108-0022 , Japan Tel:+81-3-3769-8311 Fax:+81-3-3769-8328 Email: TYAN@.co.jp

Europe Z5 Mollem 318 1730 Asse (Mollem) Belgium Sales: +32 2456 1721 Sales Email: [email protected] Technical Support: +32 2456 1722 RMA Group [email protected]

China No.213,Jiang Chang San Road, Zha Bei District,Shanghai,China Zip code:200436 Beijing Tel:+86-010-62381108#2043 Shanghai Tel: +86-021-61431194 Email:[email protected]

Rev.1 Product Catalog 2011 Specifications are subject to change without notice. Items pictured may only be representative. To be the leader in providing servers, techni- cal workstations and supercomputer clusters through worldwide channels. Your First Choice

About TYAN MiTAC Global Presence & TYAN Branch Offices

Created in 1989, TYAN designs, manufactures and markets advanced x86 server/workstation platforms. TYAN’s products are sold to OEMs, MiTAC UK Ltd. VARs, System Integrators, and Resellers around the world for a wide Mio Technology UK Ltd. range of applications. As a leading server brand asset owned by MiTAMio Technology Benelux N.V. MiTAC International Corporation, TYAN is to be deeply enhanced and Mio Technology Poland Mio Technology Korea further developed through the synergy and innovation of the new Mio Technology Moscow MiTAC. Mio Technology Beijing. MiTAC Research (Shanghai) Ltd. Mio Technology Suzhou MiTAC (Kunshan) Ltd. Products from TYAN feature design enhancements specifically MiTAC Digital Corp. (USA) MiTAC Japan Corp.

developed for enterprise computer room and data center TYAN Computer USA MiTAC Chengdu S/W Development MiTAC International Corp. MiTAC USA Inc MiTAC Computer (Shun-De) Ltd. environments. These highly stable, space-efficient products are very MiTAC Logistic Corp. attractive to OEMs and System Integrators designing next generation MiTAC Information Systems Corp. MiTAC Precision Technology Vietnam rackmount server solutions for a wide array of applications.

With design and engineering centers located in the U.S., China, and Taiwan, TYAN holds a distinct advantage over the competition. MiTAC Australia Navman Tech NZ TYAN's engineers are well-positioned to assist customers with the Index development of tailored solutions that meet their requirements. Customers are assured that TYAN products meet the highest quality Intel-Based Cloud Computing Platforms and reliability standards available. P3 FM65-B5511 P4 YR292-B5511X4 / YR292-B7008X4 TYAN enables its customers to be technology leaders by providing scalable, highly-integrated, reliable platforms for a wide range of Intel-Based GPU / HPC Platforms applications such as high-end server and workstation usage in P5 FT48-B7025 / S7025 markets such as CAD, DCC, E&P and HPC. TYAN's time-to-market P6 FT77-B7015 / FT72-B7015 strategies and cutting-edge engineering processes distinguish them TYAN Milestone from the competition. Many TYAN customers have had their Intel-Based SMB Platforms TYAN-based products recognized within their industries, garnering a P7 TN70-B7016 / S7016 ● Targeting high ● Rackmount ● TACHYON graphics ● AMD 8P Opteron™ ● TYAN 4P/1U AMD ● TYAN Tylersburg & Shanghai platforms multitude of distinguished awards. ● P8 GT24-B7016 / S7012 performance system Server cards with ATI platforms Opteron™ solutions TYAN YR Series launch boards & peripheral ● performance GPU GT20-B7002 / S7002 cards technology

Intel-Based Embedded Platforms P10 S5510 / S5512 / S5515 / S7010 Recent Wins on the TOP 500 1991 2001 2003 2005 2007 2009

Jun. 2010 #19 of Top 500 8.5 Mole, IPE, CAS, China 1994 2002 2004 2008 2010 2011 Nov. 2008 #10 of Top 500 Dawning 5000A, Dawning, China Jun. 2008 #16 of Top 500 T2K Open Supercomputer , Hitachi, Japan Jun. 2006 #34 of Top 500 PACS-CS, Hitachi-Fujitsu, Japan ● Targeting high ● 4P Intel® Xeon™ ● World’s first low-cost, ● TYAN Shanghai support ● TYAN NVIDIA Tesla ● Micro Server Jun. 2004 #10 of Top 500 Dawning 4000A, Dawning, China performance system Product entry-level AMD 4P system products certified GPU platforms launch boards & peripheral ● AMD 2P platforms board and barebones ● TYAN Double 1U ● TYAN Nehalem & cards ● TYAN Blade FX71 Westmere platforms launch ● TYAN G34 & C32 platform 1 launch 2 Lower Power & Higher Density Cloud Platforms Micro Serve Computing Node Micro Server

The TYAN Micro Server provides high-reliability and scalable performance with INTEL-BASED CLOUD PLATFORMS 18 removable front-loaded compute nodes, and redundant (2+1) hot-swap power supplies. Each individual node supports a single Intel Xeon Processors E3-1200 Series, up to 32 GB of un-buffered ECC DDR3 memory, and two 2.5” SSD or HDD drives. Each node has 1 G-bit network port and features IPMI 2.0 support for out-of-band and remote management. The majority of cloud computing infrastructure consists of reliable Yellow River Computing Node Higher Density Could Platforms services delivered through data TYAN Yellow River Series centers and built on lots of servers. Data centers have to install, operate, The TYAN Yellow River series is an ultra high density twin server platform that and manage huge number of featured with scalable, modular, space effective, manageable, efficient, flexibility and fast through put. servers so the topics of server density, power-efficiency, and

serviceability are heavily Blade Servers in 2U!! Blade Servers in 1U!! emphasized. TYAN provides a full The Traditional Way The New Way The Traditional Way The New Way Expand-on-the-top Expand-on-the-side Expand-on-the-top Expand-on-the-side array of cloud platforms offering 2x Computing Power, BUT 2x Computing Power 2x Computing Power, BUT 2x Computing Power No height growth, Blade Serviceability No height growth, Blade Serviceability scalability, reliability, remote 2x space, 2x rail kit 2x space, 2x rail kit management ability and high performance that is designed for YR 2U = 2x Generic 2U YR 2U = 2x Generic 1U Cloud Computing environments.

Cloud Platform ─ Lower Power & Higher Density Cloud Platform ─ Higher Density Cloud Platform ─ Higher Density FM65-B5511 YR292-B5518-X4 YR292-B7008-X4 B5511F65X18-160V2R B5518Y292X4-080V4HR B7008Y292X4-080V4HR

Cloud Platform Cloud Platform Cloud Platform Higher Density Higher Density Lower Power & Higher Density

Most Cost-Effective, High-Density Server Platform for IPDC ● 4U with eighteen (18) front swappable blades ● Up to 32GB main memory supported in single-socket server platform ● (2+1) hot-swappable redundant, 80-PLUS Platinum rated RPSU for all blades

Model Number FM65-B5511 Enclosure Form Factor 4U (26" in depth) Model Number YR292-B5518-X4 YR292-B7008-X4 (1) Intel® Sandy Bridge support Xeon® E3-1200 Model Number Supported CPU I3-2100 series processors upto 45W Enclosure Form Factor 2U Enclosure Form Factor 2U (28.74" in depth) / 4 Nodes ® ® Chipset Intel® C202 (1) Intel Sandy Bridge support Xeon E3-1200 (1) Intel® Xeon® Processor 5500/5600 Series (Nehalem/ Westmere) Supported CPU Supported CPU (per node) I3-2100 series processors upto 45W Chipset Interconnection DMI Chipset (per node) Intel® 5500 + ICH10R Chipset Intel C202 ® Number of DIMM Slot 4 QuickPath Interconnect Intel QPI 6.4/ 5.86/ 4.8 GT/s Chipset Interconnection DMI Memory Type (max. capacity) VLP Un-buffered, DDR-3 1333/1066 w/ ECC (32GB) Number of DIMM Slot (per node) 9 ® Number of DIMM Slot 4 Storage Controller Intel C202 2-ports SATA-II Memory Type (max. capacity) R-DDR3 1333/1066/800 w/ ECC (72GB) Memory Type (max. capacity) Un-buffered, DDR-3 1333/1066 w/ ECC (32GB) (per node) U-DDR3 1333/1066 w/ ECC (48GB) RAID Support RAID 0/1/10 ® Storage Controller Intel® C202 6-ports SATA-II Storage Controller Intel ICH10R 4-port SATA-II Multimedia Drive N/A ® RAID Support RAID 0/1/5/10 RAID Support (per node) RAID 0, 1, 10, 5 (Intel Matrix RAID) Networking (2) GbE via Networking Blade Multimedia Drive N/A Multimedia Drive (per node) N/A PCI Expansion Slots N/A 3 ® 4 Networking (3) GbE via Intel 82574 Networking (per node) (2) GbE Standard Model Number of HDD in Each Node Storage Backplane Power Supply PCI Expansion Slots (1) PCI-e x16 PCI Expansion Slots (per node) (1) PCI-E Gen.2 x16 B5511F65X18-160V2R (2) fixed 2.5" SATA-II N/A 1600W (2+1) RPSU Standard Model Number of HDD Bay Storage Backplane Power Supply Standard Model Number of HDD Bay Storage Backplane Power Supply (4) Hot-swap SATA-II (1) 4-port SAS/ SATA-II B5518Y292X4-080V4HR (4) fixed 2.5" SATA-II N/A 800W (1+1) RPSU B7008Y292X4-080V4HR (per node) (per node) 800W (1+1) RPSU FT48-B7025 FT72-B7015 B7025F48W4H / B7025F48W8HR B7015F72V2(BTO) / B7015F72V2R(BTO) INTEL-BASED World’s Only 8 GPU Barebone ‧Supporting (2) Intel® Xeon® 5500/ 5600 Processor Series ‧Supporting up to (8) GPU cards in a 4U chassis ‧(18) DDR-III R/U-DIMM slots HPC / GPU ‧(8) PCI-E x16 Gen.2 slots, (4) GbE ports ‧(2) 2.5” HDDs PLATFORMS Model Number FT72-B7015 Enclosure Form Factor 4U (28" in depth) ® Supported CPU (2) Intel Xeon® Processor 5500/5600Series (Nehalem/ Westmere) Chipset (2) Intel® 5520 + ICH10R Chipset Interconnection Intel® QPI 6.4/ 5.86/ 4.8 GT/s Number of DIMM Slot 9 + 9 GOLD Registered, DDR-3 1333/ 1066/ 800 w/ ECC (144GB) Memory Type (max. capacity) Un-buffered, DDR-3 1333/ 1066 w/ ECC (48GB) Storage Controller Intel® ICH10R 6-port SATA-II RAID Support 0, 1, 10, 5 Model Number FT48-B7025 Multimedia Drive N/A Enclosure Form Factor 4U (27.5" in depth) Networking (4) GbE Supported CPU (2) Intel® Xeon® Processor 5500/5600 Series (Nehalem/ Westmere) (8) PCI-E (Gen.2) x16; (2) PCI-E (Gen.2) x16( w/ x4 link) Intel® (2) 5520 + ICH10R PCI Expansion Slots Chipset (1) PCI-E (Gen.2) x4; (1) PCI 32/33MHz Chipset Interconnection Intel® QPI 6.4/ 5.86/ 4.8 GT/s Standard Model Number of HDD Bay Storage Backplane Power Supply Number of DIMM Slot 8/ (4+4) B7015F72V2(BTO) (2) fixed 2.5" SATA-II N/A 2400W (2+0) PSU Memory Type (max. Registered, DDR-3 1333/ 1066/ 800 w/ ECC (64GB) B7015F72V2R(BTO) (2) fixed 2.5" SATA-II N/A 2400W (2+1) RPSU Un-buffered, DDR-3 1333/ 1066 w/ ECC (32GB) capacity) B7015F72V2R-N627(BTO) (2) fixed 2.5" SATA-II N/A 2400W (2+1) RPSU Storage Controller LSI SAS1068E B7015F72V2R-B827(BTO) (2) fixed 2.5" SATA-II N/A 2400W (2+1) RPSU RAID Support 0, 1, 1E Multimedia Drive N/A Networking (2) GbE (4) PCI-E (Gen.2) x16; (1) PCI-E (Gen.2) x8 PCI Expansion Slots (1) PCI-E (Gen.2) x4; (1) PCI 32/33MHz Standard Model Number of HDD Bay Storage Backplane Power Supply B7025F48W4H (4) Hot-swap SAS 4-port SAS/ SATA 1,300W (2x 650W) B7025F48W8HR (8) Hot-swap SAS (2) 4-port SAS/ SATA 1,300W (2+1) RPSU

Server Board Intel® 5500 Series Chipset FT77-B7015 Server Board B7015F77V2R (BTO) / B7015F77V2R-N427 (BTO) B7015F77V2R-N625/-N627 (BTO) / B7015F77V2R-N825/-N827 (BTO)

The TYAN HPC/GPU Intensive Server Platforms are designed for the high performance computing and massive parallel computing environments. These solutions provide superior parallel computing World’s Only 8 GPU Barebone capability and are designed to deliver scalability, reliability and the best price/performance to support ‧Supporting (2) Intel® Xeon® 5500/ 5600 Processor Series ‧ complicated computational applications. Supporting up to (8) GPU cards in a 4U chassis ‧(18) DDR-III R/U-DIMM slots ‧ Target Applications (8) PCI-E x16 Gen.2 slots, (4) GbE ports ‧ ‧Bio-informatics and Life Sciences, (4) 2.5” HDDs ‧Computational Chemistry, Computational Electromagnetics and Electrodynamics ‧ S7025 Computational Finance and Computational Fluid Dynamics S7025AGM2NR / S7025WAGM2NR ‧ Data Mining, Analytics and Databases Model Number FT77-B7015 ‧ ® ® Computer Vision, MATLAB Acceleration and Medical Processor ‧Dual LGA1366 sockets support Intel Xeon Processor Enclosure Form Factor 4U (28" in depth) ‧Imaging, Molecular Dynamics, Weather and Atmospheric 5500/5600 Series(Nehalem/ Westmere) Supported CPU (2) Intel® Xeon® Processor 5500/5600 Series (Nehalem/ Westmere) ‧ ® Chipset Intel (2) 5520 + ICH10R ® ‧Ocean Modeling and Space Sciences Chipset Intel (2) 5520 + ICH10R Memory ‧(4+4) DDR-3 DIMM slots Chipset Interconnection Intel® QPI 6.4/ 5.86/ 4.8 GT/s ‧Support up to 64GB of Registered DDR-3 1333/1066/800 memory Number of DIMM Slot 18/ (9+9) R-DDR3 1333/ 1066/ 800 w/ ECC (144GB) ‧Support up to 32GB of Un-buffered DDR-3 1333/1066/800 Memory Type (max. capacity) U-DDR3 1333/ 1066 w/ ECC (48GB) memory Unique GPU Platform Benefits Storage Controller Intel® ICH10R 6-port SATA-II Expansion ‧(4) PCI-E (Gen.2) x16 slots ‧ ® ® ® Support Intel Xeon 5500/5600 Processors Series (Westmere / ‧(1) PCI-E (Gen.2) x8 slot RAID Support 0, 1, 10, 5 (Intel Matrix RAID) Nehalem) ‧(1) PCI-E (Gen.2) x4 slot Multimedia Drive N/A ‧Support GPU computing processors ‧(1) PCI 32/33MHz slot Networking (4) GbE Storage ‧(6) SATA-II connectors running at 3.0 Gb/s w/ RAID 0, 1, 10, (8) PCI-E (Gen.2) x16; (2) PCI-E (Gen.2) x16( w/ x4 link) ‧Over 2 Teraflops of Double Precision Performance PCI Expansion Slots 5 support (1) PCI-E (Gen.2) x4; (1) PCI 32/33MHz ‧Up to 3,584 for massively parallel computing performance ‧(8) SAS connectors w/ RAID 0, 1, 1E support Standard Model Number of HDD Bay Storage Backplane Power Supply ‧Unique GPU platform design with increased energy efficiency 5 (S7025WAGM2NR) B7015F77V2R (BTO) (4) fixed 2.5" SATA-II N/A 2400W (2+1) RPSU 6 ‧ ® ‧Optimized design reduces rack space requirements Network (2) GbE (via two Intel 82574L) B7015F77V2R-N427 (BTO) (4) fixed 2.5" SATA-II N/A 2400W (2+1) RPSU ‧ASPEED AST2050 Integrated Graphics ‧Cost Effective – Up to 8 GPU computing processors in a 4U system Video B7015F77V2R-N625/-N627 (BTO) (4) fixed 2.5" SATA-II N/A 2400W (2+1) RPSU ‧ ALC262 audio CODEC Audio B7015F77V2R-N825/-N827 (BTO) (4) fixed 2.5" SATA-II N/A 2400W (2+1) RPSU Management ‧ASPEED AST2050 (IPMI v2.0 compliant w/ iKVM) Form Factor ‧SSI EEB (12" x 13", 305mm x 330mm) TN70-B7016 GT24-B7016 GT20-B7002 B7016T70-077V12HR B7016G24V4H / B7016G24W4H B7002G20V4H

Cloud Platform INTEL-BASED More Capacity SMB PLATFORMS

GOLD

Model Number TN70-B7016 Model Number GT24-B7016 Model Number GT20-B7002 Enclosure Form Factor 2U (27.56" in depth) Enclosure Form Factor 1U (25.4" in depth) ® ® Enclosure Form Factor 1U (22.4" in depth) Supported CPU (2) Intel Xeon Processor 5500/5600 Series (Nehalem/ Westmere) (2) Intel® Xeon® Processor 5500/5600 Series (Nehalem/ Westmere) Supported CPU (2) Intel® Xeon® Processor 5500/5600 Series (Nehalem/ Westmere) Intel® 5520 + ICH10R Supported CPU Chipset Intel® 5520 + ICH10R Chipset Intel® 5500 + ICH10R QuickPath Interconnect Intel® QPI 6.4/ 5.86/ 4.8 GT/s Chipset Intel® QPI 6.4/ 5.86/ 4.8 GT/s Chipset Interconnection Intel® QPI 6.4/ 5.86/ 4.8 GT/s Number of DIMM Slot 18/ (9+9) Chipset Interconnection Number of DIMM Slot 9 + 9 Memory Type R-DDR3 1333/1066/800 w/ ECC (144GB) Number of DIMM Slot 4 + 4 Memory Type (max. Registered, DDR-3 1333/ 1066/ 800 w/ ECC (144GB) (max. capacity) U-DDR3 1333/1066 w/ ECC (48GB) Memory Type (max. Registered, DDR-3 1333/ 1066/ 800 w/ ECC (64GB) capacity) Un-buffered, DDR-3 1333/ 1066 w/ ECC (48GB) capacity) Un-buffered, DDR-3 1333/ 1066 w/ ECC (32GB) LSI SAS1068E 8-port SAS + ® Storage Controller ® Storage Controller Intel ICH10R 6-port SATA-II/ LSI SAS1068E 8-port SAS ® Intel ICH10R 6-port SATA-II Storage Controller Intel ICH10R 6-port SATA-II RAID Support 0, 1, 10, 5 (SATA)/ 0, 1, 1E (SAS) Number of HDD Bays (12) Hot-Swap 3.5" + (2) internal 2.5" RAID Support 0, 1, 10, 5 Slim DVD-ROM, 8x RAID 0, 1, 1E (SAS Integrated RAID) Multimedia Drive (Opt.) Slim DVD-ROM, 8x RAID Support Multimedia Drive RAID 0, 1, 10, 5 (Intel® Matrix RAID) Networking (3) GbE Networking (2) GbE Networking (3) GbE (1) FH/HL PCI-E (Gen.2) x16; PCI Expansion Slots PCI Expansion Slots (1) FH/HL PCI-E (Gen.2) x16 (2) PCI-E FH/FL Gen.2 x16 (w/ x8 link) + (1) FH/HL PCI-E (Gen.2) x16 (w/ x8 link) PCI Expansion Slots (2) PCI-E FH/FL Gen.2 x8 (w/ x4 link) Standard Model Number of HDD Bay Storage Backplane Power Supply Standard Model Number of HDD Bay Storage Backplane Power Supply Standard Model Number of HDD Bay Storage Backplane Power Supply B7016G24V4H (4) Hot-swap SATA-II 4-port SAS/ SATA 600W PSU B7002G20V4H (4) Hot-swap SATA-II 4-port SAS/ SATA 400W PSU B7016T70-077V12HR (12) Hot-swap SAS/ SATA-II (1) 12-port SAS/ SATA-II (1+1) ERP1U 770W B7016G24W4H (4) Hot-swap SAS 4-port SAS/ SATA 600W PSU + (2) internal SATA-II RPSU

Server Board Server Board Server Board Workstation Board Intel® 5500 Series Chipset Intel® 5500 Series Chipset Intel® 5500 Series Chipset

Intel’s new 32nm Microarchitecture Nehalem built with second-generation high-k and metal gate transistor technology.

● Intelligent Performance that automatically optimizes performance to fit business and application requirements and delivers up to 40 percent more performance per watt than Intel® Xeon® processor 5500 / 5600 series.

● Automated Energy Efficiency that scales energy usage to the workload to achieve optimal performance/watt and with new 40 watt processor options and support for lower power DDR3 memory, you can lower your energy costs even further. S7016 S7012 S7002 S7016GM3NR / S7016WGM3NR S7012GM4NR / S7012WGM4NR S7002G2NR-LE / S7002GM2NR-LE / S7002WGM2NR-LE /

● S7002WGM2NR / S7002AG2NR Flexible Virtualization that offers best-in-class performance and ® ® Processor ‧Dual LGA1366 sockets support Intel Xeon Processor ‧Dual LGA1366 sockets support Intel® Xeon® processors ‧ ® ® manageability in virtualized environments to improve IT Processor Dual LGA1366 sockets support Intel Xeon processors processors 5500/5600 series (Nehalem/ Westmere) 5500/5600 series (Nehalem/ Westmere) 5500/5600 series (Nehalem/ Westmere) ® ‧ Chipset ‧ ® ® infrastructure and enable up to 15:1 consolidation over two socket, Chipset Intel 5520 + ICH10R Intel 5520 + ICH10R Chipset ‧Intel 5520 + ICH10R (S7002WGM2NR / S7002AG2NR) ‧ Memory ‧ ® single-core servers2. Memory (9+9) DDR-3 DIMM slots (9+9) DDR-III DIMM sockets ‧Intel 5500 + ICH10R (S7002G2NR-LE/ S7002GM2NR-LE/ ‧Support up to 144GB of Registered DDR-3 ‧Support up to 144GB of R-DDR3 1333/1066/800 w/ ECC S7002WGM2NR-LE) 1333/1066/800 memory Memory ‧(4+4) DDR-3 DIMM slots ‧Support up to 48GB of Un-buffered DDR-3 ‧Support up to 48GB of U-DDR3 1333/1066 w/ ECC memory ‧Support up to 64GB of Registered DDR-3 1333/1066/800 1333/1066/800 Expansion ‧(4/3) PCI-E (Gen.2) x8 slots (S7012GM4NR/ ‧Support up to 32GB of Un-buffered DDR-3 1333/1066/800 ‧ Expansion (1) PCI-E (Gen.2) x16 slot (w/ x16 or x8 link) S7012WGM4NR) Expansion ‧(1) PCI-E (Gen.2) x16 slot ‧ ‧ (1) PCI-E (Gen.2) x8 slots (w/ x0 or x8 link) (1) PCI-E x8 slot ‧(2) PCI-E (Gen.2) x8 slots (S7002WGM2NR/S7002AG2NR) / ‧ ‧ (1) PCI-E x8 slots Storage (6) SATA-II connectors running at 3.0 Gb/s w/ RAID 0, 1, 10, (1) PCI-E (Gen.2) x8 slot (w/ x4 link) (S7002WGM2NR-LE/ Storage ‧(6) SATA-II ports by (1) mini-SAS & (2) SATA-II 5 support S7002GM2NR-LE/S7002G2NR-LE) connectors running at 3.0 Gb/s w/ RAID 0, 1, 10, 5 ‧(8) SAS ports by (2) mini-SAS connectors w/ RAID 0, 1, 1E ‧(1) PCI-E x8 slot (w/ x4 link) support support (S7012WGM4NR) Storage ‧(6) SATA-II connectors running at 3.0 Gb/s w/ RAID 0, 1, 10, 7 ‧(8) SAS ports by (2) mini-SAS connectors w/ RAID Network ‧(4) GbE (via Intel® dual-port NIC 82576EB and two Intel® 5 support 8 0, 1, 1E support (S7016WGM3NR) 82574L) ‧(4) stacked 2-port SAS connectors w/ RAID 0, 1, 1E support ® ® Network ‧(3) GbE (via Intel dual-port NIC 82576EB and Intel Video ‧ASPEED AST2050 Integrated Graphics (S7002WGM2NR/ S7002WGM2NR-LE) ‧ ® 82574L) Management ASPEED AST2050 (IPMI v2.0 compliant w/ iKVM) Network ‧(2) GbE (via 2x Intel 82574L) ‧ Form Factor ‧ Video ServerEngines Pilot 2 Integrated Graphics SSI EEB (12" x 13", 305mm x 330mm) Audio ‧Realtek ALC888 audio CODEC (S7002AG2NR) ‧ Management ServerEngines Pilot 2 (IPMI v2.0 compliant w/ iKVM) Management‧ASPEED AST2050 (IPMI v2.0 compliant w/ iKVM) Form Factor ‧Extended ATX (12" x 13", 305mm x 330mm) (S7002WGM2NR/S7002WGM2NR-LE/S7002GM2NR-LE) Form Factor ‧SSI CEB (12" x 10.5", 305mm x 267mm) INTEL-BASED EMBEDDED PLATFORMS

The Ideal Platforms for telecom, networking, storage, medical imaging, embedded servers, security and surveillance appliances.

The Benefits of TYAN’s Intel® Based Embedded Platforms

● Adopting the latest Intel technology ● Support Intel® Xeon® Processors E3-1200 Series (Sandy-Bridge) ● Available with customized features, BOM enhancement or modified designs ● Platforms designed to meet high reliability, safety and environmental requirements ● Lower-power consumption options available ● Designed for continuous operation (7x24x365) ● Designed for longer operational life cycle (7+ years)

Server Board Workstation Board Intel® C200 Chipset Intel® C200 Chipset Intel® Q67 Chipset Intel® 5500 Series Chipset

S5510 S5512 S5515 S7010 S5510G2NR-HE S5512G2NR-HE S5515AG2NR S7010AGM2NRF

Processor ‧Single LGA 1155-pin socket support Intel® Xeon® Processors Processor ‧Single LGA 1155-pin socket support Intel® Xeon® Processors Processor ‧Single LGA 1155-pin socket support Intel® CoreTM Processor ‧Dual LGA1366 sockets support Intel® Xeon® Series E3-1200, and I3-2100 Series Processors Series E3-1200, and I3-2100 Series Processors I3/I5/I7 series Processors Processors 5500/5600 Series (Nehalem/ Westmere) Chipset ‧Intel® C206 Chipset ‧Intel® C206 Chipset ‧Intel® Q67 Chipset ‧Intel® 5520 + ICH10R Memory ‧(4) DDR-3 DIMM slots Memory ‧(4) DDR-3 DIMM slots Memory ‧(4) DDR-3 DIMM slots Memory ‧(6+6) DDR-3 DIMM slots ‧Support up to 32GB of ECC U-DDR3 1066/1333" ‧Support up to 32GB of ECC U-DDR3 1066/1333 ‧Support up to 32GB of Non-ECC U-DDR3 1066/1333 ‧Support up to 96GB of Registered DDR-3 Expansion ‧(2) PCI-E Gen.2 x8 slots Expansion ‧(1) PCI-E Gen.2 x16 slot (w/ x8 link) Expansion ‧(1) PCI-E Gen.2 x16 slot 1333/1066/800 ‧(2) PCI-E Gen.2 x8 slots (w/ x4 link) ‧(1) PCI-E Gen.2 x8 slot ‧(1) PCI-E Gen.2 x1 slot ‧Support up to 48GB of Un-buffered DDR-3 Storage ‧(4) SATA-II connectors running at 3.0 Gb/s ‧(1) PCI-E Gen.2 x8 slot (w/ x4 link) ‧(1) PCI-E Gen.2 x8 slot (w/ x4 link) 1333/1066/800 ‧(2) SATA-III connectors running at 6.0 Gb/s ‧(2) PCI-E Gen.2 x1 slots ‧(1) PCI slot Expansion ‧(1) PCI-E (Gen.2) x16 slot Network ‧(2) GbE (via Intel® 82574L) ‧(1) PCI slot Storage ‧(4) SATA-II connectors running at 3.0 Gb/s ‧(2) PCI-E (Gen.2) x8 slots Video ‧Aspeed AST2150 Storage ‧(4) SATA-II connectors running at 3.0 Gb/s ‧(2) SATA-III connectors running at 6.0 Gb/s ‧(1) PCI-E x4 slot Form Factor ‧uATX (9.6" x 9.6", 244mm x 244mm) ‧(2) SATA-III connectors running at 6.0 Gb/s Network ‧(2) GbE (via Intel® 82579LM + 82583) ‧(1) PCI 32/33MHz slot Network ‧(2) GbE (via Intel® 82574L) Video ‧Intel® Graphic from Q67 Storage ‧(6) SATA-II connectors running at 3.0 Gb/s w/ RAID Video ‧Aspeed AST2150 Form Factor ‧uATX (9.6" x 9.6", 244mm x 244mm) 0, 1, 10, 5 support Form Factor ‧ATX (12" x 9.6", 305mm x 244mm) Network ‧(2) GbE (via 2x Intel® 82574L) Video ‧ASPEED AST2050 Integrated Graphics Audio ‧Realtek ALC262 audio CODEC Firewire ‧VIA VT6308 1394a controller PCI-E Slot SATA PCI-E Slot SATA LAN SKU Chipset LAN port BMC SKU Chipset BMC Management ‧ASPEED AST2050 (IPMI v2.0 compliant w/ iKVM) X8 6 Gb/s 3 Gb/s X16/ X8/ X1/ PCI 6 Gb/s 3 Gb/s port Form Factor ‧SSI EEB (12" x 13", 305mm x 330mm) 9 S5510G2NR-HE (BTO) C206 4 2 4 2 No S5512G2NR-HE (BTO) C206 2 4 2 No 10 S5510GM3NR C204 4 2 4 3 Yes S5512GM4NR C204 1/ 2/ 2/ 1 2 4 4 Yes S5510G2NR-LE C202 3 0 6 2 No S5512GM2NR C204 2 4 2 Yes S5512WGM2NR C204 2 4 2 Yes (SAS 8 ports) 1/ 1/ 2/ 1 S5510G2NR-LE C202 0 6 2 No