Thunder & Tempest Platforms

Thunder & Tempest Platforms HPC / Cloud Computing / Storage / Embedded Products

TYAN® Business Unit

USA 3288 Laurelview Court, Fremont, CA 94538 United States TEL: +1-510-651-8868 Pre-Sales: +1-510-651-8868 FAX: +1-510-440-8808 Email: [email protected]

Taiwan No.200, Wen Hwa 2nd Rd., Kuei Shan Dist., Taoyuan City 33383, Taiwan TEL: +886-3-327-5988 #2873 Johnson Chang FAX: +886-3-327-6312 Email: [email protected]

China No.213 Jiang Chang San Road, Zha Bei District,Shanghai (200436) Shanghai TEL: +86-021-61431188 #1361 Beijing TEL: +86-010-62381108 #2485 & #2013 Email: [email protected]

Japan Yasuda Shibaura 2nd Building 3F Kaigan 3-chome 2-12, Minato-ku, Tokyo 108-0022, Japan TEL: +81-3-3769-8311 FAX: +81-3-3769-8328 Email: TYAN@mitac.co.jp

EMEA Tewkesbury, Gloucestershire England TEL: +44 07540328523 Robin Daunter Email: [email protected] [email protected] World Class Server Platforms

Please contact your sales representative or TYAN authorized distributors.

Rev.1 Specifications are subject to change without notice. Items pictures may only be representative. Product Catalog 2018 Please visit our website for the latest product information. Industry leading hardware manufacturer, providing servers, technical workstations, and supercomputing clusters through worldwide distribution channels.

About TYAN MiTAC Global Presence & TYAN Branch Offices

TYAN is a world class provider of server motherboards and server platforms. MiTAC Europe Ltd. Founded in California’s Silicon Valley in 1989, TYAN has been bringing innovation MiTAC Technology UK Ltd. MiTAC Benelux N.V. and reliability to the server industry for nearly 30 years. As a leading server Mio Technology Beijing. MiTAC Europe Poland manufacturer owned by MiTAC Computing Technology Corporation, TYAN is a core Mio Technology Suzhou MiTAC Europe Moscow business units of the MiTAC Group. MiTAC Information MiTAC Japan Corp. Technology Czech MiTAC Research Shanghai Ltd. As a leading manufacturer, TYAN provides systems integrators and value added MiTAC Computer (Kunshan) Ltd. resellers with market leading products to build and customize their servers MiTAC Digital Corp. (USA) & Service/Logistic/BPO worldwide. By offering a full range of server products and accessories, TYAN TYAN Computer Corp. USA enables customers to apply their expertise and bring value to their solutions. TYAN MiTAC Logistic Corp. MiTAC Holdings Corp. prides itself in supplying the channel with building block products. MiTAC Information Systems Corp. & MiTAC International Corp. & MiTAC Computing Technology Corp. & MiTAC Digital Technology Corporation (MDT) Many customers have had their TYAN-based products recognized within their MiTAC Computer (Shun-De) Ltd. industries, covering a wide range of markets such as HPC, hyper-scale/data center, server storage and security appliances. InfoPower (MiTAC JV in India) Index TYAN has locations spanning the globe, from North America to Asia Pacific and MiTAC Australia Intel-Based HPC Platforms Europe, including R&D, distribution, local support, inventory and sales. P5 FA77-B7119 / FT77D-B7109 P6 FT48T-B7105 / GA88-B5631 FP7 FT48B-B7100 / S7100 / S7105

Intel-Based Cloud Computing Platforms P9 TN200-B7108-X4S / TN200-B7108-X4L TYAN Brand Lines P10 GT75B-B7102 / GT24E-B7106 P11 S7106 / S7103 / S5542 / S5542UHE

Intel-Based Storage Platforms Tyan has a number of server product lines designed to suit a P13P7 FA100-B7118 / TN76-B7102 wide range of applications specially tailored to meet the Thunder Tempest Application-specific Coverage P14P8 TN70E-B7106 / TN70A-B7106 needs of our channel and system integration partners. P15P7 GT86C-B5630 / GT62B-B5539 Products spanning five product segments P16P8 GT62F-B5630 / S5630 / S5620 Tyan’s Thunder and Tempest products span the following five segments: P17P10 TN52J-E3252 / TN70J-E3250 SX – Storage HX – HPC Intel-Based Embedded Platforms – Cloud P19 S3227 / S5539 / S5545 / S5547 CX RX – Security TYAN Mezzanine Cards EX – Embedded SX HX CX RX EX ‧ ‧ P21 M7106-C604-1H / M7106-C202-2V Server barebones based on Motherboards based on Intel's Storage HPC Cloud Security Embedded M7106-B414-2V / M7086-X710-2F Intel's latest technology latest world-class server Tyan is continually developing new products based on the latest Intel including Intel® Xeon® Scalable ‧Multiple ‧Designed ‧Virtualzation ‧Built to ‧Made for P22 M7062-I599-2T / M7062-I599-1T technology Processors drive bays for top-end applications provide robust industrial technologies. Check our website at www.tyan.com to stay up to date with ‧Fits off the shelf (OTS) chassis ‧ ‧ M7076-X540-2T / M7076-I350 ‧ High speed performance Remote controls applications Designed to offer best in class interfaces ‧Scalable, mangement ‧Works with ‧Durable and P23 M7059F77A-FDR-2 / M7109F77D-V710-2V our latest product offerings. products server technology, such as ‧Maximum dense for monitoring latest reliabel ‧Tested to highest standards for M7059F77A-X540 / M7059F77A-I350 remote management, field I/O infrastructure and control standards and ‧High guality ‧ P24 M7076-3108-8i / M7076-3008-8i replaceable parts design and quality Both CPU protcols materials and ‧ ‧Built to inventory and GPU components P3280 / P3260 Built to inventory focused HPC ‧ P25 M7106-4E / M5539-2E ‧Warehoused in US, EU, and Warehoused in US, EU, and designs M2092 / M2093 China China P26 P2111-2M / M2110-2M

1 2 INTEL-BASED HPC PLATFORMS

Unleash the Future with High Performance Computing

Intel® Xeon® Processor D-1500 Family Intel® Xeon® Scalable Processors Intelligent, High-Efficiency Highest Levels of Performance, Storage for the Data Center and Biggest Data Center Advancement Beyond

The Intel® Xeon® Scalable platform provides the The Intel® Xeon® processor D-1500 product foundation for a powerful data center platform family brings the performance and advanced that creates an evolutionary leap in agility and intelligence of Intel® Xeon® processors into a scalability. Disruptive by design, this innovative dense, low-power system on a chip. The Intel® processor sets a new level of platform convergence and capabilities Xeon® processor D-1500 family provides excellent performance and across compute, storage, memory, network, and security. Enterprises software compatibility in a low-power SoC, for microservers that can and cloud and communications service providers can now drive forward efficiently process lightweight, hyperscale workloads in cloud service their most ambitious digital initiatives with a feature-rich, highly versatile provider data centers and dedicated hosting company data centers. platform.

Intel® Xeon® Scalable Processors are uniquely architected for today’s evolving data center and network infrastructure — offering businesses the industry’s highest energy efficiency and system-level performance Intel® Xeon® E3-1200 v6 Processor Family averaging 1.65x higher performance over the prior generation. In growing workloads like AI, Intel Xeon Scalable processors deliver 2.2x Essential Performance and higher deep learning training and inference performance than prior generation. Visuals for Professional Compute

The Intel® Xeon® Scalable Processors are designed to support an Designed for entry-level servers used by expanding range of existing and emerging data center, and network small-business customers and powering workloads, including cloud computing, high-performance computing and entry-level workstations used by business artificial intelligence. professionals worldwide, the Intel® Xeon® processor E3-1200 v6 product family supports the increasing workloads ® ® and workflows of today’s server and workstation customers, delivering Intel Atom C3000 Processors Series greater business intelligence, acceleration and agility. Efficient Intelligence at the Edge

The Intel® Atom® C3000 processor delivers new options for cost and infrastructure High Performance Computing is becoming an increasingly important part both datacenter Target Applications: optimization, by bringing the efficient and enterprise workloads. Machine Learning applications help organizations make performance and intelligence of Intel® Atom® intelligent decisions by sifting through mountains of data generated by edge devices, ‧Data mining, Analytics and processor into a dense, lower-power customer databases, historical trends, and other key indicators. Databases ‧Imaging, Molecular Dynamics, system-on-a-chip (SoC), designed specifically Weather, Climate Modeling and TYAN’s HPC platforms are based on the latest Intel® Xeon® Scalable Processor Family and for network and edge solutions. Atmospheric feature support for new technologies like AVX512 and Intel® Omni-Path Networking Fabric. ‧Oil, Gas and Petroleum Exploration The Intel® Atom® C3000 processor is Intel’s third generation ‧Physic and Scientific Research system-on-a-chip based CPU manufactured on Intel’s optimized 14nm TYAN’s platforms also offer the widest support in the industry for PCIe based accelerator cards. ‧Cryptography process technology. It can be deployed for a variety of light scale-out ‧Particle Physics workloads that require very low power, high density, and high I/O ‧Genetic Sequencing integration. ‧Cryptocurrency Mining ‧Large Scale Facial Recognition ‧Machine Learning and Artificial Intelligence

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. 3 4 ● TYAN HPC Platforms │ Intel Based ● TYAN HPC Platforms │ Intel Based

Thunder HX Thunder HX HPC Platforms FA77-B7119 FT48T-B7105 HPC Platforms

4U2S 10-GPU server platform Pedestal/4U2S 5-GPU workstation

Cloud Computing Platforms designed for AI/Deep Learning platform designed for GPU Cloud Computing Platforms applications accelerated technical computing

Model Number FA77-B7119 Model Number FT48T-B7105 Enclosure Form Factor 4U (30.3" in depth) Enclosure Form Factor Pedestal/4U (27.5" in depth) Supported CPU (2) Intel® Xeon® Scalable Processor Supported CPU (2) Intel® Xeon® Scalable Processor Chipset Intel® C621 PCH + (2) PLX PEX8796 PCIe switches Chipset Intel® C621 PCH CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s Number of DIMM Slot 24/ (12+12) Number of DIMM Slot 12/ (6+6) Memory Type Follow latest Intel® Xeon® Scalable Platform DDR4 Memory POR* ® ® (max. capacity) *: Actual memory speed depends on populated CPU models Memory Type Follow latest Intel Xeon Scalable Platform DDR4 Memory POR* (max. capacity) *: Actual memory speed depends on populated CPU models Storage Controller Intel® C621 PCH (SATA 6Gb/s) Storage Controller Intel® C621 PCH (SATA 6Gb/s) RAID Support RAID 0, 1, 5, 10 (Intel® RSTe) RAID Support RAID 0, 1, 5, 10 (Intel® RSTe) Networking (2) 10GbE + (1) IPMI Networking (2) 10GbE + (1) IPMI (10) double-wide PCIe x16 + (1) single-wide PCIe x16 + PCI Expansion Slots (5) double-wide PCIe x16 + (1) single-wide PCIe x16 + (1) PCIe x16 Tyan Mezz. slots + (2) OCuLink 8x (SFF-8612) connectors for 4x NVMe PCI Expansion Slots (2) NVMe M.2 (22110/2280) slots Power Supply (3+1) 4,800W RPSU Power Supply (1+1) 2,000W RPSU Standard Model # Storage Bay # PCIe slots Networking B7119F77V14HR-2T-N (14) hot-swap 2.5" (10) DW PCIe x16 + (2) 10GBase-T + Standard Model # Storage Bay # PCIe slots Networking (SAS/SATA only) (1) PCIe x16 + (1) 1000Base-T (IPMI) B7105F48TV4HR-2T-N (4) hot-swap 3.5" (5) DW PCIe x16 + (2) 10GBase-T + Storage Platforms (1) Storage Mezz. (6 system fans) (SAS/SATA only) (1) PCIe x16 + (2) M.2 (1) 1000Base-T (IPMI) Storage Platforms B7119F77V10E4HR-2T-N (14) hot-swap 2.5" (10) DW PCIe x16 + (2) 10GBase-T + B7105F48TV4HR-2T-G (4) hot-swap 3.5" (5) DW PCIe x16 + (2) 10GBase-T + (up to 4x NVMe U.2) (1) PCIe x16 + (1) 1000Base-T (IPMI) (3 system fans) (SAS/SATA only) (1) PCIe x16 + (2) M.2 (1) 1000Base-T (IPMI) (1) Storage Mezz.

Thunder HX Thunder HX Embedded Platforms Embedded Platforms FT77D-B7109 GA88-B5631

4U2S 8-GPU server platform 1U1S 4-GPU server platform designed for embarrassingly designed for GPUDirect RDMA parallel workloads applications

Model Number FT77D-B7109 Model Number GA88-B5631 Enclosure Form Factor 4U (30.3" in depth) Enclosure Form Factor 1U (34.8" in depth)

® ® ® ® Mezzanine Cards Mezzanine Cards Supported CPU (2) Intel Xeon Scalable Processor Supported CPU (1) Intel Xeon Scalable Processor Chipset Intel® C621 PCH + (4) PLX PEX8747 PCIe switches Chipset Intel® C621 PCH + (2) PLX PEX8747 PCIe switches CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s CPU Interconnect - Number of DIMM Slot 24/ (12+12) Number of DIMM Slot 12 Memory Type Follow latest Intel® Xeon® Scalable Platform DDR4 Memory POR* Memory Type Follow latest Intel® Xeon® Scalable Platform DDR4 Memory POR* (max. capacity) *: Actual memory speed depends on populated CPU models (max. capacity) *: Actual memory speed depends on populated CPU models Storage Controller Intel® C621 PCH (SATA 6Gb/s) Storage Controller Intel® C621 PCH (SATA 6Gb/s) RAID Support RAID 0, 1, 5, 10 (Intel® RSTe) RAID Support RAID 0, 1, 5, 10 (Intel® RSTe) Networking (2) 10GbE + (1) IPMI Networking (2) 10GbE + (1) IPMI (8) double-wide PCIe x16 + (1) single-wide PCIe x16 + (4) double-wide PCIe x16 + (1) single-wide PCIe x16 + PCI Expansion Slots PCI Expansion Slots (2) PCIe x8 Tyan Mezz. slots (2) NVMe M.2 (22110/2280) slots Power Supply (2+1) 3,200W RPSU Power Supply (1+1) 1,600W RPSU Standard Model # Storage Bay # PCIe slots Networking Standard Model # Storage Bay # PCIe slots Networking B7109F77DV14HR-2T-N (14) hot-swap 2.5" (8) DW PCIe x16 + (2) 10GBase-T + B5631G88V2HR-2T-N (2) hot-swap 2.5" (4) DW PCIe x16 + (2) 10GBase-T + (SAS/SATA only) (1) PCIe x16 + (2) Tyan Mezz. (1) 1000Base-T (IPMI) (SAS/SATA only) (1) PCIe x16 + (2) M.2 (1) 1000Base-T (IPMI) B7109F77DV10E4HR-2T-N (14) hot-swap 2.5" (8) DW PCIe x16 + (2) 10GBase-T + (up to 4x NVMe U.2) (2) Tyan Mezz. (1) 1000Base-T (IPMI)

5 6 ● TYAN HPC Platforms │ Intel Based

Thunder HX HPC Platforms FT48B-B7100

4U2S 4-GPU server platform designed for industrial automation INTEL-BASED and large scale video capture Cloud Computing Platforms applications CLOUD PLATFORMS

Model Number FT48B-B7100 Enclosure Form Factor 4U (27.5" in depth) Supported CPU (2) Intel® Xeon® Scalable Processor Chipset Intel® C621 PCH CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s Number of DIMM Slot 12/ (6+6) Memory Type Follow latest Intel® Xeon® Scalable Platform DDR4 Memory POR* (max. capacity) *: Actual memory speed depends on populated CPU models Storage Controller Intel® C621 PCH (SATA 6Gb/s) RAID Support RAID 0, 1, 5, 10 (Intel® RSTe) Networking (2) GbE (1 shared IPMI NIC) PCI Expansion Slots (4) PCIe x16 + (3) PCIe x8 + (2) NVMe M.2 (1x 2280 + 1x 2242) slots Power Supply (1+1) 1,600W RPSU Standard Model # Storage Bay # PCIe slots Networking B7100F48BV10HR-N (10) hot-swap 2.5" (4) PCIe x16 + (2) 1000Base-T (SAS/SATA only) (3) PCIe x8 + (2) M.2 (1 shared w/ IPMI) Storage Platforms

Tempest HX Server Board WS Board Tempest HX Server Board WS Board

Embedded Platforms S7100 S7105

S5533GM2NR-LE

Dual-socket server/workstation Dual-socket server/workstation implementation for HPC applications implementation for HPC applications Mezzanine Cards Processor ‧(2) Intel® Xeon® Scalable Processor Processor ‧(2) Intel® Xeon® Scalable Processor ® ® Chipset ‧Intel C621 PCH Chipset ‧Intel C621 PCH Cloud Computing is a major technology trend that is transforming the way organizations Target Applications: Memory ‧(6+6) DDR4 DIMM slots Memory ‧(6+6) DDR4 DIMM slots deploy hardware. Moving workloads to the cloud involves taking servers that would have ‧(4) PCIe x16 slots ‧(6) PCIe x16 slots gone into local server closets and deploying them in a centralized datacenter where ‧Big Data Analytics ‧ ‧ Expansion ‧(3) PCIe x8 slots Expansion (5) PCIe x8 slots (mux'd with adjacent PCIe x16 slots) density and energy performance are key. Streaming Data Processing ‧(2) NVMe M.2 slots ‧(2) NVMe M.2 slots ‧Data Enrichment ® Storage ‧(14) SATA 6Gb/s (Intel® RSTe) Storage ‧(10) SATA 6Gb/s (Intel RSTe) ‧Trigger Event Detection ® TYAN has a wide range of Cloud Computing server platforms that feature outstanding ‧Complex Session Analysis ‧ ® ‧(2) 10GBase-T ports (Intel x550-AT2) Network (2) 1000Base-T ports (Intel I350-AM2; 1 shared w/ IPMI) Network ‧ ‧(1) 1000Base-T port dedicate for IPMI (Realtek RTL8211E-VB-CG) compute, storage, and memory density along with industry leading energy efficiency. In-Memory Databases ‧ASPEED AST2500 Integrated Graphics (Server SKU) ‧ ‧ Interactive Analysis Video & Audio ‧ASPEED AST2510 Integrated Graphics (Workstation SKU) ASPEED AST2500 Integrated Graphics Video & Audio ‧ ‧Data Visualization ‧Realtek ALC892-GR (Workstation SKU) Realtek ALC892-CG ‧ Management ‧iBMC w/ iKVM (Server SKU) Management iBMC w/ iKVM ‧ Form Factor ‧SSI EEB Form Factor 14.23" x 13.24" Standard Model PCH SAS NVMe BMC Audio Standard Model PCH SAS NVMe BMC Audio S7100GM2NR C621 - M.2 Yes - S7105AGM2NR-2T C621 - M.2 Yes Yes S7100AG2NR C621 - M.2 - Yes S7100AGM2NR-EX C621 - M.2 Yes Yes 7 8 ● TYAN Cloud Computing Platforms │ Intel Based ● TYAN Cloud Computing │ Intel Based

Thunder CX Thunder CX HPC Platforms TN200-B7108-X4S GT75B-B7102 HPC Platforms

2U4N server platform designed 1U2S server platform with for hyper-converged and HPC maximum memory support for Cloud Computing Platforms Cloud Computing Platforms workloads virtualization applications

Model Number TN200-B7108-X4S Model Number GT75B-B7102 Enclosure Form Factor 2U (33.8" in depth) Enclosure Form Factor 1U (29.72" in depth)

® ® ® ® (2) Intel Xeon Scalable Processor Supported CPU (per node) (2) Intel Xeon Scalable Processor Supported CPU Chipset Intel® C621 PCH Chipset (per node) Intel® C621 PCH CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s Number of DIMM Slot 24/ (12+12) (per node) Memory Type Follow latest Intel® Xeon® Scalable Platform DDR4 Memory POR* Number of DIMM Slot 16/ (8+8) (max. capacity) *: Actual memory speed depends on populated CPU models (per node) ® Memory Type (per node) Follow latest Intel® Xeon® Scalable Platform DDR4 Memory POR* Storage Controller Intel C621 PCH (SATA 6Gb/s) (max. capacity) *: Actual memory speed depends on populated CPU models RAID Support RAID 0, 1, 5, 10 (Intel® RSTe) Storage Controller (2) 10GbE + (1) IPMI Intel® C621 PCH (SATA 6Gb/s) Networking (per node) (2) PCIe x16 + (1) PCIe x8 OCP Mezz. + (1) PCIe x8 Storage Mezz. + (2) NVMe M.2 PCI Expansion Slots RAID Support (per node) RAID 0, 1, 5, 10 (Intel® RSTe) (2280) slots Networking (per node) (1) IPMI Power Supply (1+1) 750W RPSU PCI Expansion Slots (1) PCIe x16 + (1) PCIe x8 + (1) PCIe x16 OCP 2.0 Mezz. + Standard Model # Storage Bay # PCIe slots Networking (per node) (2) NVMe M.2 (22110/2280) slots B7102G75BV10HR-2T (10) hot-swap 2.5" (2) PCIe x16 + (1) OCP Mezz. + (2) 10GBase-T + Power Supply (1+1) 2,200W RPSU (SAS/SATA only) (1) Storage Mezz. + (2) M.2 (1) 1000Base-T (IPMI) (10) hot-swap 2.5" (1) PCIe x16 + (1) OCP Mezz. + (2) 10GBase-T + Storage Platforms Standard Model # Storage Bay # PCIe slots (per node) Networking (per node) B7102G75BV6E4HR-2T Storage Platforms (up to 4x NVMe U.2) (1) Storage Mezz. + (2) M.2 (1) 1000Base-T (IPMI) B7108T200X4-220PE6HR (24) hot-swap 2.5" (1) PCIe x16 + (1) PCIe x8 + (1) 1000Base-T (NVMe U.2/SATA only) (1) OCP 2.0 Mezz. + (2) M.2 (IPMI)

Thunder CX Thunder CX

Embedded Platforms TN200-B7108-X4L GT24E-B7106 Embedded Platforms

2U4N server platform designed 1U2S server platform for for hyper-converged and HPC cost-effective CSP server workloads applications

Model Number TN200-B7108-X4L Model Number GT24E-B7106 Enclosure Form Factor 2U (33.8" in depth) Enclosure Form Factor 1U (25.4" in depth)

® ® ® ® (2) Intel Xeon Scalable Processor Supported CPU (per node) (2) Intel Xeon Scalable Processor Supported CPU Chipset Intel® C621 PCH Mezzanine Cards Chipset (per node) Intel® C621 PCH Mezzanine Cards CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s Number of DIMM Slot 16/ (8+8) (per node) Memory Type Follow latest Intel® Xeon® Scalable Platform DDR4 Memory POR* Number of DIMM Slot 16/ (8+8) (max. capacity) *: Actual memory speed depends on populated CPU models (per node) ® Memory Type (per node) Follow latest Intel® Xeon® Scalable Platform DDR4 Memory POR* Storage Controller Intel C621 PCH (SATA 6Gb/s) (max. capacity) *: Actual memory speed depends on populated CPU models RAID Support RAID 0, 1, 5, 10 (Intel® RSTe) Storage Controller (2) GbE + (1) IPMI Intel® C621 PCH (SATA 6Gb/s) Networking (per node) (2) PCIe x16 + (1) PCIe x16 OCP 2.0 Mezz. + PCI Expansion Slots RAID Support (per node) RAID 0, 1, 5, 10 (Intel® RSTe) (1) PCIe x16 Storage Mezz. + (1) NVMe M.2 (2280/2260/2242) slots Networking (per node) (1) IPMI Power Supply (1+1) 770W RPSU PCI Expansion Slots (1) PCIe x16 + (1) PCIe x8 + (1) PCIe x16 OCP 2.0 Mezz. + Standard Model # Storage Bay # PCIe slots Networking (per node) (2) NVMe M.2 (22110/2280) slots B7106G24EV4HR (4) hot-swap 3.5" (2) PCIe x16 + (1) OCP 2.0 (2) 1000Base-T + Power Supply (1+1) 2,200W RPSU (SAS/SATA only) + Mezz. + (1) Storage Mezz. (1) 1000Base-T (IPMI) (2) int. 2.5"(SATA SSD only) + (1) M.2 Standard Model # Storage Bay # PCIe slots (per node) Networking (per node) B7108T200X4-220PV3HR (12) hot-swap 3.5" (1) PCIe x16 + (1) PCIe x8 + (1) 1000Base-T B7106G24EV2E2HR (4) hot-swap 3.5" (2) PCIe x16 + (1) OCP 2.0 (2) 1000Base-T + (SAS/SATA only) (1) OCP 2.0 Mezz. + (2) M.2 (IPMI) (up to 2x NVMe U.2) + Mezz. + (1) M.2 (1) 1000Base-T (IPMI) (2) int. 2.5"(SATA SSD only)

9 10 ● TYAN Cloud Computing Platforms │ Intel Based

Tempest CX Server Board Tempest CX Server Board

HPC Platforms S7106 S7103 INTEL-BASED

Cloud Computing Platforms STORAGE PLATFORMS

Rack-optimized dual-socket server Cost-optimized dual-socket server implementation for CSP application server implementation for general server deployment

deployment Processor ‧(2) Intel® Xeon® Scalable Processor ‧Intel® C621 PCH Processor ‧(2) Intel® Xeon ® Scalable Processor Chipset ‧Intel® C622 PCH (-L2 SKU) ® ‧Intel C621 PCH Memory ‧(6+6) DDR4 DIMM slots Chipset ® ‧Intel C622 PCH (-L2 SKU) ‧(2) PCIe x16 slots Expansion Memory ‧(8+8) DDR4 DIMM slots ‧(5) PCIe x8 slots ‧(14) SATA 6Gb/s (Intel ® RSTe) ‧(2) PCIe x24 slots Storage ‧ ‧(1) PCIe x16 OCP 2.0 mezz. slot (8) SAS 12Gb/s (Broadcom Integrated RAID) (-W SKU) Expansion ® ‧(1) PCIe x16 storage mezz. slot ‧(2) 1000Base-T ports (Intel i350-AM2) (N/A on (W)GM2NR-2F-L2 SKUs) ‧(2) 10GBase SFP+ ports (Intel® C622 PCH integrated x722) (-2F SKU) ‧(1) NVMe M.2 slot Network ‧(1) 1000Base-T port dedicate for IPMI (Realtek RTL8211E-VB-CG) Storage ‧(14) SATA 6Gb/s (Intel ® RSTe) Video ‧ASPEED AST2500 Integrated Graphics ‧(2) 1000Base-T ports (2x Intel® i210-AT) Network Management ‧iBMC w/ iKVM ‧(1) 1000Base-T port dedicate for IPMI (Realtek RTL8211E-VB-CG) Form Factor ‧EATX Storage Platforms Video ‧ASPEED AST2500 Integrated Graphics Standard Model PCH SAS GbE BMC 10GbE ‧iBMC w/ iKVM Management S7103GM2NR C621 - Yes Yes - Form Factor ‧EATX S7103WGM2NR C621 12G IOC Yes Yes - Standard Model PCH SAS NVMe BMC 10GbE S7103GM2NR-2F-L2 C622 - - Yes Yes S7103WGM2NR-2F-L2 C622 12G IOC - Yes Yes S7106GM2NR C621 - M.2 Yes - S7103GM4NR-2F-L2 C622 - Yes Yes Yes S7106GM2NR-L2 C622 - M.2 Yes - S7103WGM4NR-2F-L2 C622 12G IOC Yes Yes Yes

Tempest CX Server Board Tempest CX Server Board

Embedded Platforms S5542 S5542-UHE

Single-socket server implementation Single-socket server motherboard for for CSP entry server deployment appliances deployment Mezzanine Cards ‧(1) Intel® Xeon® E3-1200 v5/v6 Processor ‧(1) Intel® Xeon® E3-1200 v5/v6 Processor Processor Processor ‧ th th ® ‧ th th ® (1) 6 /7 Generation Intel Core™ i3 Processor (1) 6 /7 Generation Intel Core™ i3 Processor Data storage is an enormous problem for organizations spanning many different markets. Target Applications: ‧ ® ‧ ® Chipset Intel C232 PCH Chipset Intel C236 PCH (-UHE SKU) Video surveillance and high definition video distribution are a few examples of workloads Memory ‧(4) DDR4 DIMM slots Memory ‧(4) DDR4 DIMM slots that deal with mountains of data. TYAN offers a full line of storage servers capable of ‧Software Defined Storage ‧ ‧(1) PCIe x16 slot (w/ x8 link) ‧(1) PCIe x16 slot (w/ x8 link) storing massive amounts of data, from 1U servers with 12 3.5” HDD bays designed for High Speed Data Streaming Expansion ‧(1) PCIe x8 slot (w/ x4 link) (N/A on -W SKU) Expansion ‧(2) PCIe x8 slots ‧Distributed Database Applications ‧(2) PCIe x1 slots ‧(2) PCIe x1 slots Hadoop workloads to enormous 4U servers capable of storing more than a petabyte; TYAN ‧Content Distribution

® has a range of storage servers that can meet the needs of any storage application. Storage ‧(6) SATA 6Gb/s (Intel® RST) ‧(7) SATA 6Gb/s (Intel RST) (-M2 SKU) ‧Enterprise Workloads Storage ‧(8) SATA 6Gb/s (Intel® RST) (-UHE SKU) ‧Object Storage ‧(4) 1000Base-T ports (4x Intel® i210-AT) (4N SKUs) ‧Virtualization Network ‧(2) 1000Base-T ports (2x Intel® i210-AT) (2N SKUs) Network ‧(2) 1000Base-T ports (2x Intel® i210-AT) ‧(1) 100Base-T port dedicate for IPMI (Broadcom BCM5221A) Video ‧Intel® CPU Integrated Graphics Video ‧ASPEED AST2400 Integrated Graphics Form Factor ‧ATX Management ‧iBMC w/ iKVM Standard Model PCH SAS M.2 BMC GbE Form Factor ‧ATX S5542G2NR-UHE C236 - - - 2 Standard Model PCH SAS M.2 BMC GbE S5542G2NR-UHE-M2 C236 - Yes (SATA) - 2 S5542GM2NR C232 - - Yes 2 S5542WGM2NR C232 12G IOC - Yes 2 S5542GM4NR C232 - - Yes 4 11 S5542WGM4NR C232 12G IOC - Yes 4 12 ● TYAN Storage Platforms │ Intel Based ● TYAN Storage Platforms │ Intel Based

Thunder SX Thunder SX HPC Platforms FA100-B7118 TN70E-B7106 HPC Platforms

2U2S server platform for 4U2S storage server platform virtualization and server-based designed for hyper-scale storage

Cloud Computing Platforms storage applications Cloud Computing Platforms capacity requirement Model Number TN70E-B7106 Enclosure Form Factor 2U (27.56" in depth) Model Number FA100-B7118 Supported CPU (2) Intel® Xeon® Scalable Processor Enclosure Form Factor 4U (42" in depth) Chipset Intel® C621 PCH Supported CPU (2) Intel® Xeon® Scalable Processor CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s Chipset Intel® C621 PCH Number of DIMM Slot 16/ (8+8) CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s Memory Type Follow latest ntel® Xeon® Scalable Platform DDR4 Memory POR* Number of DIMM Slot 16/ (8+8) (max. capacity) *: Actual memory speed depends on populated CPU models Memory Type Follow latest ntel® Xeon® Scalable Platform DDR4 Memory POR* Storage Controller Intel® C621 PCH (SATA 6Gb/s) (max. capacity) *: Actual memory speed depends on populated CPU models RAID Support RAID 0, 1, 5, 10 (Intel® RSTe) Storage Controller (2) Broadcom SAS3008 (SAS 12Gb/s) Networking (2) GbE + (1) IPMI RAID Support - (6) PCIe x8 (on risers) + (1) PCIe x16 OCP 2.0 Mezz. + PCI Expansion Slots Networking (1) IPMI (1) PCIe x16 Storage Mezz. + (1) NVMe M.2 (2280/2260/2242) slots PCI Expansion Slots (1) PCIe x16 + (1) PCIe x16 OCP 2.0 Mezz. + (1) NVMe M.2 (22110/2280) slots Power Supply (1+1) 770W RPSU Power Supply (1+1) 1,600W RPSU Standard Model # Storage Bay # PCIe slots Networking Standard Model # Storage Bay # PCIe slots Networking B7106T70EV12HR (12) hot-swap 3.5" (6) PCIe x8 + (2) 1000Base-T + B7118F100V100HR (100) hot-swap 3.5" (1) PCIe x16 + (1) 1000Base-T (SAS/SATA only) + (1) OCP 2.0 Mezz. + (1) 1000Base-T (IPMI) (SATA 6Gb/s only) (1) OCP 2.0 Mezz. + (1) M.2 (IPMI) (2) hot-swap 2.5" (1) Storage Mezz. +

Storage Platforms (SATA 6Gb/s only) (1) M.2 Storage Platforms B7106T70EV8E4HR (12) hot-swap 3.5" (6) PCIe x8 + (2) 1000Base-T + (up to 4x NVMe U.2) + (1) OCP 2.0 Mezz. + (1) 1000Base-T (IPMI) (2) hot-swap 2.5" (1) M.2 (SATA 6Gb/s only)

Thunder SX Thunder SX

Embedded Platforms TN76-B7102 TN70A-B7106 Embedded Platforms

2U2S server platform with 2U2S server platform for maximum memory support for virtualization and server-based virtualization applications storage applications

Model Number TN70A-B7106 Model Number TN76-B7102 Enclosure Form Factor 2U (27.56" in depth) Enclosure Form Factor 2U (30.1" in depth) Supported CPU (2) Intel® Xeon® Scalable Processor Supported CPU (2) Intel® Xeon® Scalable Processor Mezzanine Cards Chipset Intel® C621 PCH Mezzanine Cards Chipset Intel® C621 PCH CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s CPU Interconnect (2) Intel® UPI 10.4/9.6 GT/s Number of DIMM Slot 16/ (8+8) Number of DIMM Slot 24/ (12+12) Memory Type Follow latest Intel® Purley Platform DDR4 Memory POR* ® ® Memory Type Follow latest ntel Xeon Scalable Platform DDR4 Memory POR* (max. capacity) *: Actual memory speed depends on populated CPU models (max. capacity) *: Actual memory speed depends on populated CPU models Storage Controller Intel® C621 PCH (SATA 6Gb/s) Storage Controller Intel® C621 PCH (SATA 6Gb/s) RAID Support RAID 0, 1, 5, 10 (Intel® RSTe) RAID Support RAID 0, 1, 5, 10 (Intel® RSTe) Networking (2) GbE + (1) IPMI Networking (2) 10GbE + (1) IPMI (6) PCIe x8 (on risers) + (1) PCIe x16 OCP 2.0 Mezz. + PCI Expansion Slots (3) PCIe x16 (2 support double-width GPU cards) or (6) PCIe x8 (on risers) + (1) PCIe x16 Storage Mezz. + (1) NVMe M.2 (2280/2260/2242) slots PCI Expansion Slots (2) PCIe x8 + (1) PCIe x8 OCP Mezz. + (1) PCIe x8 Storage Mezz. + Power Supply (1+1) 770W RPSU (2) NVMe M.2 (2280) slots Standard Model # Storage Bay # PCIe slots Networking Power Supply (1+1) 1,200W RPSU B7106T70AV26HR (24) hot-swap 2.5" (6) PCIe x8 + (2) 1000Base-T + Standard Model # Storage Bay # PCIe slots Networking (SAS/SATA only) + (1) OCP 2.0 Mezz. + (1) 1000Base-T (IPMI) B7102T76V12HR-2T-N (12) hot-swap 3.5" (3) PCIe x16 (or 6x PCIe x8) + (2) 10GBase-T + (2) hot-swap 2.5" (1) Storage Mezz. + (SAS/SATA only) (2) PCIe x8 + (1) OCP Mezz. + (1) 1000Base-T (IPMI) (SATA 6Gb/s only) (1) M.2 (1) Storage Mezz. + (2) M.2 B7102T76V12HR-2T-G (12) hot-swap 3.5" (2) PCIe x16 + (2) PCIe x8 + (2) 10GBase-T + (SAS/SATA only) (1) OCP Mezz. + (1) 1000Base-T (IPMI) (1) Storage Mezz. + (2) M.2 13 14 ● TYAN Storage Platforms │ Intel Based ● TYAN Storage Platforms │ Intel Based

Thunder SX Thunder SX HPC Platforms GT86C-B5630 GT62F-B5630 HPC Platforms

1U1S server/storage platform 1U1S server/storage platform designed for hybrid NVMe/SATA designed for CSP server-based

Cloud Computing Platforms cache storage applications Cloud Computing Platforms storage applications Model Number GT62F-B5630 Model Number GT86C-B5630 Enclosure Form Factor 1U (24.6" in depth) 1U (33.86" in depth) Enclosure Form Factor Supported CPU (1) Intel® Xeon® Scalable Processor ® ® Supported CPU (1) Intel Xeon Scalable Processor Chipset Intel® C621 PCH ® Chipset Intel C621 PCH CPU Interconnect - CPU Interconnect - Number of DIMM Slot 12 Number of DIMM Slot 12 Memory Type Follow latest Intel® Xeon® Scalable Platform DDR4 Memory POR* Memory Type Follow latest Intel® Xeon® Scalable Platform DDR4 Memory POR* (max. capacity) *: Actual memory speed depends on populated CPU models *: Actual memory speed depends on populated CPU models (max. capacity) Storage Controller Intel® C621 PCH (SATA 6Gb/s) ® Storage Controller Intel C621 PCH (SATA 6Gb/s) RAID Support RAID 0, 1, 5, 10 (Intel® RSTe) ® RAID Support RAID 0, 1, 5, 10 (Intel RSTe) Networking (1) IPMI Networking (1) IPMI (1) PCIe x16 + (1) PCIe x16 OCP 2.0 Mezz. slots + PCI Expansion Slots PCI Expansion Slots (1) PCIe x16 + (1) PCIe x16 OCP 2.0 Mezz. slots (2) OCuLink 8x (SFF-8612) connectors for 4x NVMe Power Supply (1) 500W PSU or (1+1) 500W RPSU Power Supply (1+1) 650W RPSU Standard Model # Storage Bay # PCIe slots PSU Standard Model # Storage Bay # PCIe slots Networking B5630G86CV12 (12) int. 3.5" + (2) int. 2.5" (1) PCIe x16 + (1) 500W; B5630G62FV10HR (10) hot-swap 2.5" (1) PCIe x16 + (1) 1000Base-T (SAS/SATA only) (1) OCP 2.0 Mezz. 80+ Platinum (SAS/SATA only) (1) OCP Mezz. (Dedicate for IPMI) B5630G86CV12R (12) int. 3.5" (1) PCIe x16 + (1+1) 500W RPSU; B5630G62FV6E4HR (10) hot-swap 2.5" (1) PCIe x16 + (1) 1000Base-T Storage Platforms (SAS/SATA only) (1) OCP 2.0 Mezz. 80+ Gold (up to 4x NVMe U.2) (1) OCP Mezz. (Dedicate for IPMI) Storage Platforms B5630G62FV2E8HR (10) hot-swap 2.5" (1) OCP Mezz. (1) 1000Base-T (up to 8 NVMe U.2) (Dedicate for IPMI)

Thunder SX Tempest SX Server Board Server Board

Embedded Platforms GT62B-B5539 S5630 S5620 Embedded Platforms

1U1S server/storage platform designed for hybrid NVMe/SATA cache storage applications

Single-socket server implementation for Single-socket server implementation for Model Number GT62B-B5539 Enclosure Form Factor 1U (24.6" in depth) storage server deployment storage server deployment

Mezzanine Cards ® ® Mezzanine Cards Supported CPU (1) Intel Xeon processor D 1500 series Processor ‧(1) Intel® Xeon® Scalable Processor Processor ‧(1) Intel® Xeon® E5-2600 v3 / v4 series ® ® Chipset Embedded in Intel Xeon D 1500 series processor ® ‧InteI C621 PCH Chipset ‧Intel® C612 PCH Chipset CPU Interconnect - ‧InteI® C622 PCH (-L2 SKU) Memory ‧(8) DDR4 DIMM slots Number of DIMM Slot 4 Memory ‧(12) DDR4 DIMM slots ‧(1) PCIe x16 slot Follow latest Intel® Grangeville Platform DDR4 Memory POR* ‧ (1) PCIe x16 slot Expansion ‧(1) PCIe x8 OCP mezz. slot Memory Type RDIMM (DR) 2400* (128GB) ‧(1) PCIe x16 OCP 2.0 mezz. slot Expansion ‧(2) SFF-8643 connectors for 2x NVMe connectivity (-E SKU) (max. capacity) UDIMM ECC (DR) 2400* (64GB) ‧(2) OCuLink 8x (SFF-8612) connectors for 4x NVMe connectivity *: Actual memory speed depends on populated CPU models ‧(10) SATA 6Gb/s (Intel® RSTe) (-E SKU) Storage ® ® ‧(6) SAS 6Gb/s (Broadcom Integrated RAID) (-W SKU) Storage Controller Embedded in Intel Xeon D 1500 series processor Storage ‧(14) SATA 6Gb/s (Intel® RSTe) RAID Support - ‧(2) 1000Base-T port (Intel® I210-AT; 1 shared w/ IPMI) Network ‧(1) 1000Base-T port dedicate for IPMI (Realtek RTL8211E-VB-CG) Network ‧ ® (2) 10GBase-T + (2) 1000Base-T + (1) IPMI (-2T SKU) or (2) 1000Base-T port (Intel I350-AM2)(4N SKUs) Networking ‧ASPEED AST2500 Integrated Graphics (2) 1000Base-T + (1) IPMI Video Video ‧ASPEED AST2400 Integrated Graphics ‧iBMC w/ iKVM PCI Expansion Slots (1) PCIe x8 OCP Mezz. Management Management ‧iBMC w/ iKVM ‧SSI CEB Power Supply (1+1) 450W RPSU Form Factor Form Factor ‧ATX Standard Model # Storage Bay # PCIe slots Networking Standard Model PCH SAS NVMe BMC 10GbE Standard Model PCH SAS NVMe BMC GbE (10) hot-swap 2.5" (1) OCP Mezz. (2) 10GBase-T + (2) 1000Base-T + B5539G62BV6E4HR-D41-2T S5630GMR C621 - - Yes - S5620GM2NR C612 - - Yes 2 (up to 4x NVMe U.2) (1) 1000Base-T (Dedicate for IPMI) (BTO) S5630GMRE C621 - OCuLink 8x Yes - S5620GM2NRE C612 SFF-8643 Yes 2 B5539G62BV6E4HR-D41 (10) hot-swap 2.5" (1) OCP Mezz. (2) 1000Base-T + (1) 1000Base-T S5630GMRE-L2 C622 - OCuLink 8x Yes - S5620WGM2NR C612 6G IOC - Yes 2 (BTO) (up to 4x NVMe U.2) (Dedicate for IPMI) S5620WGM4NR C612 6G IOC - Yes 4 S5620WGM4NRE C612 6G IOC SFF-8643 Yes 4 15 (BTO) 16 ● TYAN HPC Platforms │ Intel Based

HPC Platforms TN52J-E3252 INTEL-BASED

Cloud Computing Platforms 2U dual-controller storage EMBEDDED PLATFORMS expansion enclosure for mission-critical applications

Model Number TN52J-E3252

Enclosure Form Factor 2U (20.4" in depth) Chipset Microsemi PM8055 SAS 12Gb/s Expander RAID Support JBOD (RAID via controller) # of IOM per Enclosure / # of Ext. Connector per 2 / (4) SFF-8644 (MiniSAS HD) IOM Power Supply (1+1) 580W RPSU

Standard Model # Storage Bay # External Connector PSU J3252T52U24HR-U8DR (24) hot-swap 2.5" (4) SFF-8644 per IOM; (1+1) 580W RPSU; (SAS/SATA only) (8) SFF-8644 per 80+ Gold enclosure Storage Platforms

Embedded Platforms TN70J-E3250

Cost-effective 2U single-controller storage expansion enclosure Mezzanine Cards

Model Number TN70J-E3250 Enclosure Form Factor 2U (27.56" in depth) Embedded server applications require specifications that go above and beyond what is Target Applications: expected from a standard server platform. The servers used to design industrial Chipset Broadcom SAS3x24R SAS 12Gb/s Expander computers, network appliances, military hardware, and many other specialized server ‧IoT, Security, Surveillance ‧ RAID Support JBOD (RAID via controller) deployments must conform to higher standards. Telecommunications # of IOM per Enclosure / ‧Networking # of Ext. Connector per 1 / (3) SFF-8644 (MiniSAS HD) ‧Industrial Automation IOM TYAN offers a line of motherboards that feature parts from the Intel Embedded roadmap ‧Military Power Supply (1+1) 450W RPSU which include long lifespan and extended temperature bands, allowing for ruggedized ‧Digital Signage and Imaging servers and platforms that last much longer than the industry standard 3-year lifespan. ‧Set Top Box Standard Model # Storage Bay # External Connector PSU ‧Gaming J3250T70W12HR-U8 (12) hot-swap 3.5" (3) SFF-8644 (1+1) 450W RPSU; ‧Storage (SAS/SATA only) 80+ Gold ‧Medical & Healthcare

17 18 ● TYAN Embedded Platforms │ Intel Based

Tempest EX Embedded Server Tempest EX Embedded Server

HPC Platforms S3227 S5539

Cloud Computing Platforms MEZZANINE CARDS Platform targeting dedicated web-hosting, Platform targeting dynamic web-hosting, warm cold storage, NAS and security appliances storage, server-based storage and security

‧ ® ® Processor ‧(1) Intel® Atom® C3000 Processor Processor (1) Intel Xeon Processor D 1500 series ‧ ® ® Chipset ‧Included in Intel® Atom® C3000 Processor Chipset Included in Intel Xeon Processor D 1500 series ‧ ‧(2) DDR4 DIMM slots Memory (4) DDR4 DIMM slots Memory ‧(1) DDR4 DIMM slot (-C338 SKU) ‧(1) PCIe x8 slot ‧(1) PCIe x8 OCP mezz. slot Expansion ‧(1) PCIe x8 slot ‧(1) PCIe x4 slot ‧(1) PCIe x8 storage mezz. Slot Expansion ‧ (1) SFI connector in-lined w/ PCIe x8 slot for 10GbE mezzanine option Storage ‧(4) SATA 6Gb/s ‧(2) SATA 6Gb/s co-layout w/ (2) M.2 ‧(2) SATA 6Gb/s ‧(2) 1000Base-T ports (2x Intel® i210-AT) Storage ‧ (1) SATA M.2 Network ‧(2) 10GBase-T ports (Intel® x557-AT2) (-2T SKU) Network ‧(2) 1000Base-T ports (Realtek RTL8111H) ‧(1) 1000Base-T port dedicate for IPMI (Realtek RTL8211E-VB-CG) Video ‧N/A Video ‧ASPEED AST2400 Integrated Graphics Management ‧N/A Management ‧iBMC w/ iKVM Form Factor ‧Mini-ITX Form Factor ‧μ-ATX Standard Model CPU # CPU Core DIMM BMC 10GbE Option Standard Model CPU # CPU Core DIMM BMC 10GbE 2-channel S5539GM2NR-D77 Xeon® D-1577 16 2-Channel DDR4-2133 Yes - S32272NR-C958 Atom® C3958 16 - Yes ® Storage Platforms DDR4-2400 S5539GM2NR-D67 Xeon D-1567 12 2-Channel DDR4-2133 Yes - 2-channel S32272NR-C858 Atom® C3958 12 - Yes S5539GM2NR-D57 Xeon® D-1567 12 2-Channel DDR4-2133 Yes - DDR4-2400 S5539GM2NR-D71 Xeon® D-1571 16 2-Channel DDR4-2133 Yes - ® 2-channel S32272NR-C538 Atom C3958 4 - Yes ® DDR4-2133 S5539GM4NR-D41-2T Xeon D-1541 8 2-Channel DDR4-2133 Yes Yes 1-channel S5539GM2NR-D41 Xeon® D-1541 8 2-Channel DDR4-2133 Yes - S32272NR-C338 Atom® C3958 2 - - DDR4-1866 S5539GM2NR-D21 Xeon® D-1521 4 2-Channel DDR4-2133 Yes -

Tempest EX WS Board Embedded Tempest EX Embedded

Embedded Platforms S5545 S5547

S5533GM2NR-LE

Embedded workstation motherboard Embedded motherboard in compact size supports both server/client processors for appliance deployment Mezzanine Cards

‧(1) 6th/7th Generation Intel® Core™ i3/i5/i7 Processor Processor ‧(1) 6th/7th Generation Intel® Core™ i3/i5/i7 Processor Processor ‧(1) Intel® Xeon® E3-1200 v5/v6 Processor Chipset ‧Intel® H110 PCH TYAN adopts a modular I/O approach with many of its server platforms. This design flexibility ‧Intel® Q170 PCH Chipset Memory ‧(2) DDR4 DIMM slots allows customers to deploy a single base motherboard with a wide variety of networking and ‧Intel® C236 PCH (-HE SKU) ‧(1) PCIe x16 slot storage options. It also allows customers to upgrade portions of their server without having to Memory ‧(4) DDR4 DIMM slots Expansion ‧(1) PCIe x8 slot ‧(1) PCIe x16 slot replace core parts such as the motherboard. ‧ ® Expansion ‧(1) PCIe x8 slot (w/ x4 link) Storage (4) SATA 6Gb/s (Intel RST) ‧(1) PCIe x1 slot ® ® Network ‧(2) 1000Base-T ports (Intel i210-AT & Intel i219-LM) TYAN’s mezzanine cards span today’s most common technologies, with network speeds ranging Storage ‧(6) SATA 6Gb/s (Intel® RST) ‧Intel® CPU Integrated Graphics Video from 1000Base-T all the way to 100 Gigabit QSFP28 and storage controllers spanning both Network ‧(2) 1000Base-T ports (Intel® i210-AT & Intel® i219-LM) Management ‧N/A ® simple SAS IOC and RAID controllers. Video ‧Intel CPU Integrated Graphics Form Factor ‧f-ATX Management ‧HD 7.1 (Realtek ALC892-GR) Standard Model PCH SAS NVMe BMC Audio Form Factor ‧μ-ATX S5547G2NR H110 - - - - Standard Model PCH SAS NVMe BMC Audio S5545AG2NR Q170 - - - Yes S5545AG2NR-HE C236 - - - Yes 19 20 ● TYAN Mezzanine Cards ● TYAN Mezzanine Cards

OCP LAN Mezzanine OCP LAN Mezzanine OCP LAN Mezzanine OCP LAN Mezzanine

HPC Platforms M7106-C604-1H M7106-C202-2V M7062-I599-2T M7062-I599-1T HPC Platforms Cloud Computing Platforms Cloud Computing Platforms

Cavium, OCP Cavium, OCP Intel, OCP Intel, OCP Ethernet Network Adapter Ethernet Network Adapter Ethernet Network Adapter Ethernet Network Adapter

Chipset ‧Cavium QL45604 Chipset ‧Cavium QL41202 Chipset ‧Intel® 82599ES Chipset ‧Intel® 82599EN Host Interface ‧PCIe Gen.3 x16 Host Interface ‧PCIe Gen.3 x8 Host Interface ‧PCIe Gen.2 x8 Host Interface ‧PCIe Gen.2 x8 Storage Platforms Storage Platforms Data Trans. Rate ‧(1) 100Gb/s Ethernet Data Trans. Rate ‧(2) 25Gb/s Ethernet Data Trans. Rate ‧(2) 10Gb/s Ethernet Data Trans. Rate ‧(1) 10Gb/s Ethernet Network Interface ‧(1) QSFP28 Network Interface ‧(2) SFP28 Network Interface ‧(2) SFP+ Network Interface ‧(1) SFP+ Form Factor ‧OCP 2.0 w/ Type 1 connector Form Factor ‧OCP w/ Type 1 connector Form Factor ‧OCP w/ Type 1 connector Form Factor ‧OCP w/ Type 1 connector

OCP LAN Mezzanine OCP LAN Mezzanine OCP LAN Mezzanine OCP LAN Mezzanine M7106-B414-2V M7086-X710-2F M7076-X540-2T M7076-I350 Embedded Platforms Embedded Platforms Mezzanine Cards Mezzanine Cards

Broadcom, OCP Intel, OCP Intel, OCP Intel, OCP Ethernet Network Adapter Ethernet Network Adapter Ethernet Network Adapter Ethernet Network Adapter

Chipset ‧Broadcom BCM57414 Chipset ‧Intel® X710-AM2 Chipset ‧Intel® X540-BT2 Chipset ‧Intel® I350-BT2 Host Interface ‧PCIe Gen.3 x8 Host Interface ‧PCIe Gen.3 x8 Host Interface ‧PCIe Gen.2 x8 Host Interface ‧PCIe Gen.2 x8 Data Trans. Rate ‧(2) 25Gb/s Ethernet Data Trans. Rate ‧(2) 10Gb/s Ethernet Data Trans. Rate ‧(2) 10Gb/s Ethernet Data Trans. Rate ‧(2) 1Gb/s Ethernet Network Interface ‧(2) SFP28 Network Interface ‧(2) SFP+ Network Interface ‧(2) 10GBase-T Network Interface ‧(2) 1000Base-T Form Factor ‧OCP w/ Type 1 connector Form Factor ‧OCP w/ Type 1 connector Form Factor ‧OCP w/ Type 1 connector Form Factor ‧OCP w/ Type 1 connector

21 2022 ● TYAN Mezzanine Cards ● TYAN Mezzanine Cards

GPU Server LAN Mezzanine GPU Server LAN Mezzanine SAS Mezzanine SAS Mezzanine

HPC Platforms M7059F77A-FDR-2 M7109F77D-V710-2V M7076-3108-8i M7076-3008-8i HPC Platforms Cloud Computing Platforms Cloud Computing Platforms

Broadcom, Tyan Storage Mezzanine Broadcom, Tyan Storage Mezzanine Mellanox, Tyan GPU Mezzanine Intel, Tyan GPU Mezzanine 8-port SAS I/O Controller 8-port SAS RAID Controller

InfiniBand Network Adapter Ethernet Network Adapter ‧ Chipset Broadcom SAS3108 Chipset ‧Broadcom SAS3008 ‧ Cache 1GB cache Host Interface ‧PCIe Gen.3 x8 in a high-density connector Chipset ‧Mellanox MT27508A1-FCCR-FV ® Chipset ‧Intel XXV710-AM2 ‧ Host Interface PCIe Gen.3 x8 in a high-density connector Data Trans. Rate ‧12Gb/s SAS Storage Platforms Host Interface ‧PCIe Gen.2 x8 Storage Platforms Host Interface ‧PCIe Gen.3 x8 ‧ Data Trans. Rate 12Gb/s SAS Device Interface ‧(2) SFF-8643 support up to (8) devices Data Trans. Rate ‧(2) 56Gb/s InfiniBand Data Trans. Rate ‧(2) 25Gb/s Ethernet ‧ Device Interface (2) SFF-8643 support up to (8) devices RAID Level ‧RAID 0/1/1E/10 (Broadcom Integrated RAID) Network Interface ‧(2) QSFP+ Network Interface ‧(2) SFP28 ‧ RAID Level RAID 0/1/5/10/50 (Broadcom MegaRAID) Form Factor ‧2.52" x 3.52" Form Factor ‧2.6" x 5.5" ‧2.6" x 5.5" Form Factor Form Factor ‧3.31" x 3.52"

GPU Server LAN Mezzanine GPU Server LAN Mezzanine SAS Exp. HBA SATA HBA M7059F77A-X540 M7059F77A-I350 P3280 P3260 Embedded Platforms Embedded Platforms Mezzanine Cards Mezzanine Cards

Intel, Tyan GPU Mezzanine Intel, Tyan GPU Mezzanine Broadcom, Tyan SAS Expander Adapter Marvell, Tyan SATA HBA Ethernet Network Adapter Ethernet Network Adapter 32-/24-port SAS Expander 12-port SATA I/O Controller

® ® Chipset ‧Broadcom SAS35x36 Chipset ‧Intel X540-BT2 Chipset ‧Intel I350-BT2 Chipset ‧(3) Marvell 88SE9235 ‧(2) SFF-8643 (P3280-24I) Host Interface ‧PCIe Gen.2 x8 Host Interface ‧PCIe Gen.2 x8 Host Interface Host Interface ‧(3) SFF-8643 ‧(1) SFF-8643 (P3280-24I8E) Data Trans. Rate ‧(2) 10Gb/s Ethernet Data Trans. Rate ‧(2) 1Gb/s Ethernet Data Trans. Rate ‧6Gb/s SATA Data Trans. Rate ‧12Gb/s SAS Network Interface ‧(2) 10GBase-T ‧ ‧ Network Interface (2) 1000Base-T ‧(6) SFF-8643 support up to (24) int. devices Device Interface (3) SFF-8643 support up to (12) int. devices Device Interface Form Factor ‧2.6" x 5.5" Form Factor ‧2.6" x 5.5" ‧(2) SFF-8644 fanout for ext. devices (P3280-24I8E only) Form Factor ‧2.54" x 6.6" Form Factor ‧2.54" x 10.34" 23 2024 ● TYAN Mezzanine Cards

NVMe Mezzanine NVMe Mezzanine NVMe M.2 Adapter NOTES HPC Platforms M7106-4E M5539-2E P2111-2M Cloud Computing Platforms

Tyan NVMe M.2 Adapter Tyan NVMe Mezzanine Tyan NVMe Mezzanine PCIe Bifurcation for NVMe M.2 Devices PCIe Bifurcation for NVMe Devices PCIe Bifurcation for NVMe Devices

Host Interface ‧PCIe Gen.3 x16 Host Interface ‧PCIe Gen.3 x16 in (2) high-density connectors Host Interface ‧PCIe Gen.3 x8 in a high-density connector ‧(2) M.2 (M-key) 22110 / 2280 / 2260 / 2242 Device Interface ‧(2) SFF-8612 support up to (4) NVMe devices ‧ Device Interface Device Interface (2) SFF-8643 support up to (2) NVMe devices ‧PCIe x8 in a high-density connector Form Factor ‧3.31" x 3.52" ‧ Storage Platforms Form Factor 2.52" x 3.52" Form Factor ‧2.54" x 6.6"

NVMe Adapter NVMe Adapter NVMe M.2 Adapter M2092 M2093 M2110-2M Embedded Platforms

For use with P2111-2M only Mezzanine Cards

Tyan NVMe Adapter Tyan NVMe Adapter Tyan NVMe M.2 Adapter PCIe Bifurcation for NVMe Devices PCIe Bifurcation for NVMe Devices PCIe Bifurcation for NVMe M.2 Devices

‧ Host Interface ‧PCIe Gen.3 x8 Host Interface ‧PCIe Gen.3 x16 Host Interface PCIe Gen.3 x8 in a high-density connector ‧ Device Interface ‧(2) SFF-8643 support up to (2) NVMe devices Device Interface ‧(2) SFF-8612 support up to (4) NVMe devices Device Interface (2) M.2 (M-key) 22110 / 2280 / 2260 / 2242 ‧ Form Factor ‧2.54" x 6.6" Form Factor ‧2.54" x 6.6" Form Factor 2.2" x 5.5" Note ‧For use with P2111-2M only

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