07137_Fully_Buffered_DIMM.qxd 22.03.2007 12:08 Uhr Seite 1
Product Information April 2007
Fully Buffered Complete in-house solution DIMM up to 8 GB
DDR2 SDRAM DIMM
With the ever increasing operation frequency the number of DIMM modules on a memory channel with the current parallel stub-bus interface has hit saturation * point. For server applications where lots of DRAM components are required, a new solution replacing the Registered DIMM modules for data rates of 533 Mb/s Advantages and above becomes necessary. s Maximum DRAM density per channel s World-class module assembly The FB-DIMM channel architecture introduces a new memory interconnect s Optimized heat sink solution s Power Saving Trench Technology – designed technology, which enables high memory capacity with high-speed DRAMs. The for optimized power consumption transition to serial point-to-point connections between the memory controller s Full JEDEC compliant and Intel validated and the first module on the channel, and between subsequent modules down the channel, makes the bus-loading independent from the DRAM input/output Availability (IO) speed. This enables high memory capacity with high-speed DRAMs. s DDR2-533, DDR2-667 and DDR2-800 s Densities from 512 MB up to 8 GB The FB-DIMM requires high-speed chip design and DRAM expertise. Qimonda Features is uniquely positioned to provide the entire skill set in-house, which clearly s Based on Qimonda’s 512 Mb and demonstrates Qimonda’s solution competence. Qimonda supplies FB-DIMMs in 1 Gb component two AMB sources with optimized heat sink design using power-saving DDR2 s Buffer with up to 6 Gb/s per pin s Complete data buffering on DIMM components. s Extension of high density portfolio with 4-rank support Key technical data
Operating voltage AMB: 1.4 V – 1.6 V, DRAM: 1.7 V – 1.9 V, EEPROM: 1.7 V – 3.6 V DRAM peak bandwidth 4.2 / 5.3 / 6.4 GB/s Link transfer rate 3.2 / 4.0 / 4.8 GB/s GT/s Operating temperature 0 °C – +85 °C (at 10 % to 90 % humidity) FB-DIMM high-speed differential point-to-point (1.5 V), External interfaces SMBus (AMB control, EEPROM) External clock 133 / 166.5 / 200 MHz * color can vary Pads 240 07137_Fully_Buffered_DIMM.qxd 22.03.2007 12:08 Uhr Seite 2
Product Information April 2007
DDR2 Fully buffered DIMMs for Server
Module Organization Genera- Component Compo. # of ranks Module Module speed Sales description Dash no. Ordering code Prod. Green density tion organization package on module height
1 GB 128 M x 72 512 M 64 M x 8 FBGA-60 2 30 mm PC2-4200 4-4-4 HYS72T128020HFN -3.7-A not for new design now
128 M x 72 512 M 64 M x 8 FBGA-60 2 30 mm PC2-4200 4-4-4 HYS72T128420HFN -3.7-A not for new design now
128 M x 72 512 M 64 M x 8 FBGA-60 2 30 mm PC2-4200 4-4-4 HYS72T128020HFD -3.7-A not for new design now
128 M x 72 512 M 64 M x 8 FBGA-60 2 30 mm PC2-4200 4-4-4 HYS72T128420HFD -3.7-A not for new design now
128 M x 72 512 M 64 M x 8 FBGA-60 2 30 mm PC2-5300 5-5-5 HYS72T128420HFN -3S-A not for new design now
128 M x 72 512 M 64 M x 8 FBGA-60 2 30 mm PC2-5300 5-5-5 HYS72T128420HFD -3S-A not for new design now 128 M x 72 512 M 64 M x 8 FBGA-60 2 30 mm PC2-5300 5-5-5 HYS72T128420HFN -3S-B SP000108161 now 128 M x 72 512 M 64 M x 8 FBGA-60 2 30 mm PC2-5300 5-5-5 HYS72T128420HFA -3S-B SP000108153 now 128 M x 72 512 M 64 M x 8 FBGA-60 2 30 mm PC2-5300 5-5-5 HYS72T128420HFD -3S-B SP000218302 now
2 GB 256 M x 72 512 M 128 M x 4 FBGA-60 2 30 mm PC2-4200 4-4-4 HYS72T256020HFN -3.7-A not for new design now
256 M x 72 512 M 128 M x 4 FBGA-60 2 30 mm PC2-4200 4-4-4 HYS72T256420HFN -3.7-A not for new design now
256 M x 72 512 M 128 M x 4 FBGA-60 2 30 mm PC2-4200 4-4-4 HYS72T256020HFD -3.7-A not for new design now
256 M x 72 512 M 128 M x 4 FBGA-60 2 30 mm PC2-4200 4-4-4 HYS72T256420HFD -3.7-A not for new design now
256 M x 72 512 M 128 M x 4 FBGA-60 2 30 mm PC2-5300 5-5-5 HYS72T256420HFN -3S-A not for new design now
256 M x 72 512 M 128 M x 4 FBGA-60 2 30 mm PC2-5300 5-5-5 HYS72T256420HFD -3S-A not for new design now 256 M x 72 512 M 128 M x 4 FBGA-60 2 30 mm PC2-5300 5-5-5 HYS72T256420HFN -3S-B SP000108124 now 256 M x 72 512 M 128 M x 4 FBGA-60 2 30 mm PC2-5300 5-5-5 HYS72T256420HFA -3S-B SP000108116 now 256 M x 72 512 M 128 M x 4 FBGA-60 2 30 mm PC2-5300 5-5-5 HYS72T256420HFD -3S-B SP000221223 now 4 GB 512 M x 72 1 G 512 M x 4 SDFBGA 2 30 mm PC2-4200 4-4-4 HYS72T512022HFN -3.7-A on request now 512 M x 72 1 G 512 M x 4 SDFBGA 2 30 mm PC2-4200 4-4-4 HYS72T512422HFN -3.7-A SP000108181 now 512 M x 72 1 G 512 M x 4 SDFBGA 2 30 mm PC2-4200 4-4-4 HYS72T512022HFD -3.7-A on request now 512 M x 72 1 G 512 M x 4 SDFBGA 2 30 mm PC2-4200 4-4-4 HYS72T512422HFD -3.7-A SP000204825 now 512 M x 72 1 G 512 M x 4 SDFBGA 2 30 mm PC2-5300 5-5-5 HYS72T512422HFN -3S-A SP000222141 now 512 M x 72 1 G 512 M x 4 SDFBGA 2 30 mm PC2-5300 5-5-5 HYS72T512422HFD -3S-A SP000222140 now 512 M x 72 1 G 512 M x 4 SDFBGA 2 30 mm PC2-5300 5-5-5 HYS72T512422EFN -3S-B SP000108183 2Q07 512 M x 72 1 G 512 M x 4 SDFBGA 2 30 mm PC2-5300 5-5-5 HYS72T512422EFA -3S-B SP000108177 2Q07 512 M x 72 1 G 512 M x 4 SDFBGA 2 30 mm PC2-5300 5-5-5 HYS72T512422EFD -3S-B SP000225667 2Q07
Nomenclature DDR2 FB-DIMM
HYS 72 T 128 0 2 0 H F A 3.7 -A (Example)
Part number Component die revision indicator extension
Speed 3.7 = PC2-4200 4-4-4 DDR2-533 3s = PC2-5300 5-5-5 DDR2-667
AMB variant N / D / A / E (variable options)
Module family F = Fully-buffered DIMM
Package type H = Lead-free (RoHS*-compliant)
Designator Product variations
Number of 0 = One Memory Module rank memory ranks 2 = Two Memory Module ranks 4 = Four Memory Module ranks Ordering no. QIM07137FB-0307-2.5, Printed in Germany, UNID
Designator Data sheet defined (heat sink options)
Memory density 64 = 64 Mb per DQ 128 = 128 Mb 256 = 256 Mb 512 = 512 Mb
Power supply T = 1.8 V
Data width 72 = x 72 (ECC)
Prefix HYS = Standard prefix for SDRAM-based Memory Modules
*RoHS = Restriction of Hazardous Substances
Please note The information in this document is subject to change without notice. The information herein describes certain components and shall not be considered as guarantee of characteristics.