Intel® Core™ I7-900/I7-800/I7-700 Mobile Processor
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Intel® Core™ i7-900 Mobile Processor Extreme Edition Series, Intel Core i7-800 and i7-700 Mobile Processor Series Datasheet- Volume One This is volume 1 of 2. Refer to document 320766 for Volume 2 September 2009 Document Number: 320765 -001 INFORMATIONLegal Lines and Disclaimers IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. 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All rights reserved. 2 Datasheet Contents 1Features Summary.................................................................................................. 10 1.1 Introduction ..................................................................................................... 10 1.2 Processor Feature Details ................................................................................... 12 1.2.1 Supported Technologies .......................................................................... 12 1.3 Interfaces ........................................................................................................ 12 1.3.1 System Memory Support ......................................................................... 12 1.3.2 PCI Express* ......................................................................................... 13 1.3.3 Direct Media Interface (DMI).................................................................... 14 1.3.4 Platform Environment Control Interface (PECI)........................................... 15 1.4 Power Management Support ............................................................................... 15 1.4.1 Processor Core....................................................................................... 15 1.4.2 System ................................................................................................. 15 1.4.3 Memory Controller.................................................................................. 15 1.4.4 PCI Express* ......................................................................................... 15 1.4.5 DMI...................................................................................................... 15 1.5 Thermal Management Support ............................................................................ 15 1.6 Package ........................................................................................................... 16 1.7 Terminology ..................................................................................................... 16 1.8 Related Documents ........................................................................................... 18 2Interfaces................................................................................................................ 20 2.1 System Memory Interface .................................................................................. 20 2.1.1 System Memory Technology Supported ..................................................... 20 2.1.2 System Memory Timing Support............................................................... 21 2.1.3 System Memory Organization Modes......................................................... 21 2.1.4 Rules for Populating Memory Slots............................................................ 23 2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA) ........ 23 2.1.6 DRAM Clock Generation........................................................................... 24 2.1.7 System Memory Pre-Charge Power Down Support Details ............................ 24 2.2 PCI Express Interface ........................................................................................ 24 2.2.1 PCI Express Architecture ......................................................................... 24 2.2.2 PCI Express Configuration Mechanism ....................................................... 26 2.2.3 PCI Express* Ports and Bifurcation ........................................................... 27 2.3 DMI................................................................................................................. 27 2.3.1 DMI Error Flow....................................................................................... 27 2.3.2 Processor/PCH Compatibility Assumptions.................................................. 27 2.3.3 DMI Link Down ...................................................................................... 27 2.4 Platform Environment Control Interface (PECI)...................................................... 28 2.5 Interface Clocking ............................................................................................. 28 2.5.1 Internal Clocking Requirements................................................................ 28 3 Technologies ........................................................................................................... 30 3.1 Intel® Virtualization Technology (Intel® VT) ........................................................ 30 3.1.1 Intel® VT-x Objectives ........................................................................... 30 3.1.2 Intel VT-x Features................................................................................. 31 3.1.3 Intel® VT-d Objectives ........................................................................... 31 3.1.4 Intel VT-d Features Supported ................................................................. 32 3.1.5 Intel VT-d Features Not Supported ........................................................... 32 3.2 Intel® Trusted Execution Technology (Intel® TXT) ................................................ 32 3.3 Intel® Hyper-Threading Technology .................................................................... 33 3.4 Intel® Turbo Boost Technology ........................................................................... 33 Datasheet 3 3.4.1 Intel Turbo Boost Technology Processor Frequency......................................34 4 Power Management .................................................................................................36 4.1 ACPI States Supported .......................................................................................36 4.1.1 System States........................................................................................36 4.1.2 Processor Core/Package Idle States...........................................................36 4.1.3 Integrated Memory Controller States.........................................................37 4.1.4 PCIe Link States .....................................................................................37 4.1.5 DMI States ............................................................................................37 4.1.6 Interface State Combinations ...................................................................38 4.2 Processor Core Power Management ......................................................................38 4.2.1 Enhanced Intel SpeedStep® Technology....................................................39 4.2.2