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Gkougkousis RD50 B Setup.Pdf 37TH RD50 Workshop A comprehensive MIP measurement & analysis system Evangelos –Leonidas Gkougkousis CERN, EP-R&D WG 1.1: Hybride Pixel Detectors Geneva – November 19th, 2020 Mechanics General Overview Spacers M4x20 screws All parts in transit from CERN since last Friday source container source support back Trigger source support DUT front Aluminum support assembly (reduced size) baseplate 20 / 11 / 2020 E. L. Gkougkousis 2 Mechanics Individual Pieces https://twiki.cern.ch/twiki/bin/view/Main/HGTDSensorTesting#Mechanics • Assembled on aluminum Specifications breadboard base Outer dimensions 250 x 220 x 10 mm • M5 tapped hole grid, 15 mm Material Aluminum Plate spacing Grid type M5 • 10 mm thickness recommended Grid size 16 X 14 Grid spacing 15 mm for stability Base Distance form grid end to edge 12.5 mm + + = • 3-piece aluminum L-shaped support frame for board alignment and mounting • M5 screws used for fixing to baseplate & mount sensor board to the frame Plane support Plane • 165 mm x 120 mm outer dimentions • 2xM5, 10 mm nuts per board mounting hole as spacers. • 2-pice support designed for CERN sources • Encapsulates an L-frame plane support • 3D printed piece + • ABS with a 99% fill factor for mechanical stability • Non-metallic parts to avoid bremsstrahlung • Assures correct alignment with boards and sensors Source Holder Source 20 / 11 / 2020 E. L. Gkougkousis 3 Electronics st 1 Stage Amplifier • Electronics based on UCSC single channel board • High frequency SiGe (~2GHz) common emitter first stage charge amplifier (470 Ohm trans-impedance) • Based on Iminium transistor (Vcc >1.25V) with well calibrated gain to voltage ratio • 1.8 mm 4-layer FRP architecture with buried signal layer • SMA calibration inputs and dielectric impedance test • 2.25 V input, ~17 mA Estimated gain of 10 Extremely fast shaping time (< 1 ns) Bandwidth limited (especially at low frequencies) Relative expensive No hot-swap available High leakage current because of heavy decoupling Integrated low pass Reworked Double Amplifier Calibration filtering at HV, LV side area, input input capacitor with limited cut-off ground diode capacitor (missing) contract assembly (replaced (removed) ) https://twiki.cern.ch/twiki/bin/view/Main/HGTDSensorTesting#Second_Stage_Amplifier 20 / 11 / 2020 E. L. Gkougkousis 4 Electronics https://twiki.cern.ch/twiki/bin/view/Main/LgadSecondStage 2nd Stage Amplifier • Mini-Circuits integrated GALI-52 Voltage amplifier on test board • Gallium Phosphate technology with 2GHz bandwidth • 15.5 dB at 50 Ohm matched impedance • 0.64 dB insertion loses at 1 GHz • Supply Voltage: 12 +/- 0.2 V • Supply current: 60 +/- 10 mA • Amplifier directly mounted to Readout board • Aluminum shield cover with M1.2 screws for shielding • Outer dimensions 36 x 40 mm • SMA to SMA connector (18 GHz cut-off), rated at 1.5kV https://twiki.cern.ch/twiki/bin/view/Main/LgadCables Cables and connectors • Direct SMA-BNC cables (no converters) for signal, HV and LV • 50 Ohm, 20 GHz, RG-174 standard with 2m max length • Thin Coaxial cooper shielded cables, PTFE insulation • 100 dB/m shielding effectiveness with 3kV operating voltage (HYTEM HY402FLEX) • banana-BNC converters at the HV and LV side 20 / 11 / 2020 E. L. Gkougkousis 5 •Environmental Expander (EnviE) https://gitlab.cern.ch/egkougko/environemental-monitoring-expander-envie • Based on an ESP8266 microcontroller with integrated 10- bit ADC, I2C and WiFi 802.11b • Integrated OLED 128X64 pixel screen • Base board 3 humidity and 5 temperature channels • High precision voltage dividers and sensor decoupling • ARDUINO / LoUA core based • Temperature resolution of 0.8 oC ± 0.06 % • Humidity resolution of 0.1 % across the range with integrated temperature compensation 20 / 11 / 2020 E. L. Gkougkousis 6 Assembly Absorbers – Shields 90 푒− 90 푒− 90 50mm x 50mm tin plated 38푆푟 → 39푌 → 40푍푟 metal shield covers on both sides Emax= 0.46 MeV Emax= 2.28 MeV T1/2 = 28,8 y T1/2 = 64 h Multi-energetic electron 300mm diameter circular spectrum openings at center of both Emax at 2.28MeV front and back covers on top Average energy ~ 939 keV from of the sensor pad 90Y decay Average energy ~ 188 keV from 90Sr decay 30 μm thickness, 2 x 2 cm Al foil attached on both openings Low temperature Multi-metal solder (91% Tin 9% Zinc) 20 / 11 / 2020 E. L. Gkougkousis 7 Assembly Wire bonding TRD for temp. sensing Gold plated dive-in pins Assembled sensor • Wire bonds are to be kept to a minimum distance from sensor to reduce inductance • Gold-plated dive-in pads required • Flatness of top sensor pad to be guaranteed • Anisotropically conductive adhesive tape to attach sensor (3M155818-ND ) https://www.digikey.com/product-detail/en/3m-tc/3-4-5-9703/3M155818- ND/3830765 20 / 11 / 2020 E. L. Gkougkousis 8 Functional Setups Schematics Board type Sampic LeCroy WR Channels 16 4 Sampling Rate 8.4Gs/sec 20 Gs/sec Impedance 50 Ω 50 Ω MCX, SMA, BNC, USB, Connectors USB, Ethernet GPIB slave Bandwidth 1.6GHz 5GHz Resolution 8 – 11 bit 8 bit (11 tough fit) Dynamic Scale 1V Range dependent 20 / 11 / 2020 E. L. Gkougkousis 9 Functional Setups Location, Location, Location HV 1 – Keithley 2410 DAQ & control PC 4-channel LV HV 2 – Keithley 2410 HMP4040 Climate Chamber 28/2/-020 (Binder MK-115) 40 Gs Oscilloscope (Agilent Infinium) Timing boards Second Stage amplifiers 20 / 11 / 2020 E. L. Gkougkousis 10 Functional Setups Location, Location, Location Replicate the lab setup at Previssin Use of an “Abandoned” iTk climate chamber Replace all infrastructure, mechanical supports and instruments Take care of Sr90 source (34 MBq) and RP procedures Software installation, configuration and testing Dry air provided from central circuit 20 / 11 / 2020 E. L. Gkougkousis 11 DAQ Software Current supported Instrument Library Supported Oscilloscopes Sampic Series v2.0 (16 ch version) TDS5000 series WaveRunner Infinium DS08000 Under Integration series series Compatible with models form the same family, may require minor adjustments if use of different model of one of the supported brands Supported Climate Chambers Votsch VT4002 Votsch VT4002 EM Votsch VC2020 Binder MK53 Binder MK115 + Air input Many more can be added, need to create a LabVIEW library for your model 20 / 11 / 2020 E. L. Gkougkousis 12 DAQ Software Current supported Instrument Library High voltage Supported Low Voltage Power supplies 363X series 364X series HMP4040 PL330DP 2400 / 2410 Multiple models supported from these series Will not support CAEN Units supported at any combination with a maximum of 4 Plans include support for channels 2600 series electrometers How does multi – instrument support work? Completely transparent for end user Selection of instrument through drop-down menus UI adapts to selected instrument (polymorphism) Acquired data have a single unique format (no matter which oscilloscope used) Customized commands and libraries used in each case New instrument integration easy through use of separated dedicated libraries 20 / 11 / 2020 E. L. Gkougkousis 13 DAQ Software 1 General Interface Tab interface organized in 4 sections: I. HV Control, V-I recording and visualization 2 II. Low Voltage and temperature control III. Oscilloscope and triggering mode control IV. Charged particle and auto-trigger sequencing and programming Multiple supported instruments with adaptive 4 3 polymorphic UI Integrated error handling and quai-full proof operation () 20 / 11 / 2020 E. L. Gkougkousis 14 DAQ Software Event Preview Real-time Waveform Visualization Dynamically enabled / only visible during data taking Available for LeCroy, Tektronix and Agilent oscilloscopes Holds last acquired waveform in case of error Re-initialization at program start-up Eliminate need to remotely access oscilloscope GUI 20 / 11 / 2020 E. L. Gkougkousis 15 DAQ Software HV Control and Monitoring HV PSU model select 1st HV channel control panel 2nd HV channel control panel Filename to save data (asci format, tab separated .txt) Voltage/Time graph (15 days implemented buffer size, reset afterwards) Current/Time graph (15 days implemented buffer size, reset afterwards) 20 / 11 / 2020 E. L. Gkougkousis 16 DAQ Software HV Control and Monitoring Data Logging: Current, Voltage and their uncertainties are recorded in a vertical line separated ASCII file. ONLY active channel recorded. Automatic start/Stop upon Example from output file: HV activation. • Default directory : /system/user/ • Data append existing file • File created at HV power on • Record only value variations to limit channel voltage current date time data size δV δI IVs: Simultaneously plotting both channel voltage and current vs time. Start automatically once at least one channel turned on. Auto scaling time axis. 15 day buffer for continues running. 20 / 11 / 2020 E. L. Gkougkousis 17 DAQ Software Agilent 363x + 364x Temperature and LV control Hameg HMP404 2 x Agilent 364x LV Selection menu 2 x Agilent 363x Votsh VT4002 No Air / VC2020 Votsh VT4002 Air Binder MK53 Climate chamber selection menu 20 / 11 / 2020 E. L. Gkougkousis 18 DAQ Software Oscilloscope Control Oscilloscope model select Oscilloscope settings control panel Timing and vertical scale control for up to 4 oscilloscope channels Triggering Mode select Coincidence trigger with multichannel logic or single channel edge trigger configuration 20 / 11 / 2020 E. L. Gkougkousis 19 DAQ Software Oscilloscope Control – Channel Settings Com. Interface: Sets the VISA port for the Oscilloscope type: Select one of the four supported oscilloscope types oscilloscope to to work with. Dialog box disabled when configure program running. Error: Error indicator will turn ON if communications fails, set parameters are out of range for instrument or instrument reports error. Turning panel OFF/ON clears error. Time-Base: Set time scale, time offset and memory depth in number of points. Sampling rate will be adjusted to maximum value for selected memory depth. Vertical setup: Voltage scale and offset, coupling, impedance (when available), ON/OFF: To turn on or off the oscilloscope one needs to bandwidth limit and probe use the corresponding buttons at the trigger attenuation settings.
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