H.264 Codec Family MS3500HCM01Wx1 Super Compact Full HD H.264 Codec Module Features High Picture Quality, Full HD 4:2:0 Color Space Support High Density Module Solution Low Latency Mode Support Low Power Consumption
Block Diagram
Enc. Module Dec. Module Video Video Input Output Video FPGA FPGA Video Enc. (TS MUX) (TS DEMUX) Dec. Transport Stream Audio Audio Enc. Dec. Audio Audio Input Output NAND NAND DDR2 Flash Flash DDR2 SDRAM (Firm/RTL) (Firm/RTL) SDRAM
Application Examples Video Conferencing Video Surveillance
Wireless Broadcasting Digital Signage
H.264 Codec Family MS3500HCM01Wx1 Specifications
MS3500HCM01WE1(Encoder) MS3500HCM01WD1(Decoder) Video Codec H.264/AVC H.264/AVC, MPEG2 Support Signals 1080i60, 1080i59.94, 1080i50, 720p60, 576i50, 480p59.94, 480i59.94 Audio Codec MPEG-1/2 Layer II,AAC-LC MPEG-1/2 Layer I,MPEG-1/2 Layer II,AAC-LC Video Interface Digital YUV (8bit x 2 or 16bit x 1) Max Video Bitrate H.264: 25M H.264:25M, MPEG2:T.B.D. Audio Interface I2S (Mono/Stereo x 1, 32KHz/44.1KHz/48KHz 16bit sampling) Stream Interface MPEG2-TS(8bit parallel/ serial selectable) or RTP (on Ethernet) Control Interface I2C Other Functions Dual stream encoding from one video source (Enc. Only) Interface Connector Samtec QSH-090 (180pin), USB-MicroAB connector for Firmware updating only Dimension 76mm(W) x 50mm(D) Power DC 5.0V Power Consumption 3W Specifications subject to change without prior notice. Evaluation Kit
MS3500EV01W MS3500DGC01W MS3500DGC02W(tentative)*1
Function Mother Board Interface Board Interface Board Control Interface Serial Controlled from Mother Controlled from Mother Component (YPbPr), Composite, Video Interface N.A. S-Video, HDMI, HD-SDI, SD-SDI CMOS HD camera (for input) Audio Interface Analog (L/R) HDMI SDI Stream Interface TS (CMOS level), Ethernet N.A. DVB-ASI, DVB-SPI Dimension 278mm(W) x 140mm(D) 180mm(W) x 110mm(D) T.B.D. Power AC100~240V Supplied from Mother Supplied from Mother Option N.A. CMOS HD Camera Module N.A. *1 Under development. Specifications subject to change without prior notice.
Manufactured by Distributed by
Europe North America Asia Germany (Düsseldorf Office) Silicon Valley Office (West) China (Shanghai Office) Michael Oelmann +49-2151-6435134 Monica Degnan +1-408-982-4638 Bing Wang +86-21-6163-1295 [email protected] [email protected] [email protected]
France (Paris Office) Chicago Office (East) Taiwan (Taipei Office) Ludovic Plante +33-1-39-26-01-60 Steve Keough +1-847-273-4350 Peter Ho +886-2-2522-6973 [email protected] [email protected] [email protected]
Rest of EMEA (Paris Office) Korea (Seoul Office) Pierre Inisan +33-1-39-26-01-74 Mitsuhiro Akeboshi +82-2-773-5692 [email protected] [email protected]
Hitachi High-Technologies. Printed in 2010.1