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Invensense 6-Axis OIS IMU & Stmicroelectronics LSM6DSM InvenSense 6-Axis OIS IMU & STMicroelectronics LSM6DSM IMU for OIS MEMS report by Stéphane ELISABETH November 2016 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 1 Table of Contents Overview / Introduction 4 Manufacturing Process Flow 57 o Executive Summary o Global Overview o Reverse Costing Methodology o ASIC Front-End Process Company Profile 7 o ASIC Wafer Fabrication Unit o InvenSense o MEMS Process Flow o iPhone 7 Plus Teardown o MEMS Wafer Fabrication Unit Physical Analysis 13 o Packaging Process Flow o Package Assembly Unit o Synthesis of the Physical Analysis Cost Analysis 76 o Physical Analysis Methodology o Synthesis of the cost analysis o Package 16 o Yields Explanation & Hypotheses Package Views & Dimensions o ASIC Die 81 Package Pin Out ASIC Front-End Cost Package Opening ASIC Back-End 0 : Probe Test & Dicing Wire Bonding Process ASIC Wafer & Die Cost Package Cross-Section o MEMS Die 84 o ASIC Die 27 MEMS Front-End Cost View, Dimensions & Marking MEMS Back-End 0 : Probe Test & Dicing Delayering MEMS Front-End Cost per process steps Main Blocks Identification MEMS Wafer & Die Cost Cross-Section o Component 90 Process Characteristics Back-End : Packaging Cost o MEMS Die 37 Back-End : Packaging Cost per Process Steps View, Dimensions & Marking Back-End : Final Test Cost Cap Removed & Cap Details 6-Axis OIS IMU Component Cost Sensing Areas Details Cross-Section (Sensor, Cap & Sealing) Estimated Price Analysis 95 Process Characteristics Company services 99 ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 2 Executive Summary Overview / Introduction o Executive Summary • This full reverse costing study has been conducted to provide insight on technology data, o Reverse Costing Methodology manufacturing cost and selling price of the 6-Axis IMU supplied by InvenSense and found in o Glossary the Apple iPhone 7 Plus. Company Profile & Supply Chain • Physical Analysis The IMU is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis Accelerometer) made for Apple and integrated in the iPhone 7 Plus. It’s an high performance 6-Axis motion tracking optimized for Manufacturing Process Flow optical image stabilization with enhanced Electronic Image stabilization support. Cost Analysis Selling Price Analysis • With dimensions of 3.0 x 3.0 x 0.75 mm, it can be applied to mobile, IOT, Drone, Wearable or imaging. About System Plus • It uses the same process as InvenSense’s previous generation generation 6-axis device found in the iPhone 6 and iPhone 6 Plus. ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 3 Executive Summary Overview / Introduction o Executive Summary • This full reverse costing study has been conducted to provide insight on technology data, o Reverse Costing Methodology manufacturing cost and selling price of the LSM6DSM 6-Axis IMU supplied by STMicro. o Glossary Company Profile & Supply Chain • By keeping the same footprint and decreasing considerably the power consumption compared to ST’s Physical Analysis previous generation IMU, the LSM6DSM is ready to attack the mobile market where the competition on price is stronger than ever. Manufacturing Process Flow Cost Analysis • The IMU is the most advanced of STMicroelectronics 6-Axis port-folio device (3-Axis gyroscope + 3-Axis Selling Price Analysis Accelerometer) made for motion tracking and optimized for optical image stabilization with enhanced About System Plus Electronic Image stabilization support. • It’s directly targeting the market of the OIS IMU from InvenSense found in the iPhone 7 Plus. • But with dimensions of 3.0 x 2.5 x 0.82 mm, it can be applied to mobile, IOT, Drone, Wearable or imaging. • The report includes a detailed technology and cost comparison with ST’s previous generation LSM6DS3, the latest ST’s IMU LSM6DSL and with leading edge 6-Axis OIS IMU from InvenSense found in the iPhone 7 Plus. ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 4 Reverse Costing Methodology Overview / Introduction o Executive Summary o Reverse Costing The reverse costing analysis is conducted in 3 phases: Methodology o Glossary Company Profile & Supply • Package is analyzed and measured Chain • The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking Physical Analysis Teardown • Setup of the manufacturing process. Manufacturing Process Flow analysis Cost Analysis Selling Price Analysis • Setup of the manufacturing environment About System Plus • Cost simulation of the process steps Costing analysis • Supply chain analysis • Analysis of the selling price Selling price analysis ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 5 Synthesis of the Physical Analysis Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 6 Synthesis of the Physical Analysis Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 7 Package View & Dimensions Overview / Introduction • Package: LGA 16-pin • Marking: Company Profile & Supply • Dimensions: 3.0 x 3.0 x 0.75 mm E Chain • Pin Pitch: 0.5 mm 7944 Physical Analysis o Synthesis CE7 o Package 3.0 mm o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus 3.0 mm Package Top View Package Bottom View 0.75 mm Package Side View ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 8 Package View & Dimensions Overview / Introduction • Package: LGA 14-pin • Marking: Company Profile & Supply • Dimensions: 3.0 x 2.5 x 0.82 mm SF Chain • Pin Pitch: 0.5 mm 627 Physical Analysis o Synthesis o Package 3.0 mm o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis 2.5 mm About System Plus Package Top View Package Bottom View 0.82 mm Package Side View ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 9 Package Cross-Section Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 10 Package Cross-Section Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 11 MEMS Sensing Area – Gyroscope Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 12 MEMS Sensing Area – Gyroscope Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 13 Comparison with MP67B & ICM-30630 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 14 Comparison with LSM6DS3 & LSM6DSL Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 15 MEMS Front-End Process Flow Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Global Overview o ASIC Front-End Process o MEMS Front-End Process o Packaging Process Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 16 MEMS – Sensor Process Flow 1/2 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Global Overview o ASIC Front-End Process o MEMS Front-End Process o Packaging Process Cost Analysis Selling Price Analysis About System Plus ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 17 ASIC Front-End Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost Selling Price Analysis About System Plus ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 18 MEMS Wafer & Die Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost
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