Invensense 6-Axis OIS IMU & Stmicroelectronics LSM6DSM

InvenSense 6-Axis OIS IMU & STMicroelectronics LSM6DSM

IMU for OIS MEMS report by Stéphane ELISABETH November 2016

21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 1 Table of Contents

Overview / Introduction 4 Manufacturing Process Flow 57 o Executive Summary o Global Overview o Reverse Costing Methodology o ASIC Front-End Process Company Profile 7 o ASIC Wafer Fabrication Unit o InvenSense o MEMS Process Flow o iPhone 7 Plus Teardown o MEMS Wafer Fabrication Unit Physical Analysis 13 o Packaging Process Flow o Package Assembly Unit o Synthesis of the Physical Analysis Cost Analysis 76 o Physical Analysis Methodology o Synthesis of the cost analysis o Package 16 o Yields Explanation & Hypotheses  Package Views & Dimensions o ASIC Die 81  Package Pin Out  ASIC Front-End Cost  Package Opening  ASIC Back-End 0 : Probe Test & Dicing  Wire Bonding Process  ASIC Wafer & Die Cost  Package Cross-Section o MEMS Die 84 o ASIC Die 27  MEMS Front-End Cost  View, Dimensions & Marking  MEMS Back-End 0 : Probe Test & Dicing  Delayering  MEMS Front-End Cost per process steps  Main Blocks Identification  MEMS Wafer & Die Cost  Cross-Section o Component 90  Process Characteristics  Back-End : Packaging Cost o MEMS Die 37  Back-End : Packaging Cost per Process Steps  View, Dimensions & Marking  Back-End : Final Test Cost  Cap Removed & Cap Details  6-Axis OIS IMU Component Cost  Sensing Areas Details  Cross-Section (Sensor, Cap & Sealing) Estimated Price Analysis 95  Process Characteristics Company services 99

Overview / Introduction o Executive Summary • This full reverse costing study has been conducted to provide insight on technology data, o Reverse Costing Methodology manufacturing cost and selling price of the 6-Axis IMU supplied by InvenSense and found in o Glossary the Apple iPhone 7 Plus. Company Profile & Supply Chain • Physical Analysis The IMU is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis Accelerometer) made for Apple and integrated in the iPhone 7 Plus. It’s an high performance 6-Axis motion tracking optimized for Manufacturing Process Flow optical image stabilization with enhanced Electronic Image stabilization support.

Cost Analysis Selling Price Analysis • With dimensions of 3.0 x 3.0 x 0.75 mm, it can be applied to mobile, IOT, Drone, Wearable or imaging. About System Plus • It uses the same process as InvenSense’s previous generation generation 6-axis device found in the iPhone 6 and iPhone 6 Plus.

Company Profile & Supply Chain • By keeping the same footprint and decreasing considerably the power consumption compared to ST’s

Physical Analysis previous generation IMU, the LSM6DSM is ready to attack the mobile market where the competition on price is stronger than ever. Manufacturing Process Flow

Cost Analysis • The IMU is the most advanced of STMicroelectronics 6-Axis port-folio device (3-Axis gyroscope + 3-Axis Selling Price Analysis Accelerometer) made for motion tracking and optimized for optical image stabilization with enhanced About System Plus Electronic Image stabilization support.

• It’s directly targeting the market of the OIS IMU from InvenSense found in the iPhone 7 Plus. • But with dimensions of 3.0 x 2.5 x 0.82 mm, it can be applied to mobile, IOT, Drone, Wearable or imaging. • The report includes a detailed technology and cost comparison with ST’s previous generation LSM6DS3, the latest ST’s IMU LSM6DSL and with leading edge 6-Axis OIS IMU from InvenSense found in the iPhone 7 Plus.

Overview / Introduction o Executive Summary o Reverse Costing The reverse costing analysis is conducted in 3 phases: Methodology o Glossary

Company Profile & Supply • Package is analyzed and measured Chain • The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking Physical Analysis Teardown • Setup of the manufacturing process. Manufacturing Process Flow analysis

Cost Analysis

Selling Price Analysis • Setup of the manufacturing environment About System Plus • Cost simulation of the process steps Costing analysis

• Supply chain analysis • Analysis of the selling price Selling price analysis

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction • Package: LGA 16-pin • Marking: Company Profile & Supply • Dimensions: 3.0 x 3.0 x 0.75 mm E Chain • Pin Pitch: 0.5 mm 7944 Physical Analysis o Synthesis CE7 o Package 3.0 mm o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus 3.0 mm

Package Top View Package Bottom View 0.75 mm

Package Side View

Overview / Introduction • Package: LGA 14-pin • Marking: Company Profile & Supply • Dimensions: 3.0 x 2.5 x 0.82 mm SF Chain • Pin Pitch: 0.5 mm 627 Physical Analysis o Synthesis o Package 3.0 mm o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis 2.5 mm About System Plus

Package Top View Package Bottom View 0.82 mm Package Side View

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow o Global Overview o ASIC Front-End Process o MEMS Front-End Process o Packaging Process

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow o Global Overview o ASIC Front-End Process o MEMS Front-End Process o Packaging Process

Cost Analysis

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost

Selling Price Analysis

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis o Financial Ratios o Manufacturer Price

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow Custom Analyses (>130 analyses per year) Cost Analysis

Selling Price Analysis

About System Plus Reports o Company services (>40 reports per year) o Feedbacks o Contact o Legal Costing Tools

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Overview / Introduction

Company Profile & Supply Dear Customer, Chain

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Overview / Introduction

Company Profile & Supply Chain

Physical Analysis FRANKFURT/MAIN Europa Sales Office Manufacturing Process Flow NANTES LYON Headquarter YOLE HQ Cost Analysis TOKYO PHOENIX YOLE KK Selling Price Analysis YOLE Inc. GREATER CHINA About System Plus YOLE o Company services o Feedbacks o Contact o Legal

Headquarters Europe Sales Office America Sales Office Asia Sales Office 21 rue La Noue Bras de Fer Lizzie LEVENEZ Steve LAFERRIERE Takashi ONOZAWA 44200 Nantes Frankfurt am Main Phoenix Tokyo FRANCE GERMANY USA JAPAN +33 2 40 18 09 16 +49 151 23 54 41 82 [email protected] [email protected] [email protected] [email protected] Mavis WANG GREATER CHINA [email protected] www.systemplus.fr

Overview / Introduction

Company Profile & Supply Chain DISCLAIMER Physical Analysis System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the Manufacturing Process Flow report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this Cost Analysis report. The quoted trademarks are property of their owners. Reverse Costing® is a deposed brand, by System Plus Consulting. Selling Price Analysis

About System Plus o Company services SERVICES o Feedbacks o Contact Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by o Legal industry experts. These results are open for discussion. We can reevaluate this circuit with your information.