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Full Technical Program IPFA 2021 Virtual Conference Technical Program 14 September - 13 October 2021 Time, SGT Plenary Session (GMT + 0800hrs) 14 September, Tuesday 09:00 - 09:15 hrs Opening Address by General Chair - Nagarajan Raghavan, Singapore University of Technology & Design, Singapore 09:15 - 09:20 hrs Technical Program Briefing by TPC Chair - Alfred Quah, GlobalFoundries, Singapore 09:20 - 09:30 hrs BREAK ( Connect to KN1 Live Session) 09:30 hrs Live Keynote Sessions (KN 1 - KN 3 ) KN 1 Anomalous Mechanical Deformation – New Variable in Reliability for Flexible and Stretchable CMOS Electronics 09:30 - 10:30 hrs Session Chair : Speaker - Professor Muhammad Mustafa Hussain, Nagarajan Raghavan UC Berkeley, USA 10:30 - 10:40 hrs BREAK ( Connect to KN2 Live Session) KN 2 Reliability Insights from 25 Million Fully Autonomous Miles 10:40 - 11:40 hrs Session Chair : Speaker - Noah Lassar Alfred Quah Waymo, USA EDFAS FA Technology Roadmap Overview Session Chair : 11:40 - 11:50 hrs Speaker - Vinod Narang Alfred Quah Advanced Micro Devices, Singapore 11:50 - 13:00 hrs Lunch BREAK ( Connect to KN3 Live Session) KN 3 What’s wrong with my chip? – Dr. AI, can you please diagnose? 13:00 - 14:00 hrs Session Chair : Speaker - Professor Aaron Thean Samuel Chef National University of Singapore, Singapore 14:00 - 14:10 hrs BREAK Best Paper Exchange Session 14:10 hrs (Pre-Recorded Video Presentations) Quantum Diamond Microscope: Integrated Circuit Magnetic Field Imaging Dr. Edlyn V. Levine ISTFA 2020 14:10 - 14:30 hrs The MITRE Coporation Exchange Paper Harvard University University of Maryland FEM Simulation-Based Failure Analysis of Additive Manufacturing Liquid Cold Plates for More Reliable Power Press-Pack ESREF 2020 Assemblies 14:40 - 15:00 hrs 1 1 1 2 2 2 1 Exchange Paper Davide Spaggiari , Nicola Delmonte , Danilo Santoro , Federico Portesine , Filippo Vaccaro , Emilio Sacchi , Paolo Cova 1 University of Parma, Italy, 2 POSEICO S.p.A, Italy End of Live Day Tutorials Session 14 September - 13 October 2021 ( Video On Demand ) FA Tutorials Reliability Tutorials Scanning Probe Microscopies for Correlative Analysis of Advanced Technology Nodes Robust and Reliable Design for In-Memory Computing Dr. Umberto Celano Prof Tuo-Hung Hou FA 1IMEC, Belgium REL 1 National Yang Ming Chiao Tung University,Taiwan MESA+ Institute for Nanotechnology, University of Twente, Netherlands Faster Fault Isolation with Advanced Data Analysis and Automotive Reliability Requirements & Challenges for Computer Vision Semiconductor Foundries FA 2 REL 2 Dr. Franco Stellari Dr Oliver Aubel IBM T.J. Watson Reseach Center, USA GlobalFoundries, Germany 3D IC Process Technology – Drivers, Technology Platforms, Contactless Fault Isolation Techniques and IC Hardware Security Challenges & Solution FA 3Prof Christian Boit REL 3 Prof Tan Chuan Seng TU Berlin, Germany Nanyang Technological University, Singapore Introduction of TEM/STEM Techniques in Analyzing Nano Laser Diodes: An Introductory Tutorial Materials Prof Massimo Vanzi FA 4Dr Jong-Shing Bow REL 4 University of Cagliari, Italy Integrated Service Technology Group, Taiwan Track A - Emerging Topics in Failure Analysis & Reliability 14 September - 13 October 2021 ( Video On Demand ) Evaluation of Breakdown Interference and Strategy of Mitigating Yield Loss in Crossbar Memory Arrays Invited Dr. I-Ting Wang - National Yang Ming Chiao Tung University, Taiwan Data analytics and Machine Learning: Root-Cause Problem- Reinforcement Learning to Reduce Failures in SOT-MRAM Solving Approach to prevent Yield Loss and Quality Issues in Switching Semiconductor Industry for Automotive Applications 1,2 2 1,2 A1.1 1 2 3 4 A1.5 Johannes Ender , Roberto Lacerda de Orio , Simone Fiorentini , Corinne Bergès , Jim Bird , Mehul D. Shroff , René Rongen , 2 3 1,2 (ID 16) 3 (ID 74) Siegfried Selberherr , Wolfgang Goes , Viktor Sverdlov Chris Smith 1 2 1 2 3 4 Christian Doppler Laboratory, Institute for Microelectronics, TU NXP, France, NXP Chandler, USA, NXP Austin, USA, NXP 3 Nijmegen, Netherlands Wien, Austria, Silvaco Europe Ltd, United Kingdom Extraction of Secrets from Allegedly Secret-free IoT Sensors A1.2 ASIC Circuit Netlist Recognition Using Graph Neural Network A1.6 using Artificial Intelligence Xuenong Hong , Tong Lin, Yiqiong Shi, Bah Hwee Gwee Tuba Kiyan , Thilo Krachenfels, Elham Amini, Zarin Shakibaei, (ID 48) Nanyang Technological University, Singapore (ID 93) Christian Boit, Jean-Pierre Seifert TU Berlin, Germany IC SynthLogo: A Synthetic Logo Image Dataset for Counterfeit Failure Analysis of Large Area Pt/HfO2/Pt Capacitors Using and Recycled IC detection Multilayer Perceptrons 1 2 2 A1.3 Mukhil Azhagan Mallaiyan Sathiaseelan , Manoj Yasaswi Vutukuru, A1.7 J. Muñoz-Gorriz , S. Monaghan , K. Cherkaoui , J. Suñé1, P.K. (ID 59) Suryaprakash Vasudev Pandurangi, Shayan Taheri, Navid (ID 94) Hurley 2 , E. Miranda 1 Asadizanjani 1 Universitat Autònoma de Barcelona, Spain, University of Florida, USA 2 University College Cork, Ireland Generative Adversarial Network for Integrated Circuits Physical Virtual Metrology of Visualizing Copper Microstructure Featured Assurance Using Scanning Electron Microscopy A1.4 with Computer Vision and Artificial Neural Network A1.8 Md Mahfuz Al Hasan , Nidish Vashistha, Shayan Taheri, Mark Ling-Yen Yeh , Rencheng Chen (ID 62) (ID 101) Tehranipoor, and Navid Asadizanjani Sun Innovation Co. Ltd, Taiwan University of Florida, USA A1.9 Hybrid Modelling for the Failure Analysis of SiC Power Transistors on Time-Domain Reflectometry Data Simon Kamm , Kanuj Sharma, Ingmar Kallfass, Nasser Jazdi, Michael Weyrich (ID 123) University of Stuttgart, Germany Track B - Metrology & Package Failure Analysis 14 September - 13 October 2021 ( Video On Demand ) B1. Package Level Failure Analysis 3D MIM Capacitor Embedded in TSV: Concept, Device Demonstration, Reliability and Applications Invited Prof. Tan Chuan Seng - Nanyang Technological University, Singapore Atmospheric Corrosion of Ag/Cu Plated FeNi Based Leadframe Mechanical BEoL Stability Investigation at Cu-Pillars under used in MOSFET Package Cyclic Load 1 2 2 3 Lois Jinzhi Liao , Bisheng Wang , Juanlu Cai , Tao Zhang , Jing Jendrik Silomon 1 , Jürgen Gluch 2 , André Clausner 2 , Ehrenfried B1.1 4 1 1 1 1 B1.4 Liu , Liu Binhai , Xi Zhang , Younan Hua , Xiaomin Li Zschech 2 (ID 9 ) 1 (ID 91) WinTech Nano-Technology Services, Singapore 1 Volkswagen AG, Germany, 2 3 Huawei Technologies, China, Northeastern University, China, 2 Fraunhofer Institute for Ceramic Technologies and Systems IKTS, 4 Wuhan University of Technology,China Germany A New 3D X-ray Solution for Non-Destructive Construction Simple Methods to Improve the CSAM Thru-Scan Efficiency on Analysis of Advanced Electronics Packages Package Units 1 2 3 2 B1.2 B1.5 Yanjing Yang , Allen Gu , Thom Gregorich , Masako Terada Hao Tan, Hnin Hnin Win Thoung, Krishnanunni Menon, Htin Kyaw, (ID 30) (ID 95) 1 Carl Zeiss X-ray Microscopy Applictations, Singapore Naiyun Xu, Pik Kee Tan, Changqing Chen 2 GlobalFoundries, Singapore Carl Zeiss Research Microscopy Solutions, USA 3 Carl Zeiss Semiconductor Manufacturing Technology, USA Failure Analysis on Diode-Triggered Silicon-Controlled Rectifiers By using Nondestructive X-ray Microscopy 1 1 3 1 1 Xinqian Chen , Mengge Jin , Feihou , Fang Liang , Zijian Zhang , A Systematic Failure Analysis Approach on Copper Pad 1 1 1 B1.3 Yanan Wang , Dongming Liu , Le Chen2 Chaolun Wang , Zhiwei B1.6 Discoloration Issue (ID 66) Liu 2 , Xing Wu 1 (ID 107) Hemalatha Somu , Krishnan Arul 1 East China Normal University, China, 2 University of Electronic Infineon Technology (Kulim) Sdn. Bhd, Malaysia Science and Technology of China, China, 3 Chengdu University, China B1.7 Digital Twin Aided IC Packaging Structure Analysis for High-quality Sample Preparation Chengjie Xi , Aslam A. Khan, John True, Nidish Vashistha, Nathan Jessurun, Dr. Navid Asadizanjani (ID 118) University of Florida, USA B2. Sample Preparation, Metrology & Defect Characterization New Routine to Determine Microstructures of Metallic SIMS Analysis of Ultra-Shallow Boron Implant B2.1 B2.7 Interconnectors Using SEM-EBSD Technique Han Wei Teo , Yun Wang, Kenny Ong, Zhi Qiang Mo Jiang Wu and Eugene Choo (ID 20 ) GlobalFoundries, Singapore (ID 57) Oxford Instruments, Singapore Super wide area cross sectioning using broad Ar ion beam on Sample Preparation For VCSEL Device Contamination Analysis solder bumping B2.2 Lei Zhu , Derrick Tan, Caryn Sek, Binghai Liu, Younan Hua, Xiaomin B2.8 Natsuko Asano , Tamae Omoto, Lu Jinfeng, Shogo Kataoka, Li (ID 21) (ID 68) Shunsuke Asahina WinTech Nano-Technology Services , Singapore JEOL, Japan A Novel CMOS Image Sensor Package Cover Glass White Stain SIMS Methodology Study of Indium Implant Quantification B2.3 Material Identification Metrology by TOF-SIMS B2.9 Yun Wang , Kian Kok Ong, Han Wei Teo, Ramesh Rao Nistala and (ID 24) Yeh Yee Kee , Kei Lin Sek, Lei Zhu, Younan Hua, Xiaomin Li (ID 69) Zhi Qiang Mo WinTech Nano-Technology Services , Singapore GlobalFoundries, Singapore The Monitor and Management of Sulfide Contamination for TEM-EDX Characterization of Immersion Pd & Pd-MoOx on Cu & Probing FAB clean room B2.4 B.2.10 NiP Frank Su , W.F. Hsieh, Henry Lin, Vincent Chen, Y.S. Lou Wan Tatt Wai , Arul Krishnan (ID 35 ) Ardentec Corporation, Taiwan (ID 85) Infineon Technologies Sdn Bhd, Malaysia X-ray Microanalysis Background Noise Reduction by FIB sample Automatic Defect Review of a Patterned Wafer using Hybrid B2.5 Preparation B2.11 Metrology (ID 40) Kim Hong Yip , Poh Chuan Ang, Kwai Fun Lee, Ley Hong Khoo
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