Wave & Reflow Soldering Troubleshooting Chart

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Wave & Reflow Soldering Troubleshooting Chart

575-37810 Poster.qxd 3/8/00 3:19 PM Page 1 SPEEDLINE TECHNOLOGIES ELECTROVERT REFLOW & WAVE SOLDERING PROBLEMS & SOLUTIONS INSUFFICIENT SOLDER FLOW-THRU INSUFFICIENT SOLDER (SOLDER SIDE) DE-WETTING OR NON-WETTING SOLDER VOIDS OR OUTGASSING SKIPPED OR OMITTED SOLDER EXCESSIVE SOLDER (COMP SIDE) EXCESSIVE SOLDER (SOLDER SIDE) EXCESSIVE SOLDER (BOTH SIDES) ICICLES BRIDGING WEBBING SOLDER BALLS & SPLATTER ROUGH OR DISTURBED SOLDER GRAINY SOLDER COLD SOLDER JOINT DISCLOSED SOLDER JOINT FLUX ENTRAPMENT MASKING FAILURE BLISTERING MEASLING COMPONENTS LIFTED WARPAGE FLOODING EXCESSIVE DROSS GENERATED EXCESSIVE FLUX USED EXCESSIVE SOLDER DRAGOUT BRIDGING SOLDER BALLS GRAINY SOLDER INCOMPLETE FILLET OPEN JOINT DISCOLORATION LAMINATE LEACHING HALO EFFECT TOMBSTONING DISCOLORED JOINT REFLOW CYCLE TOO LONG EXCESSIVE REFLOW TEMP EXCESSIVE HEATING RATE DEFECTIVE FIXTURE BOARD RERUN BOARD NOT SEATED RIGHT EARLY REMOVAL OF BOARD CONVEYOR ANGLE LOW CONVEYOR ANGLE HIGH CONVEYOR VIBRATION CONVEYOR SPEED LOW CONVEYOR SPEED HIGH PALLET TOO HOT NO FLUX BLOW-OFF FLUX BLOW-OFF EXCESSIVE FLUXER UNEVEN FLUX FOAMHEAD LOW FLUX NOT MAKING CONTACT FLUX NO LONGER ACTIVE FLUX SPECIFIC GRAVITY HIGH FLUX SPECIFIC GRAVITY LOW FLUX CONTAMINATED PREHEAT TEMP LOW PREHEAT TEMP HIGH EXCESSIVE SOLDER DROSS SOLDER CONTAMINATED SOLDER WAVE UNEVEN SOLDER WAVE HEIGHT LOW SOLDER WAVE HEIGHT HIGH SOLDER TEMP LOW SOLDER TEMP HIGH SOLDER PASTE OXIDATION SCREEN/STENCIL CLOGGED INSUFFICIENT SOLDER PASTE OXIDIZED SOLDER PASTE SOLDER PASTE VISCOCITY TOO LOW MISALIGNED COMPONENT EXCESS SOLDER DEPOSITION IMPROPER BOARD HANDLING COMPONENT LEADS TOO SHORT COMPONENT LEADS TOO LONG COMPONENT CONTAMINATION BOARD CONTAMINATION COMPONENT CONTAMINATION ROUGH PLATED THROUGH HOLE BOARD WARPED HOLE/PAD MISREGISTRATION MOISTURE IN LAMINATE DEFECTIVE MASK MATERIAL MISREGISTRATION OF MASK MASKING IN HOLES BOARD CONTAMINATION BOARD OXIDIZED PAD SIZE MISMATCH WEIGHT DISTRIBUTION SIZE OF BOARD COMPONENT ORIENTATION HOLE-TO-LEAD RATIO-LARGE HOLE-TO-LEAD RATIO-SMALL INTERNAL PLANE LARGE PLANE ON SOLDER SIDE LARGE PLANE ON COMPONENT SIDE PALLET DESIGN For process, applications or general questions, please contact ELECTROVERT at: Speedline Technologies, Inc., ELECTROVERT Division, Highway 5 South, Camdenton, MO 65020, Tel: (573) 346-3341, Fax: (573) 346-5554, Customer Service and Support: (800) 737-8110.

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Low Temperature Soldering Using Sn-Bi Alloys
LOW TEMPERATURE SOLDERING USING SN-BI ALLOYS Morgana Ribas, Ph.D., Anil Kumar, Divya Kosuri, Raghu R. Rangaraju, Pritha Choudhury, Ph.D., Suresh Telu, Ph.D., Siuli Sarkar, Ph.D. Alpha Assembly Solutions, Alpha Assembly Solutions India R&D Centre Bangalore, KA, India [email protected] ABSTRACT package substrate and PCB [2-4]. This represents a severe Low temperature solder alloys are preferred for the limitation on using the latest generation of ultra-thin assembly of temperature-sensitive components and microprocessors. Use of low temperature solders can substrates. The alloys in this category are required to reflow significantly reduce such warpage, but available Sn-Bi between 170 and 200oC soldering temperatures. Lower solders do not match Sn-Ag-Cu drop shock performance [5- soldering temperatures result in lower thermal stresses and 6]. Besides these pressing technical requirements, finding a defects, such as warping during assembly, and permit use of low temperature solder alloy that can replace alloys such as lower cost substrates. Sn-Bi alloys have lower melting Sn-3Ag-0.5Cu solder can result in considerable hard dollar temperatures, but some of its performance drawbacks can be savings from reduced energy cost and noteworthy reduction seen as deterrent for its use in electronics devices. Here we in carbon emissions [7]. show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics In previous works [8-11] we have showed how the use of industry specific needs. The physical properties and drop micro-additives in eutectic Sn-Bi alloys results in significant shock performance of various alloys are evaluated, and their improvement of its thermo-mechanical properties.
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PCB Solder Finishes
Package on Package Assembly Inspection & Quality Control Advertising and Media Sponsors Falcon PCB Group www.falconpcbgroup.com Practical Components www.practicalcomponents.com Sparks Laser Stencils www.sparkslaser.com © Copyright Bob Willis 2013 V2 Page 2 Package on Package Assembly Inspection & Quality Control Author’s Profile Bob Willis currently operates a training and consultancy business based in UK and has created one of the largest collections of interactive training material in the industry. With his online training webinars Bob Willis provides a cost effective solution to training worldwide and regularly runs training for SMTA, SMART, IPC and recently EIPC. Although a specialist for companies implementing lead-free manufacture Bob has provided worldwide consultancy in most areas of electronic manufacture over the last 25 years. Bob has travelled in the United States, Japan, China, New Zealand, Australia, South Africa and the Far East consulting and lecturing on electronic assembly. Bob was presented with the “Paul Eisler award by the IMF (Institute of Metal Finishing)” for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and ran Reflow and Wave Soldering Workshops in Europe for one of the largest suppliers of capital equipment. This is based on many years of practical experience working in contract assembly, printed board manufacture, environmental test and quality control laboratories. This has earned him the SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution to the industry. He has also been presented with the SMTA International Leadership Award and IPC Committee Award for contribution to their standards activity. He has also run training workshops with research groups like ITTF, SINTEF, NPL & IVF in Europe.
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Tin-Copper Based Solder Options for Lead-Free Assembly Tin-Coppertin-Copper Basedbased Soldersolder Optionsoptions Forfor Lead-Freelead-Free Assemblyassembly
Tin-copper based solder options for lead-free assembly Tin-copperTin-copper basedbased soldersolder optionsoptions forfor lead-freelead-free assemblyassembly As the transition to lead-free progresses a substantial percentage of assemblers have either implemented less costly solder alloys or are investigating them. Tin-copper solder by itself without dopants has limitations however the addition of certain elements helps out in the deficiencies normally seen with tin-copper. Figure 1. Comparative solder button showing differing surface finishes. This paper discusses several options and the advantages they offer when Tin-silver-copper has received much publicity less, making the overall operation much less compared with SAC based in recent years as the lead-free solder of choice. expensive. solders. It compares tin-copper The IPC Solder Value Product Council SAC305 based solders with SAC305 (Sn96.5 Ag3.0 Cu0.5) was endorsed by as the Properties of SnCu based solders and describes results being preferred option for SMT assembly, and most If the properties of SAC305 and tin-copper obtained by large assemblers. assemblers have transitioned to this alloy for based solders are compared, the melting point of their solder paste requirements. However, SAC305 is lower; this is one reason why it is not Peter Biocca, Senior Market due to the 3.0% silver content, the SAC305 a popular choice for reflow soldering. Tin-copper Development Engineer, Kester, is expensive when compared to traditional based solder would require a slightly higher peak Des Plaines, Illinois Sn63Pb37. For this reason, many wave temperature in this operation. If wetting speeds assemblers are opting for less costly options, are compared, tin-copper based solders would Keywords: such as tin-copper based solders, for their wave, show lower values than SAC305 when weaker Solder, tin-copper, selective and dip tinning operations.
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Recommended Reflow Soldering Conditions
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