Wave & Reflow Soldering Troubleshooting Chart

Wave & Reflow Soldering Troubleshooting Chart

575-37810 Poster.qxd 3/8/00 3:19 PM Page 1 SPEEDLINE TECHNOLOGIES ELECTROVERT REFLOW & WAVE SOLDERING PROBLEMS & SOLUTIONS INSUFFICIENT SOLDER FLOW-THRU INSUFFICIENT SOLDER (SOLDER SIDE) DE-WETTING OR NON-WETTING SOLDER VOIDS OR OUTGASSING SKIPPED OR OMITTED SOLDER EXCESSIVE SOLDER (COMP SIDE) EXCESSIVE SOLDER (SOLDER SIDE) EXCESSIVE SOLDER (BOTH SIDES) ICICLES BRIDGING WEBBING SOLDER BALLS & SPLATTER ROUGH OR DISTURBED SOLDER GRAINY SOLDER COLD SOLDER JOINT DISCLOSED SOLDER JOINT FLUX ENTRAPMENT MASKING FAILURE BLISTERING MEASLING COMPONENTS LIFTED WARPAGE FLOODING EXCESSIVE DROSS GENERATED EXCESSIVE FLUX USED EXCESSIVE SOLDER DRAGOUT BRIDGING SOLDER BALLS GRAINY SOLDER INCOMPLETE FILLET OPEN JOINT DISCOLORATION LAMINATE LEACHING HALO EFFECT TOMBSTONING DISCOLORED JOINT REFLOW CYCLE TOO LONG EXCESSIVE REFLOW TEMP EXCESSIVE HEATING RATE DEFECTIVE FIXTURE BOARD RERUN BOARD NOT SEATED RIGHT EARLY REMOVAL OF BOARD CONVEYOR ANGLE LOW CONVEYOR ANGLE HIGH CONVEYOR VIBRATION CONVEYOR SPEED LOW CONVEYOR SPEED HIGH PALLET TOO HOT NO FLUX BLOW-OFF FLUX BLOW-OFF EXCESSIVE FLUXER UNEVEN FLUX FOAMHEAD LOW FLUX NOT MAKING CONTACT FLUX NO LONGER ACTIVE FLUX SPECIFIC GRAVITY HIGH FLUX SPECIFIC GRAVITY LOW FLUX CONTAMINATED PREHEAT TEMP LOW PREHEAT TEMP HIGH EXCESSIVE SOLDER DROSS SOLDER CONTAMINATED SOLDER WAVE UNEVEN SOLDER WAVE HEIGHT LOW SOLDER WAVE HEIGHT HIGH SOLDER TEMP LOW SOLDER TEMP HIGH SOLDER PASTE OXIDATION SCREEN/STENCIL CLOGGED INSUFFICIENT SOLDER PASTE OXIDIZED SOLDER PASTE SOLDER PASTE VISCOCITY TOO LOW MISALIGNED COMPONENT EXCESS SOLDER DEPOSITION IMPROPER BOARD HANDLING COMPONENT LEADS TOO SHORT COMPONENT LEADS TOO LONG COMPONENT CONTAMINATION BOARD CONTAMINATION COMPONENT CONTAMINATION ROUGH PLATED THROUGH HOLE BOARD WARPED HOLE/PAD MISREGISTRATION MOISTURE IN LAMINATE DEFECTIVE MASK MATERIAL MISREGISTRATION OF MASK MASKING IN HOLES BOARD CONTAMINATION BOARD OXIDIZED PAD SIZE MISMATCH WEIGHT DISTRIBUTION SIZE OF BOARD COMPONENT ORIENTATION HOLE-TO-LEAD RATIO-LARGE HOLE-TO-LEAD RATIO-SMALL INTERNAL PLANE LARGE PLANE ON SOLDER SIDE LARGE PLANE ON COMPONENT SIDE PALLET DESIGN For process, applications or general questions, please contact ELECTROVERT at: Speedline Technologies, Inc., ELECTROVERT Division, Highway 5 South, Camdenton, MO 65020, Tel: (573) 346-3341, Fax: (573) 346-5554, Customer Service and Support: (800) 737-8110.

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