CVC 601 DC Sputterer, Metals

Wisconsin Center for Applied Microelectronics

1550 Engineering Drive Phone: 608/262-6877 Madison, WI 53706 Fax: 608/265-2614

HEADWAY PPHOTORESIST SSPINNER #2#2

Process Description: For reproducible lithography, the photoresist needs to be uniform and pinhole-free. The standard method of application is spinning. In this method, the substrate is mounted on a vacuum chuck; a metered amount of photoresist is deposited onto the center of the wafer; and then the revolving wafer flings off the excess resist and a uniform film is produced. Viscosity of the photoresist, rotational speed and time of the spin are the controlling parameters.

Equipment Description: The Headway spinners are capable of coating substrates up to 8 inches in diameter. A variety of chuck holders are available. The spinning speed is adjustable from 500 to 5,000 rpm and an electronic timer automatically controls the spin cycle.

Approved Materials for use in this equipment: Check the APPROVED MATERIALS for this equipment on http://mywebscape.wisc.edu under WCAM in the group directories.

Date last modified: 4/8/2018 Date created: 4/8/2018 Content by: Rebecca Bauer