Rapid Screening for Potential Wafer Bond Pad Punch-Through

waferWoRx® 300 Wafer Probing Process Analysis System

In-depth analysis of probe marks reveals the true performance under actual test conditions of the prober, interface, probe card, and probe card analyzer. With its’ automated probe mark data collection, delivery of quantifiable data, and easy-to-interpret results, the waferWoRx 300 enables a level of analysis previously unachievable by manual methods. This enables automated root cause analysis for rapid corrective action, yield optimization and process control, and new technology validation for the wafer probing process.

Key Features/Benefits:

Prober Setup and Performance Analysis The waferWoRx 300 allows test floor managers to validate wafer probing test cells by assessing probe marks to determine the quality of the process; a critical function before production runs and after PMs and maintenance actions. After setup, the waferWoRx 300 gives users the data necessary for on-going qualification and control of processes.

New Technology Assessment and Analysis The waferWoRx 300 system provides rapid feedback from the test cell allowing validation of your process readiness for the incorporation of increasingly complex probing technologies. This analysis and assessment of current process limits and the interaction between prober, interface, probe card, and wafer enables the exploration, verification and validation of pad shrink efforts.

Advanced 3-D Imaging The 3-Dimensional capabilities of the waferWoRx 300 enable users to analyze probe marks and probe tips in a rapid and information-rich format not seen before. Live pad and color-enhanced views of probe mark and probe tip topographies provide users with fast, easy to assess information for making critical process decisions. And the user- defined cross-sectional views provide unlimited measurement capabilities, providing complete control of their analysis. Rapid Screening for Potential Wafer Bond Pad Punch-Through Through the incorporation of a color camera, advanced algorithms and image-based spectral analysis, the waferWoRx 300 system rapidly screens for pads that exhibit the potential for bond pad punch-through.

Automated or Self-Guided Analysis Whether you are trying to qualify a new test process or improve an existing test process, the waferWoRx 300 enables the success of your project. From automated wafer scans to self- guided analysis, the waferWoRx 300 provides a powerful and efficient means of analyzing your wafer probe test process.

Probe Tip Analysis The waferWoRx 300 Probe Tip Analysis Module allows you to take probe card maintenance to a new level. From probe tip wear studies to individual probe tip analysis and maintenance, waferWoRx 300 users enjoy benefits such as:  Optical planarity and alignment analysis  Probe card cleaning process verification, monitoring and optimization  Fast damage analysis of tips  Rapid, ergonomic maintenance of probe tips  Wear and “end of life” monitoring