SMTA TECHNICAL SYMPOSIUM

SMTA INTERMOUNTAIN CHAPTER presents the annual FREE TECHNICAL SYMPOSIUM Co-sponsors: University of Utah and SMTA

Thursday, October 6, 2011 The cost to exhibit is $300 before University of Utah Sept 15 and $400 after Sept 15. SMTA Warnock Engineering Building members save an additional 10% on the Main lobby cost to exhibit. The price includes table, Salt Lake City, Utah two chairs, attendee list, basic electrical Show Hours 10:00 am—4:00 pm outlet and lunch for 1 exhibitor.

Attendees: ATTENDEE REGISTRATION Exhibitors: Please see attached registration IS FREE. See attached registration form to sign up. Register early for savings and to form to sign up. Lunch for attendees is reserve a space. Exhibitor space is limited. also free with registration. Register now Coffee break sponsors and door prize sponsors to visit with representatives from major are welcome. suppliers to the industry. Join us for free networking, free technical sessions and a free lunch!

Technical Session:

10:00-11:00 ...... Welcome and social hour 11:00-12:00 ...... Cedro Toro: “5 Steps to Successful Lean Implementation” 12:00 ...... Lunch 2:00-3:00 ...... Lilia Kondrachovak: “Solder paste metrology” 3:00-4:00...... Ram Wissel: “Cleaning Flux Residue from under Bottom Termination Components” 4:00...... Door prize drawing Cedro Toro is the Lean Six Sigma Champion for Plexus Boise, a 2+ billion dollar global electronics manufacturing services company. Cedro is a certified Lean Six Sigma Master Black Belt and Project Management Professional. He received his MBA from Idaho State University and holds a bachelors degree in Electrical Engineering from the University of Utah. Prior to Plexus Cedro led the North American Lean Six Sigma deployment for AMI Semiconductor (now ON Semiconductor). Cedro is also the owner of Lean Six Sigma Toolbox online business process engineering software.

Title: “5 Steps to Successful Lean Implementation”

Abstract: Lean and Six Sigma methodologies and tools can be very powerful. They’ve proven successful in many companies in many industries for many years. But for each company that has successfully implemented a portion or all of Lean Six Sigma, a dozen others have failed. Why? There are too many reasons to list. There is a recipe for success however. Here are the 5, not necessarily easy, steps to succeeding in moving your organization or department down the road of Lean Six Sigma with example projects and scenarios.

Lilia Kondrachovak works for Intel. She is an international student from Russia. She got her B. S. in Chemistry from the University of Colorado at Colorado Springs. As an undergraduate student she worked at Dr. Radha Pyati’s lab on spectroscopic and electrochemical characterization of a family of Pt (II) phenylethynyl complexes. In 2004, Lilia came to UT as a graduate student and joined Dr. Keith J. Stevenson’s research lab. The main focus of her research project is the development of diffraction-based sensing schemes that utilize chemically and electrochemically responsive gratings for the detection of gas and liquid-phase analytes. In her spare time, Lilia enjoys spending time with her friends, dancing, playing Wii games and watching movies.

Title: " Solder Paste Metrology"

Abstract: TBD… Ram Wissel, Technology Manager for Kyzen

B.S. in Chemical Engineering from the University of Arkansas in 1997. Began working with Kyzen in January 1998 as an Applications Engineer, and in 1999 was promoted to Engineering Services Manager. Lead our team of craftsmen, technicians, and engineers in addressing the unique cleaning process challenges of our customers. We developed new automated process control systems and environmental containment technologies; which could be easily integrated into existing processes.

Left Kyzen in 2008 and worked as a Consulting Engineer at the Callaway Nuclear Power Plant while pursuing a family opportunity. Received Ameren’s Presidential Performance Leadership Award in 2009 for addressing concerns raised by the United States Nuclear Regulatory Commission.

Rejoined Kyzen in June of 2011 in the role of Technology Manager. My primary focus is continuing Kyzen’s longstanding commitment to efficient chemical usage and environmental stewardship by developing and integrating innovative new technologies with our customer’s processes.

Title: “Cleaning Flux Residue from under Bottom Termination Components”

Abstract: Bottom Termination Components consist of any surface mount device whose external connections consist of metallized terminations that are an integral part of the circuit assembly. Common bottom termination components include QFN, DFN, SON, LGA, MLP, and MLF, which utilize surface to surface interconnections. Critical variables for cleaning flux residues from under bottom termination components include the cleaning agent, heat exposure, gap height, and fluid flow dynamics. The cleaning agent must match up to the soil in order to wet and dissolve the reflowed residues. Energy is needed to deliver the cleaning agent to residues that fill the bottom of the component. The purpose of this research is to provide process conditions needed to remove all residues from under the component and circuit assembly. The target audience for this presentation is managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, cleaning, inspection, and repair processes.