Tolapai A System on a Chip with Integrated Accelerators
Rumi Zahir, Sr. Principal Engineer (Contributions from S. Lakshmanamurthy and D. Parikh)
INTEL Confidential- CNDA required Hot Chips
All products, dates and figures are preliminary, for planning purposes only,(Revision and are subject 1.0) to change August without any2007 notice. Intel may make changes to specifications, product descriptions, and plans at any time, without notice.
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All products, dates and figures are preliminary, for planning purposes only, and are subject to change without any notice. Intel may make 2 changes to specifications, product descriptions, and plans at any time, without notice. Tolapai SOC – Intel® Architecture (IA) Computing & Secure Packet Processing on 1 Die Single Die integrates • IA CPU @ 600, 1066 and 1200MHz • DDR2 memory controller (MCH) • PCI Express* • Standard IA PC peripherals (ICH) • 3x Gigabit Ethernet MACs • 3x TDM high-speed serial interfaces for 12 T1/E1 or Slic/Codec connections • Intel® QuickAssist Integrated Accelerator – For high-performance security and IP telephony applications
Vital Statistics • 148 Million transistors • 1,088-ball FCBGA w/1.092 mm pitch • 37.5 mm x 37.5 mm package • Intel's first integrated IA processor, chipset and memory controller since 1994's 80386EX.
All products, dates and figures are preliminary, for planning purposes only, and are subject to change without any notice. Intel may make 3 changes to specifications, product descriptions, and plans at any time, without notice.
Wireless Tolapai Market Segments Comms Infrastructure
Industrial Storage Control Tolapai is expected to play in a diverse set of Security Federal embedded, storage & comms segments.
Print Imaging Infotainment Interactive Clients Medical Enterprise Print Imaging Voice
All products, dates and figures are preliminary, for planning purposes only, and are subject to change without any notice. Intel may make 4 changes to specifications, product descriptions, and plans at any time, without notice. Tolapai Agenda