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Various Energy-Saving Approaches to a TFT-LCD Panel Fab

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Various Energy-Saving Approaches to a TFT-LCD Panel Fab sustainability Article Various Energy-Saving Approaches to a TFT-LCD Panel Fab Cheng-Kuang Chang 1, Tee Lin 1, Shih-Cheng Hu 1,*, Ben-Ran Fu 2,* and Jung-Sheng Hsu 1 1 Department of Energy and Refrigerating Air-conditioning Engineering, National Taipei University of Technology, Taipei 10608, Taiwan; [email protected] (C.-K.C.); [email protected] (T.L.); [email protected] (J.-S.H.) 2 Department of Mechanical Engineering, Ming Chi University of Technology, New Taipei City 24301, Taiwan * Correspondence: [email protected] (S.-C.H.); [email protected] (B.-R.F.); Tel.: +886-2-2771-2171 (ext. 3512) (S.-C.H.) Academic Editor: Andrew Kusiak Received: 24 August 2016; Accepted: 31 August 2016; Published: 7 September 2016 Abstract: This study employs the developed simulation software for the energy use of the high-tech fabrication plant (hereafter referred as a fab) to examine six energy-saving approaches for the make-up air unit (MAU) of a TFT-LCD (thin-film transistor liquid-crystal display) fab. The studied approaches include: (1) Approach 1: adjust the set point of dry bulb temperature and relative humidity in the cleanroom; (2) Approach 2: lower the flow rate of supply air volume in the MAU; (3) Approach 3: use a draw-through type instead of push through type MAU; (4) Approach 4: combine the two stage cooling coils in MAU to a single stage coil; (5) Approach 5: reduce the original MAU exit temperature from 16.5 ◦C to 14.5 ◦C; and (6) Approach 6: avoid an excessive increase in pressure drop over the filter by replacing the HEPA filter more frequently. The simulated results are further compared to the measured data of the studied TFT-LCD fab in Taiwan. The simulated results showed that Approach 1 exhibits more significant influence on annual power consumption than the other approaches. The advantage/disadvantage of each approach is elaborated. The impact of the six approaches on the annual power consumption of the fab is also discussed. Keywords: energy conversion factor; cleanroom; annual energy consumption; energy-saving 1. Introduction Large-scale high-tech cleanrooms need conditioned air from the ambient environment to maintain a positive pressure. Figure1 shows a typical schematic diagram for a make-up air unit (MAU) and cleanroom heating, ventilation, air conditioning (HVAC) system. Humidity in large-scale high-tech cleanrooms is often controlled by a dedicated MAU which consists of a fan, two stage cooling coils, a heating coil (or heater), filters, and a humidifier. Methods of humidification include mist humidification and steam humidification. The steam humidification process is a quasi-isothermal process, which needs heat energy to generate steam. The mist humidification process is an isenthalpic process, which draws evaporation energy from the air. Irrespective of whether quasi isothermal process or isenthalpic process is adopted, the heating system is indispensable. For mist humidification, outdoor air needs to be pre-heated to a temperature that has the same enthalpy as off-coil saturation condition. Whether a cleanroom uses electric-heater or a boiler, it would be a burden on operation and maintenance costs. Even with a heat recovery chiller, it negatively affects the efficiency of the chiller system. Normally, MAU output air has a temperature range of 14–17 ◦C, and the humidity is controlled at 9.65 × 10−3 kg/kg for TFT-LCD (thin-film transistor liquid-crystal display) fabrication plants. The make-up air (MA) is mixed with return air (RA) to maintain temperature at 23 ± 1 ◦C and humidity at 55% ± 5% for most TFT-LCD industries [1]. Additionally, the temperature in the cleanroom Sustainability 2016, 8, 907; doi:10.3390/su8090907 www.mdpi.com/journal/sustainability Sustainability 2016,, 8,, 907907 2 of 10 Sustainability 2016, 8, 907 2 of 10 the temperature in the cleanroom can be controlled by a dry coil but this does not regulate humidity, canthusthe be the temperature controlled MAU output by in athe dryhumidity cleanroom coil but becomes thiscan be does controlled very not regulateimport by aant, dry humidity, coilas it but is this thusthe doesonly the not MAUmechanism regulate output humidity, to humidity control becomeshumiditythus the veryin MAU the important, cleanroom.output humidity as it Figure is the becomes only2 shows mechanism very the import psychrometric to controlant, as it humidity isprocesses the only in theofmechanism both cleanroom. humidifying to control Figure 2a showscleanroomhumidity the psychrometric by in steam the cleanroom. and processesmist humidification. Figure of both 2 shows humidifying the psychrometric a cleanroom processes by steam of and both mist humidifying humidification. a cleanroom by steam and mist humidification. Pre-filter Mid-filter Heating coil Air washer Cooling coil Heating coil Fan Final-filter Pre-filter Mid-filter Heating coil Air washer Cooling coil Heating coil Fan Final-filter C/C C/C H/C H/C C/C C/C H/C H/C D/C D/C FigureFigure 1. 1.A Atypical typical schematic schematic diagram diagram for for MAU MAU and cleanclean roomroom HVAC HVAC system. system.system. Figure 2. The psychrometric process of humidification: steam-humidification (1-2-3) and Figure 2. The psychrometric process of humidification: steam-humidification (1-2-3) and mist- mist-humidification (1-20-3), where r is the room condition [1]. Figurehumidification 2. The psychrometric (1-2′-3), where processr is the room of humidificati condition [1].on: steam-humidification (1-2-3) and mist- humidification (1-2′-3), where r is the room condition [1]. DependingDepending on on the the location location ofof thethe fanfan relative to to the the cooling cooling coils coils (upstream (upstream or downstream), or downstream), a a MAUMAUDepending can can bebe categorized categorizedon the location asas aa push-throughofpush-through the fan relative type toMAU MAU the cooling(Figure (Figure coils3a)3a) or or (upstream a draft-through or downstream), type type MAU MAU a (FigureMAU(Figure can3b) be3b) [ 2 categorized].[2]. As As the the relative relativeas a push-through humidity humidity requiredrequired type MAU for industrial (Figure 3a) cleanroom cleanroom or a draft-through is is low, low, the the typedesigned designed MAU humidity(Figurehumidity 3b) ratio ratio[2]. is As loweris lower the thanrelative than the the HVAC humidityHVAC system system required used used ininfor commercialcommercial industrial building buildings.cleanrooms. Thus, Thus, is low, the the supply the supply designed water water temperature for the cooling coil inside the MAU is typically ◦5–7 °C. This low temperature of the temperaturehumidity ratio for is the lower cooling than coil the inside HVAC the system MAU us ised typically in commercial 5–7 C. This building low temperatures. Thus, the supply of the supply water supply water reduces water chiller’s efficiency. In general, a rise◦ of 1 °C in evaporator temperature watertemperature reduces for water the chiller’scooling coil efficiency. inside Inthe general, MAU is a risetypically of 1 C5–7 in evaporator°C. This low temperature temperature of of water the of water chiller can increase chiller efficiency by about 3%. Therefore, by dividing one cooling coil chillersupply canwater increase reduces chiller water efficiency chiller’s byefficiency. about 3%. In Therefore,general, a rise by dividingof 1 °C in one evaporator cooling coil temperature with low with low supply water temperature into two cooling coils with different supply water temperatures◦ supplyof water water chiller temperature can increase into chiller two coolingefficiency coils by with about different 3%. Therefore, supply waterby dividing temperatures one cooling (i.e.,9 coilC with low supply water temperature into two cooling coils with different supply water temperatures Sustainability 2016,, 8,, 907907 3 of 10 (i.e., 9 °C for first cooling coil and 6 °C for second cooling coil), total energy consumption of water ◦ forchillers first coolingcan be reduced coil and [2]. 6 C Heat for second sources cooling of heating coil), coil total generally energy consumption are steam, hot of waterwater, chillers or electric can beheater. reduced However, [2]. Heat replacing sources these of heating high coilenergy generally consumption are steam, components hot water, orwith electric heat heater.recovery However, chiller replacinghelps reduce these energy high energyconsumption consumption of heating components coil. Reheating with heat is required recovery chillerafter the helps dehumidification reduce energy consumptionprocess in order of heating to satisfy coil. the Reheating temperature is required requ afterirement, the dehumidification which is determined process by in the order cleanroom to satisfy thetemperature temperature and requirement,the relative humidity which is determinedsettings. In bysuch the a cleanroomcase, mounting temperature the MAU and fan the after relative the humiditycooling coils settings. can replace In such some a case, of mounting the energy the required MAU fan for after reheating. the cooling This coils cuts can down replace the someenergy of theconsumption energy required by reducing for reheating. the energy This load cuts of down the heat theing energy coil. The consumption last device by is reducinga steam humidifier, the energy loadwhich of provides the heating steam coil. and The increases last device humidity is a steam at humidifier, the discharge, which helping provides to steammeet andthe humidity increases humidityrequirement at thein winter. discharge, helping to meet the humidity requirement in winter. (a) (b) Figure 3. ComponentsComponents arrangement of MAUs with mist humidifier humidifier [3]. [3]. ( (aa)) A A push-through push-through type type MAU; MAU; and (b) a draft-through type MAU.MAU. On the other hand, energy consumption for controlling humidity by the MAU is huge. On the other hand, energy consumption for controlling humidity by the MAU is huge. Generally, Generally, power consumption for air-conditioning in a high-tech facility is about 30%–40% of the power consumption for air-conditioning in a high-tech facility is about 30%–40% of the total power total power consumption [3–6], around 50% of which is accounted for by the chiller.
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