Vol. 2009 Issue 1 Compact Efficient Fanless Flexible Ultra small form factor and Advanced processor Industry-leading low power, Comprehensive portfolio of rich integration enabling architecture and fanless, silent and cool standard and customisable rapid development of platform-centric design for processing platforms products to suit your intelligent devices higher performance-per-watt embedded requirements About VIA Embedded VIA Technologies, Inc. is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multime- dia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquar- tered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs, motherboard vendors and system integrators. VIA's mission is to provide world class customer value in the embedded market by combining best of breed technologies with extensive development and customer design experience. Offering unparalleled flexibility in bringing your ideas to market, VIA is your best choice as embedded platform provider. embedded in your success eadership L Embedded Leadership ed d d ■ Providing Complete x86 Platforms e b Leading the Way in Integration and Miniaturization m ■ E H i ■ Pioneer of Small Form Factor Embedded Boards g ■ Industry-leading Low Power Consumption and Rich h e Feature Integration s t Q Highest Quality Assured u a e l i c t ■ ISO 9001:2000 Certification i y v r ■ RoHS Compliance A e s S s ■ IECQ HSPM QC080000 Certified u d r e e ■ Green Computing Initiatives t d n e i r O - r e Customer-Oriented Service m o C t s ■ Global Presence, Integrated Support u ■ Strong Research & Development Capabilities ■ VIA Embedded Partner Zone ■ Integrated Design Services and Embedded Software Services VIA Silicon Solutions VIA Processor Platform Ultra low power consumption platform One-stop-shop for complete product solution ■ Lowest power x86 platform with full management support ■ Total solution for compatible platform and single technical support ■ PowerSaverTM for maximum processor power efficiency ■ Fulfill different market segments by offering a complete product line solution Time and resource saving for product development ■ Highly-integrated platforms for building small, stylish, and highly ■ Scalable platform for mid-high-low market segment functional devices with rich computing and multimedia performance ■ VIA pin-to-pin strategy for dependable upgrade path Green technologies ■ Provides leading concept and ultimate reference design ■ First company to market with RoHS compliant processors in 2003 Small and high integration for small form factor design ■ Entire silicon portfolio with RoHS compliance by 2005 ■ 21 mm x 21 mm NanoBGA2 footprint ■ Fully lead-free and halogen-free by the end of 2008 ■ Compatible with VIA single chip system processors with high multimedia integration (H.264, MPEG-2, MPEG-4, WMV9, VC1, etc.) Packing VIA Processor VIA NanoTM Processor VIA C7® Processor VIA EdenTM Processor Key Attributes The VIA NanoTM processor is a high The VIA C7® processor is designed The VIA EdenTM processor boasts an performance, power efficient to extend the digital lifestyle by ultra power-efficient architecture, processor line-up aimed at revitalizing combining robust performance of scalable up to 1.6 GHz within a truly optimized performance for the up to 2.0 GHz with ultra low power maximum power envelope of just most demanding computing, consumption and highly efficient 8 W. The EdenTM family has ultra entertainment and connectivity heat dissipation. low voltage (ULV) SKUs for ultra applications. compact embedded devices. VIA Chipset Solutions The VIA single-chip system media processors and other core logic North impressive platforms help embedded equipment manufacturers deploy Bridge/South Bridge chipsets address key requirements of many exceptionally responsive, high-performance, and low-power applications such as embedded computing designs including 2D/3D graphics, low power point-of-sale terminals, gaming devices, digital signage, industrial consumption, easy cooling, increased performance, and manageability. control/automation, storage devices, and network security. When combined with VIA Nano™, C7® and Eden™ processors, these 1 VIA Embedded Boards Mini-ITX Form Factor (17 cm x 17 cm) Launched in 2002, the VIA EPIA® Mini-ITX form factor has inspired thousands of embedded system builders and end users around the Embedded Platform Innovative Architecture world to create innovative devices that take advantage of its small size and rich feature set. The Mini-ITX form factor is designed to fit standard VIA EPIA® embedded boards are the embodiment of VIA’s feature rich ATX mount points — ensuring a wide variety of compatible chassis. and power efficient platform technologies. EPIA® boards come in a variety of flavors and form factors. A mix of low-power embedded processors, core logic, networking, connectivity and multimedia Nano-ITX Form Factor (12 cm x 12 cm) components make up the wide selection of available Mini-ITX, Advancing the trend in platform miniaturization, VIA developed the 12 Nano-ITX, Pico-ITX and Pico-ITXe embedded boards. cm x 12 cm EPIA® Nano-ITX embedded board as the ideal building block for a wide variety of applications requiring even smaller dimensions. With complete connectivity and multimedia technologies, the VIA EPIA® ATX 30.5 cm x 24.4 cm (12” x 9.6”) Nano-ITX gives developers even more scope for system size flexibility. microATX 24.4 cm x 24.4 cm (9.6” x 9.6”) Pico-ITX Form Factor (10 cm x 7.2 cm) VIA launched EPIA® Pico-ITX, the world’s smallest commercialized form FlexATX 23 cm x 19 cm (9” x 7.5”) factor in 2007, measuring just 10 cm x 7.2 cm. Designed to enable x86 architecture for embedded systems where it was previously impractical Mini-ITX 17 cm x 17 cm (6.7” x 6.7”) for space reasons, the VIA EPIA® Pico-ITX provides an innovative platform alternative to any standard embedded board or x86 system on module. Em-ITX 17 cm x 12 cm (6.7” x 4.7”) Nano-ITX 12 cm x 12 cm (4.7” x 4.7”) Pico-ITXe Form Factor (10 cm x 7.2 cm) Pico-ITX 10 cm x 7.2 cm (3.9” x 2.8”) The Pico-ITX Express (Pico-ITXe) form factor defines a super-compact, self-reliant mainboard with full functionality. The Pico-ITXe is the same size as the Pico-ITX, while supporting customizable I/O expansion modules through the addition of SUMIT™ connectors. Developed to meet the evolving needs of the rapidly-expanding embedded industry, it allows efficient module stacking on its small form factor. It also solves developer’s requirements for both high-speed and low-speed serial buses while being space efficient and power-efficient. 2 Segment Series VIA Total Solutions VIA Embedded not only designs the EPIA® series boards, but it also provides As leaders in integration and miniaturization, VIA Embedded provides application-ready segment platforms to fulfill customer requirements. The flexible and cost effective platforms for an almost unlimited variety of VIA Embedded team produces a wide array of segment specific boards for applications, from digital entertainment devices, edge networking device, network appliances, digital signage, storage, server and retail stores. From industrial control, kiosk, POS, set top box, car PCs, etc. general purpose platforms to segment specific platforms, VIA develops application oriented and easy-to-use features to inspire businesses in the embedded vertical market. VB Series (17 cm x 17 cm) VIA Embedded also offers the VB series for entry-level market deployments. The VB series, based on the Mini-ITX form factor, is designed for emerging segment markets and bring VIA’s knowledge, ideas, and input to the customers. With the VB series, customers can define their product and application needs faster and more cost effectively. Em-ITX Form Factor (17 cm x 12 cm) Em-ITX is a new generation of embedded boards suitable for designing compact systems for diversified embedded control. Based on the Em-ITX form factor, the Em-ITX series support dual-sided I/O coastlines and can combine with Em-IO expansion modules — making it flexible and easy to extend functionality and I/O ports for a specific vertical application. 3 VIA Pico-ITXe Embedded Board Form Factor 10 cm x 7.2 cm Pico-ITXe is an open source standard designed in collaboration with Flexible I/O Options Small Form Factor Special Interest Group (SFF-SIG) and based on VIA’s Pico-ITX form factor. With the same 10 cm x 7.2 cm dimensions as the The Pico-ITXe possesses the technical diversity to offer system Pico-ITX, the Pico-ITXe specification includes fixed mounting holes and developers considerable scope for customizing I/O simply and cost SUMIT™ connectors that facilitate the development of stackable, effectively through the addition of selected Pico-IO bus expansion I/O-centric embedded devices with advanced serial bus technology. modules. When it comes to I/O layout, the Pico-ITXe form factor enables flexibility and stability, with using a customizable I/O expansion board in a stackable, I/O-centric implementation. SUMIT™ Connectors SUMIT™ is an acronym for Stackable Unified Module Interconnect Applications Technology. It brings a stackable, I/O-centric, serial expansion approach The compact Pico-ITXe is ideally suited to demanding embedded to system design that combines the strengths of yesterday’s general I/O applications that require space saving and customized I/O options, such architectures with serial interconnect buses for future needs, including as industrial automation, data acquisition and process monitoring, as 2 PCI Express, USB, LPC, I C, SPI, and ExpressCard interfaces. well as standalone platforms (e.g., mid-range signage and kiosk solutions), and ruggedized systems.