The Pin Diode Circuit Designers' Handbook
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Fully Passive Conductive-Bridging Solid State RF Switch Abstract 1
32nd URSI GASS, Montreal, 19-26 August 2017 Fully Passive Conductive-Bridging Solid State RF Switch M.P. Jayakrishnan(1), Arnaud Vena(2), Brice Sorli(2) and Etienne Perret(1,3) (1) Université Grenoble Alpes - LCIS, 50, rue de Laffemas, BP 54, Valence 26902, France. (2) Institut d’Electronique du Sud, Université de Montpellier 2, Montpellier 34095, France. (3) Institut Universitaire de France, Paris 75005, France. Email: [email protected], [email protected] Abstract performance and good repeatability, which makes this concept a promising set forth. This study reports the design and experimental results of a fully-passive solid-state RF switch based on the 2. Background Conductive Bridging Memory Technology, popularly known as CBRAM. The developed device is a shunt The CBRAM RF switch is based on a Metal-Insulator- mode RF switch based on a Metal-Insulator-Metal (MIM) Metal structure as shown in Fig. 1 where the Insulator structure with Copper – Nafion – Aluminum switching layer is a solid electrolyte like common synthetic resin layers on a Coplanar Waveguide (CPW) transmission [6,7]and one of the electrode is an electrochemically line, operational in the DC to 3GHz range. DC pulses in active metal like copper or silver and the other is a the range +12V to –20V are used to operate the switch. relatively inert metal like aluminum or gold. The The design is initially simulated using the FEM based switching action is obtained by applying electric field of CST microwave Studio and then realized and validated on sufficient voltage to establish a metallic link between the a low cost FR4 substrate, and without using any two electrodes through the electrolyte, and by dissolving sophisticated clean room technology. -
BTN-0040 the BTN-0040 Is Constructed Using a Custom-Made, Resonance-Free Conical Inductor to Achieve Extremely Broadband Performance
LEAD-FREE / RoHS-COMPLIANT BIAS TEE BTN-0040 The BTN-0040 is constructed using a custom-made, resonance-free conical inductor to achieve extremely broadband performance. By minimizing the overall inductor size and using proprietary packaging techniques, the BTN-0040 is a superior option in terms of performance, reliability and ease-of-use when compared to cumbersome self-made bias tees employing off-the-shelf conical inductors. The extremely low cutoff and resonance free operation makes the BTN-0040 suitable for biasing amplifiers, lasers, and modulators driven with high frequency data patterns. Features Broadband: 40 kHz to 40 GHz Low Insertion Loss Non-Resonant Compact Size Electrical Specifications - Specifications guaranteed from -55 to +100°C, measured in a 50Ω system. Parameter Frequency Range Min Typ Max Insertion Loss (dB) 1.5 2.2 DC Port Isolation (dB) 30 Return Loss (dB) 14 RF Power (W) 1 DC Current (mA) 500 40 kHz-40 GHz DC Voltage (V) 30 DC Resistance (Ω) 6 Inductance (uH) 1000 Capacitance (uF) 1.1 Weight (g) 10 Risetime/Falltime (ps)1 11 1 2 2 2 Specified as 90%/10%. Calculated from bt = (out – in ) .470 [11.94] PROJECTION .370 XXX=±.005 INCH XX=±.02 [9.40] [MM] .050 [1.27] .135 .235 [3.43] [5.97] .470 .200 [11.94] BTN0040 [5.08] Ø.067 Thru 4 PL [1.70] .39 .20 [9.9] [5.0] 215 Vineyard Court, Morgan Hill, CA 95037 | Ph: 408.778.4200 | Fax 408.778.4300 | [email protected] Copyright © 2019 Marki Microwave, Inc. | Rev. A BIAS TEE BTN-0040 Page 2 Schematic RF RF+DC DC Application Examples Fig. -
Special Diodes 2113
CHAPTER54 Learning Objectives ➣ Zener Diode SPECIAL ➣ Voltage Regulation ➣ Zener Diode as Peak Clipper DIODES ➣ Meter Protection ➣ Zener Diode as a Reference Element ➣ Tunneling Effect ➣ Tunnel Diode ➣ Tunnel Diode Oscillator ➣ Varactor Diode ➣ PIN Diode ➣ Schottky Diode ➣ Step Recovery Diode ➣ Gunn Diode ➣ IMPATT Diode Ç A major application for zener diodes is voltage regulation in dc power supplies. Zener diode maintains a nearly constant dc voltage under the proper operating conditions. 2112 Electrical Technology 54.1. Zener Diode It is a reverse-biased heavily-doped silicon (or germanium) P-N junction diode which is oper- ated in the breakdown region where current is limited by both external resistance and power dissipa- tion of the diode. Silicon is perferred to Ge because of its higher temperature and current capability. As seen from Art. 52.3, when a diode breaks down, both Zener and avalanche effects are present although usually one or the other predominates depending on the value of reverse voltage. At reverse voltages less than 6 V, Zener effect predominates whereas above 6 V, avalanche effect is predomi- nant. Strictly speaking, the first one should be called Zener diode and the second one as avalanche diode but the general practice is to call both types as Zener diodes. Zener breakdown occurs due to breaking of covalent bonds by the strong electric field set up in the depletion region by the reverse voltage. It produces an extremely large number of electrons and holes which constitute the reverse saturation current (now called Zener current, Iz) whose value is limited only by the external resistance in the circuit. -
Wideband Bias Tee Gary W
Wideband Bias Tee Gary W. Johnson, WB9JPS 11-8-08 Bias tees are useful for injecting DC bias to a device under test while isolating an instrument from any DC offset. For instance, you may be applying a bias to the base of a transistor while using a network analyzer to measure S parameters. Or, when testing a modulated laser diode, a DC operating current is required while an ac modulation rides on top of that. Conceptually, the simplest bias tee is just a coupling capacitor and an inductor, and is in effect a diplexer. For real-world components, the big shortcoming is inductor performance, especially self-resonance. If you are only interested in a narrow band of frequencies (say, one decade), the solution is indeed a simple LC network, and is no different than an RF choke and coupling capacitor on the output of an RF amplifier. But wideband applications—covering multiple decades in frequency—are more difficult and this is the performance we seek for test and measurement applications. One solution is to design a series of damped lowpass filter sections where each inductor is only required to operate over a little more than one decade of frequency. Damping is very important and requires experimentation. With no damping, return loss and isolation exhibit large undesired deviations at many frequencies as you’ll see later. A side effect of those large deviations is poor time domain response. If you want to use your bias tee to transmit fast digital pulses, you need to achieve smooth frequency-domain behavior, which typically translates into good pulse fidelity. -
CMOS T/R Switch Design : Towards Ultra‑Wideband and Higher Frequency
This document is downloaded from DR‑NTU (https://dr.ntu.edu.sg) Nanyang Technological University, Singapore. CMOS T/R switch design : towards ultra‑wideband and higher frequency Li, Qiang; Zhang, Yue Ping 2007 Li, Q., & Zhang, Y. P. (2007). CMOS T/R switch design : towards ultra‑wideband and higher frequency. IEEE Journal of Solid‑State Circuits, 42(3), 563‑570. https://hdl.handle.net/10356/91145 https://doi.org/10.1109/JSSC.2006.891442 © 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site. Downloaded on 01 Oct 2021 08:29:57 SGT IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 42, NO. 3, MARCH 2007 563 CMOS T/R Switch Design: Towards Ultra-Wideband and Higher Frequency Qiang Li, Member, IEEE, and Y. P. Zhang Abstract—This paper presents the comprehensive consider- point in the transmit mode was obtained. The disad- ations of CMOS transmit/receive (T/R) switch design towards vantages of this approach are the design complexity and large ultra-wideband and over 15-GHz frequencies. -
PIN Diode Drivers Literature Number: SNVA531
PIN Diode Drivers Literature Number: SNVA531 PIN Diode Drivers National Semiconductor PIN Diode Drivers Application Note 49 March 1986 INTRODUCTION The charge control model of a diode1,2 leads to the charge The DH0035/DH0035C is a TTL/DTL compatible, DC continuity equation given in Equation (1). coupled, high speed PIN diode driver. It is capable of deliver- ing peak currents in excess of one ampere at speeds up to 10 MHz. This article demonstrates how the DH0035 may be (1) applied to driving PIN diodes and comparable loads which = require high peak currents at high repetition rates. The sa- where: Q charge due excess minority carriers lient characteristics of the device are summarized in Table 1. τ = mean lifetime of the minority carriers Equation (1) implies a circuit model shown in Figure 2. Under TABLE 1. DH0035 Characteristics steady conditions hence: Parameter Conditions Value Differential Supply 30V Max. (2) Voltage (V+ −V−) where: I = steady state “ON” current. Output Current 1000 mA Maximum Power 1.5W tdelay PRF = 5.0 MHz 10 ns + − trise V −V =20V 15 ns 10% to 90% + − tfall V −V =20V 10 ns 90% to 10% PIN DIODE SWITCHING REQUIREMENTS Figure 1 shows a simplified schematic of a PIN diode switch. AN008750-2 Typically, the PIN diode is used in RF through microwave fre- I = Total Current quency modulators and switches. Since the diode is in shunt IDC = SS Control Current with the RF path, the RF signal is attenuated when the diode iRF = RF Signal Current is forward biased (“ON”), and is passed unattenuated when FIGURE 2. -
Driver Circuit for High-Power PIN Diode Switches
APPLICATION NOTE Driver Circuit for High-Power PIN Diode Switches Introduction The Skyworks High-Power Pin Diode Switch Driver Circuit is a TTL/DTL compatible, DC coupled, high-speed PIN diode bias controller. Part No. EN33-X273 This driver reference design is designed to operate with the Skyworks series of high-power SPDT PIN diode switches. These include: SKY12207-306LF SKY12207-478LF SKY12208-306LF SKY12208-478LF SKY12209-478LF SKY12210-478LF SKY12211-478LF SKY12212-478LF SKY12213-478LF SKY12215-478LF Features High drive current capability (± 50 mA to ± 100 mA) This driver is designed to provide forward currents up to 100 mA 28 V back bias in off state for each diode, and 28 V reverse bias. It is designed for SPDT switches operating with a CW input a power up to 100 W. The Fast switching speed approximately 142 nS driver utilizes fast switching NPN transistors and Skyworks Low current consumption discrete PIN diodes. The driver is designed to utilize a VDD set to Single TTL logic input +28 V, but could operate with voltages as low as +5 V. Skyworks GreenTM products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of GreenTM, document number SQ04–0074. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203950A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • March 28, 2016 1 APPLICATION NOTE • DRIVER CIRCUIT FOR HIGH-POWER PIN DIODE SWITCHES Table 1. Absolute Maximum Ratings1 Parameter Conditions ANT (+5 V) –0.5 V to 7 V RXTX (+28 V) –0.5 V to 40 V VLGC –0.5 V to 7 V RX drive current 150 mA TX drive current 150 mA Operational temperature –40 to +85°C Storage temperature –55 to +125°C 1 Exposure to maximum rating conditions for extended periods may reduce device reliability. -
Broadband Chokes for Bias Tee Applicationsdoc 1193
Broadband Chokes for Bias Tee Applications How to successfully apply a DC bias onto an RF line Insertion loss measured in shunt (ref: 50 Ohms) Introduction 0 The demand for increased bandwidth in data communi- 1 cation is continually increasing, and the integrity of RF 2 signals has become a major design concern. In broadband 3 bias applications, most inductors do not cover enough 4 5 impedance bandwidth. By putting three or four inductors 6 in series, bandwidth can be increased, but DC losses and 7 (dB) S21 filter complexity increase. Broadband chokes provide wide 8 bandwidth in a single inductor package. This document 9 discusses the use of broadband chokes in bias tees. 10 11 12 Broadband Chokes for Bias Tees 1 10 100 1000 10000 The purpose of the inductor in a bias tee, as shown in Frequency (MHz) Figure 1, is to inject a DC bias while isolating the AC signal Figure 2. 4310 LC Characteristics from the DC source. Ideally, any stray AC signal applied to the DC bias line will be isolated by the inductor, preventing Figure 3 shows that the insertion loss from 50 MHz to distortion of the AC signal. 35 GHz is less than 1.0 dB when the BCR inductor is measured in shunt from a transmission line to ground. AC Insertion loss (ref: 50 Ohms) 0 AC only AC + DC -652 0.5 DC -531 1.0 -122 1.5 -802 DC S21 (dB) Figure 1. Equivalent Circuit of a Bias Tee 2.0 For example, a television antenna may need up to 500 mA 2.5 DC injected onto the RF line, while blocking frequencies 0.05 10 20 30 40 from 20 MHz to 2 GHz. -
Application Note AN-1E Copyright November, 2000
Application Note AN-1e Copyright November, 2000 Broadband Coaxial Bias Tees James R Andrews, PhD, IEEE Fellow frequency cutoffs down to ultrasonic frequencies of tens of kHz or lower Figure 1 shows the basic schematic diagrams of the two most common bias tee designs Capacitor C is a DC block installed in the center conductor of the 50 Ohm coaxial line It prevents the DC power from flowing out the AC port For low-current applications, such as biasing photodiodes, a resistor R is used to provide the connection between the DC input and the coaxial center conductor To avoid loading Bias Tees are coaxial components that are used whenever the coax line, the resistor value is chosen to be much greater a source of DC power must be connected to a coaxial cable than the coax impedance For higher-current applications When properly designed, the bias tee does not affect the AC in which the potential drop across R or the power dissipated or RF transmission through the coaxial cable The usual in R would be too great, it is necessary to instead use an application is to provide a means of powering an active device inductor such as a transistor, laser diode or photodiode Other uses would be to provide power to operate remotely located coaxial relays or amplifiers, or to transmit low frequency analog or digital signals on the same coax cable along with RF signals Bias tees have been around and used for a long time There are several microwave and RF manufacturers that have built bias tees for many years Most of these tees were designed only for specific -
PIN Diode Switch Circuit for Short Time High Current Pulse Signal By
PIN Diode Switch Circuit for Short Time High Current Pulse Signal by Rogelio Palomera-Arias B.S. Electrical Engineering University of Puerto Rico Mayagiez Campus, 1996 Submitted to the Department of Electrical Engineering and Computer Science in partial fulfillment of the requirements for the degree of Master of Science in Electrical Engineering at the Massachusetts Institute of Technology June, 1998 © 1998 Rogelio Palomera-Arias. All rights reserved. The author hereby grants to MIT permission to reproduce and to distribute publicly paper and electronic copies of this thesis document in whole or in part. Signature of Author: 1--. -- Department of Electial Engineering and Computer Science May 22, 1998 Certified by: / -Dr. Chathan M. Cooke ncipal Research Engineer / ~-hesjs Superxwisor Accepted by: Professor Arthur C. Smith Chair, Department Committee on Graduate Students L'~n ~'" "If your problems have solution, no need to worry. If your problems have no solution, why worry?" - Anonymous PIN Diode Switch Circuit for Short Time High Current Pulse Signal by Rogelio Palomera-Arias Submitted to the Department of Electrical Engineering and Computer Science on May 22, 1998 in partial fulfillment of the requirements for the degree of Master of Science in Electrical Engineering ABSTRACT The protection of devices from transients is an important general problem and is investigated here in regard to a circuit with a sensor and transient pulses. The specific problem uses a sensor connected in series with a fast pulse source, of about hundred nano seconds duration and five hundred volts size. The method of protection employed is based on using both series isolation and a shunt parallel to the sensor. -
Reverse Recovery Operation and Destruction of MOSFET Body Diode Application Note
Reverse Recovery Operation and Destruction of MOSFET Body Diode Application Note Reverse Recovery Operation and Destruction of MOSFET Body Diode Description This document describes the reverse recovery operation and destruction of the MOSFET body diode. © 2018 1 2018-09-01 Toshiba Electronic Devices & Storage Corporation Reverse Recovery Operation and Destruction of MOSFET Body Diode Application Note Table of Contents Description ............................................................................................................................................ 1 Table of Contents ................................................................................................................................. 2 1. MOSFET body diode ........................................................................................................................ 3 2. Reverse recovery ............................................................................................................................. 4 3. Destruction of the body diode during reverse recovery ............................................................. 5 RESTRICTIONS ON PRODUCT USE.................................................................................................... 9 List of Figures Figure 1 Body diode in a MOSFET .......................................................................................................... 3 Figure 2 Reverse recovery waveform of the body diode .................................................................... 5 Figure 3 -
High-Power T/R Circuits for a Multichannel VHF/UHF/HF Ice Imaging Radar by Syed Faiz Ahmed Submitted to the Graduate Degree
High-Power T/R circuits for a Multichannel VHF/UHF/HF Ice Imaging Radar By Syed Faiz Ahmed Submitted to the graduate degree program in Electrical Engineering and Computer Science and the Graduate Faculty of the University of Kansas in partial fulfillment of the requirements for the degree of Master of Science. ________________________________ Chairperson Dr. Carlton Leuschen ________________________________ Dr. Fernando Rodriguez - Morales ________________________________ Dr. Christopher Allen Date Defended: 01 October 2015 ii The Thesis Committee for Syed Faiz Ahmed certifies that this is the approved version of the following thesis: High-Power T/R circuits for a Multichannel VHF/UHF/HF Ice Imaging Radar ________________________________ Chairperson Dr. Carlton Leuschen Date approved: 01 October 2015 iii Abstract This thesis presents the design and implementation of high-power wide-bandwidth transmit/receive (T/R) switches and modules for use in multi-channel ice-penetrating imaging radars. The switches were designed to address the lack of standard off-the shelf (COTS) devices that meet our technical requirements. The design of these switches was accomplished using electronic design automation (EDA) tools and implemented with quadrature hybrids and actively-biased PIN diodes. Three different circuits were developed for three different frequency bands: 160-230 MHz (VHF band), 150-600 MHz (VHF/UHF), and 10-45 MHz (HF band). The circuits are capable of transmitting at least 1000 W of peak power and exhibit an insertion loss lower than 1.3 dB for 160-230 MHz, 1.6 dB for 150-600 MHz, and 2.39 dB for 10-45 MHz ranges. A fourth, miniaturized prototype for the 160-230 MHz range was implemented for use in future multi-channel systems.