2020 Form 10-K
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In the United States District Court for the District of Delaware
IN THE UNITED STATES DISTRICT COURT FOR THE DISTRICT OF DELAWARE SEMCON TECH, LLC, Plaintiff, v. C.A. No. _________ APPLIED MATERIALS, INC., APPLIED MATERIALS SOUTH EAST ASIA PTE. JURY TRIAL DEMANDED LTD., APPLIED MATERIALS TAIWAN, LTD., APPLIED MATERIALS CHINA, APPLIED MATERIALS FRANCE S.A.R.L., AND APPLIED MATERIALS ITALIA SRL, Defendants. COMPLAINT FOR PATENT INFRINGEMENT This is an action for patent infringement arising under the Patent Laws of the United States of America, 35 U.S.C. § 1 et seq. in which Plaintiff Semcon Tech, LLC makes the following allegations against Defendants Applied Materials, Inc., Applied Materials South East Asia Pte. Ltd., Applied Materials Taiwan, Ltd., Applied Materials China, Applied Materials France S.A.R.L., and Applied Materials Italia Srl (collectively, “AMAT” or “Defendants”). PARTIES 1. Plaintiff Semcon Tech, LLC (“Semcon”) is a Delaware limited liability company. 2. On information and belief, Defendant Applied Materials, Inc. (“AMAT- US”) is a Delaware corporation with its principal place of business at 3050 Bowers Avenue, Santa Clara, California. On information and belief, AMAT can be served through its registered agent, The Corporation Trust Company, Corporation Trust Center, 1 1209 Orange Street, Wilmington, Delaware 19801. 3. On information and belief, Defendant Applied Materials South East Asia Pte. Ltd. (“AMAT-SG”) is a corporation organized under the laws of Singapore with its principal place of business at 8 Upper Changi Road North, Singapore 506906. 4. On information and belief, Defendant Applied Materials Taiwan, Ltd. (“AMAT-TW”) is a corporation organized under the laws of Taiwan with its principal place of business at No. -
Amd Filed: February 24, 2009 (Period: December 27, 2008)
FORM 10-K ADVANCED MICRO DEVICES INC - amd Filed: February 24, 2009 (period: December 27, 2008) Annual report which provides a comprehensive overview of the company for the past year Table of Contents 10-K - FORM 10-K PART I ITEM 1. 1 PART I ITEM 1. BUSINESS ITEM 1A. RISK FACTORS ITEM 1B. UNRESOLVED STAFF COMMENTS ITEM 2. PROPERTIES ITEM 3. LEGAL PROCEEDINGS ITEM 4. SUBMISSION OF MATTERS TO A VOTE OF SECURITY HOLDERS PART II ITEM 5. MARKET FOR REGISTRANT S COMMON EQUITY, RELATED STOCKHOLDER MATTERS AND ISSUER PURCHASES OF EQUITY SECURITIES ITEM 6. SELECTED FINANCIAL DATA ITEM 7. MANAGEMENT S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS ITEM 7A. QUANTITATIVE AND QUALITATIVE DISCLOSURE ABOUT MARKET RISK ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA ITEM 9. CHANGES IN AND DISAGREEMENTS WITH ACCOUNTANTS ON ACCOUNTING AND FINANCIAL DISCLOSURE ITEM 9A. CONTROLS AND PROCEDURES ITEM 9B. OTHER INFORMATION PART III ITEM 10. DIRECTORS, EXECUTIVE OFFICERS AND CORPORATE GOVERNANCE ITEM 11. EXECUTIVE COMPENSATION ITEM 12. SECURITY OWNERSHIP OF CERTAIN BENEFICIAL OWNERS AND MANAGEMENT AND RELATED STOCKHOLDER MATTERS ITEM 13. CERTAIN RELATIONSHIPS AND RELATED TRANSACTIONS AND DIRECTOR INDEPENDENCE ITEM 14. PRINCIPAL ACCOUNTANT FEES AND SERVICES PART IV ITEM 15. EXHIBITS, FINANCIAL STATEMENT SCHEDULES SIGNATURES EX-10.5(A) (OUTSIDE DIRECTOR EQUITY COMPENSATION POLICY) EX-10.19 (SEPARATION AGREEMENT AND GENERAL RELEASE) EX-21 (LIST OF AMD SUBSIDIARIES) EX-23.A (CONSENT OF ERNST YOUNG LLP - ADVANCED MICRO DEVICES) EX-23.B -
ED-7311-20.Pdf
EIAJ ED-7311-20 - 1 - EIAJ ED-7311-20 - 2 - EIAJ ED-7311-20 - 3 - EIAJ ED-7311-20 - 4 - EIAJ ED-7311-20 - 5 - EIAJ ED-7311-20 - 6 - EIAJ ED-7311-20 - 7 - EIAJ ED-7311-20 - 8 - EIAJ ED-7311-20 - 9 - EIAJ ED-7311-20 - 10 - EIAJ ED-7311-20 - 11 - EIAJ ED-7311-20 - 12 - EIAJ ED-7311-20 - 13 - EIAJ ED-7311-20 - 14 - EIAJ ED-7311-20 - 15 - EIAJ ED-7311-20 - 16 - EIAJ ED-7311-20 - 17 - EIAJ ED-7311-20 - 18 - EIAJ ED-7311-20 - 19 - EIAJ ED-7311-20 - 20 - EIAJ ED-7311-20 - 21 - EIAJ ED-7311-20 - 22 - EIAJ ED-7311-20 - 23 - EIAJ ED-7311-20 - 24 - EIAJ ED-7311-20 - 25 - EIAJ ED-7311-20 - 26 - EIAJ ED-7311-20 - 27 - EIAJ ED-7311-20 - 28 - EIAJ ED-7311-20 - 29 - EIAJ ED-7311-20 - 30 - EIAJ ED-7311-20 - 31 - EIAJ ED-7311-20 - 32 - EIAJ ED-7311-20 - 33 - EIAJ ED-7311-20 - 34 - EIAJ ED-7311-20 - 35 - EIAJ ED-7311-20 - 36 - EIAJ ED-7311-20 - 37 - EIAJ ED-7311-20 - 38 - EIAJ ED-7311-20 - 39 - EIAJ ED-7311-20 - 40 - EIAJ ED-7311-20 - 41 - EIAJ ED-7311-20 - 42 - EIAJ ED-7311-20 - 43 - EIAJ ED-7311-20 - 44 - EIAJ ED-7311-20 - 45 - EIAJ ED-7311-20 - 46 - EIAJ ED-7311-20 - 47 - EIAJ ED-7311-20 - 48 - EIAJ ED-7311-20 - 49 - EIAJ ED-7311-20 - 50 - EIAJ ED-7311-20 - 51 - EIAJ ED-7311-20 - 52 - EIAJ ED-7311-20 - 53 - EIAJ ED-7311-20 - 54 - EIAJ ED-7311-20 - 55 - EIAJ ED-7311-20 - 56 - EIAJ ED-7311-20 - 57 - EIAJ ED-7311-20 - 58 - EIAJ ED-7311-20 - 59 - EIAJ ED-7311-20 - 60 - EIAJ ED-7311-20 - 61 - EIAJ ED-7311-20 - 62 - EIAJ ED-7311-20 - 63 - EIAJ ED-7311-20 - 64 - EIAJ ED-7311-20 - 65 - EIAJ ED-7311-20 - 66 - EIAJ ED-7311-20 - 67 - EIAJ ED-7311-20 - 68 - EIAJ -
Redacted Public Version 28
Case3:11-cv-04689-WHO Document250 Filed06/11/14 Page1 of 109 MICHAEL S. ELKIN (admitted pro hac vice) 1 [email protected] THOMAS P. LANE (admitted pro hac vice) 2 [email protected] WINSTON & STRAWN LLP 3 200 Park Avenue New York, NY 10166-4193 4 Telephone: 212.294.6700 Facsimile: 212.294.4700 5 ERIN R. RANAHAN (No. 235286) 6 [email protected] DREW A. ROBERTSON (No. 266317) 7 [email protected] WINSTON & STRAWN LLP 8 333 S. Grand Avenue, Suite 3800 Los Angeles, CA 90071-1543 9 Telephone: 213.615.1700 Facsimile: 213.615.1750 10 DANIEL B. ASIMOW (No. 165661) 11 [email protected] ROBERT D. HALLMAN (No. 239949) 12 [email protected] ARNOLD & PORTER LLP 13 Three Embarcadero Center, 10th Floor San Francisco, CA 94111-4024 14 Telephone: 415.471.3100 Facsimile: 415.471.3400 15 Attorneys for Plaintiff 16 PNY TECHNOLOGIES, INC. 17 UNITED STATES DISTRICT COURT 18 NORTHERN DISTRICT OF CALIFORNIA 19 SAN FRANCISCO DIVISION 20 21 PNY TECHNOLOGIES, INC., Case No.: 11-cv-04689 WHO 22 Plaintiff, THIRD AMENDED COMPLAINT FOR 23 ANTITRUST VIOLATIONS; v. DECLARATORY RELIEF; AND 24 UNFAIR COMPETITION SANDISK CORPORATION, 25 DEMAND FOR JURY TRIAL Defendant. 26 27 REDACTED PUBLIC VERSION 28 PNY’S THIRD AMENDED COMPLAINT 11-cv-04689-WHO LA:355215.1 Case3:11-cv-04689-WHO Document250 Filed06/11/14 Page2 of 109 1 Plaintiff PNY Technologies, Inc. (“PNY”), by and through its attorneys, Winston & Strawn 2 LLP and Arnold & Porter LLP, files this Third Amended Complaint against Defendant SanDisk 3 Corporation (“SanDisk”) to secure damages, declaratory relief and injunctive relief, and demanding 4 trial by jury, claims and alleges as follows: 5 NATURE OF ACTION 6 1. -
Intel and Micron Produce Breakthrough Memory Technology
July 28, 2015 Intel and Micron Produce Breakthrough Memory Technology New Class of Memory Unleashes the Performance of PCs, Data Centers and More NEWS HIGHLIGHTS ● Intel and Micron begin production on new class of non-volatile memory, creating the first new memory category in more than 25 years. 1 ● New 3D XPoint™ technology brings non-volatile memory speeds up to 1,000 times faster than NAND, the most popular non-volatile memory in the marketplace today. ● The companies invented unique material compounds and a cross point architecture for a memory technology that is 10 times denser than conventional memory2. ● New technology makes new innovations possible in applications ranging from machine learning to real-time tracking of diseases and immersive 8K gaming. SANTA CLARA, Calif. & BOISE, Idaho--(BUSINESS WIRE)-- Intel Corporation and Micron Technology, Inc. today unveiled 3D XPoint™ technology, a non-volatile memory that has the potential to revolutionize any device, application or service that benefits from fast access to large sets of data. Now in production, 3D XPoint technology is a major breakthrough in memory process technology and the first new memory category since the introduction of NAND flash in 1989. This Smart News Release features an interactive multimedia capsule. View the full release here: http://www.businesswire.com/news/home/20150728005534/en/ The explosion of connected devices and digital services is generating massive amounts of new data. To make this data useful, it must be stored and analyzed very quickly, creating challenges for service providers and system builders who must balance cost, power and performance trade-offs when they design memory and storage solutions. -
FY2008 Results Meeting
FY200FY20088 ResultsResults MeetingMeeting FY2008 : Year ended March 31, 2009 May 14, 2009 Ryosan Company, Limited Code : 8140 / Stock listings: Tokyo Stock Exchange (First Section) URL : http://www.ryosan.co.jp/eng/ Notice This presentation contains forward-looking statements regarding business performance, which may differ substantially from actual results, depending on certain risks and uncertainties, the most significant of which are listed below. z Economic conditions in key markets (Japan and the rest of Asia), rapid changes in consumption patterns and supply-demand balance for products z Sharp fluctuations in the ¥/$ exchange rate z Substantial fluctuation in prices in capital markets Consolidated results for FY 2008 FY2007 FY2008 FY2009(Forecasts) Of Total Of Total % Chg. YoY Of Total % Chg. YoY ¥ 100 million% ¥ 100 million%% ¥ 100 million %% Net sales 2,860 2,208 (22.8) 1,700 (23.0) Gross margin 251 8.8 196 8.9 (22.1) 149 8.8 (24.1) SG&A expenses 144 5.0 134 6.1 (6.8) 115 6.8 (14.7) Operating income 107 3.8 61 2.8 (42.8) 34 2.0 (44.7) Ordinary income 112 3.9 72 3.3 (35.6) 38 2.2 (47.7) Net income 67 2.4 39 1.8 (41.8) 22 1.3 (43.9) Earnings per share ¥187.15 ¥111.83 (¥75) ¥63.83 (¥48) 1 Segment results for FY2008 Unit : ¥ 100 million FY2007 FY2008 FY2009(Forecasts) OP OP OP Margin Margin % Chg. YoYMargin % Chg. YoY % % Sales 1,489 1,169 (21.5) 808 (30.9) Semiconductors Operating income 724.9% 48 4.2%(32.7) 28 3.5% (42.7) Electronic Sales 1,031 759 (26.4) 584 (23.1) Components Operating income 444.3 28 3.7 (35.9) 22 3.8 (22.1) -
Media Briefing
Media Briefing SANJAY MEHROTRA | President and Chief Executive Officer Mr. Mehrotra joined Micron in May 2017, after a long and distinguished career at SanDisk Corporation where he led the company from start-up in 1988 until its eventual sale in 2016. In addition to being a SanDisk co-founder, Mr. Mehrotra served as its president and CEO from 2011 to 2016, overseeing its growth to an industry-leading Fortune 500 company. Prior to SanDisk, Mr. Mehrotra held design engineering positions at Integrated Device Technology, Inc., SEEQ Technology and Intel Corporation. Mr. Mehrotra earned both bachelor’s and master’s degrees in electrical engineering and computer science from the University of California, Berkeley and is a graduate of the Stanford Graduate School of Business Executive Program (SEP). He currently serves on the board of directors of Cavium, Inc. Mr. Mehrotra holds more than 70 patents and has published articles in the areas of nonvolatile memory design and flash memory systems. MANISH BHATIA | Executive Vice President, Global Operations Mr. Bhatia is responsible for driving the vision and direction for Micron’s end-to-end operations. Mr. Bhatia joined Micron in 2017. Mr. Bhatia most recently served as the executive vice president of Silicon Operations at Western Digital Corporation. Prior to that, Mr. Bhatia held several executive roles at SanDisk Corporation and was the company’s executive vice president of Worldwide Operations when it was acquired by Western Digital. Prior to SanDisk, Mr. Bhatia’s career included positions at Matrix Semiconductor, McKinsey & Company and Saint Gobain Corporation. Mr. Bhatia earned bachelor’s and master’s degrees in mechanical engineering from the Massachusetts Institute of Technology and a master’s degree in business administration from MIT’s Sloan School of Management, which he attended as a Leaders for Manufacturing fellow. -
Click Here for a High-Res Headshot SANJAY MEHROTRA | President
SANJAY MEHROTRA | President and Chief Executive Officer Mr. Mehrotra joined Micron in May 2017, after a long and distinguished career at SanDisk Corporation where he led the company from start- up in 1988 until its eventual sale in 2016. In addition to being a SanDisk co-founder, Mr. Mehrotra served as its president and CEO from 2011 to 2016, overseeing its growth to an industry-leading Fortune 500 company. Prior to SanDisk, Mr. Mehrotra held design engineering positions at Integrated Device Technology, Inc., SEEQ Technology and Intel Corporation. Mr. Mehrotra earned both bachelor’s and master’s degrees in electrical engineering and computer science from the University of California, Berkeley and is a graduate of the Stanford Graduate Click here for a high-res School of Business Executive Program (SEP). He currently serves on headshot the board of directors of Cavium, Inc. Mr. Mehrotra holds more than 70 patents and has published articles in the areas of nonvolatile memory design and flash memory systems. JEFF VERHEUL | Senior Vice President of Nonvolatile Engineering Jeff VerHeul is senior vice president of nonvolatile engineering at Micron Technology. He is responsible for leading the nonvolatile memory engineering team and driving execution of Micron’s storage and Managed NAND products. Mr. VerHeul joined Micron in 2017. Prior to Micron, Mr. VerHeul most recently served as senior vice president of corporate engineering for SanDisk. His career has also included senior and corporate vice president positions with SMSC (acquired by Microchip) and AMD, as well as 25 years with IBM where he held several positions of increasing responsibility, including director, vice president, systems development – IBM Systems Group; Click here a for high-res vice president, product development – IBM Microelectronics; and vice president, engineering and technology services. -
1332:Xtks Nippon Suisan Kaisha Ltd 3 4 1 1334:Xtks Maruha Nichiro Holdings Inc. 3 4 1 1377:Xtks Sakata Seed Corp. 3 5 2 1414:Xtks SHO-BOND Holdings Co
Symbol Code Description Current Rating New rating Diff 1332:xtks Nippon Suisan Kaisha Ltd 3 4 1 1334:xtks Maruha Nichiro Holdings Inc. 3 4 1 1377:xtks Sakata Seed Corp. 3 5 2 1414:xtks SHO-BOND Holdings Co. Ltd 3 6 3 1766:xtks TOKEN Corp. 3 6 3 1801:xtks Taisei Corp. 3 5 2 1803:xtks Shimizu Corp. 3 4 1 1808:xtks Haseko Corp. 3 4 1 1812:xtks Kajima Corp. 3 5 2 1820:xtks Nishimatsu Construction Co. Ltd 3 6 3 1824:xtks Maeda Corp. 3 6 3 1833:xtks Okumura Corp. 3 6 3 1860:xtks Toda Corp. 3 5 2 1861:xtks Kumagai Gumi Co. Ltd 3 8 5 1865:xtks Asunaro Aoki Construction Co. Ltd 3 6 3 1870:xtks Yahagi Construction Co. Ltd 3 4 1 1881:xtks NIPPO Corp. 3 6 3 1883:xtks Maeda Road Construction Co. Ltd 3 6 3 1911:xtks Sumitomo Forestry Co Ltd 3 4 1 1924:xtks PanaHome Corp. 3 4 1 1925:xtks Daiwa House Industry Co. Ltd 3 4 1 1928:xtks Sekisui House Ltd 3 4 1 1934:xtks YURTEC Corp. 3 6 3 1945:xtks Tokyo Energy & Systems Inc. 3 4 1 1961:xtks Sanki Engineering Co. Ltd 3 4 1 1963:xtks JGC Corporation 3 4 1 1968:xtks Taihei Dengyo Kaisha Ltd 3 4 1 1969:xtks Takasago Thermal Engineering Co. Ltd 3 4 1 1973:xtks NEC Networks & System Integration Corp. 3 5 2 1979:xtks Taikisha Ltd 3 4 1 1983:xtks TOSHIBA PLANT SYSTEMS & SERVICES Corp. -
Cisco, Hewlett-Packard, and Micron Technology
April 3, 2013 Submitted by Electronic Filing The Honorable Lisa R. Barton Secretary U.S. International Trade Commission 500 E Street S.W. Washington, DC 20436 Subject: In re Certain Electronic Devices, Including Wireless Communication Devices, Portable Music and Data Processing Devices, and Tablet Computers, Investigation No. 337-TA-794 Dear Secretary Barton: Cisco Systems, Inc. (“Cisco”), Hewlett Packard Company (“HP), and Micron Technology, Inc. (“Micron”) (collectively, “Submitting Parties”) submit these comments in response to the Notice of Commission Determination to Extend the Target Date; Requesting Additional Written Submissions on Remedy and the Public Interest (“Notice”) issued by the International Trade Commission (“ITC”) in the above-captioned investigation. The Notice raises the question of the appropriate remedy for a violation of Section 337 of the Tariff Act involving a FRAND-encumbered patent and application of the Georgia-Pacific factors to the determination of whether a fair, reasonable, and non-discriminatory license offer was made. Submitting Parties provide these comments to address these questions. I. Background of Submitting Parties Cisco is a leader in the networking industry, based in San Jose. Cisco invests five billion dollars annually into research and development and employs over 36,000 people in the United States. Cisco’s customers include the Federal and numerous U.S. state governments and U.S. businesses both large and small.1 Cisco’s customers, who include individuals, governments, and businesses large and small, demand products that exchange information seamlessly with products made by our competitors and other industry participants. Cisco satisfies these customer needs through the implementation of industry standards. -
M E M O R a N D U M
Memo # 1949-07 M E M O R A N D U M TO: Members and Member Organizations FROM: William N. Briggs, Executive Vice President – Administration, Finance & Business Development DATE: August 7, 2007 RE: Options Specialist Shortfall Fee – October 2007 As previously announced in memorandum no. 2000-130 dated August 24, 2000, the options specialists shortfall transaction fee became effective on August 1, 2000. Modifications to the fee were announced in memorandum no. 2001-2255-01 dated December 19, 2001. This fee of $0.35 per contract is paid by the specialist trading any Top 120 Option if at least 12% (effective July 1, 2003) of the total national monthly contract volume for such Top 120 Option is not effected on the PHLX in that month. Attached is a list of the Top 120 Options for the October 2007 billing. The Exchange believes it is necessary to continue to attract order flow to the Exchange in order to remain competitive. This fee should encourage specialists to compete for order flow, which not only enhances the specialist’s role, but also provides additional revenue to the Exchange. For questions regarding the billing and collection of this fee, please contact Joseph Jennings at (215)-496-1467. TOP 120 Multiply-Listed Options For Charges in October 2007 (Comparative Volume, July 2007) # Symbol Company 1 QQQQ NASDAQ-100 Index Tracking Stock 2 IWM iShares Russell 2000 Index Fund 3 SPY SPDR Trust Series 1 4 AAPL Apple Computers, Inc. 5 XLF S&P Financial Select Sector SPDR 6 INTC Intel Corporation 7 AA Alcoa Inc 8 BMY Bristol-Meyers Squibb Company 9 GOOG Google, Inc. -
UNO Template
01 July 2013 Global Securities Research & Analytics Yen and You Connections Series The competitive edge Figure 1: Yen 'normalisation'—only halfway there 160 USDJPY Average 1990-2008 Forecast 150 140 130 120 110 100 The Credit Suisse Connections Series 90 leverages our exceptional breadth of 80 macro and micro research to deliver 70 incisive cross-sector and cross-border 1990 1992 1994 1997 1999 2001 2004 2006 2008 2011 2013 thematic insights for our clients. Source: Credit Suisse Commodities research, the BLOOMBERG PROFESSIONAL™ service The impact on competitiveness: Our global Yen and You series has been SECURITIES RESEARCH & ANALYTICS examining themes stemming from the 'shock therapy' the Bank of Japan Please see inside for contributors to each section initiated earlier this year. In a parallel report published today (Global Equity Strategy - Japan: The sun is still rising), our Global Equity Strategy team revisit their overweight stance on Japanese equities. Here we focus on a key component of that view—a structurally weak yen (our FX team has a 12-month target of JPY120/USD1) and the resulting competitiveness issues. The significance of this theme is underlined by Japan's wide range of high value-add industry segments—starkly highlighted by Fukushima and the 2011 tsunami. Alongside the work of our analysts and strategists, we leverage our proprietary PEERs supply chain framework to highlight company-specific competition. The added topical relevance of this is the number of 'head-to- heads' with the current embattled emerging markets. This report analyses the relative sensitivity within key tradeable sectors such as technology, autos, steel and capital goods.