2015 A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 19, Number 4 WINTER 14th ANNUAL MEPTEC MEMS TECHNOLOGY SYMPOSIUM Advancing MEMS and Sensors for Today’s Exploding Demands Wednesday, May 11, 2016 San Jose, California + page 22 The Great Miniaturization Symposium Follow-Up page 15 MEPTEC MEMBER COMPANY PROFILE Now in its 43rd year, SHENMAO TECHNOLOGY INC., the leading solder material provider globally, started by manu- facturing resin flux cored solder wire and solder bar in 1973 at its Taiwan Headquarters, continuously expanding since 1998 to 10 worldwide locations. page 18 -Corp. INSIDE THIS ISSUE Semico Research SiP module packaging The technology of IC The large number Corp. looks at provides an alternative packaging has over- of mergers and the growing and and complementary taken chip fabrication acquisitions this last changing SoC solution to System- as the focal point of year has been truly market. on-Chip. innovation. staggering. 13 23 26 SPRING 342011 MEPTEC Report 3 Wear Sense Move it. it. it. Innovative IC, System-in-Package, and MEMS packaging portfolio for today’s miniaturization, mobility, and IoT needs. Wire Flip 2.5D WLP Fanout SiP Bond Chip & 3D Package it. Visit: aseglobal.com 2015 The MEPTEC Report is a Publication of the Microelectronics Packaging & Test Engineering Council 315 Savannah River Dr., Summerville, SC 29485 Tel: (650) 714-1570 Email:
[email protected] A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 19, Number 4 WINTER