DOCSLIB.ORG

PC104.2008.09.Pdf

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
PC104.2008.09.Pdf For Single Print Only For Single Print Only www.smallformfactors.com www.pc104online.com Volume 12 • Number 4 COLUMNS FEATURES 8 Small Form Factor SIG SPECIAL: The lowdown on low power Modules, mapping, and more By Colin McCracken 16 The art of just enough By Don Dingee 10 PC/104 Consortium Expressing the standard 17 10 low-power processors worth watching By Dr. Paul Haris By Don Dingee 12 Focus on Form Factors: Catalyst Module 18 Roundup: Intel Atom-based boards, systems, and tools Maximum performance using minimal power By Don Dingee By Haritha Bandla 14 European Technology 20 The ‘next big thing’ is small: Industrial PCs tackle dusty environments Expanding Atom’s PCI Express lanes By Hermann Strass By Steve Moore, PLX Technology 50 Editor’s Insight 28 Tide of malware threats turning against the network Mini-notebooks are certain to drive NextGen of devices SFF technologies By Adrian Turner, Mocana By Chris A. Ciufo APPLICATION: Not so routine instrumentation DEPARTMENTS 32 Small systems help curb risky driving For Single By Peter Ellegaard,Print DriveCam Only 40-43 Editor’s Choice Products By Don Dingee 34 Innovation and technology bring performance to 44-49 New Products instrumentation in small packages By Robin DiPerna By Brett Burger, National Instruments 38 PC/104 controls photon beams, acquires data for critical research EVENTS By David Fastenau, Diamond Systems ESC Boston October 26-30 • Boston, MA www.cmp-egevents.com/web/escb E-LETTER Fall: www.smallformfactors.com/eletter Evolving the next generation of PC/104 technology ON THE COVER: By Jim Blazer and Matthias Huber, PC/104 Consortium A little sunshine goes a long way with the Solio (www.solio.com) low-power universal hybrid charger, which uses solar energy to Technical Committee power portable gadgets such as cell phones, MP3 players, digital Pico-sized platform ushers in new era for I/O cameras, and GPS devices. By Colin McCracken, SFF-SIG, and John Lin, VIA Technologies Inset photo: Eurotech’s Catalyst Module runs the Intel Atom processor at 3 W. For more technical details on this small form factor module, see page 12. WEB RESOURCES Subscribe to the magazine or E-letter at: Published by: OpenSystems www.opensystems-publishing.com/subscriptions Publishing™ Industry news: © 2008 OpenSystems Media/OpenSystems Publishing © 2008 PC/104 and Small Form Factors Read: www.smallformfactors.com/news All registered brands and trademarks in PC/104 and Small Form Factors are property of their respective owners. Submit: www.opensystems-publishing.com/news/submit Submit new products at: 4 / Fall 2008 PC/104 and Small Form Factors www.opensystems-publishing.com/np For Single Print Only OpenSystems Media/OpenSystems Publishing Advertising/Business Office Regional Sales Managers 30233 Jefferson Avenue Ernest Godsey St. Clair Shores, MI 48082 Central and Mountain States n Tel: 586-415-6500 Fax: 586-415-4882 [email protected] A N OPEN S Y S TEM S PUBLIC A TI O N Vice President Marketing & Sales Barbara Quinlan Patrick Hopper Midwest/Southwest Military & Aerospace Group [email protected] [email protected] Business Manager Denis Seger n DSP-FPGA.com/E-letter Karen Layman Southern California n DSP-FPGA.com Resource Guide [email protected] n Military Embedded Systems/E-letter n Sales Group Sydele Starr Military Embedded Systems Resource Guide n PC/104 and Small Form Factors/E-letter Dennis Doyle Northern California [email protected] n PC/104 and Small Form Factors Resource Guide Senior Account Manager n VME and Critical Systems/E-letter [email protected] Ron Taylor n VME and Critical Systems Resource Guide Tom Varcie East Coast/Mid Atlantic Senior Account Manager [email protected] Group Editorial Director Chris Ciufo [email protected] [email protected] Contributing Editor Don Dingee Doug Cordier International Sales [email protected] Account Manager Dan Aronovic [email protected] Account Manager – Israel Senior Associate Editor Jennifer Hesse [email protected] Andrea Stabile [email protected] Senior Editor (columns) Terri Thorson Advertising/Marketing Coordinator Sam Fan [email protected] [email protected] Account Manager – Asia Associate Editor Sharon Schnakenburg Christine Long [email protected] Assistant Editor Robin DiPerna E-marketing Manager New Products Editor Cliff Witte [email protected] European Representative Hermann Strass [email protected] Reprints and PDFs Senior Web Developer Konrad Witte Nan Lamade: 800-259-0470 • [email protected] Web Content Specialist Matt Avella Creative Director Steph Sweet ADVERTISER INFORMATION Art Director David Diomede Circulation/Office Manager Phyllis Thompson Page Advertiser/Ad Title [email protected] 37 ACCES I/O Products, Inc. – Boldly go where no system has gone n yst m 47 Advantech Corporation – Reliability is built-in OpenSystemsi h ng™ Media/OpenSystems Publishing 43 Aprotek, Inc. – PC/104 modems Editorial/Production office: 36 Axiomtek – Innovations for the embedded world 16872 E. Ave. of the Fountains, Ste 203, Fountain Hills, AZ 85268 18 congatec – Highscore for COM Express For SingleTel: 480-967-5581 Print n Fax: 480-837-6466 Only 22 Connect Tech Inc. – Whatever you need, we have the solution Website: www.opensystems-publishing.com 2 Diamond Systems Corporation – 4 things you’ll love Publishers John Black, Michael Hopper, Wayne Kristoff 41 DIGITAL-LOGIC AG – New standard for stackable PCI Express bus Vice President Editorial Rosemary Kristoff 23 EMAC, Inc. – System on Module 9 Eurotech Inc. – Eurotech ISIS Communications Group 31 Excalibur Systems, Inc. – Ready for the unexpected 35 Fastwel Co. Ltd. – PC/104-Plus Editorial Director Joe Pavlat 3 Intel – Join our community of bright people Managing Editor Anne Fisher 7 Jacyl Technology Inc. – The Mission Workstation Senior Editor (columns) Terri Thorson 25 Kontron – Engineering beyond low power Technology Editor Curt Schwaderer 45 LiPPERT Embedded Computers – Resilient and powerful European Representative Hermann Strass Senior Designer Joann Toth 39 Logic Supply – Compact, fanless, solid 5 Micro/sys, Inc. – Dreaming of embedded super powers 30 MPL AG – MAGBES Embedded and Test & Analysis Group 40 Radicom Research, Inc. – PC/104 modem Editorial Director Jerry Gipper 17 RAF Electronic Hardware – Your electronic hardware source Editorial Director Don Dingee 26-27 RTD Embedded Technologies, Inc. – HighRel PC/104 ISA, PCI & PCIe Senior Associate Editor Jennifer Hesse 51 RTD Embedded Technologies, Inc. – Rugged, reliable, mission-ready European Representative Hermann Strass 43 SCIDYNE – PC/104 peripherals 21 Sensoray Co., Inc. – 4 channels of uncompressed video ISSN Print 1096-9764, ISSN Online 1550-0373. Publication Agreement Number: 40048627 48 servo Halbeck GmbH – POSYS motion controllers PC/104 and Small Form Factors is published five times a year by OpenSystems Media/OpenSystems Publishing LLC, 30233 Jefferson Ave., St. Clair Shores, MI 48082. Subscriptions are free upon request to 42 StackableUSB.org – Stretching to make your embedded USB persons interested in PC/104 and other small form factor single board computer technology. For others 49 Technologic Systems – 7" touch panel computer inside the US and Canada, subscriptions are $35/year. For 1st class delivery outside the US and Canada, subscriptions are $50/year (advance payment in US funds required). Canada return address: WDS, 15 Toronto MicroElectronics, Inc. – PC/104-P3 Station A, PO Box 54, Windsor, ON N9A 615 29 Toronto MicroElectronics, Inc. – Peripherals POSTMASTER: Send address changes to PC104 and Small Form Factors 33 Toronto MicroElectronics, Inc. – DVR301 16872 E. Ave. of the Fountains, Ste 203, Fountain Hills, AZ 85268 19 Tri-M Systems Inc. – PC/104 FlexTainer 46 Tri-M Systems Inc. – Intel Pentium M 745 24 VersaLogic Corp. – All the features you need 13 VIA Technologies, Inc. – Pico-ITXe 11 WDL Systems – The power inside tomorrow’s technology 52 WinSystems, Inc. – -40°C to +85°C operation 6 / Fall 2008 PC/104 and Small Form Factors For Single Print Only Modules, mapping, and more With the latest low-power chipsets on Besides COM form factors, SFF-SIG legacy interfaces. SFF-SIG is develop- the market now, the Small Form Factor members are starting to address rugged ing legacy-friendly specifications with Special Interest Group (SFF-SIG) has a peripherals. Some OEMs need small, a mixture of high-speed and easy inter- spate of new form factor standards under removable probes, sensors, and storage face buses on expansion connectors. It’s development to take full advantage of the devices. In harsh and industrial environ- not realistic to expect the ISA bus to be I/O and bus interfaces. Because many ments, these peripherals should have around forever, but the near-term future aspects are involved in designing modular retaining clips, as consumer-grade USB looks bright based on off-the-shelf bridge architectures, consideration must be given dongles are inadequate. End users – equip- chips and FPGA cores. After that, a com- regarding how to offer expansion while ment operators and maintenance tech- bination of Serial Peripheral Interface keeping control over cost and power. nicians – need to remove and exchange (SPI) and I2C will cover most of the low- these peripherals in the communications,
Load more

Recommended publications
  • Compact 2G, 3G, and 4G Modules for Essential M2M Connectivity Sierra
    Sierra Wireless AirPrime® Embedded Wireless Modules HL Series and WS6318 Compact 2G, 3G, and 4G Modules for Essential M2M Connectivity Sierra Wireless AirPrime® HL Series and AirPrime WS6318 are compact and easy- to-integrate modules for voice and data connectivity. They provide everything device manufacturers need to meet essential connectivity requirements for machine-to-machine (M2M) applications. Features including compact size, high-quality, low power consumption, and KEY BENEFITS enhanced RF performance make these 2G, 3G, and 4G modules ideal for use in designs where size, power consumption, and worldwide coverage are key • Small and easy to use differentiators. These modules are ideal for applications in healthcare, point of • Reliable, proven M2M connectivity sale terminals, fl eet management, tracking, and consumer electronics. • Scalable: one footprint across 2G, 3G, and 4G technologies; ensures easy migration AIRPRIME HL SERIES: THE SMALLEST 2G TO 4G FORM FACTOR ON THE MARKET path The AirPrime HL Series is the smallest, scalable, fl exible solution across 2G, 3G, and 4G* technologies, and optionally contains GNSS. The HL Series provides device manufacturers with the ability to serve different regions, across multiple Essential network technologies, with one device design. The HL Series common form factor provides device manufacturers the choice of soldering down the module for effi cient high-volume production or, using a snap-in socket on the same solder pads. The innovative snap-in socket allows OEMs to deploy modules at any point in the production and product life cycles. This provides device manufacturers fl exibility to build with 2G modules in current deployments and then swap 2G modules for 3G or 4G modules in the future, even in completed and fi eld-deployed devices.
    [Show full text]
  • No Worry Protection Program
    Multi-Device Insurance (part of Multi-Device Protection Pack) Device Eligibility and Deductible Schedule 6/1/2014 Update Devices connected to the AT&T network: The Equipment Tier list is updated regularly to include new models. This list applies to only the devices connected to the AT&T network. Devices introduced under Equipment Tier 2 or Equipment Tier 3 may be moved to a lower Tier during their lifecycle. The non-refundable deductible is based on the date of loss. If you are not certain of the model of your device, refer to your original receipt or you may be able to determine the model by following these steps (if applicable): Turn the power off. Carefully remove the battery cover and the battery. The model is typically printed on the white label located under the battery. This list is changed from time to time. Please check this list any time your equipment changes. Multi-Device Insurance for devices connected to the AT&T network is not available for and coverage does not apply to: Galaxy Camera (EK-GC100A) Blackberry Playbook ® Phones on GoPhone accounts Tablets with pre-paid data plans PlayStation® Vita AT&T 3G MicroCell Phone or device models not sold by AT&T (e.g., Dell Streak, Google Nexus One, TerreStar Genus) Docks (such as for the Motorola ATRIX 4G) Amazon Kindle Eligibility is subject to change. Devices not connected to the AT&T network (wi-fi): Multi-Device Insurance for Non-Connected Eligible Devices are not included in the Equipment Tier list below, but are charged a non-refundable deductible at the time of a repair ($89) or replacement ($199) as set forth in the Deductible Schedule directly below.
    [Show full text]
  • Operating Guide
    Operating Guide EPIA EN-Series Mini-ITX Mainboard January 18, 2012 Version 1.21 EPIA EN-Series Operating Guide Table of Contents Table of Contents ...................................................................................................................................................................................... i VIA EPIA EN-Series Overview.............................................................................................................................................................. 1 VIA EPIA EN-Series Layout .................................................................................................................................................................. 2 VIA EPIA EN-Series Specifications ...................................................................................................................................................... 3 VIA EPIA EN Processor SKUs .............................................................................................................................................................. 4 VIA CN700 Chipset Overview ............................................................................................................................................................... 5 VIA EPIA EN-Series I/O Back Panel Layout ...................................................................................................................................... 6 VIA EPIA EN-Series Layout Diagram & Mounting Holes ..............................................................................................................
    [Show full text]
  • In This Video We Are Going to See How a Personal Computer Hardware Is Organised the PC Was Designed with an Open Architecture
    In this video we are going to see how a personal computer hardware is organised The PC was designed with an open architecture. This means that it uses standard modular components. We can add, replace, update or swap them easily and the computer will identify and handle the new devices automatically. The main component of a computer system is the motherboard or main board. It is a printed circuit board (PCB) that holds the main components of the computer and the electronics needed to communicate between them and to expand the system. We could say that it is the central nervous system of the computer. A motherboard provides the electrical connections by which the other components of the system communicate. Unlike a backplane, it also contains the central processing unit and hosts other subsystems and devices The form factor is the specification of a motherboard – the dimensions, power supply type, location of mounting holes, number of ports on the back panel, etc. In the IBM PC compatible industry, standard form factors ensure that parts are interchangeable across competing vendors and generations of technology, while in enterprise computing, form factors ensure that server modules fit into existing rack mount systems. Traditionally, the most significant specification is for that of the motherboard, which generally dictates the overall size of the case. The most used form factor for IBM PC compatible motherboards is ATX (Advanced Technology Extended) and its derivatives. For small form factor mainboards mini ITX is the de facto standard. A power supply unit (PSU) converts mains AC to low- voltage regulated DC power for the internal components of a computer.
    [Show full text]
  • Netmotion Diagnostics - Network Adapter and GPS Receiver Matrix
    NetMotion Diagnostics - Network Adapter and GPS Receiver Matrix Network Adapters The following tables show the network adapters that work with NetMotion Diagnostics. They also identify devices that have not been tested by NetMotion, but that customers have reported are compatible with Diagnostics. Each time we release a new version of the Diagnostics client that supports additional adapters, we update this document—the most current version of the matrix is always available on our web site: http://www.netmotionwireless.com/support/docs/Diagnostics/matrix/NetMotion-Diagnostics_Network-Adapter-and-GPS-Receiver-Matrix.pdf Adapters are organized as follows: ! Supported Network Adapters — Carrier: AT&T ! Supported Network Adapters — Carrier: Sprint ! Supported Network Adapters — Carrier: Verizon ! Supported Network Adapters — Carrier: Vodafone ! Supported Network Adapters — Carrier: FirstNet ! Supported Network Adapters — Canadian Carriers (All) ! Supported Network Adapters — Android Devices (All Carriers) ! Supported Network Adapters — Apple iOS Devices (All Carriers) ! Supported Vehicle-Mounted Modems — Miscellaneous (All Carriers) ! Supported Vehicle-Mounted Modems — CradlePoint (All Carriers) ! Supported Vehicle-Mounted Modems — Rocket (All Carriers) ! Supported Vehicle-Mounted Modems — Sierra Wireless AirLink - ALEOS (All Carriers) ! Supported Mobile Hotspot Devices for WiFi-Enabled Devices (All Carriers) ! Untested Network Adapters Reported to be Compatible with Diagnostics — Windows Laptops (All Carriers) ! Untested Vehicle-Mounted Modems Reported to be Compatible with Diagnostics — CradlePoint (All Carriers) ! Untested Mobile Hotspot Devices for WiFi-Enabled Devices (All Carriers) ! Diagnostics Compatibility with Chipsets in Embedded Modems On Windows devices, Diagnostics supports these network adapters only when they are operated in NDIS mode. GPS receivers vary in reliability and quality from model to model. Customers are responsible for the operation and performance of the GPS receivers used in their deployments.
    [Show full text]
  • Flexatx-SKL-S
    USER GUIDE FlexATX-SKL-S Doc. Rev. 1.4 Doc.-ID: 1061-4868 FlexATX-SKL-S – Rev. 1.4 This page has been intentionally left blank www.kontron.com // 2 FlexATX-SKL-S – Rev. 1.4 FLEXATX-SKL-S - USER GUIDE Disclaimer Kontron would like to point out that the information contained in this manual may be subject to alteration, particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee on the part of Kontron with respect to technical processes described in the manual or any product characteristics set out in the manual. Kontron assumes no responsibility or liability for the use of the described product(s), conveys no license or title under any patent, copyright or mask work rights to these products and makes no representations or warranties that these products are free from patent, copyright or mask work right infringement unless otherwise specified. Applications that are described in this manual are for illustration purposes only. Kontron makes no representation or warranty that such application will be suitable for the specified use without further testing or modification. Kontron expressly informs the user that this manual only contains a general description of processes and instructions which may not be applicable in every individual case. In cases of doubt, please contact Kontron. This manual is protected by copyright. All rights are reserved by Kontron. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron.
    [Show full text]
  • Focus on Your Core Competency the COM Express Standard
    Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1.
    [Show full text]
  • A Superscalar Out-Of-Order X86 Soft Processor for FPGA
    A Superscalar Out-of-Order x86 Soft Processor for FPGA Henry Wong University of Toronto, Intel [email protected] June 5, 2019 Stanford University EE380 1 Hi! ● CPU architect, Intel Hillsboro ● Ph.D., University of Toronto ● Today: x86 OoO processor for FPGA (Ph.D. work) – Motivation – High-level design and results – Microarchitecture details and some circuits 2 FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT6-LUT 6-LUT6-LUT 3 6-LUT 6-LUT FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT 6-LUT 6-LUT 6-LUT 4 6-LUT 6-LUT FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 5 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 6 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel
    [Show full text]
  • SIMD Extensions
    SIMD Extensions PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 12 May 2012 17:14:46 UTC Contents Articles SIMD 1 MMX (instruction set) 6 3DNow! 8 Streaming SIMD Extensions 12 SSE2 16 SSE3 18 SSSE3 20 SSE4 22 SSE5 26 Advanced Vector Extensions 28 CVT16 instruction set 31 XOP instruction set 31 References Article Sources and Contributors 33 Image Sources, Licenses and Contributors 34 Article Licenses License 35 SIMD 1 SIMD Single instruction Multiple instruction Single data SISD MISD Multiple data SIMD MIMD Single instruction, multiple data (SIMD), is a class of parallel computers in Flynn's taxonomy. It describes computers with multiple processing elements that perform the same operation on multiple data simultaneously. Thus, such machines exploit data level parallelism. History The first use of SIMD instructions was in vector supercomputers of the early 1970s such as the CDC Star-100 and the Texas Instruments ASC, which could operate on a vector of data with a single instruction. Vector processing was especially popularized by Cray in the 1970s and 1980s. Vector-processing architectures are now considered separate from SIMD machines, based on the fact that vector machines processed the vectors one word at a time through pipelined processors (though still based on a single instruction), whereas modern SIMD machines process all elements of the vector simultaneously.[1] The first era of modern SIMD machines was characterized by massively parallel processing-style supercomputers such as the Thinking Machines CM-1 and CM-2. These machines had many limited-functionality processors that would work in parallel.
    [Show full text]
  • Operating Guide
    Operating Guide EPIA-P830 Mainboard EPIA-P830 Operating Guide Table of Contents Table of Contents .......................................................................................................................................................................................... i VIA EPIA-P830 overview.............................................................................................................................................................................1 VIA EPIA-P830 layout ..................................................................................................................................................................................2 VIA EPIA-P830 specifications ...................................................................................................................................................................3 VIA EPIA-P830 processor SKUs ...............................................................................................................................................................4 VIA VX900 chipset overview.....................................................................................................................................................................5 VIA EPIA-P830 and P830-A board dimensions.................................................................................................................................6 VIA P830-B board dimensions.................................................................................................................................................................7
    [Show full text]
  • COM Express® Basic, Compact, Mini • Qseven® • SMARC™
    • • • • Computer Highlights Product ETX® SMARC™ Qseven COM Express® - ® Qseven® on (70 x 70 mm) - Module Basic SMARC™ (84 x 55 mm) , Compact COM Express® mini (84 x 55 mm) , Mini your specialist for embedded solutions COM Express® Compact (95 x 95 mm) 13.10.2017 COM Express® Basic (125 x 95 mm) Embedded Boards Industrial Mainboards Embedded Systems Accessories & IoT 2,5“ Pico-ITX™ Mini-ITX™ Embedded Box PCs Gateways 3,5“ Single Board Computer Micro-ATX Embedded Panel PCs Switches PC/104 Flex-ATX Embedded Server Router Slot SBC ATX Embedded Desktop PCs Memory, CPUs Computer-on-Module Digital Signage Player Cables Industrial Monitors Power Supplies Available Features & Options: Designed for Industrial Applications Long-term Availability Extended Temperature -40°C…+85°C Custom Design Design-in Support Fixed Bill of Material Kits (Board with OS, Display & Cables) EOL / PCN Handling your specialist for embedded solutions Systems - Custom - Standard Kit Solutions - Embedded Board - Operating System - Accessories e.g. Cable/Memory Distribution - Embedded Boards - Displays - Power Supplies your specialist for embedded solutions COM Express® Basic Type 6 & Type 7 COM Express® Basic (125 x 95 mm) your specialist for embedded solutions COM Express® Basic (95 x 125 mm) Intel® Core™ i CPU (Kaby Lake & Skylake) Product SOM-5898 COMe-bKL6 ET970 SOM-5897 COMe-bSL6 Vendor ADVANTECH Kontron iBASE ADVANTECH Kontron Type / Pin-out Type 6 R2.1 Type 6 Type 6 Type 6 Type 6 Intel® Xeon®, Core® i, Intel® Core® i, Xeon, Intel® Core™ i , Xeon (7th Intel® Core™
    [Show full text]
  • Highrel PC/104 ISA, PCI & Pcie Modules and Systems
    Copyright © 2010 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. RTD Embedded Technologies, Inc. Catch the Express! Left: a stellar PCI/104-Express IDAN® including dual, hot-swappable SATA drawers, a 1.86 GHz Intel® Core™ 2 Duo cpuModule™ and Controller with video ports, serial ports, gigabit Ethernet, Advanced Analog & Digital I/O ports, and an 88W high-efficiency power supply. Below: a sample of RTD’s Express offering. RTD is proud to lead the industry in PCI/104-Express selection and development. PCI/104-Express PCIe/104 with Dual Ethernet Intel® Core™ 2 Duo cpuModule™ Intel® Core™ 2 Duo cpuModule™ High-Speed Digital I/O Isolated Digital I/O 88W Power Supply SATA Drive Carrier Dual-Slot Mini PCIe 5-Port Ethernet Switch Dual Gigabit Ethernet PCI Express to PCI Bridge rights reserved. All Inc. Inc. the property of their respective companies. the property of their respective are Technologies, Embedded RTD The Leading Source for Express. 2010 Design, Engineering, Manufacturing & Tech Support Copyright © Copyright All trademarks or registered trademarks All trademarks or registered www.rtd.com AS9100 and ISO 9001 Certified [email protected] www.smallformfactors.com www.pc104online.com Volume 14 • Number 5 COLUMNS FEATURES 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs 10 THE BIG YET SMALL PICTURE By Paul Rosenfeld Mission interoperable Achieving compatibility by 7 PC/104 Consortium Promotions and spec revisions on tap for standardizing
    [Show full text]