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Compact 2G, 3G, and 4G Modules for Essential M2M Connectivity Sierra
Sierra Wireless AirPrime® Embedded Wireless Modules HL Series and WS6318 Compact 2G, 3G, and 4G Modules for Essential M2M Connectivity Sierra Wireless AirPrime® HL Series and AirPrime WS6318 are compact and easy- to-integrate modules for voice and data connectivity. They provide everything device manufacturers need to meet essential connectivity requirements for machine-to-machine (M2M) applications. Features including compact size, high-quality, low power consumption, and KEY BENEFITS enhanced RF performance make these 2G, 3G, and 4G modules ideal for use in designs where size, power consumption, and worldwide coverage are key • Small and easy to use differentiators. These modules are ideal for applications in healthcare, point of • Reliable, proven M2M connectivity sale terminals, fl eet management, tracking, and consumer electronics. • Scalable: one footprint across 2G, 3G, and 4G technologies; ensures easy migration AIRPRIME HL SERIES: THE SMALLEST 2G TO 4G FORM FACTOR ON THE MARKET path The AirPrime HL Series is the smallest, scalable, fl exible solution across 2G, 3G, and 4G* technologies, and optionally contains GNSS. The HL Series provides device manufacturers with the ability to serve different regions, across multiple Essential network technologies, with one device design. The HL Series common form factor provides device manufacturers the choice of soldering down the module for effi cient high-volume production or, using a snap-in socket on the same solder pads. The innovative snap-in socket allows OEMs to deploy modules at any point in the production and product life cycles. This provides device manufacturers fl exibility to build with 2G modules in current deployments and then swap 2G modules for 3G or 4G modules in the future, even in completed and fi eld-deployed devices. -
No Worry Protection Program
Multi-Device Insurance (part of Multi-Device Protection Pack) Device Eligibility and Deductible Schedule 6/1/2014 Update Devices connected to the AT&T network: The Equipment Tier list is updated regularly to include new models. This list applies to only the devices connected to the AT&T network. Devices introduced under Equipment Tier 2 or Equipment Tier 3 may be moved to a lower Tier during their lifecycle. The non-refundable deductible is based on the date of loss. If you are not certain of the model of your device, refer to your original receipt or you may be able to determine the model by following these steps (if applicable): Turn the power off. Carefully remove the battery cover and the battery. The model is typically printed on the white label located under the battery. This list is changed from time to time. Please check this list any time your equipment changes. Multi-Device Insurance for devices connected to the AT&T network is not available for and coverage does not apply to: Galaxy Camera (EK-GC100A) Blackberry Playbook ® Phones on GoPhone accounts Tablets with pre-paid data plans PlayStation® Vita AT&T 3G MicroCell Phone or device models not sold by AT&T (e.g., Dell Streak, Google Nexus One, TerreStar Genus) Docks (such as for the Motorola ATRIX 4G) Amazon Kindle Eligibility is subject to change. Devices not connected to the AT&T network (wi-fi): Multi-Device Insurance for Non-Connected Eligible Devices are not included in the Equipment Tier list below, but are charged a non-refundable deductible at the time of a repair ($89) or replacement ($199) as set forth in the Deductible Schedule directly below. -
Operating Guide
Operating Guide EPIA EN-Series Mini-ITX Mainboard January 18, 2012 Version 1.21 EPIA EN-Series Operating Guide Table of Contents Table of Contents ...................................................................................................................................................................................... i VIA EPIA EN-Series Overview.............................................................................................................................................................. 1 VIA EPIA EN-Series Layout .................................................................................................................................................................. 2 VIA EPIA EN-Series Specifications ...................................................................................................................................................... 3 VIA EPIA EN Processor SKUs .............................................................................................................................................................. 4 VIA CN700 Chipset Overview ............................................................................................................................................................... 5 VIA EPIA EN-Series I/O Back Panel Layout ...................................................................................................................................... 6 VIA EPIA EN-Series Layout Diagram & Mounting Holes .............................................................................................................. -
In This Video We Are Going to See How a Personal Computer Hardware Is Organised the PC Was Designed with an Open Architecture
In this video we are going to see how a personal computer hardware is organised The PC was designed with an open architecture. This means that it uses standard modular components. We can add, replace, update or swap them easily and the computer will identify and handle the new devices automatically. The main component of a computer system is the motherboard or main board. It is a printed circuit board (PCB) that holds the main components of the computer and the electronics needed to communicate between them and to expand the system. We could say that it is the central nervous system of the computer. A motherboard provides the electrical connections by which the other components of the system communicate. Unlike a backplane, it also contains the central processing unit and hosts other subsystems and devices The form factor is the specification of a motherboard – the dimensions, power supply type, location of mounting holes, number of ports on the back panel, etc. In the IBM PC compatible industry, standard form factors ensure that parts are interchangeable across competing vendors and generations of technology, while in enterprise computing, form factors ensure that server modules fit into existing rack mount systems. Traditionally, the most significant specification is for that of the motherboard, which generally dictates the overall size of the case. The most used form factor for IBM PC compatible motherboards is ATX (Advanced Technology Extended) and its derivatives. For small form factor mainboards mini ITX is the de facto standard. A power supply unit (PSU) converts mains AC to low- voltage regulated DC power for the internal components of a computer. -
Netmotion Diagnostics - Network Adapter and GPS Receiver Matrix
NetMotion Diagnostics - Network Adapter and GPS Receiver Matrix Network Adapters The following tables show the network adapters that work with NetMotion Diagnostics. They also identify devices that have not been tested by NetMotion, but that customers have reported are compatible with Diagnostics. Each time we release a new version of the Diagnostics client that supports additional adapters, we update this document—the most current version of the matrix is always available on our web site: http://www.netmotionwireless.com/support/docs/Diagnostics/matrix/NetMotion-Diagnostics_Network-Adapter-and-GPS-Receiver-Matrix.pdf Adapters are organized as follows: ! Supported Network Adapters — Carrier: AT&T ! Supported Network Adapters — Carrier: Sprint ! Supported Network Adapters — Carrier: Verizon ! Supported Network Adapters — Carrier: Vodafone ! Supported Network Adapters — Carrier: FirstNet ! Supported Network Adapters — Canadian Carriers (All) ! Supported Network Adapters — Android Devices (All Carriers) ! Supported Network Adapters — Apple iOS Devices (All Carriers) ! Supported Vehicle-Mounted Modems — Miscellaneous (All Carriers) ! Supported Vehicle-Mounted Modems — CradlePoint (All Carriers) ! Supported Vehicle-Mounted Modems — Rocket (All Carriers) ! Supported Vehicle-Mounted Modems — Sierra Wireless AirLink - ALEOS (All Carriers) ! Supported Mobile Hotspot Devices for WiFi-Enabled Devices (All Carriers) ! Untested Network Adapters Reported to be Compatible with Diagnostics — Windows Laptops (All Carriers) ! Untested Vehicle-Mounted Modems Reported to be Compatible with Diagnostics — CradlePoint (All Carriers) ! Untested Mobile Hotspot Devices for WiFi-Enabled Devices (All Carriers) ! Diagnostics Compatibility with Chipsets in Embedded Modems On Windows devices, Diagnostics supports these network adapters only when they are operated in NDIS mode. GPS receivers vary in reliability and quality from model to model. Customers are responsible for the operation and performance of the GPS receivers used in their deployments. -
Flexatx-SKL-S
USER GUIDE FlexATX-SKL-S Doc. Rev. 1.4 Doc.-ID: 1061-4868 FlexATX-SKL-S – Rev. 1.4 This page has been intentionally left blank www.kontron.com // 2 FlexATX-SKL-S – Rev. 1.4 FLEXATX-SKL-S - USER GUIDE Disclaimer Kontron would like to point out that the information contained in this manual may be subject to alteration, particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee on the part of Kontron with respect to technical processes described in the manual or any product characteristics set out in the manual. Kontron assumes no responsibility or liability for the use of the described product(s), conveys no license or title under any patent, copyright or mask work rights to these products and makes no representations or warranties that these products are free from patent, copyright or mask work right infringement unless otherwise specified. Applications that are described in this manual are for illustration purposes only. Kontron makes no representation or warranty that such application will be suitable for the specified use without further testing or modification. Kontron expressly informs the user that this manual only contains a general description of processes and instructions which may not be applicable in every individual case. In cases of doubt, please contact Kontron. This manual is protected by copyright. All rights are reserved by Kontron. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron. -
Focus on Your Core Competency the COM Express Standard
Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1. -
A Superscalar Out-Of-Order X86 Soft Processor for FPGA
A Superscalar Out-of-Order x86 Soft Processor for FPGA Henry Wong University of Toronto, Intel [email protected] June 5, 2019 Stanford University EE380 1 Hi! ● CPU architect, Intel Hillsboro ● Ph.D., University of Toronto ● Today: x86 OoO processor for FPGA (Ph.D. work) – Motivation – High-level design and results – Microarchitecture details and some circuits 2 FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT6-LUT 6-LUT6-LUT 3 6-LUT 6-LUT FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT 6-LUT 6-LUT 6-LUT 4 6-LUT 6-LUT FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 5 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 6 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel -
SIMD Extensions
SIMD Extensions PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 12 May 2012 17:14:46 UTC Contents Articles SIMD 1 MMX (instruction set) 6 3DNow! 8 Streaming SIMD Extensions 12 SSE2 16 SSE3 18 SSSE3 20 SSE4 22 SSE5 26 Advanced Vector Extensions 28 CVT16 instruction set 31 XOP instruction set 31 References Article Sources and Contributors 33 Image Sources, Licenses and Contributors 34 Article Licenses License 35 SIMD 1 SIMD Single instruction Multiple instruction Single data SISD MISD Multiple data SIMD MIMD Single instruction, multiple data (SIMD), is a class of parallel computers in Flynn's taxonomy. It describes computers with multiple processing elements that perform the same operation on multiple data simultaneously. Thus, such machines exploit data level parallelism. History The first use of SIMD instructions was in vector supercomputers of the early 1970s such as the CDC Star-100 and the Texas Instruments ASC, which could operate on a vector of data with a single instruction. Vector processing was especially popularized by Cray in the 1970s and 1980s. Vector-processing architectures are now considered separate from SIMD machines, based on the fact that vector machines processed the vectors one word at a time through pipelined processors (though still based on a single instruction), whereas modern SIMD machines process all elements of the vector simultaneously.[1] The first era of modern SIMD machines was characterized by massively parallel processing-style supercomputers such as the Thinking Machines CM-1 and CM-2. These machines had many limited-functionality processors that would work in parallel. -
Operating Guide
Operating Guide EPIA-P830 Mainboard EPIA-P830 Operating Guide Table of Contents Table of Contents .......................................................................................................................................................................................... i VIA EPIA-P830 overview.............................................................................................................................................................................1 VIA EPIA-P830 layout ..................................................................................................................................................................................2 VIA EPIA-P830 specifications ...................................................................................................................................................................3 VIA EPIA-P830 processor SKUs ...............................................................................................................................................................4 VIA VX900 chipset overview.....................................................................................................................................................................5 VIA EPIA-P830 and P830-A board dimensions.................................................................................................................................6 VIA P830-B board dimensions.................................................................................................................................................................7 -
COM Express® Basic, Compact, Mini • Qseven® • SMARC™
• • • • Computer Highlights Product ETX® SMARC™ Qseven COM Express® - ® Qseven® on (70 x 70 mm) - Module Basic SMARC™ (84 x 55 mm) , Compact COM Express® mini (84 x 55 mm) , Mini your specialist for embedded solutions COM Express® Compact (95 x 95 mm) 13.10.2017 COM Express® Basic (125 x 95 mm) Embedded Boards Industrial Mainboards Embedded Systems Accessories & IoT 2,5“ Pico-ITX™ Mini-ITX™ Embedded Box PCs Gateways 3,5“ Single Board Computer Micro-ATX Embedded Panel PCs Switches PC/104 Flex-ATX Embedded Server Router Slot SBC ATX Embedded Desktop PCs Memory, CPUs Computer-on-Module Digital Signage Player Cables Industrial Monitors Power Supplies Available Features & Options: Designed for Industrial Applications Long-term Availability Extended Temperature -40°C…+85°C Custom Design Design-in Support Fixed Bill of Material Kits (Board with OS, Display & Cables) EOL / PCN Handling your specialist for embedded solutions Systems - Custom - Standard Kit Solutions - Embedded Board - Operating System - Accessories e.g. Cable/Memory Distribution - Embedded Boards - Displays - Power Supplies your specialist for embedded solutions COM Express® Basic Type 6 & Type 7 COM Express® Basic (125 x 95 mm) your specialist for embedded solutions COM Express® Basic (95 x 125 mm) Intel® Core™ i CPU (Kaby Lake & Skylake) Product SOM-5898 COMe-bKL6 ET970 SOM-5897 COMe-bSL6 Vendor ADVANTECH Kontron iBASE ADVANTECH Kontron Type / Pin-out Type 6 R2.1 Type 6 Type 6 Type 6 Type 6 Intel® Xeon®, Core® i, Intel® Core® i, Xeon, Intel® Core™ i , Xeon (7th Intel® Core™ -
Highrel PC/104 ISA, PCI & Pcie Modules and Systems
Copyright © 2010 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. RTD Embedded Technologies, Inc. Catch the Express! Left: a stellar PCI/104-Express IDAN® including dual, hot-swappable SATA drawers, a 1.86 GHz Intel® Core™ 2 Duo cpuModule™ and Controller with video ports, serial ports, gigabit Ethernet, Advanced Analog & Digital I/O ports, and an 88W high-efficiency power supply. Below: a sample of RTD’s Express offering. RTD is proud to lead the industry in PCI/104-Express selection and development. PCI/104-Express PCIe/104 with Dual Ethernet Intel® Core™ 2 Duo cpuModule™ Intel® Core™ 2 Duo cpuModule™ High-Speed Digital I/O Isolated Digital I/O 88W Power Supply SATA Drive Carrier Dual-Slot Mini PCIe 5-Port Ethernet Switch Dual Gigabit Ethernet PCI Express to PCI Bridge rights reserved. All Inc. Inc. the property of their respective companies. the property of their respective are Technologies, Embedded RTD The Leading Source for Express. 2010 Design, Engineering, Manufacturing & Tech Support Copyright © Copyright All trademarks or registered trademarks All trademarks or registered www.rtd.com AS9100 and ISO 9001 Certified [email protected] www.smallformfactors.com www.pc104online.com Volume 14 • Number 5 COLUMNS FEATURES 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs 10 THE BIG YET SMALL PICTURE By Paul Rosenfeld Mission interoperable Achieving compatibility by 7 PC/104 Consortium Promotions and spec revisions on tap for standardizing