COMCOM ExpressExpress CompactCompact andand QsevenQseven embeddedembedded PCPC ModuleModule basedbased onon IntelIntel AtomAtom ProcessorProcessor

Presented by: congatec AG Christof Riederer COMCOM ExpressExpress DimensionsDimensions

 Compact (95mm x 95mm)  Perfect for limited space apps.  Suitable for ultra low voltage CPUs  Ideal for Intel Atom based Modules  Basic (125mm x 95mm)  Intended for mobile and space constrained stationary systems  More powerful CPUs, SO-DIMM  Extended (155mm x 110mm)  High performance CPUs, DIMM  Dual channel memory applications  For high end market applications

 For all modules the connector pinout is the same! BenefitsBenefits

 Faster time-to-market  Cost effective customization alternatives  Improved form-fit-function, minimizing current and future design risks  Lower product life cycle costs  Module scalability  Interchangeability  Smooth transition from legacy to legacy free  (PCI, IDE) + (PCI Express, SATA) ►(PCI Express, SATA)  Headroom for growth of emerging technologies  (2.5 GHz PCI Express, SATA-150) ► (5 GHz PCI Express, SATA-300)  PICMG embedded standard

 Safeguards R&D investment and lowers total cost of ownership conga-CAconga-CA –– COMCOM ExpressExpress CompactCompact ModuleModule

 CPU: Intel® Atom™ processor Z5xx series - 45nm  Z510: 1.1 GHz, 512kB L2 Cache  Z530: 1.6 GHz, 512kB L2 Cache with Hyperthreading  Chipset: Intel® SCH US15W  Ultra low power 3D graphics HD video decoder, 256MB UMA 24bit LVDS (max. 1366x768) and SDVO (max. 1280x1024)  Integrated DDR2 memory controller 1GB soldered memory onboard  Limited PCI Express (optional) 2 onboard SDIO slots  Controller  congatec controller for reset and power sequencing conga-CAconga-CA –– COMCOM ExpressExpress CompactCompact ModuleModule

 Interfaces (not provided by US15SW)  2 Serial ATA channels  PCI Bus (Rev. 2.3)  Gigabit

 congatec Embedded Features  Embedded BIOS  Board Controller  Multistage Watchdog  Battery Management  32 Bit API (CGOS) conga-CAconga-CA –– COMCOM ExpressExpress CompactCompact ModuleModule

 Form Factor: COM Express  COM Express Features (Pinout Type 2, compact size)  2 Serial ATA Channel  SDRAM: soldered 1GB  PCI Bus (Rev. 2.3) (DDR2 533MT/s)   EPI/DisplayID Support 8 USB 2.0 Ports (Embedded Panel Interface)  HDA Interface  Power Management  LPC Bus ACPI 3.0  Ethernet (100/1000Base-Tx) Suspend to RAM  EIDE Channel (UDMA-100)  Operating Systems  I²C Bus (Fast Mode, Multimaster) WinXP, 2000, XPe, CE  SM Bus 6.0, Linux, QNX  Power Consumption <5Watt @12V conga-CAconga-CA –– BlockBlock DiagramDiagram conga-CAconga-CA –– BoardBoard ControllerController

congatec Board Controller

Multistage Watchdog I2C EEPROM Controller

Serial No. EAN code Boot- HW/FW rev. counter Manuf. date Repair. date ...... Running- time User Data meter

 Low cost solution for US15W glue logic  Firmware completely engineered by congatec

conga-CAconga-CA –– ApplicationApplication ExampleExample

 Low-Power Intel® In-Vehicle Infotainment Reference Design  Design Highlights  Specifically designed for automotive vendors  High-performance, highly integrated, low-power solutions  conga-CA COM Express module from congatec  Combination with the base board  3D navigation  Rear-seat entertainment  Cameras  Internet connectivity, ...  Dual independent display  www.intel.com/go/infotainment conga-IVIconga-IVI InIn VehicleVehicle InfotainmentInfotainment starterstarter KitKit

165-mm wide by 175-mm deep supports standard DIN slot conga-CEVALconga-CEVAL –– EvaluationEvaluation PlatformPlatform

 Designed to accommodate COM Express Modules  4x1 PCI Express, 1x ExpressCard  1x16 PCI Express Graphics Port  1x Mini PCI Express Card  Gigabit Ethernet, 8x USB  AC97 compatible codec  HDA optional via connector  4xSATA, PATA, 2xCOM, LPT, FD  PS/2 kbd./mouse, LPC POST code  Beeper, Power button, Reset button, Battery  CRT connector, LVDS interface  ATX connector, 12V/GND banana jacks COMCOM ExpressExpress EngineeringEngineering ToolsTools

 Debug Card  POST Code Display  LPC Firmware Hub Socket  Debug Interfaces SATA, VGA, USB, ...  Flat Panel Adaptation Module  EPI/DisplayID Conform  LVDS and TTL In and Out  For 18 and 24 bit panels  Backlight Control  SDVO/DVI Evaluator  SDVO to DVI-D (ADD2 card)  HDA Evaluator SmartSmart BatteryBattery ManagerManager SolutionSolution

 Instant Battery Solution  Supports 2S1P up to 4S3P, Parallel or sequential battery operation  S3 support (suspend to RAM)  Input voltage of 19V, max. 4.5A with input power delimitation

 Starter Kit  Smart Battery Manager Module and carrier board  Complete set of cables  SMART Battery  for testing with the evaluation carrier board HeatspreadersHeatspreaders andand HeatsinksHeatsinks

 Heatspreader  Heatsink  With 2.7mm non threaded  Passive or active with 12V stand-offs fan  With M2.5 mm threaded  Non threaded or threaded stand-offs stand-offs

AA newnew StandardStandard forfor Computer-On-ModulesComputer-On-Modules

 Why do we need a new Standard?  To provide the features of latest 45nm mobile chipsets and processors.  To provide the ability to use the successful Computer-On-Module concept for mobile and ultra mobile embedded applications.  To support the latest graphic standards such as DisplayPort and HDMI.  Small form factor for easy integration.

 What is special about Qseven?  Legacy free – only new serial buses are defined  Flexible graphics – new graphic standards are supported  Embedded API – Software interface for easy interchangeability MechanicMechanic andand CoolingCooling

 Compact size  Quadratic 7 cm (2¾” x 2¾”)  Solid mechanical mounting  Cost efficient direct edge connector  Rugged 1.2 mm PCB thickness  Cooling interface  Top edge defined for heat transfer  Heat transfer from CPU, Chipset and DRAM enhanced via copper layers  Heatspreader defined for high power versions (max. 12 W) MXMMXM ConnectorConnector

 MXM edge connector  Foxconn ASOB3 series  Currently used for notebook MXM graphics cards  230 positions, .020” pitch, SMT  5.5 and 7.8 mm height versions  Certified for rugged mobile applications and for high speed serial buses (PEG bus)  Low cost connector InterfacesInterfaces

 Legacy free interfaces only  4x PCI Express lanes  2x SATA, 8x USB 2.0  2x ExpressCard  SDIO  I²C Bus, LPC  High Definition Audio (HDA)  1x Gigabit Ethernet  LVDS 2x24 Bit (with DisplayID flat panel detection)  SDVO, DisplayPort and HDMI  Battery Management  Power  5V power rail for low cost implementation  Additional power management signals SummarySummary

 Qseven  Freely available industry standard  Defined for low product cost  High performance serial interfaces  Compact size  Perfect for new SFF low power chipsets and processors QsevenQseven SupportingSupporting MembersMembers

Founding Members

Participating Members

Supporting Members

Apply for your free membership : www.Qseven-standard.org conga-QAconga-QA –– QsevenQseven Intel®Intel® Atom™Atom™ ModuleModule

 CPU: Intel® Atom™ processor Z5xx series - 45nm  Z510: 1.1 GHz, 512kB L2 Cache  Z530: 1.6 GHz, 512kB L2 Cache with Hyperthreading  Chipset: Intel® SCH US15W  Ultra low power 3D graphics  Integrated DDR2 memory controller 1GB soldered memory onboard  Interfaces  2x PCI Express lane*  2x SATA*  Gigabit Ethernet*  8x USB 2.0, ExpressCard  SDIO, I²C Bus, LPC, HDA  LVDS 1x24 Bit, SDVO