ADAS) Technical Brief
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Product Sample & Technical Tools & Support & Folder Buy Documents Software Community TDA2E SPRT714 –OCTOBER 2015 TDA2E SoC Processor for Advanced Driver Assist Systems (ADAS) Technical Brief 1 Device Overview 1.1 Features 1 • Architecture Designed for ADAS Applications • General-Purpose Memory Controller (GPMC) • Video, Image, and Graphics Processing Support • Enhanced Direct Memory Access (EDMA) – Full-HD Video (1920 × 1080p, 60 fps) Controller – Multiple Video Input and Video Output • 2-Port Gigabit Ethernet (GMAC) • ARM® Cortex®-A15 Microprocessor Subsystem – Up to Two External Ports, One Internal • C66x Floating-Point VLIW DSP • Sixteen 32-Bit General-Purpose Timers – Fully Object-Code Compatible With C67x and • 32-Bit MPU Watchdog Timer C64x+ • Six High-Speed Inter-Integrated Circuit (I2C) Ports – Up to Thirty-two 16 x 16-Bit Fixed-Point • Ten Configurable UART/IrDA/CIR Modules Multiplies per Cycle • Four Multichannel Serial Peripheral Interfaces • Up to 512KB of On-Chip L3 RAM (MCSPIs) • Level 3 (L3) and Level 4 (L4) Interconnects • Quad SPI Interface (QSPI) • DDR3/DDR3L Memory Interface (EMIF) Module • SATA Interface – Supports up to DDR3-1333 (667MHz) • Multichannel Audio Serial Port (MCASP) – Up to 4GB Across Two Chip Selects • SuperSpeed USB 3.0 Dual-Role Device • Two ARM Dual Cortex-M4 Image Processing Units • High Speed USB 2.0 Dual-Role Device (IPUs) • High Speed USB 2.0 On-The-Go • IVA-HD Subsystem • PCI Express® 2.0 Port With Integrated PHY • Display Subsystem – One 2-lane Gen2-Compliant Port – Display Controller With DMA Engine and up to – or Two 1-lane Gen2-Compliant Ports Three Pipelines • Dual Controller Area Network (DCAN) Modules – HDMI Encoder: HDMI 1.4a and DVI 1.0 – CAN 2.0B Protocol Compliant • Up to 215 General-Purpose I/O (GPIO) Pins • Single-Core PowerVR™ SGX544 3D GPU • Real-Time Clock Subsystem (RTCSS) • 2D-Graphics Accelerator (BB2D) Subsystem • Power, Reset, and Clock Management – Vivante® GC320 Core • On-Chip Debug With CTools Technology PRODUCTPREVIEW • Video Processing Engine (VPE) • 28-nm CMOS Technology • One Video Input Port (VIP) Module • 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA – Support for up to 4 Multiplexed Input Ports (ABC) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. TDA2E SPRT714 –OCTOBER 2015 www.ti.com 1.2 Applications • LVDS or Ethernet Surround View • Sensor Fusion – Vision, Radar, Ultrasonic, Lidar – 3D surround view sensors – Rear object detection – Object data fusion – Parking assist – Raw data fusion – Pedestrian Detection – Lane tracking – Drive Recording 1.3 Description TI’s new TDA2Ex (TDA2Eco) system-on-chips (SoCs) are a highly optimized and scalable family of automotive processors designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Eco family targets today’s entry-to-mid-range automobiles by integrating an optimal mix of performance, low power and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience. The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a broad range of ADAS applications including park assist, surround view and sensor fusion on a single PRODUCTPREVIEW architecture. The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, ARM Cortex-A15 MPCore™ and dual-Cortex-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. And the TDA2Ex SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB. Additionally, TI provides a complete set of development tools for the ARM and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution. The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard. Device Information PART NUMBER PACKAGE BODY SIZE TDA2Ex FCBGA (760) 23.0 mm × 23.0 mm 2 Device Overview Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TDA2E TDA2E www.ti.com SPRT714 –OCTOBER 2015 1.4 Functional Block Diagram Figure 1-1 is functional block diagram for the device. TDA2Ex MPU IVA HD CAL CSI2 x2 (1x ARM 1080p Video Cortex–A15) Co-Processor IPU 1 Display Subsystem GPU (Dual Cortex–M4) (1x SGX544 3D) IPU 2 1x GFX Pipeline LCD1 (Dual Cortex–M4) LCD2 3x Video Pipeline DSP BB2D LCD3 (C66x Co-Processor) (GC320 2D) Blend / Scale HDMI 1.4a EDMA JTAG MMU x2 VIP x1 VPE High-Speed Interconnect System Connectivity Spinlock Timers x16 RTC SS 1x USB 3.0 Dual Mode FS/HS/SS PCIe SS x2 Mailbox x13 WDT SDMA w/ PHY GPIO x8 PWM SS x3 2x USB 2.0 Dual Mode FS/HS GMAC AVB 1x PHY, 1x ULPI Program/Data Storage Serial Interfaces SATA UART x10 QSPI GPMC / ELM EMIF 512-KB PRODUCTPREVIEW 1x 32-bit RAM (NAND/NOR/ Async) DDR3/3L W/ECC McSPI x4 McASP x8 256-KB ROM MMC / SD x4 DCAN x2 I2C x6 OCMC DMM intro-001 Copyright © 2016, Texas Instruments Incorporated Figure 1-1. TDA2Ex Block Diagram 1.5 Trademarks ARM, Cortex are registered trademarks of ARM Limited. PowerVR is a trademark of Imagination Technologies Limited. PCI Express is a registered trademark of PCI-SIG. Vivante is a registered trademark of Vivante Corporation. All other trademarks are the property of their respective owners. Copyright © 2015, Texas Instruments Incorporated Device Overview 3 Submit Documentation Feedback Product Folder Links: TDA2E PACKAGE OPTION ADDENDUM www.ti.com 15-Feb-2021 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) Ball material (3) (4/5) (6) TDA2EGADQABCQ1 ACTIVE FCBGA ABC 760 60 RoHS & Green Call TI | SNAGCU Level-3-250C-168 HR -40 to 125 TDA2EGADQABCQ1 JACINTO 784 784 ABC TDA2EGADQABCRQ1 PREVIEW FCBGA ABC 760 250 RoHS & Green Call TI | SNAGCU Level-3-250C-168 HR -40 to 125 TDA2EGADQABCQ1 784 784 ABC TDA2EGAHQABCQ1 ACTIVE FCBGA ABC 760 60 RoHS & Green Call TI | SNAGCU Level-3-250C-168 HR -40 to 125 TDA2EGAHQABCQ1 784 784 ABC TDA2EGAHQABCRQ1 ACTIVE FCBGA ABC 760 250 RoHS & Green Call TI | SNAGCU Level-3-250C-168 HR -40 to 125 TDA2EGAHQABCQ1 784 784 ABC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 15-Feb-2021 (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.