Aggregated Massive Modular Paradigm for 6G
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Cisco ISR1100-4G, 1100-4GLTE and 1100-6G Routers
Data sheet Cisco public Cisco ISR1100-4G, 1100-4GLTE and 1100-6G Routers © 2020 Cisco and/or its affiliates. All rights reserved. Page 1 of 10 Contents Primary features and benefits 4 Platform architecture and capabilities 4 Product specifications 6 System specifications 6 Cisco IOS software licensing and packaging 8 Cisco and partner services 9 Ordering information 9 Cisco environmental sustainability 10 Cisco Capital 10 For more information 10 © 2020 Cisco and/or its affiliates. All rights reserved. Page 2 of 10 Part of the Cisco® 1000 Series Integrated Services Routers (ISR), the ISR 1100-4G, ISR1100-4GLTE and ISR 1100-6G models are powered by the Viptela® operating system and combine WAN and comprehensive security in a wired high-performance platform. The ISR 1100-4G, 1100-4GLTE and 1100-6G combine an enterprise grade platform with best-in-class SD-WAN. Cisco Software-Defined WAN (SD-WAN) is a cloud-first architecture that provides unparalleled visibility across your WAN, optimal connectivity for end users, and the most comprehensive security platform to protect your network. Cisco SD-WAN provides transport independence, rich network, and security services as well as endpoint flexibility. The ISR 1100-4G, 1100-6G and 1100-4GLTE routers are delivered as platforms that sit at the perimeter of a site, such as a remote office, branch office, campus, or data center. They participate in establishing a secure virtual overlay network over a mix of any WAN transports. Figure 1. ISR 1100-4G, front and back view Figure 2. ISR 1100-6G, front view; back view same as ISR 1100-4G above Figure 3. -
Innovation and Sustainability in French Fashion Tech Outlook and Opportunities. Report By
Innovation and sustainability in French Fashion Tech outlook and opportunities Commissioned by the Netherlands Enterprise Agency and the Innovation Department of the Embassy of the Kingdom of the Netherlands in France December 2019 This study is commissioned by the Innovation Department of the Embassy of the Kingdom of the Netherlands in France and the Netherlands Enterprise Agency (RVO.nl). Written by Alice Gras and Claire Eliot Translated by Sophie Bramel pages 6-8 INTRODUCTION 7 01. Definition and key dates 8 02. Dutch fashion tech dynamics I 9-17 THE CONVERGENCE OF ECOLOGICAL AND ECONOMIC SUSTAINABILITY IN FASHION 11-13 01. Key players 14 02. Monitoring impact 14-16 03. Sustainable innovation and business models 17 04. The impact and long-term influence of SDGs II 18-30 THE FRENCH FASHION INNOVATION LANDSCAPE 22-23 01. Technological innovation at leading French fashion companies 25-26 02. Public institutions and federations 27-28 03. Funding programmes 29 04. Independent structures, associations and start-ups 30 05. Specialised trade events 30 06. Specialised media 30 07. Business networks 30 08 . Technological platforms III 31-44 FASHION AND SCIENTIFIC RESEARCH: CURRENT AND FUTURE OUTLOOK 34-35 01. Mapping of research projects 36-37 02. State of fashion research in France 38-39 03. Key fields of research in fashion technology and sustainability 40 04. Application domains of textile research projects 42-44 05. Fostering research in France IV 45-58 NEW TECHNOLOGIES TO INNOVATE IN THE FRENCH FASHION SECTOR 47 01. 3D printing 48 02. 3D and CAD Design 49-50 03. Immersive technologies 51 04. -
Notice X-ESPCI 2021
MODALITÉS D’ADMISSION À L’ESPCI PARIS Filière PC Responsable Concours 01 40 79 51 13 Direction Des Études 01 40 79 45 10 Renseignements : [email protected] MODALITÉS D’ADMISSION À L’ESPCI PARIS PRÉSENTATION de l’École Situation et site L’École Supérieure de Physique et de Chimie Industrielles de la Ville de Paris (ESPCI Paris) est située au cœur du quartier Latin sur le site de la Montagne Sainte-Geneviève. Elle bénéficie, à proximité immé- diate, d’un environnement scientifique particulièrement favorable. Elle est située à 2 min de l’ENS de la rue d’Ulm, de Chimie ParisTech, de l’Institut Curie et à moins de 20 min de Sorbonne-Université et de l'Université de Paris. Organisation L’École est gérée par un conseil d’administration présidé par une personnalité nommée par la Mairie de Paris. Sa direction est assurée par un directeur général assisté d’un directeur des études et d’un directeur scientifique. Le corps professoral propre à l’école ou issu des grands centres d’enseignement et de recherche voisins dispense un enseignement spécifique à l’école reconnu par des équivalences universitaires. Établissement d’enseignement supérieur et de recherche, l’École regroupe onze unités mixtes de recherche associées au CNRS. Elle dispose en outre de nombreux services annexes (bibliothèque, service audiovi- suel, caféteria, Espace des Sciences Pierre-Gilles de Gennes…). L’ESPCI est un des membres fondateurs de ParisTech. L’ESPCI fait également partie de l’Université de recherche Paris Sciences et Lettres - PSL Research University. Enfin, l’ESPCI est membre de la Fédéra- tion Gay-Lussac (FGL) qui regroupe les principales écoles de Chimie et de Génie Chimique françaises. -
Tuitions Fees, Cvec & Fees
TUITIONS FEES, CVEC & FEES NORMAL PRICE FOR PRICE FOR CSC SCHOLARS PRICE FOR CSC SCHOLARS WITHIN A DOUBLE DEGREE (DD) NON-EUROPEAN STUDENTS (INDIVIDUAL APPLICANTS) AND/OR COMING FROM A PARTNER UNIVERSITY NB: Full cost of a "Diplôme d'ingénieur*" per year = 17 000€ (on average) List of partner Tuition fees CVEC** Tuition fees CVEC Tuition fees CVEC universities (DD and others) 1st year in France 4 290 € 92 € 4 290 € 92 € 1 765 € 92 € DD Tongji, all partner GRO ARIS ECH A P T universities of ParisTech 2nd year in France 4 290 € 92 € 4 290 € 92 € 4 290 € 92 € ARTS ET MÉTIERS 1st year in France 3 370 € 92 € 3 370 € 92 € 3 370 € 92 € SCIENCES ET TECHNOLOGIES 2nd year in France 3 370 € 92 € 3 370 € 92 € 3 370 € 92 € 1st year in France 3 570 € 92 € 1 785 € 92 € 0 € 92 € CHIMIE PARISTECH - PSL 2nd year in France 3 570 € 92 € 1 785 € 92 € 0 € 92 € 6300 € (tuition) + 3150 € (tuition) + 3150 € (tuition) + 92 € 92 € 92 € DD Tongi, XJTU 975€ (fees) 975 € (fees) 975€ (fees) 1st year in France 0 € (tuition) + DD SEU, Tsinghua n/a n/a n/a n/a 92 € ECOLE DES PONTS 975 € (fees) University 6300 € (tuition) + 3150 € (tuition) + 3150 € (tuition) + DD Tongi University, PARISTECH 92 € 92 € 92 € 975 € (fees) 975 € (fees) 975 € (fees) XJTU 2nd year in France n/a n/a n/a n/a 0 tuition + 975€ fees 92 € DD SEU, Tsinghua 1st year in France 850 € 92 € 150 € 92 € 0 € 92 € ESPCI PARIS - PSL 2nd year in France 850 € 92 € 150 € 92 € 0 € 92 € 1st year in France 5 000 € 92 € 2 900 € 92 € 2 900 € 92 € DD HUST INSTITUT D'OPTIQUE GRADUATE SCHOOL 2nd year in France 5 000 € 92 -
Curriculum Vitae
Dr. Konstantinos Danas Curriculum Vitae LMS, CNRS, École Polytechnique Work : +33 (0) 169 33 5786 Route de Saclay Email : [email protected] Palaiseau Cedex, 91128, France Web : http://www.kostasdanas.com PERSONAL INFO Date of Birth: March 1st, 1981 Place of Birth: Kozani, Greece Citizenship: Greek, French Marital Status: Married, 2 children ACADEMIC POSITIONS 2016-present: Associate Professor (Professeur Chargé des Cours), Ecole Polytechnique, Palaiseau, France. 2009-present: Tenured Senior Scientist (Chargé de Recherche), CNRS, Laboratoire de Mécanique des Solides (LMS), Ecole Polytechnique, Palaiseau, France. Feb-Mar 2012: Visiting Research Scholar, Department of Civil and Environmental Engineering, University of Illinois at Urbana-Champaign, U.S.A. Oct-Dec 2009: Visiting Research Scholar, Department of Engineering, University of Cambridge, Centre for Micromechanics, Cambridge, U.K. 2008-2009: Postdoctoral Research Associate, Department of Engineering, University of Cambridge, Centre for Micromechanics, Cambridge, U.K. EDUCATION 2016: HDR (Habilitation à Diriger des Recherches) Dissertation: Soft and Metallic Microstructured Solids: Theory, Modeling and Experiments. University of Pierre and Marie Curie (Paris VI), Paris, France 2003-2008: PhD in Mechanical Engineering and Applied Mechanics Dissertation: Porous materials with evolving microstructure: constitutive modeling, numerical implementation and applications. École Polytechnique, Palaiseau, France. University of Pennsylvania, Philadelphia, PA, U.S.A. 2003-2004: -
Enabling Massive Iot Toward 6G: a Comprehensive Survey Fengxian Guo, F
1 Enabling Massive IoT Toward 6G: A Comprehensive Survey Fengxian Guo, F. Richard Yu, Fellow, IEEE, Heli Zhang, Xi Li, Hong Ji, Senior Member, IEEE, and Victor C.M. Leung, Fellow, IEEE Abstract—Nowadays, many disruptive Internet of things (IoT) in the future, including holographic communications, five- applications emerge, such as augmented/virtual reality (AR/VR) sense communications, and wireless brain-computer interfaces online games, autonomous driving, and smart everything, which (WBCI), which will lead to a true immersion into a distant are massive in number, data-intensive, computation-intensive, and delay-sensitive. Due to the mismatch between the fifth gen- environment. At the same time, advances in personal com- eration (5G) and the requirements of such massive IoT-enabled munications will promote the evolution of smart verticals in applications, there is a need for technological advancements and the fifth generation networks (5G) to a higher level, including evolutions for wireless communications and networking toward healthcare, remote education/training, industry Internet, fully the sixth generation (6G) networks. 6G is expected to deliver autonomous driving, and super smart homes/cities. During extended 5G capabilities at a very high level, such as Tbps data rate, sub-ms latency, cm-level localization, and so on, this paradigm shift, the Internet of Things (IoT) plays a vital which will play a significant role in supporting massive IoT role in enabling these emerging applications by connecting devices to operate seamlessly with highly diverse service require- the physical environment to the cyberspace of communication ments. Motivated by the aforementioned facts, in this paper, systems [1]. we present a comprehensive survey on 6G-enabled massive IoT. -
CRETON Costantino
Curriculum Vitae CRETON Costantino Address: Laboratoire de Sciences et Ingénierie de la Matière Molle Ecole Supérieure de Physique et Chimie Industrielle de la Ville de Paris 10, Rue Vauquelin, 75231 Paris Cédex 05 Tel: +33 1 40 79 46 83 Email: [email protected] Web : http://ccreton.simm.espci.fr/ Researcher unique identifier(s): ORCID: 0000-0002-0177-9680; Researcher-ID: B-4077-2008 • CURRENT POSITION(S) 2019 - VP Research of the ESPCI Paris-PSL 2018 – Directeur de Recherche CNRS, Exceptional class, Laboratoire SIMM, ESPCI Paris-Tech/ France • Head of the group “Soft Polymer Networks” in the Soft Matter Science and Engineering Laboratory of the ESPCI. 2016 - Distinguished Professor of the University of Hokkaido, Japan • PREVIOUS POSITIONS 2001 – Directeur de Recherche CNRS, Laboratoire SIMM, ESPCI Paris-PSL/ France 1994 – 2001 Chargé de Recherche CNRS, 1st class, Laboratoire PPMD, ESPCI Paris-PSL/ France 1993– 1994 Post-doctoral fellow, Laboratoire PCSM, ESPCI Paris-PSL/ France L. Monnerie/Laboratoire SIMM/ESPCI ParisTech/France 1992– 1993 Visiting Scientist, IBM Almaden Research Center, USA with H.R. Brown • EDUCATION AND DIPLOMAS 1985 Materials Science & Engineering degree, Ecole Polytechnique Fédérale de Lausanne, Switzerland 1991 Ph. D. Department of Materials Science & Engineering, Cornell University, USA 1999 Habilitation in Physics, Université Pierre et Marie Curie, Paris, France • FELLOWSHIPS, AWARDS AND HONOURS 1986 Swiss National Research Fund Junior Fellowship (1 year) 1988 IBM Almaden Reserach Center research Fellowship -
5G Massive Iot Access in the Coming Decades
IoT & Industry 4.0 in the 5G era Huawei's perspective Koby Levy Director of Digital Transformation & IoT About me Huawei is passionate about intelligent communications & IoT and is investing in innovations, and collaborations in the areas of : 5G 5.5G & 6G Fixed & Mobile Convergence IIOT, C-V2X,SmartXXX… Native Cloud Edge computing AI Devices, Cameras, Chipsets, CPEs and other hardware and more… Working with Telecom Operators, Enterprise Clients, Consumers , Industry and Technology Partners globally Huawei © 2021 MWC Barcelona Platinum Sponsor Evolution Current affairs 5G Era A Decade Outlook Evolution 5 Huawei © 2021 MWC Barcelona Evolution into 5G Era eMBB Personal GPRS/EDGE HSPA/HSPA+ 4.5G Evolve + Experience IoT 2G 3G 4G 5G Enhance Voice Internet Mobile Internet of Broadband Everything mMTC URLLC Industrial + Application 6 Huawei © 2021 MWC Barcelona Evolution of Mobile IoT LTE 7 Huawei © 2021 MWC Barcelona 7 Evolution of Mobile IoT From LTE to 5G 2017 2018 2020 2021 LTE 5G phase1 5G phase2 5G Enhanced ◼Rel-13 Rel-14 Rel-15 Rel-16 Rel-17 advanced ✓ 20 dB coverage ✓ Peak rate > 100 kbit/s ✓ Latency reduction ✓ Coexistence with 5G NR ✓ DL16QAM (248kbps) ✓ Large connection ✓ Multi-carrier enhancement ✓ Reduced terminal power consumption✓ Connection to the 5G Core ✓ Diverse-service efficiency ✓ Low power consumption ✓ Positioning (ECID and OTDOA) ✓ Mixed mode multi-carrier ✓ Latency & Mobility enhancement ✓ Lower mobility latency ✓ Low cost ✓ Terminal power consumption reduction ✓ New PRACH format ✓ SON ✓ Mobility enhancement ✓ 15 dB coverage -
Invent the Future at ESPCI Paris Welcome to an Outstanding Environment for Science
INVENT THE FUTURE AT ESPCI PARIS WELCOME TO AN OUTSTANDING ENVIRONMENT FOR SCIENCE. ESPCI PARIS, AN ENGINEERING SCHOOL RUN BY THE CITY OF PARIS, HAS TRAINED 90 INNOVATION ENGINEERS READY TO INVENT THE FUTURE AND MEET THE CHALLENGES OF TOMORROW EVERY YEAR SINCE 1882. 90 STUDENT-ENGINEERS PER GRADUATING CLASS 1 PTA ENT APPLICATION SUBMITTED CHOOSE EACH WEEK ESPCI 6 NOBEL PARIS ! PRIZES JEAN-FRANÇOIS JOANNY Choose science and research by 1 Director of ESPCI Paris SCIENTIFIC ARTICLE joining an outstanding scientific community made up of more than PUBLISHED EACH DAY 530 researchers and professor-researchers on a campus that includes 9 joint research units. We encourage you to choose an education founded in excellence and ND the freedom that comes with it. You will walk in the footsteps of 6 Nobel 2 Prizes winning alums. You will be trained by the best minds in physics, BEST ENGINEERING chemistry and biology. With more than one professor-researcher for every SCHOOL, IN THE student-engineer, ESPCI has the highest student-teacher ratio of all engi- SHANGHAI RANKING neering schools in France. ESPCI Paris’ unique pedagogical approach is based on interdisciplinary studies and a close relationship between teaching and research. Here, you have everything you need to fully concentrate on your passion for 9 science and prove yourself among the world’s best. To study at ESPCI JOINT Paris is to study in the heart of Paris, in the Latin Quarter, on a campus RESEARCH UNITS that will be entirely renovated in the years to come. By choosing ESPCI Paris, you will become one of 90 students in the 135th graduating class who will go on to discover and invent the science of tomorrow—and maybe even create their own start-up. -
1G, 2G, 3G, 4G, 5G
1G, 2G, 3G, 4G, 5G By: Simon Johansen G? • G Generation • Generation of wireless phone technology 1G • Frequency: 150MHz / • From 1980 to 1990 900MHz • Bad voice quality • Bandwidth: Analog • Poor battery, cellphones telecommunication • Big cellphones (30KHz) • Characteristic: First • Better than nothing, at wireless communication least its wireless and • Technology: Analog mobile cellular • Capacity (data rate): 2kbps 2G • Frequency: 1.8GHz • From 1991 to 2000 (900MHz), digital • Allows txt msg service telecommunication • Signal must be strong or • Bandwidth: 900MHz else weak digital signal (25MHz) • Characteristic: Digital • 2.5G • Technology: Digital – 2G cellular technology with cellular, GSM GPRS • Capacity (data rate): – E-Mails 64kbps – Web browsing – Camera phones • Why better than 1G? 3G • Frequency: 1.6 – 2.0 • From 2000 to 2010 GHz • Called smartphones • Bandwidth: 100MHz • Video calls • Characteristic: Digital • Fast communication broadband, increased • Mobil TV speed • 3G phones rather • Technology: CDMA, expensive UMTS, EDGE • Capacity (data rate): 144kbps – 2Mbps • Why better than 2G? 4G • Frequency: 2 – 8 GHz • From 2010 to today (2020?) • Bandwidth: 100MHz • MAGIC • Characteristic: High – Mobile multimedia speed, all IP – Anytime, anywhere • Technology: LTE, WiFi – Global mobile support • Capacity (data rate): – Integrated wireless 100Mbps – 1Gbps solutions – Customized personal service • Why better than 3G? • Good QoS + high security • Bigger battery usage 5G • https://5g.co.uk/guides • From X (2020?) to Y /5g-frequencies-in-the- -
MEMS INERTIAL SENSOR: 3-Axis - +/-2G/6G Ultracompact Linear Accelerometer
LIS3L06AL MEMS INERTIAL SENSOR: 3-axis - +/-2g/6g ultracompact linear accelerometer Features ■ 2.4V to 3.6V single supply operation ■ Low power consumption ■ ±2g/±6g user selectable full-scale ■ 0.5mg resolution over 100hz bandwidth LGA-8 ■ Embedded self test ■ Output voltage, offset and sensitivity ratiometric to the supply voltage to design a dedicated circuit which is trimmed to ■ High shock survivability better match the sensing element characteristics. ■ ECOPACK® Lead-free compliant The LIS3L06AL has a dynamically selectable full (see Section 6) scale of ±2g/±6g and it is capable of measuring accelerations over a bandwidth of 1.5 kHz for all Description axes. The device bandwidth may be reduced by using external capacitances. A self-test capability The LIS3L06AL is a low-power 3-axis linear allows to check the mechanical and electrical capacitive accelerometer that includes a sensing signal path of the sensor. element and an IC interface able to take the The LIS3L06AL is available in plastic SMD information from the sensing element and to package and it is guaranteed to operate over an provide an analog signal to the external world. extended temperature range of -40°C to +85°C. The sensing element, capable of detecting the The LIS3L06AL belongs to a family of products acceleration, is manufactured using a dedicated suitable for a variety of applications: process developed by ST to produce inertial sensors and actuators in silicon. – Mobile terminals – Gaming and Virtual Reality input devices The IC interface is manufactured using a standard – Free-fall detection for data protection CMOS process that allows high level of integration – Antitheft systems and Inertial Navigation – Appliance and Robotics. -
6G Fundamentals: Vision & Enabling Technologies
6G Fundamentals: Vision & Enabling Technologies Towards Trustworthy Solutions & Resilient Systems Author: David Soldani Published by 6GWorld, 15 June 2021 Link:https://www.6gworld.com/latest-research/6g-fundamentals-vision-and-enabling-technologies/ Reference number: 6GW02 Page | 1 6G Gains Momentum While the next generation of mobile connectivity still lies roughly a decade ahead, the number of 6G initiatives ongoing globally, and corresponding investments provide an intriguing prospect for the future. Public and private sectors have already started investing in research and innovation (R&I) actions to tackle requirements that 6G will probably demand when it reaches commercial reality around 2030 (Castro, 2021, 5G Americas, 2021b). These include use cases promised in 5G networks but not yet realised, and more advanced scenarios that are emerging in the context of next generation/6G networks such as Terahertz frequencies, holoportation, tactile/haptic communications, ubiquitous services (land, air, space, sea), medical/health services, government/national security, imaging and sensing, first responder/emergency services, cyber-physical systems/manufacturing, and transportation services. Some examples of relevant use cases and corresponding technology requirements are shown in Figure 1 (5G Americas, 2021b). For more information and other usage scenarios towards 6G, the reader may refer to, e.g., (6G Flagship, 2021a, 6GIC Vision, 2021). Specific international efforts by leading nations in the wireless cellular industry and relevant Beyond 5G (B5G) and 6G initiatives and related investments are illustrated in Figure 2. In Europe, within the EU Horizon 2020 R&I framework programme, three recent joint projects focused on 6G development have been announced: Hexa-X, RISE-6G, and NEW-6G.