Hypertransport(TM) an Emerging New I/O Bus Standard

Total Page:16

File Type:pdf, Size:1020Kb

Hypertransport(TM) an Emerging New I/O Bus Standard TECHNOLOGY FEATURE HyperTransportTM as an emerging new I/O bus standard By Peter Robinson Faster processors and silicon process developed for the PCI bus, including the nology provides the same type of “tree” have squeezed traditional single-ended, ability to support non-coherent memory topology and the same ordering rules Address/Data, and Control I/O buses read/write operations. From a system widely used by PCI buses (see Figure 2). to their engineering limits. These I/O design viewpoint, HyperTransport tech- buses, such as PCI-X, can no longer meet the demand for high-speed, multi- node data connectivity, leaving system designers with few design options. Either they must limit system I/O and throughput and work within the limits of current standards or adopt an emerging new I/O bus standard such as Infini- Band™, RapidIO™, 3GIO™, Hyper- Transport technology and others. Today, there is an emerging standard that can deliver the needed throughput and leverage existing PCI software drivers – HyperTransport technology. While competing next-generation serial I/O technologies are trying to address this problem by saying they are more capable than PCI, HyperTransport tech- nology is both backward-compatible to the PCI era and an extensible bridge to Figure 1 the post-PCI future. Co-developed by AMD and API NetWorks, HyperTransport technology Data is held in DRAM addresses the need for increased system waiting to be entered into Data blasts in from performance and provides a high-speed redundant RAID arrays, network or Internet because of data bursts. D over fiber channel R scalable point-to-point link that reduces A M D data bottlenecks and boosts the perfor- R DRAM Ctrl. A mance of current and future commu- RAID HT - Single M (Redundant Array Ended Slave H L-1 Cache nications equipment, including PCs, of Inexpensive 8 r CPU processes Disks) arrays Fiber incoming data and PC Lk PC Lk Channel H workstations, servers, and Internet Four o CPU sends it to the 8 8 88 8 HT tunnel HT tunnel Port HT tunnel s RAID arrays routers (see Figure 1). With the devel- Switch t opment of HyperTransport technology, 8 PC Lk PC Lk embedded systems developers now 88 Data is transported over an HT tunnel HT tunnel 8 8-bit wide HyperTransport have a highly scalable bus standard that switch and fabric from tunnel device to tunnel device at up addresses I/O throughput, while pre- Each leg can support up to to 2 Gigabytes/sec 31 tunnel devices allowing serving their PCI software investments. for very complex network topologies, while remaining Extremely Scalable HyperTransport Networking Topology HyperTransport technology extends PCI HyperTransport makes it possible to build complex systems such as a dual DRAM cached RAID based storage subsystem with minimal by providing a high-performance fabric cost and ship count, while remaining extremely scalable compared Source: API Networks, Inc. (see Figure 1) that maintains backward- to technologies currently on the market. compatibility with existing software Figure 2 Copyright 2001 CompactPCI Systems Reprinted from CompactPCI Systems / September 2001 TECHNOLOGY FEATURE This complementary relationship with There are three reasons why the Hyper- tion to command, addressing, and con- PCI is particularly significant with PCI- Transport technology proprietary LVDS trol, each HyperTransport technology X and double rate PCI-X, viewed as out performs the industry standard: device has PWROK (Power Okay) and the only practical near-term solution to RESET_H (Reset_HyperTransport) I/O performance bottlenecks in com- I Lower differential voltage swing pins. These pins are single-ended munications and storage applications. I The integration of an intelligent, because of their low-frequency use. At Although PCI-X extends the popular dynamically adjustable source and the user’s option, HyperTransport tech- PCI standard, its deployment success termination resistor mechanism nology devices for use in lower power needs a high-speed chip-to-chip mezza- I The transmission of the data clock applications such as hand held appli- nine bus, such as HyperTransport, to with groups of eight or less RX/TX ances can implement HT_Stop (Hyper- serve as a fabric backbone. Likewise, data pairs. Transport_Stop). This pin puts the HyperTransport technology will sup- HyperTransport technology channel in a port and compliment InfiniBand as the The low differential voltage alone low-power state where virtually no preferred “in the box” fabric while implies lower current and higher speed. power is used by the channel. InfiniBand is the preferred “outside the However, the integrated dynamically box” fabric. adjustable source and termination resis- HyperTransport technology is scal- tor mechanism, combined with the able, supporting a wide selection of Gaining accceptance transmitted data clock is where the real bus widths and speeds to fit the power, Currently, HyperTransport technology performance is realized. Together, on space, and cost requirements of next architecture is in the standards review one hand, they add a higher level of generation devices. A HyperTransport process and has gained the support of complexity to the HyperTransport tech- technology channel can be 2, 4, 8, more than 100 early adopters, including nology PHY; on the other-hand, they 16, or 32 bits wide in each direction. Cisco, Sun, Broadcom, Nvidia, ATI, and have simplified the total PHY approach Asymmetric interconnects supporting Fujitsu. Compared to competing technol- by eliminating the need for external ter- different upstream and downstream ogies, its current time-to-market advan- mination resistors and PLL to recover bandwidths are also supported. As an tage portends economies of scale, which the RX clock. example, it is possible to construct a will drive down prices and increase fabric with a 2-bit wide physical link availability of parts. In addition, with its It is projected, with continued design up-stream and an eight-bit wide link backwards compatibility to PCI, Hyper- improvements to the existing PHY, com- downstream. There is no need for spe- Transport technology is the ideal choice bined with wider channels and reduced cial software I/O drivers to support for companies looking to increase per- silicon geometries, that HyperTransport this type of asymmetric topology, as formance while preserving existing tech- technology’s DDR channel could con- the protocol layer at reset will ensure nology investments. tinue to double in throughput every 18 proper flow of data throughout the months following Moore’s law. fabric. The ability to support different HyperTransport technology I/O up-stream and down-stream widths interconnect physical layer Initially, differential signaling would gives the designer the flexibility to allo- There are two elements to Hyper- seem to double the pin count to two pins cate bandwidth specific to the needs of Transport technology, the PHY or phys- per bit, but the increase in signal pins is the system. This feature alone will sim- ical pin interface and the logical or offset by two factors. First, operating at plify PCB layout and reduce pin-count protocol layer. At the pin or physical higher frequencies than single ended on ASICs. layer, HyperTransport technology is busses, HyperTransport technology based on a proprietary point-to-point, requires fewer pins to deliver equivalent The differential data is double-clocked Low Voltage Differential Sign (LVDS) or better bandwidth. Second, differen- or Dual Data Rate (DDR). Today transceiver set. The electrical specifica- tial signaling provides a return current HyperTransport technology supports tion of HyperTransport technology is path for each signal, which greatly re- clock rates from 200 MHz to 1 GHz in different from the industry standard duces the number of power and ground 100 MHz steps (up to 2.0 Gbits per LVDS as noted in Table 1. pins required for the interface. In addi- second per physical channel). Each 8-bit channel has its own clock (a 16-bit Specification LVDS HyperTransport LVDS channel would have two clocks and Supply 2.5 volt 1.2 volt 2-bit, four) with one control line per interface to differentiate commands Swing 1.25 volt 600m from address/data. This reduces clock Termination External Resistors Dynamically Balanced line skew and insures a low bit error rate. Peak clock rate 622 MHz 1 GHz HyperTransport technology also sup- ports dynamic clock configuration, Table 1 making it possible for the software to Copyright 2001 CompactPCI Systems Reprinted from CompactPCI Systems / September 2001 TECHNOLOGY FEATURE change the data transfer clock rate A switch passes data to and from one will be “tens” of HyperTransport tech- between any two peripheral devices. HyperTransport technology chain to nology peripheral devices and four plus This is useful for dynamic power man- another. The switch will configure each host port equipped processors. agement in battery-powered applica- of its interfaces as either a host or single tions. ended slave. This allows the system As the technology moves forward, more architect to use a switch to build a and more HyperTransport technology HyperTransport host interfaces have switching fabric while isolating a devices will emerge bridging not only to been announced on a wide range of HyperTransport technology chain from PCI but InfiniBand, Gigabit Ethernet, MIPS architecture, embedded proces- a host to: PCI-X, and related standards. They will sors, providing a high-speed mezzanine provide the building blocks capable of bus that both enhances and extends
Recommended publications
  • Direct Memory Access Components Verification System
    ТРУДЫ МФТИ. — 2012. — Том 4, № 1 Frolov P. V. et al. 1 УДК 004.052.42 P. V. Frolov, V. N. Kutsevol, A. N. Meshkov, N. Yu. Polyakov, M. P. Ryzhov AO «MCST» PAO «INEUM» Direct Memory Access components verification system A method of direct memory access subsystem verification used for Elbrus series micro- processors has been described. A peripheral controller imitator has been developed in order to reduce verification overhead. The model of imitator has been included into the functional machine simulator. A pseudorandom test generator for verification of the direct memory access subsystem has been based on the simulator. Ключевые слова: system verification, functional model, direct memory access, pseu- dorandom test generation. Direct Memory Access components verification system 1. Introduction Modern computer systems require very intensive data exchange between the peripheral de- vices and the random-access memory. In the most cases this exchange is performed by the direct memory access (DMA) subsystem. The increasing demands for the performance of the subsys- tem lead to an increase in its complexity, therefore requiring development of effective approaches to DMA subsystem verification [1,2]. This article is based on a result of a comprehensive project than combined implementation of a there co-designed verification techniques based on the consecutive investigation of theDMA subsystem employing one the three models: 1) a functional model written in C++ that corre- sponds to behaviour of the subsystem in the environment determined by a real computer system configuration, 2) RTL model in Verilog and 3) FPGA-based prototype. This article describesthe first method that enables verifying correctness of the design at an early stage of the verification and eliminate a large quantity of bugs using simple tests.
    [Show full text]
  • VIA RAID Configurations
    VIA RAID configurations The motherboard includes a high performance IDE RAID controller integrated in the VIA VT8237R southbridge chipset. It supports RAID 0, RAID 1 and JBOD with two independent Serial ATA channels. RAID 0 (called Data striping) optimizes two identical hard disk drives to read and write data in parallel, interleaved stacks. Two hard disks perform the same work as a single drive but at a sustained data transfer rate, double that of a single disk alone, thus improving data access and storage. Use of two new identical hard disk drives is required for this setup. RAID 1 (called Data mirroring) copies and maintains an identical image of data from one drive to a second drive. If one drive fails, the disk array management software directs all applications to the surviving drive as it contains a complete copy of the data in the other drive. This RAID configuration provides data protection and increases fault tolerance to the entire system. Use two new drives or use an existing drive and a new drive for this setup. The new drive must be of the same size or larger than the existing drive. JBOD (Spanning) stands for Just a Bunch of Disks and refers to hard disk drives that are not yet configured as a RAID set. This configuration stores the same data redundantly on multiple disks that appear as a single disk on the operating system. Spanning does not deliver any advantage over using separate disks independently and does not provide fault tolerance or other RAID performance benefits. If you use either Windows® XP or Windows® 2000 operating system (OS), copy first the RAID driver from the support CD to a floppy disk before creating RAID configurations.
    [Show full text]
  • ECESATUSB1 This Expresscard Power Esata Port Controller Card
    1 Port ExpressCard Power eSATA Controller Adapter Card StarTech ID: ECESATUSB1 This ExpressCard Power eSATA port controller card can be installed in an available ExpressCard 34/54 mm slot to provide a powered eSATA connection, and also alternatively provide either external SATA (data only) or USB 2.0 connectivity from one uniquely designed port if using with standard eSATA or USB devices. An ideal solution for using an eSATA SSD Flash drive on your laptop, the power eSATA card delivers both a high speed eSATA connection and power from the combined USB port. A versatile connectivity solution, the card features built-in port multiplier support, allowing multi-drive eSATA storage enclosures to be connected to the host computer using a single eSATA cable. Taking advantage of the transfer speed of eSATA connection and the 5V power output of the USB 2.0 port, the ExpressCard Power eSATA adapter is the perfect answer for connecting compatible mobile drive enclosures, similar to the built-in power eSATA port provided by the following laptop computers: Toshiba: Satellite E105, A350, Satellite Pro P300; Qosmio G50, X305, Portege A600, M750, R500, R600; and Tecra M10, R10, A10. Dell: Studio 15, 17; Latitude E6400, E6500; Precision M2400, M4400, M6400, M6400 Covet. Applications Connects to eSATA SSD Flash drives, such as OCZ Throttle, Kangaru e-Flash drives and Ridata Racer series flash drives Provides connectivity between Notebooks and PCs with ExpressCard slots to external drive enclosures with Power eSATA (eSATA+USB) port, or with regular eSATA
    [Show full text]
  • Computer Bus Characteristics
    Upendra Sharma (upsharma.in) Computer Bus A bus, in computing, is a set of physical connections (cables, printed circuits, etc.) which can be shared by multiple hardware components in order to communicate with one another. The purpose of buses is to reduce the number of "pathways" needed for communication between the components, by carrying out all communications over a single data channel. This is why the metaphor of a "data highway" is sometimes used. If only two hardware components communicate over the line, it is called a hardware port (such as a serial port or parallel port). Characteristics A bus is characterised by the amount of information that can be transmitted at once. This amount, expressed in bits, corresponds to the number of physical lines over which data is sent simultaneously. A 32-wire ribbon cable can transmit 32 bits in parallel. The term "width" is used to refer to the number of bits that a bus can transmit at once. Additionally, the bus speed is also defined by its frequency (expressed in Hertz), the number of data packets sent or received per second. Each time that data is sent or received is called a cycle. This way, it is possible to find the maximum transfer speed of the bus, the amount of data which it can transport per unit of time, by multiplying its width by its frequency. A bus with a width of 16 bits and a frequency of 133 MHz, therefore, has a transfer speed equal to: Upendra Sharma (upsharma.in) Types of Buses In reality, each bus is generally constituted of 50 to 100 distinct physical lines, divided into three subassemblies: The address bus (sometimes called the memory bus) transports memory addresses which the processor wants to access in order to read or write data.
    [Show full text]
  • Tms320dm643x DMP Peripherals Overview Reference Guide (Rev. A
    TMS320DM643x DMP Peripherals Overview Reference Guide Literature Number: SPRU983A June 2007 2 SPRU983A–June 2007 Submit Documentation Feedback Contents Preface ............................................................................................................................... 4 1 Overview.................................................................................................................... 5 2 Asynchronous External Memory Interface (EMIF)............................................................ 6 3 DDR2 Memory Controller ............................................................................................. 6 4 DSP Megamodule Internal Direct Memory Access (IDMA) Controller ................................. 7 5 DSP Megamodule Interrupt Controller (INTC) ................................................................. 7 6 DSP Megamodule Power-Down Controller (PDC) ............................................................ 8 7 Enhanced Direct Memory Access (EDMA) Controller....................................................... 8 8 Ethernet Media Access Controller (EMAC)/Management Data Input/Output (MDIO) Module....................................................................................................................... 8 9 General-Purpose Input/Output (GPIO)............................................................................ 8 10 High-End CAN Controller (HECC).................................................................................. 9 11 Host Port Interface (HPI) .............................................................................................
    [Show full text]
  • 2 Port Flush Mount Expresscard 54Mm Superspeed USB 3.0 Card Adapter Startech ID: ECUSB3S254F
    2 Port Flush Mount ExpressCard 54mm SuperSpeed USB 3.0 Card Adapter StarTech ID: ECUSB3S254F The ECUSB3S254F 2-Port Flush Mount USB 3.0 ExpressCard Adapter uses a unique form factor design that allows it to sit fully in a standard 54mm laptop ExpressCard slot without sticking out. When inserted, the USB 3.0 ports provided by the ExpressCard adapter sit flush with the sides of the laptop, creating a seamless add-on that can be left installed even while on the move, without having to worry about impact damage to either the card or the ExpressCard slot. The SuperSpeed USB 3.0 Card supports data transfer rates of up to 5Gbps, and is backward compatible with USB 2.0 (at up to 480Mbps), or USB 1.1/1.0 at up to 12/1.5 Mbps respectively - the perfect laptop accessory for users to connect USB devices, both new and old. Applications Users who need USB connectivity, but do not need to swap between other ExpressCard adapters, so will leave the card installed in the card slot Mobile users who want to leave ExpressCard adapters installed, without worry about damaging the card or slot while on the move Connect high performance USB 3.0 external storage devices to a laptop Upgrade an older laptop with USB 3.0 connectivity Expand on your laptop expansion capabilities with additional USB ports Features Unique flush-mount form factor design Two SuperSpeed USB 3.0 compliant ports with support for transfer rates up to 5 Gbps Backward compatible with USB 2.0/1.x devices Compliant with USB 3.0 base specification 1.0 and xHCI specification 0.95 Compliant with
    [Show full text]
  • Get More out of the Intel Foxhollow Platform
    Get More Out Of the Intel Foxhollow Platform Akber Kazmi, Marketing Director, PLX Technology Introduction As being reported by the mainstream technology media, Intel is leveraging the technology from its latest server-class Nehalem CPU to offer the Lynnfield CPU, targeted for high-end desktop and entry-level servers. This platform is codenamed “Foxhollow “. Intel is expected to launch this new platform sometime in the second half of 2009. This entry-level uni-processor (UP) server platform will feature two to four cores as Intel wants to pack a lot of processing power in all its platforms. The Foxhollow platform is quite different from the previous Desktops and UP servers in that it reduces the solution from three chips to two chips by eliminating the northbridge and replacing the southbridge with a new device called the Platform Controller Hub (or PCH) code named Ibexpeak (5 Series Chipset). As Intel has moved the memory controller and the graphics function into the CPU, there's no need for an MCH (Memory Controller Hub), so Intel has simplified its chipset design to keep costs down in the entry-level and mainstream segments. The PCH chip interfaces with the CPU through Intel’s DMI interconnect. The PCH will support eight PCIe lanes, up to four PCI slots, the GE MAC, display interface controllers, I/O controllers, RAID controllers, SATA controllers, USB 2.0 controllers, etc. Foxhollow Motherboards Foxhollow motherboards are being offered in two configurations, providing either two or three x8 PCIe ports for high performance I/Os. However, motherboard vendors can use an alternate configuration that provides one more PCIe x8 port with no significant burden and instead offers 33% more value than the three port solution and 50% more value than the two port solution.
    [Show full text]
  • Front Panel I/O Connectivity Design Guide
    Front Panel I/O Connectivity Design Guide Revision 1.1 July 2018 Document Number: 600569 Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com. Intel technologies may require enabled hardware, specific software, or services activation. Check with your system manufacturer or retailer. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548- 4725 or visit www.intel.com/design/literature.htm. Intel and the Intel logo are trademarks of Intel Corporation in the U.S.
    [Show full text]
  • Getting Started with Microchip's Low Pin Count USB Solutions
    Slide 1 Getting Started with Microchip's Low Pin Count USB solutions Welcome to “Getting Started with Microchip’s Low Pin Count USB Solutions”. This self-directed course is intended to provide the user with a quick overview of the USB, introduce the new Low Pin Count USB Development kit, and Microchip’s Full-Speed USB Firmware Framework to ease the development of your own USB applications quickly. Slide 2 Class Prerequisites O Attendees should have a the following: - A general knowledge of the Universal Serial Bus (USB) - A working knowledge of the C programming language - Familiarity with Microchip’s High Performance PIC18 Microcontrollers Getting Started with Microchip’s Low Pin Count USB Solutions Slide 2 In order to fully benefit from this self-directed course the user should have a very basic knowledge of the USB, have programmed in C, and be familiar with Microchip’s High Performance PIC18 Microcontrollers. Once completed, the user should complete the Project Labs listed in the Low Pin-Count USB Development kit user’s guide. Slide 3 Agenda O High-level overview of the USB and how it relates to the PIC18F1XK50 Device - Physical and Logical Topologies - “Plug and Play” - Communication O Overview of Microchip’s Low Pin Count USB Solutions - Low Pin-Count USB Development Kit - Microchip’s Full Speed USB Firmware Framework Getting Started with Microchip’s Low Pin Count USB Solutions Slide 3 This class will begin with an overview, albeit moderately high-level, of the USB. This is a complex protocol. Therefore, you should not feel discouraged if you don’t understand everything the first time through this class.
    [Show full text]
  • Memory Technology and Trends for High Performance Computing Contract #: MDA904-02-C-0441
    Memory Technology and Trends for High Performance Computing Contract #: MDA904-02-C-0441 Contract Institution: Georgia Institute of Technology Project Director: D. Scott Wills Project Report 12 September 2002 — 11 September 2004 This project explored the impact of developing memory technologies on future supercomputers. This activity included both a literature study (see attached whitepaper), plus a more practical exploration of potential memory interfacing techniques using the sponsor recommended HyperTransport interface. The report indicates trends that will affect interconnection network design in future supercomputers. Related publications during the contract period include: 1. P. G. Sassone and D. S. Wills, On the Scaling of the Atlas Chip-Scale Multiprocessor, to appear in IEEE Transaction on Computers. 2. P. G. Sassone and D. S. Wills, Dynamic Strands: Collapsing Speculative Dependence Chains for Reducing Pipeline Communication, to appear in IEEE/ACM International Symposium on Microarchitecture, Portland, OR, December 2004. 3. B. A. Small, A. Shacham, K. Bergman, K. Athikulwongse, C. Hawkins, and D. S. Wills, Emulation of Realistic Network Traffic Patterns on an Eight-Node Data Vortex Interconnection Network Subsystem, to appear in OSA Journal of Optical Networking. 4. P. G. Sassone and D. S. Wills, On the Extraction and Analysis of Prevalent Dataflow Patterns, to appear in The IEEE 7th Annual Workshop on Workload Characterization (WWC-7), 8 pages, Austin, TX, October 2004. 5. H. Kim, D. S. Wills, and L. M. Wills, Empirical Analysis of Operand Usage and Transport in Multimedia Applications, in Proceedings of the 4th IEEE International Workshop on System-on-Chip for Real-Time Applications(IWSOC'04), pages 168-171, Banff, Alberta, Canada, July 2004.
    [Show full text]
  • Hypertransport Extending Technology Leadership
    HyperTransport Extending Technology Leadership International HyperTransport Symposium 2009 February 11, 2009 Mario Cavalli General Manager HyperTransport Technology Consortium Copyright HyperTransport Consortium 2009 HyperTransport Extending Technology Leadership HyperTransport and Consortium Snapshot Industry Status and Trends HyperTransport Leadership Role February 11, 2009 Mario Cavalli General Manager HyperTransport Technology Consortium Copyright HyperTransport Consortium 2009 HyperTransport Snapshot Low Latency, High Bandwidth, High Efficiency Point-to-Point Interconnect Leadership CPU-to-I/O CPU-to-CPU CPU-to-Coprocessor Copyright HyperTransport Consortium 2009 Adopted by Industry Leaders in Widest Range of Applications than Any Other Interconnect Technology Copyright HyperTransport Consortium 2009 Snapshot Formed 2001 Controls, Licenses, Promotes HyperTransport as Royalty-Free Open Standard World Technology Leaders among Commercial and Academic Members Newly Elected President Mike Uhler VP Accelerated Computing Advanced Micro Devices Copyright HyperTransport Consortium 2009 Industry Status and Trends Copyright HyperTransport Consortium 2009 Global Economic Downturn Tough State of Affairs for All Industries Consumer Markets Crippled with Long-Term to Recovery Commercial Markets Strongly Impacted Copyright HyperTransport Consortium 2009 Consequent Business Focus Cost Effectiveness No Redundancy Frugality Copyright HyperTransport Consortium 2009 Downturn Breeds Opportunities Reinforced Need for More Optimized, Cost-Effective Computing
    [Show full text]
  • Motherboards, Processors, and Memory
    220-1001 COPYRIGHTED MATERIAL c01.indd 03/23/2019 Page 1 Chapter Motherboards, Processors, and Memory THE FOLLOWING COMPTIA A+ 220-1001 OBJECTIVES ARE COVERED IN THIS CHAPTER: ✓ 3.3 Given a scenario, install RAM types. ■ RAM types ■ SODIMM ■ DDR2 ■ DDR3 ■ DDR4 ■ Single channel ■ Dual channel ■ Triple channel ■ Error correcting ■ Parity vs. non-parity ✓ 3.5 Given a scenario, install and configure motherboards, CPUs, and add-on cards. ■ Motherboard form factor ■ ATX ■ mATX ■ ITX ■ mITX ■ Motherboard connectors types ■ PCI ■ PCIe ■ Riser card ■ Socket types c01.indd 03/23/2019 Page 3 ■ SATA ■ IDE ■ Front panel connector ■ Internal USB connector ■ BIOS/UEFI settings ■ Boot options ■ Firmware upgrades ■ Security settings ■ Interface configurations ■ Security ■ Passwords ■ Drive encryption ■ TPM ■ LoJack ■ Secure boot ■ CMOS battery ■ CPU features ■ Single-core ■ Multicore ■ Virtual technology ■ Hyperthreading ■ Speeds ■ Overclocking ■ Integrated GPU ■ Compatibility ■ AMD ■ Intel ■ Cooling mechanism ■ Fans ■ Heat sink ■ Liquid ■ Thermal paste c01.indd 03/23/2019 Page 4 A personal computer (PC) is a computing device made up of many distinct electronic components that all function together in order to accomplish some useful task, such as adding up the numbers in a spreadsheet or helping you to write a letter. Note that this defi nition describes a computer as having many distinct parts that work together. Most PCs today are modular. That is, they have components that can be removed and replaced with another component of the same function but with different specifi cations in order to improve performance. Each component has a specifi c function. Much of the computing industry today is focused on smaller devices, such as laptops, tablets, and smartphones.
    [Show full text]