Embedded 3D API and Chipset

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Embedded 3D API and Chipset Embedded 3D API And ChipSet Aram So 국내외 모바일 플랫폼 현황 국외 플랫폼 개발언어 수행방식 추진사 비고 Symbian C/C++ 바이너리 노키아, 에릭슨,모토로라 서비스 Brew C/C++ 바이너리 퀼컴 서비스 J2ME 자바 인터프리터 Sun Microsystems 서비스 Window Mobile C/C++ 바이너리 Microsoft - 국내 플랫폼 개발언어 수행방식 추진사 비고 KBM JAVA 인터프리터 LGT 서비스 GVM C/C++ 인터프리터 SKT 서비스 브루 C/C++ 바이너리 KTF 서비스 WIPI 자바,C/C++ 바이너리 무선인터넷 표준,,TTA 국내 국내외 모바일 플랫폼 현황 ` 유럽, 북미는 Symbian, J2ME가 강세. ` 일본은 NTT도코모의 iMode등 자바가 강세 ` 중국은 J2ME와 Brew가 시장양분 ` 한국은 최종적으로 WIPI 통합 국내외 모바일 3D API 현황 국외 API 개발언어 플랫폼 관리사 비고 OpenGL ES C Symbian,Brew 크로노스 서비스 Win CE M3G JAVA 바이너리 Sun,JSR 서비스 Mascot V3,V4 C,JAVA 인터프리터 일본 HI.Corp. 서비스 Renderware, X-Forge, Ect 국내 이통사 언어 3D 플랫폼 추가내용 비고 SKT C/C++ Hi 신지소프트- 서비스 Micro3D,Reako Swerve3D, sys OpenGL M3D( OpenGL ES+Extension ES) API를 포함 KTF C/C++ NF3D(OpenGL NF3D,(가바플러 서비스 ES) 스 3D엔진) QT(디지털아이 3D엔진 LTG C/C++ - - - OpenGL ES ` 1. OpenGL ES 1.x, 2.x -1.x 고정소수점 사용하는 모바일 3D 가속칩을 타겟으로 발전. -2.x는 Programmable Pipeline 구조지원 ` OpenGL ES Extension API -Core Addition 확장 API와 Profile 확장 API로 나뉜다. -Profile Extensiton 은 필수적으로 구현해야하는 Mandatory와 선택 으로 포함될수있는 Optinal 확장 API로 나뉜다. ` EGL -하드웨어 기능을 규격화 하는 스펙 -OpenGL ES를 EGL를 사용하여 구현 할 수도 있고, 아닐 수도 있다. 각 플랫 폼 밴더 고유의 규격을 사용. JAVA API M3G ` JCP(Java Community Process) ‒ 1998 Sun Microsys tems 설립, 자바 플랫폼 표준화 활동 지원 ‒ JSR(Java Specification Requests) ‒ JCP 회원사가 제안한 자바 플랫폼에 대한 구체적인 기술 사양 ` 모바일 3D 표준과 관련된 항목 ‒ JSR-184 : Mobile 3D Graphics API for J2ME ‒ JSR-226 : Scalable 2D Vector Graphics API for J2ME ‒ JSR-287 : Scalable 2D Vector Graphics API 2.0 for J2ME ‒ JSR-239 : JAVA Bindings for OpenGL ES ‒ OpenGL ES 3D 그래픽 라이브러리에 대한 자바 바인딩 ‒ 기본 내용은 OpenGL ES와 동일하며, 자바에서 동작하는 환경 제공 M3G ` Java Soft M3G -MIDP 2. 0의 확장 패키지 -주로 유럽과 북미 핸드폰에 포팅 씬그래프를 사용하는 고수준API ` M3G의 구현 -대부분 OpenGL 기반 구현 -속도는 느리지만 코드의 양을 줄이는 데 유리하다. ` M3G의 전망 -하드코어 모바일 3D 게임은 OpenGL ES를 사용할것으로 예상됨. -M3G의 경우 MIDP와 OpenGL ES의 갭을 매꿀것으로 예상됨. -대부분 OpenGL ES와 동시에 탑재할 것으로 예상됨. M3G Class M3G Rendering 결론(모바일 API) ` 국외 -Symbian, Brew의 경우 OpenGL ES 지원 - Windows CE 경우 OpenGL ES와 DirectX 동시 지원 - 자바 플랫폼의 경우 M3G 지원 ` 국내 -OpenGL ES가 기본적으로 제공 - KTF,SKT는 독자적인 3D 플랫폼을 사용 중 - WIPI 표준을 제안한 Aroma Soft에서 3D API 제공 예정. 결론(모바일 API) ` OpenGL ES - OpenGL의 서브셋으로 명령, 토큰의 이름이 유사함. - 지원기기에 따라 Common Profile, Critical Safety Profile로 나뉨. ` M3G - M3G는 씬그래프 모델을 사용하는 객체지향 3D 자바API - 대부분 OpenGL ES 기반으로 구현됨 -소스 코드의 양을 줄일 수 있음. ` Open GLESVSM3GGL ES VS M3G - 속도는 OpenGL ES가 빠름. - 현재 대부분 OpenGL ES 기준으로 가속 칩 지원예정 - 유럽,북미는 대부분 동시지원 - 국내는 M3G 미 탑재 시장변화 ` 모바일 CPU와 3D 가속 칩은 급격히 발전 하고 있음 -Arm11, Xcale 경우400mHz 이상 -Qualcom Chip 경우 ATI 가속칩이 내장 -MSM 7xxxx부터 ImageOn 칩 내장 ` 3D에 맞는 디스플레이 사운드도 ` 발전 모바일 3D 가속 하드웨어의 필요성 ` 필요성 ‒ 소프트웨어 기반 3D 엔진의 성능은 최대 초당 5~6만개 다각형 ‒ 높은 그래픽 품질이나 빠른 속도감 구현은 곤란 ‒ 3D 가속 하드웨어 칩셋, 초당 20~100만 폴리곤 정도 성능 예상 ` 용도 ‒ 다양한 멀티미디어 기능을 위해서는 범용 프로세서로 개발 ‒ 3D 게임만을 위해서는 3D 전용 칩의 개발 ‒ 생산 단가를 고려하면 DSP 칩의 사용을 선호 ` 사례 ‒ SK “기가폰”: 나조미 사의 자바 가속 칩 사용, 향후 DSP칩 예정 ‒ PDA 분야에서는 미국 MeidaQ사의 3D 전용 칩이 많이 사용 ‒ 휴대폰 분야에서는 일본 산신전자의 GSHARK, 미쯔비시의 Z3D, ‒ 핀란드 bitboys 사의 Acceleon 칩이 많이 사용 업체 동향 ` Qualcomm Q3D / Q3Dimension ‒ MSM 6100 : Q3D 하드웨어 엔진, OpenGL ES, 초당 10만 다각형 ‒ MSM 7000 : ATI 사의 Imageon 코어 채택, 향후 ATI와 기술 협력 ` ATI Imageon 2300 ‒ 2004년OpenGL ES 를 충족하는 휴대전화용 멀티미디어 칩 발표 ` CPU가 없는 순수 가속칩의 형태 ` Nvidia GoForce 3D ‒ OpenGL ES 및 Direct 3D API를 충족 ‒ 휴대전화용 3D 그래픽스 칩 코어, 저전력 기술이 특징 ` 산신전자 Gshark plus ‒ 일본 산신전자 독자규격, CPU가 없는 순수 3D 가속 칩 iPhone ` SAMSUNG K9MCGD8U5M 4G chip ` SAMSUNG ARM (H.264, MP3 decoding) (339S0030ARM, 8900B 0719, NOD4BZ02, K4X1G153PC-XGC3, ECC457Q3 716) ` Wolfson audio chip(WM8758BG and 73AFMN5) ` Linear Technology 4066 USB Power Li-Ion Battery Charger ` MARVELL, W8686B13, 702AUUP. This is Marvell's 802.11b/g 18.4mm2 chip. ` Skyworks GSM/Edge Power amplifier ` CSR BlueCore4-ROM WLCSP singgple chip radio and baseband IC for Bluetooth 2+ED R ` PN 338S0289 and 8G60710 ` Intel 32 MB NOR flash chip. PN 1030W0YTQ2, 5716A673, and Z717074A ` PN 338S 0297 G0719, EL629058S03. ARM 620MHz included ARM1176JZF chip with TrustZone (enables trusted computing environment for media , apps, network, OS, etc. -- very bad for hackers) ` Can vary in clock speed up to 700MHz or more, depending on implementation (thank s, Nigma) ` ARM Intelligent Energy Manager (claimed to reduce power consumption 25-50% in po rtables) ` 16K / 16K cache ` Features vector floating point coprocessor ("for embedded 3D-graphics") ` ARM Jazelle enabled for embedded Java execution (hmm...) ` SIMD, high perf integer CPU (8-stage pipeline, 675 Dhrystone, 2.1 MIPS) ` 0.45 mW/MHz power draw (with cache) ` 출처 : http://www.ifixit.com/Guide/iPhone Qualcomm Chip Comparisons INTEL Toshiba Sharp 903SH ATI LG SV360 NVIDIA Gizmon do -Programmable Pixel Shader -Multi Texture (up to 6) -Super-Sampled Anti-Aliasing JBenchmark 3D See www.jbenchmark.com for more 결론(모바일 3D 발전방향) ` 모바일 3D 가속 하드웨어 장치의 개발 및 일반화 ‒ H/W 장치의 과열 방지 기술과 저전력 H/W 설계 기술이 중요 ‒ 고성능 PC, PS2, X-Box 등에서 구현이 가능했던 고품질 3D ‒ 콘텐츠의 모바일 기기 상에서의 구현이 가능해질 것 ` 모바일 기기 전용의 다양한 사용자 인터페이스 기기 ‒ 현재 간단한 버튼 조작과 방향키로 게임 조작이 매우 단순 ‒ 아날로그 방식의 입력버튼, 360도 조이스틱 장치 등 예상 ‒ 최근 입체 디스플레이 패널을 장착한 모바일 기기가 등장 ` 3D 기술의 표준화 ‒ 현재는 Khronos 그룹과 JSR-184 그룹이 업계 표준을 제정 ‒ 많은 업체들이 이들의 표준 3D API를 채택하여 상품을 개발 ‒ 국내의 경우 국제 표준화 활동을 하기에 좋은 조건을 보유.
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