DOCSLIB.ORG

Dfx Guidelines

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Dfx Guidelines DFX GUIDELINES Copyright Notice This document contains proprietary information of .No part of this document may be reproduced, stored, copied, or transmitted in any form or by means of electronic, mechanical, photocopying or otherwise, without the express consent of. This document is intended for internal circulation only and not meant for external distribution. O_GD0322_10 DFX GUIDELINES Glossary Abbreviation Description ADHESIVE (SMT) A substance such as glue or cement used to fasten objects together. In surface mounting, an epoxy adhesive is used to adhere SMD’s to the substrate. AQUEOUS WASH De-ionized water wash process used to remove contaminates and (SMT and PTH) flux residue from the PCB. Teradyne uses an aqueous cleaning system. AUTO PLACE (SMT) The act or operation of assembling discrete components to printed boards by means of electronically controlled equipment. CABLE ASSEMBLY Manual process to route, solder and tie down coax or other cable assemblies. COMPONENT Component insertion equipment installs the leads of a PTH INSERTION (PTH) component Into the PCB, cuts each lead to the proper length and then clinches some or all of the leads against the Surface of the PCB. Current capability includes axial insertion, DIP insertion, SIP insertion and socket Insertion. CURE A chemical reaction that changes the physical properties of a substance, e.g., an adhesive. DPMO Defects per million opportunities is the number of defects divided by the number of opportunities multiplied by one million. DISPENSING (SMT) Process to dispense adhesive material used to secure large parts on the bottom side of PCB. Solder paste is also dispensed on land pads for BGA rework. ECO ASSEMBLY Manual process to incorporate jumper wires and other add-on components required by engineering change documentation. LEAD FORM (PTH) Preconditioning leaded components by forming and/or trimming leads prior to insertion. MANUAL SOLDER Manual process. Soldering using a solder iron or other hand-held, (PTH) operator controlled apparatus. MECHANICAL Manual installation of mechanical components such as Ejectors, ASSEMBLY Heat sink Plates, air baffles etc. Page 2 of 95 O_GD0322_10 DFX GUIDELINES Abbreviation Description PRESS-FIT Manual process to press-fit an electrical contact into a hole in a printed board with or without Plated thru holes. PRINTING (SMT) Process to apply a material (solder paste or thermally conductive epoxy) by forcing it thru a stainless steel stencil. Two methods are employed in printing: automated (solder paste printing for PCBs) and manual (thermally conductive epoxy for heat sink applications). REFLOW SOLDERING The joining of surfaces that have been tinned and have solder (SMT) between them, placing them together, heating them until solder flows, and allowing the surfaces and the solder to cool in the joined surfaces. REWORK (PTH and The act of reprocessing non-complying articles, thru the use of SMT) original or alternate equivalent processing, in a manner that assures compliance of the article with applicable drawings or specifications. SOCKET ASSEMBLY Manual process to hand load socketed components such as relays into pre-installed sockets. SOLDER PASTE Solder paste is a homogeneous mixture of metal spheres and flux APPLICATION (SMT) that promotes wetting. Two automated methods are used to apply solder paste to the PCB surface: printing or dispensing. Printing, which has the fastest cycle time and best process capability, is the preferred process. SURFACE PREP Manual process where the bonding surfaces are abraded prior to applying epoxy. WAVE SOLDERING A process wherein an assembled printed board is brought in contact (PTH) with the surface of a continuously flowing and circulating mass of solder ALIGNMENT HOLES Unplated holes used to position component alignment fixtures during assembly and soldering. BREAKOFF BORDERS PCB material used to adapt PCB arrays to conform to PTH, In-Line or Carrier formats. BREAKOFF PCB material used to extend the dimensions of a PCB image or EXTENSIONS array to conform to PTH or In-Line formats. BREAK-OFF TABS Snap-off tabs between images in an array to permit depanelization after assembly. MULTI-IMAGE ARRAYS PCB images arranged in rows & columns to reduce costs or meet processing format requirements. Page 3 of 95 O_GD0322_10 DFX GUIDELINES Abbreviation Description PANELIZATION Method to reduce costs by using break off borders, extensions or by creating multi-image arrays. CARRIER FORMAT Processing format for Mixed Technology Boards that do not meet requirement of In-Line format. PCB IMAGE Refers to a single PCB which can be processed individually or as part of an array. PTH FORMAT Processing format for leaded technology boards that permits use of standard board holding plates. ROUTER TABS Webs of PCB material between images in an array which are cut or routed after assembly. SAW SCORING Grooves cut between images in an array to permit depanelization after assembly. SMT CARRIER Processing format for SMT or Mixed Technology Boards that do not FORMAT meet requirement of In-Line format. SMT IN-LINE FORMAT Processing format for Mixed Technology Boards that permits conveyorized board handling. TOOLING HOLES Un plated holes used for mechanical board alignment during assembly and test. Page 4 of 95 O_GD0322_10 DFX GUIDELINES Table of Contents 1 Introduction..................................................................................................................................8 2 Tooling Holes, Fiducials..............................................................................................................8 3 Layout considerations (SMT/THT)...............................................................................................9 4 PTH Calculations .......................................................................................................................11 5 Outline Drawing dimension and requirements.........................................................................12 6 Stackup construction ................................................................................................................12 7 Silkscreen guidelines ................................................................................................................13 8 SOLDERMASK REQUIREMENTS ..............................................................................................13 9 Solder Paste Requirements.......................................................................................................14 10 PCB Surface Finishes................................................................................................................14 11 Soldering Types and Layout Requirements .............................................................................16 11.1 Design Guideline for Reflow soldering...........................................................................16 11.2 Design Guideline for Intrusive Reflow............................................................................16 11.3 Design Guideline for Wave Soldering............................................................................17 11.4 Selective Wave Soldering Requirements.......................................................................18 12 Assembly Drawing Requirements:............................................................................................18 13 Panelization and De-Panelization..............................................................................................19 13.1 Panelization:.................................................................................................................19 13.2 Depanelization Methods:...............................................................................................20 14 Vias (Types, Preferred, Via Selection).......................................................................................22 15 Laminate Material Selection ......................................................................................................25 16 Pb-free Laminate Characteristics..............................................................................................26 16.1 Laminate Selection .......................................................................................................27 17 ROHS compliance......................................................................................................................28 17.1 Minimum RoHS Component Requirements...................................................................28 17.2 All PCB surface finishes must meet the following requirements .....................................29 18 Chip Components......................................................................................................................30 19 Design for Testability Guidelines..............................................................................................52 19.1 ICT (In circuit Test) Mechanical Guidelines ...................................................................52 19.1.1 Probe Spacing .....................................................................................................52 19.1.2 Probe Access.......................................................................................................52 19.1.3 Test Pad Density..................................................................................................53 19.1.4 Test Pad Requirement: ........................................................................................53 19.1.5
Load more

Recommended publications
  • Low Temperature Soldering Using Sn-Bi Alloys
    LOW TEMPERATURE SOLDERING USING SN-BI ALLOYS Morgana Ribas, Ph.D., Anil Kumar, Divya Kosuri, Raghu R. Rangaraju, Pritha Choudhury, Ph.D., Suresh Telu, Ph.D., Siuli Sarkar, Ph.D. Alpha Assembly Solutions, Alpha Assembly Solutions India R&D Centre Bangalore, KA, India [email protected] ABSTRACT package substrate and PCB [2-4]. This represents a severe Low temperature solder alloys are preferred for the limitation on using the latest generation of ultra-thin assembly of temperature-sensitive components and microprocessors. Use of low temperature solders can substrates. The alloys in this category are required to reflow significantly reduce such warpage, but available Sn-Bi between 170 and 200oC soldering temperatures. Lower solders do not match Sn-Ag-Cu drop shock performance [5- soldering temperatures result in lower thermal stresses and 6]. Besides these pressing technical requirements, finding a defects, such as warping during assembly, and permit use of low temperature solder alloy that can replace alloys such as lower cost substrates. Sn-Bi alloys have lower melting Sn-3Ag-0.5Cu solder can result in considerable hard dollar temperatures, but some of its performance drawbacks can be savings from reduced energy cost and noteworthy reduction seen as deterrent for its use in electronics devices. Here we in carbon emissions [7]. show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics In previous works [8-11] we have showed how the use of industry specific needs. The physical properties and drop micro-additives in eutectic Sn-Bi alloys results in significant shock performance of various alloys are evaluated, and their improvement of its thermo-mechanical properties.
    [Show full text]
  • Case Study on the Validation of SAC305 and Sncu-Based Solders in SMT, Wave and Hand Soldering at the Contract Assembler Level
    Case Study on the Validation of SAC305 and SnCu-based Solders in SMT, Wave and Hand Soldering at the Contract Assembler Level Peter Biocca, ITW Kester Itasca, Illinois Carlos Rivas, SMT Dynamics Anaheim, California Abstract: At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a 63/37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes. The selection of soldering materials and fluxes are important as to insure high quality solder joints with lead-free solders which tend to wet slower than leaded solders but also the process equipment must be lead-free process compatible. Components must be lead-free and able to meet the thermal requirements of the process but also the MSL (moisture sensitivity limits) must be observed. Board finish must be lead- free and the PCB must be able to sustain higher process temperature cycles with no physical damage but also good solderability to enable subsequent soldering at the wave or hand assembly. Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council as the preferred option for SMT assembly and most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many contract manufacturers and PCBA assemblers are opting for less costly options such as tin-copper based solders for wave, selective, hand soldering, dip tinning operations.
    [Show full text]
  • 'Pin in Paste' Reflow Process with Combination of Solder Preforms To
    As originally published in the IPC Printed Circuit Expo, APEX & Designer Summit Proceedings. Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering Guhan Subbarayan, Scott Priore Assembly Sciences and Technology, Cisco Systems, Inc. San Jose, California [email protected] Paul Koep, Scott Lewin*, Rahul Raut Cookson Electronics - Assembly Materials South Plainfield, NJ; *Elgin, IL Sundar Sethuraman Jabil Circuits San Jose, California ABSTRACT The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several advantages compared to the traditional wave soldering process. One of the primary advantages is lowering of cost due to the elimination of the wave soldering process and its associated tooling cost and potential handling damage. Another advantage is that with the wave soldering process, it is extremely difficult to achieve adequate holefill on thermally challenging thick Printed Circuit Boards (PCBs). However, by using PiP process with combination of solder preforms, it is possible to achieve adequate holefill and reliable solder joints for soldering PTH components. The objective of this study is to investigate the use and limitations of machine-placed solid solder preforms during the top- side SMT reflow process for PTH components. An experiment was designed to investigate the following problems: 1) How much additional volume is provided by the combination
    [Show full text]
  • PCB Solder Finishes
    Package on Package Assembly Inspection & Quality Control Advertising and Media Sponsors Falcon PCB Group www.falconpcbgroup.com Practical Components www.practicalcomponents.com Sparks Laser Stencils www.sparkslaser.com © Copyright Bob Willis 2013 V2 Page 2 Package on Package Assembly Inspection & Quality Control Author’s Profile Bob Willis currently operates a training and consultancy business based in UK and has created one of the largest collections of interactive training material in the industry. With his online training webinars Bob Willis provides a cost effective solution to training worldwide and regularly runs training for SMTA, SMART, IPC and recently EIPC. Although a specialist for companies implementing lead-free manufacture Bob has provided worldwide consultancy in most areas of electronic manufacture over the last 25 years. Bob has travelled in the United States, Japan, China, New Zealand, Australia, South Africa and the Far East consulting and lecturing on electronic assembly. Bob was presented with the “Paul Eisler award by the IMF (Institute of Metal Finishing)” for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and ran Reflow and Wave Soldering Workshops in Europe for one of the largest suppliers of capital equipment. This is based on many years of practical experience working in contract assembly, printed board manufacture, environmental test and quality control laboratories. This has earned him the SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution to the industry. He has also been presented with the SMTA International Leadership Award and IPC Committee Award for contribution to their standards activity. He has also run training workshops with research groups like ITTF, SINTEF, NPL & IVF in Europe.
    [Show full text]
  • Recommendations for Assembly of Infineon to Packages
    Additional Information, DS1, March 2008 Recommendations for Assembly of Infineon TO Packages Edition 2008-03 Published by Infineon Technologies AG 81726 München, Germany © 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Assembly & Interconnect Technology Table of Contents 1 Package Description and Thermal Performance .
    [Show full text]
  • Tin-Copper Based Solder Options for Lead-Free Assembly Tin-Coppertin-Copper Basedbased Soldersolder Optionsoptions Forfor Lead-Freelead-Free Assemblyassembly
    Tin-copper based solder options for lead-free assembly Tin-copperTin-copper basedbased soldersolder optionsoptions forfor lead-freelead-free assemblyassembly As the transition to lead-free progresses a substantial percentage of assemblers have either implemented less costly solder alloys or are investigating them. Tin-copper solder by itself without dopants has limitations however the addition of certain elements helps out in the deficiencies normally seen with tin-copper. Figure 1. Comparative solder button showing differing surface finishes. This paper discusses several options and the advantages they offer when Tin-silver-copper has received much publicity less, making the overall operation much less compared with SAC based in recent years as the lead-free solder of choice. expensive. solders. It compares tin-copper The IPC Solder Value Product Council SAC305 based solders with SAC305 (Sn96.5 Ag3.0 Cu0.5) was endorsed by as the Properties of SnCu based solders and describes results being preferred option for SMT assembly, and most If the properties of SAC305 and tin-copper obtained by large assemblers. assemblers have transitioned to this alloy for based solders are compared, the melting point of their solder paste requirements. However, SAC305 is lower; this is one reason why it is not Peter Biocca, Senior Market due to the 3.0% silver content, the SAC305 a popular choice for reflow soldering. Tin-copper Development Engineer, Kester, is expensive when compared to traditional based solder would require a slightly higher peak Des Plaines, Illinois Sn63Pb37. For this reason, many wave temperature in this operation. If wetting speeds assemblers are opting for less costly options, are compared, tin-copper based solders would Keywords: such as tin-copper based solders, for their wave, show lower values than SAC305 when weaker Solder, tin-copper, selective and dip tinning operations.
    [Show full text]
  • Recommended Reflow Soldering Conditions
    SURFACE MOUNT ALUMINUM ELECTROLYTIC CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITIONS AlchipTM MVA/MVE/MZJ/MZA/MVY/MZF/MZE/MZK/MLA/MLF/MLE/MLK/ MVL/MVJ/MVH/MHB/MHJ/MKB/MV-BP/MVK-BP The following conditions are recommended for air convection and infrared reflow soldering on the SMD products on to a glass epoxy circuit boards by cream solder. The dimensions of the glass epoxy boards with resist are 90×50×0.8mm for D55 to KG5 case code SMD capacitors and 180×90×0.8mm for LH0 to MN0 case codes SMD capacitors. The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals. Reflow should be performed twice or less. Please ensure that the capacitor became cold enough to the room temperature (5 to 35℃) before the second reflow. Consult with us when performing reflow profile in IPC / JEDEC (J-STD-020) ●Recommended soldering heat conditions (Except for Conductive Polymer Aluminum Solid Capacitors) Peak temp. Voltage Time maintained Time maintained Peak SMD type Size code range Preheat Peak temp. Reflow number 230 above 217 above 230 (Vdc) ℃ ℃ Max. period of time over 230℃ 217 4 to 63V ) (Except 63V 90sec. max 60sec. max. 260℃max. 2 times or less ℃ D55 to F90 for MVH) Max. period of time over 217℃ 63V(MVH), 80V 150 to 180℃ 60sec. max. 40sec. max. 250℃max. 2 times or less Temp ( Preheat Vertical 4 to 50V 120sec. max. 60sec. max. 30sec. max. 245℃max. 2 times or less H63 to JA0 63 to 100, 400V 30sec.
    [Show full text]
  • Fundamentals of Hot Bar Reflow Soldering
    Fundamentals of Pulse Heated Reflow Soldering “Pulse Heated Reflow Soldering is a process where two pre-fluxed, solder coated parts are heated to a temperature sufficient to cause the solder to melt and flow, and then cooled under pressure, to form a permanent electro-mechanical bond between the parts and solder.” A thermode is used to apply heat and pressure over a specific time/temperature profile. Temperature feedback is provided by a thermocouple: Goal: Heat the solder to 400 C above melting point temperature for 2-3 seconds to achieve proper wetting and flow. Equipment REFLOW HEAD THERMODE POWER SUPPLY (CONTROL UNIT) TOOLING 1/19 Thermode Heating TIME & TEMPERATURE PROFILE: Thermocouple provides temperature feedback to Power Supply Heat is generated due to Power Supply delivers AC electrical resistance of current to Thermode Thermode Heating Rates Coarse Heating Rate adjustment changes transformer taps: Fine Heating Rate adjustment changes maximum % Current: 2/19 PID Tuning PID Tuning can be used to optimize the rise time and stability of the output: PID Table Note: Using PID setting “99” will emulate Uniflow 2 and 3’s default PID settings 3/19 PID Tuning Typical PID and Coarse Heat Settings Thermode Type Heat Rate Setting PID Peg Tip Very slow 155, 243 Big blade > 1" Medium 175 Small blade < 1" Very slow 200, 268, 185 Big TD > 1" Fast 105 MID TD Fast 155 Small TD < 0.5" Medium 185 Materials: Solders and Fluxes ABOUT SOLDER • Solders are alloys: chemical mixture of two or more metals • Alloy type and characteristics are determined
    [Show full text]
  • Hot Bar Reflow Soldering Fundamentals Comprehensive Manufacturer of Metalworking Machinery a High Quality Selective Soldering Technology Content
    Hot Bar Reflow Soldering Fundamentals Comprehensive Manufacturer of Metalworking Machinery A high quality Selective Soldering Technology Content 1. Hot Bar Reflow Soldering Introduction page 3-5 2. Application Range page 6-7 3. Process Descriptions page 8-13 > Flex to PCB > Wire to PCB 4. Design Guidelines page 14-22 5. Equipment page 23-25 6. Troubleshooting Guide page 26-27 All data, images and text described and illustrated in this document are subject to change. Amada Miyachi Europe reserves the right to modify the specifications, the design and the illustrations at any time. © All rights reserved – September 2014 What is Hot Bar Reflow Soldering? HBR Introduction Pulsed heat Thermode (Hot Bar) soldering, is a joining technology where two pre-tinned THERMODE HOLDER parts are heated to the melting point of the tin. The joining technology results in a HEAT IS THERMODE CONDUCTED permanent electro mechanical joint. FROM THE THERMODE TO THE PARTS AND The required process energy is supplied by a SOLDER thermode, also know as a Hot Bar. This PCB thermode is pressed on the upper part to transfer the thermal energy to both parts. Closed loop process control is used to control the time-temperature profile . How does it work? HBR Introduction Load PCB in Apply non-clean flux Load and position Start soldering customized fixture on pads Flex on the PCB process After a preset time Uniflow heats up the The reflow temp is Thermode moves uniflow ramps up to thermode to preheat kept on temperature down on the the reflow temperature to for a preset time soldering area temperature activate flux Thermode cools thermode moves up Hot Bar soldering down to the cool from the soldering process is temperature area completed The benefits of Hot Bar Reflow Soldering HBR Introduction • Suitable for mass production • Reliable processing, always equal process conditions • Cost effective due to the fact that no third component is needed to connect flex/wire to the PCB/substrate (connector or ACA can be avoided) • Multiple connections to be made simultaneously.
    [Show full text]
  • The Application of Bi-Based Solders for Low Temperature Reflow to Reduce Cost While Improving Smt Yields in Client Computing Systems
    As originally published in the SMTA Proceedings THE APPLICATION OF BI-BASED SOLDERS FOR LOW TEMPERATURE REFLOW TO REDUCE COST WHILE IMPROVING SMT YIELDS IN CLIENT COMPUTING SYSTEMS Scott Mokler, Ph.D., P.E., Raiyo Aspandiar, Ph.D., Kevin Byrd, Olivia Chen, Satyajit Walwadkar, Kok Kwan Tang, Mukul Renavikar and Sandeep Sane Intel Corporation Hillsboro, OR, USA [email protected] ABSTRACT Key words: Bismuth, low temperature reflow, collapse, The continued miniaturization of personal computing ductile, dynamic warpage, carbon footprint, energy saving systems has a significant impact on the ability to surface mount high I/O density component devices with high yield. INTRODUCTION To ensure complete solder joint melting, typical SnAgCu Currently, printed circuit boards used in consumer (SAC) solder reflow temperatures peak in the 245 to 260C electronic products, such as cell phones, tablets, mobile range. At these temperatures, the mismatch in Coefficient of computers, are assembled with components by reflow Thermal Expansion (CTE) of the key constituents in the soldering with lead-free SAC solder pastes at peak system, primarily the PCB and BGA components, results in temperatures in the 240 to 260C range. The desire to lower dynamic warpage that leads to both bridging and open this reflow temperature has existed for some time now and solder joint defects. The use of low temperature Bi-based has been identified as one of the paradigm shifts within the solder paste reduces the peak reflow temperatures below electronics manufacturing industry in the 2015 iNEMI 200C at which point The magnitude of the dynamic warpage Roadmap [1]. The two main drivers for this have been is reduced and this improves SMT yield.
    [Show full text]
  • Wave & Reflow Soldering Troubleshooting Chart
    575-37810 Poster.qxd 3/8/00 3:19 PM Page 1 SPEEDLINE TECHNOLOGIES ELECTROVERT REFLOW & WAVE SOLDERING PROBLEMS & SOLUTIONS INSUFFICIENT SOLDER FLOW-THRU INSUFFICIENT SOLDER (SOLDER SIDE) DE-WETTING OR NON-WETTING SOLDER VOIDS OR OUTGASSING SKIPPED OR OMITTED SOLDER EXCESSIVE SOLDER (COMP SIDE) EXCESSIVE SOLDER (SOLDER SIDE) EXCESSIVE SOLDER (BOTH SIDES) ICICLES BRIDGING WEBBING SOLDER BALLS & SPLATTER ROUGH OR DISTURBED SOLDER GRAINY SOLDER COLD SOLDER JOINT DISCLOSED SOLDER JOINT FLUX ENTRAPMENT MASKING FAILURE BLISTERING MEASLING COMPONENTS LIFTED WARPAGE FLOODING EXCESSIVE DROSS GENERATED EXCESSIVE FLUX USED EXCESSIVE SOLDER DRAGOUT BRIDGING SOLDER BALLS GRAINY SOLDER INCOMPLETE FILLET OPEN JOINT DISCOLORATION LAMINATE LEACHING HALO EFFECT TOMBSTONING DISCOLORED JOINT REFLOW CYCLE TOO LONG EXCESSIVE REFLOW TEMP EXCESSIVE HEATING RATE DEFECTIVE FIXTURE BOARD RERUN BOARD NOT SEATED RIGHT EARLY REMOVAL OF BOARD CONVEYOR ANGLE LOW CONVEYOR ANGLE HIGH CONVEYOR VIBRATION CONVEYOR SPEED LOW CONVEYOR SPEED HIGH PALLET TOO HOT NO FLUX BLOW-OFF FLUX BLOW-OFF EXCESSIVE FLUXER UNEVEN FLUX FOAMHEAD LOW FLUX NOT MAKING CONTACT FLUX NO LONGER ACTIVE FLUX SPECIFIC GRAVITY HIGH FLUX SPECIFIC GRAVITY LOW FLUX CONTAMINATED PREHEAT TEMP LOW PREHEAT TEMP HIGH EXCESSIVE SOLDER DROSS SOLDER CONTAMINATED SOLDER WAVE UNEVEN SOLDER WAVE HEIGHT LOW SOLDER WAVE HEIGHT HIGH SOLDER TEMP LOW SOLDER TEMP HIGH SOLDER PASTE OXIDATION SCREEN/STENCIL CLOGGED INSUFFICIENT SOLDER PASTE OXIDIZED SOLDER PASTE SOLDER PASTE VISCOCITY TOO LOW MISALIGNED COMPONENT EXCESS SOLDER
    [Show full text]
  • Assembly Instructions for Sca6x0 and Sca10x0 Series
    Technical Note 71 Assembly Instructions for SCA6x0 and SCA10x0 series TABLE OF CONTENTS Table of Contents .....................................................................................................................1 1 Objective ..............................................................................................................................2 2 VTI'S DIL-8 and DIL-12 packages.......................................................................................2 3 Package Outline and Dimensions......................................................................................2 4 Tape and reel specifications ..............................................................................................3 5 Printed Circuit Board (PCB) Level Guidelines..................................................................5 5.1 Recommended PCB pad layout................................................................................................5 5.2 Solder paste and Cleaning process .........................................................................................5 5.3 Stencil .........................................................................................................................................6 5.4 Paste printing.............................................................................................................................6 5.5 Component picking and placement .........................................................................................6 5.6 Reflow soldering........................................................................................................................6
    [Show full text]