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Effective Virtual CPU Configuration with QEMU and Libvirt
Effective Virtual CPU Configuration with QEMU and libvirt Kashyap Chamarthy <[email protected]> Open Source Summit Edinburgh, 2018 1 / 38 Timeline of recent CPU flaws, 2018 (a) Jan 03 • Spectre v1: Bounds Check Bypass Jan 03 • Spectre v2: Branch Target Injection Jan 03 • Meltdown: Rogue Data Cache Load May 21 • Spectre-NG: Speculative Store Bypass Jun 21 • TLBleed: Side-channel attack over shared TLBs 2 / 38 Timeline of recent CPU flaws, 2018 (b) Jun 29 • NetSpectre: Side-channel attack over local network Jul 10 • Spectre-NG: Bounds Check Bypass Store Aug 14 • L1TF: "L1 Terminal Fault" ... • ? 3 / 38 Related talks in the ‘References’ section Out of scope: Internals of various side-channel attacks How to exploit Meltdown & Spectre variants Details of performance implications What this talk is not about 4 / 38 Related talks in the ‘References’ section What this talk is not about Out of scope: Internals of various side-channel attacks How to exploit Meltdown & Spectre variants Details of performance implications 4 / 38 What this talk is not about Out of scope: Internals of various side-channel attacks How to exploit Meltdown & Spectre variants Details of performance implications Related talks in the ‘References’ section 4 / 38 OpenStack, et al. libguestfs Virt Driver (guestfish) libvirtd QMP QMP QEMU QEMU VM1 VM2 Custom Disk1 Disk2 Appliance ioctl() KVM-based virtualization components Linux with KVM 5 / 38 OpenStack, et al. libguestfs Virt Driver (guestfish) libvirtd QMP QMP Custom Appliance KVM-based virtualization components QEMU QEMU VM1 VM2 Disk1 Disk2 ioctl() Linux with KVM 5 / 38 OpenStack, et al. libguestfs Virt Driver (guestfish) Custom Appliance KVM-based virtualization components libvirtd QMP QMP QEMU QEMU VM1 VM2 Disk1 Disk2 ioctl() Linux with KVM 5 / 38 libguestfs (guestfish) Custom Appliance KVM-based virtualization components OpenStack, et al. -
Fujitsu Siemens Computers
SPEC CINT2006 Result spec Copyright 2006-2014 Standard Performance Evaluation Corporation Fujitsu Siemens Computers SPECint_rate2006 = 21.4 PRIMERGY TX150 S5, Intel Pentium D processor 945, 3.40 GHz SPECint_rate_base2006 = 20.5 CPU2006 license: 22 Test date: May-2007 Test sponsor: Fujitsu Siemens Computers Hardware Availability: Sep-2006 Tested by: Fujitsu Siemens Computers Software Availability: Mar-2007 Copies 0 2.00 4.00 6.00 8.00 10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 30.0 32.0 34.0 36.0 38.0 40.0 25.5 400.perlbench 2 2 24.1 17.8 401.bzip2 2 2 16.7 22.4 403.gcc 2 22.5 429.mcf 2 2 23.2 19.8 445.gobmk 2 2 18.7 19.5 456.hmmer 2 2 17.1 18.5 458.sjeng 2 2 17.4 19.4 462.libquantum 2 2 18.8 39.9 464.h264ref 2 2 38.3 16.7 471.omnetpp 2 2 15.7 15.5 473.astar 2 2 14.9 28.2 483.xalancbmk 2 SPECint_rate_base2006 = 20.5 SPECint_rate2006 = 21.4 Hardware Software CPU Name: Intel Pentium D 945 Operating System: 64-Bit SUSE LINUX Enterprise Server 10, Kernel CPU Characteristics: 800 MHz system bus 2.6.16.21-0.8-smp on an x86_64 CPU MHz: 3400 Compiler: Intel C++ Compiler for IA32/EM64T application, Version 9.1 - Build 20070215, Package-ID: FPU: Integrated l_cc_p_9.1.047 CPU(s) enabled: 2 cores, 1 chip, 2 cores/chip Auto Parallel: No CPU(s) orderable: 1 chip File System: ReiserFS Primary Cache: 12 K micro-ops I + 16 KB D on chip per core System State: Multiuser, Runlevel 3 Secondary Cache: 2 MB I+D on chip per core Base Pointers: 32-bit L3 Cache: None Peak Pointers: 32/64-bit Other Cache: None Other Software: Smart Heap Library, Version -
Thermal Interface Material Comparison: Thermal Pads Vs
Thermal Interface Material Comparison: Thermal Pads vs. Thermal Grease Publication # 26951 Revision: 3.00 Issue Date: April 2004 © 2004 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel, or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Trademarks AMD, the AMD Arrow logo, AMD Athlon, AMD Duron, AMD Opteron and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. -
Dual-Core Intel® Xeon® Processor 3100 Series Specification Update
Dual-Core Intel® Xeon® Processor 3100 Series Specification Update — on 45 nm Process in the 775-land LGA Package December 2010 Notice: Dual-Core Intel® Xeon® Processor 3100 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this Specification Update. Document Number: 319006-009 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. -
2021 User Guide
i Pro Fortran Linux Absoft Pro Fortran User Guide Absoft Fortran Linux Fortran User Guide 5119 Highland Road, PMB 398 Waterford, MI 48327 U.S.A. Tel (248) 220-1190 Fax (248) 220-1194 [email protected] All rights reserved. No part of this publication may be reproduced or used in any form by any means, without the prior written permission of Absoft Corporation. THE INFORMATION CONTAINED IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE AND RELIABLE. HOWEVER, ABSOFT CORPORATION MAKES NO REPRESENTATION OF WARRANTIES WITH RESPECT TO THE PROGRAM MATERIAL DESCRIBED HEREIN AND SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. FURTHER, ABSOFT RESERVES THE RIGHT TO REVISE THE PROGRAM MATERIAL AND MAKE CHANGES THEREIN FROM TIME TO TIME WITHOUT OBLIGATION TO NOTIFY THE PURCHASER OF THE REVISION OR CHANGES. IN NO EVENT SHALL ABSOFT BE LIABLE FOR ANY INCIDENTAL, INDIRECT, SPECIAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE PURCHASER'S USE OF THE PROGRAM MATERIAL. U.S. GOVERNMENT RESTRICTED RIGHTS — The software and documentation are provided with RESTRICTED RIGHTS. Use, duplication, or disclosure by the Government is subject to restrictions set forth in subparagraph (c) (1) (ii) of the Rights in Technical Data and Computer Software clause at 252.227-7013. The contractor is Absoft Corporation, 2111 Cass Lake Rd. Ste 102, Keego Harbor, Michigan 48320. ABSOFT CORPORATION AND ITS LICENSOR(S) MAKE NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, REGARDING THE SOFTWARE. ABSOFT AND ITS LICENSOR(S) DO NOT WARRANT, GUARANTEE OR MAKE ANY REPRESENTATIONS REGARDING THE USE OR THE RESULTS OF THE USE OF THE SOFTWARE IN TERMS OF ITS CORRECTNESS, ACCURACY, RELIABILITY, CURRENTNESS, OR OTHERWISE. -
Microcode Revision Guidance August 31, 2019 MCU Recommendations
microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. -
Single Board Computer
Single Board Computer SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) SBC-C66 and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs High-performing, flexible solution for intelligence at the edge HIGHLIGHTS CONNECTIVITY CPU 2x USB 3.1; 4x USB 2.0; NVMe SSD Slot; PCI-e x8 Intel® 8th gen. Core™ / Xeon® and 9th gen. Core™ / port (PCI-e x16 mechanical slot); VPU High Speed Xeon® / Pentium® / Celeron® CPUs Connector with 4xUSB3.1 + 2x PCI-ex4 GRAPHICS MEMORY Intel® UHD Graphics 630/P630 architecture, up to 128GB DDR4 memory on 4x SO-DIMM Slots supports up to 3 independent displays (ECC supported) Available in Industrial Temperature Range MAIN FIELDS OF APPLICATION Biomedical/ Gaming Industrial Industrial Surveillance Medical devices Automation and Internet of Control Things FEATURES ® ™ ® Intel 8th generation Core /Xeon (formerly Coffee Lake H) CPUs: Max Cores 6 • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Max Thread 12 HyperThreading • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Intel® QM370, HM370 or CM246 Platform Controller Hub Chipset Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), (PCH) with HyperThreading • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB 2x DDR4-2666 or 4x DDR4-2444 ECC SODIMM Slots, up to 128GB total (only with 4 SODIMM modules). Cache, 45W TDP (35W cTDP) Memory ® ™ ® ® ECC DDR4 memory modules supported only with Xeon Core Information subject to change. Please visit www.seco.com to find the latest version of this datasheet Information subject to change. -
"PCOM-B216VG-ECC.Pdf" (581 Kib)
Intel® Arrandale processor based Type II COM Express module support ECC DDR3 SDRAM PCOM-B216VG-ECC with Gigabit Ethernet 204pin ECC DDR3 SODIMM socket ® Intel QM57 ® Intel Arrandale processor FEATURES GENERAL CPU & Package: Intel® 45nm Arrandale Core i7/i5/i3 or Celeron P4505 ® Processor The Intel Arrandale and QM57 platform processor up to 2.66 GHz with 4MB Cache in FC-BGA package with turbo boost technology to maximize DMI x4 Link: 4.8GT/s (Full-Duplex) CPU & Graphic performance Chipset/Core Logic Intel® QM57 ® Intel Arrandale platform support variously System Memory Up to 8GB ECC DDR3 800/1066 SDRAM on two SODIMM sockets powerful processor from ultra low power AMI BIOS to mainstream performance type BIOS Storage Devices SATA: Support four SATA 300 and one IDE Supports Intel® intelligent power sharing Expansion Interface VGA and LVDS technology to reduce TDP (Thermal Six PCI Express x1 Design Power) LPC & SPI Interface High definition audio interface ® ® Enhance Intel vPro efficiency by Intel PCI 82577LM GbE PHY and AMT6.0 Hardware Monitoring CPU Voltage and Temperature technology Power Requirement TBA Support two ECC DDR3 800/1066 SDRAM on Dimension Dimension: 125(L) x 95(W) mm two SODIMM sockets, up to 8GB memory size Environment Operation Temperature: 0~60 °C Storage Temperature: -20~80 °C Operation Humidity: 5~90% I/O ORDERING GUIDE MIO N/A IrDA N/A PCOM-B216VG-ECC ® Standard Ethernet One Intel 82577LM Gigabit Ethernet PHY Intel® Arrandale processor based Type II COM Express module with ECC DDR3 SDRAM and Audio N/A Gigabit Ethernet USB Eight USB ports Keyboard & Mouse N/A CPU Intel® Core i7-610E SV (4M Cache, 2.53 GHz) Support List Intel® Core i7-620LE LV (4M Cache, 2.00 GHz) Intel® Core i7-620UE ULV (4M Cache, 1.06 GHz) Intel® Core i5-520E SV (3M Cache, 2.40 GHz) Intel® Celeron P4505 SV (2M Cache, 1.86 GHz) DISPLAY Graphic Controller Intel® Arrandale integrated Graphics Media Accelerator (Gen 5.75 with 12 execution units) * Specifications are subject to change without notice. -
AMD EPYC™ 7371 Processors Accelerating HPC Innovation
AMD EPYC™ 7371 Processors Solution Brief Accelerating HPC Innovation March, 2019 AMD EPYC 7371 processors (16 core, 3.1GHz): Exceptional Memory Bandwidth AMD EPYC server processors deliver 8 channels of memory with support for up The right choice for HPC to 2TB of memory per processor. Designed from the ground up for a new generation of solutions, AMD EPYC™ 7371 processors (16 core, 3.1GHz) implement a philosophy of Standards Based AMD is committed to industry standards, choice without compromise. The AMD EPYC 7371 processor delivers offering you a choice in x86 processors outstanding frequency for applications sensitive to per-core with design innovations that target the performance such as those licensed on a per-core basis. evolving needs of modern datacenters. No Compromise Product Line Compute requirements are increasing, datacenter space is not. AMD EPYC server processors offer up to 32 cores and a consistent feature set across all processor models. Power HPC Workloads Tackle HPC workloads with leading performance and expandability. AMD EPYC 7371 processors are an excellent option when license costs Accelerate your workloads with up to dominate the overall solution cost. In these scenarios the performance- 33% more PCI Express® Gen 3 lanes. per-dollar of the overall solution is usually best with a CPU that can Optimize Productivity provide excellent per-core performance. Increase productivity with tools, resources, and communities to help you “code faster, faster code.” Boost AMD EPYC processors’ innovative architecture translates to tremendous application performance with Software performance. More importantly, the performance you’re paying for can Optimization Guides and Performance be matched to the appropriate to the performance you need. -
Class-Action Lawsuit
Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 1 of 279 Steve D. Larson, OSB No. 863540 Email: [email protected] Jennifer S. Wagner, OSB No. 024470 Email: [email protected] STOLL STOLL BERNE LOKTING & SHLACHTER P.C. 209 SW Oak Street, Suite 500 Portland, Oregon 97204 Telephone: (503) 227-1600 Attorneys for Plaintiffs [Additional Counsel Listed on Signature Page.] UNITED STATES DISTRICT COURT DISTRICT OF OREGON PORTLAND DIVISION BLUE PEAK HOSTING, LLC, PAMELA Case No. GREEN, TITI RICAFORT, MARGARITE SIMPSON, and MICHAEL NELSON, on behalf of CLASS ACTION ALLEGATION themselves and all others similarly situated, COMPLAINT Plaintiffs, DEMAND FOR JURY TRIAL v. INTEL CORPORATION, a Delaware corporation, Defendant. CLASS ACTION ALLEGATION COMPLAINT Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 2 of 279 Plaintiffs Blue Peak Hosting, LLC, Pamela Green, Titi Ricafort, Margarite Sampson, and Michael Nelson, individually and on behalf of the members of the Class defined below, allege the following against Defendant Intel Corporation (“Intel” or “the Company”), based upon personal knowledge with respect to themselves and on information and belief derived from, among other things, the investigation of counsel and review of public documents as to all other matters. INTRODUCTION 1. Despite Intel’s intentional concealment of specific design choices that it long knew rendered its central processing units (“CPUs” or “processors”) unsecure, it was only in January 2018 that it was first revealed to the public that Intel’s CPUs have significant security vulnerabilities that gave unauthorized program instructions access to protected data. 2. A CPU is the “brain” in every computer and mobile device and processes all of the essential applications, including the handling of confidential information such as passwords and encryption keys. -
User's Manual User's Manual
User’s Manual (English Edition) Intel Pentium 4 Socket 478 CPU AMD Athlon/ Duron/Athlon XP Socket 462 CPU AMD Athlon 64 Socket 754 CPU ZM-WB2 Gold * Please read before installation http://www.zalman.co.kr http://www.zalmanusa.com 1. Features 1) Gold plated pure copper base maximizes cooling performance and prevents CPU blocks from galvanic corrosion 2) Intel Pentium 4 (Socket 478), AMD Athlon/Duron/Athlon XP (Socket 462),Athlon 64 (Socket 754) compatible design for broad compatibility. 3) Three types of compression fitting are offered for use with water tubes (8X10mm,8X11mm,10X13mm) * Zalman Tech. Co., Ltd. is not responsible for any damage resulting from CPU OVERCLOCKING. 2. Specifications Part No Part name Q’ ty Weight (g) Use 1 CPU block 1 447.0 CPU mountimg 2 Hand screw 2 8.0 Clip mountimg 3 Thermal grease 1 1.8 Apply to cpu core 4 Clip 1 9.6 CPU block mountimg 5 User’s manual 1 6 Clip supports 2 8.2 Socket 478 7 Clip supports A 2 5.0 Socket 462 8 Clip supports B 2 5.0 Socket 462 9 Bolts 4 0.8 Clip supports, A, B-type 10 Paper washer 1 set 7, 8 mountimg 11 Nipple 2 6.2 Socket 754 mountimg 12 Back plate 60.0 Socket 754 mountimg Fitting to 13 Fitting 3 set 8 x 10mm, 8 x 11mm, 10 x 13mm tubes NOTE 1) The maximum weight for the cooler is specified as 450g/450g/300g for socket 478/754/462 respectively. Special care should be taken when moving a computer equipped with a cooler which exceeds the relevant weight limit. -
System Management BIOS (SMBIOS) Reference 6 Specification
1 2 Document Number: DSP0134 3 Date: 2011-01-26 4 Version: 2.7.1 5 System Management BIOS (SMBIOS) Reference 6 Specification 7 Document Type: Specification 8 Document Status: DMTF Standard 9 Document Language: en-US 10 System Management BIOS (SMBIOS) Reference Specification DSP0134 11 Copyright Notice 12 Copyright © 2000, 2002, 2004–2011 Distributed Management Task Force, Inc. (DMTF). All rights 13 reserved. 14 DMTF is a not-for-profit association of industry members dedicated to promoting enterprise and systems 15 management and interoperability. Members and non-members may reproduce DMTF specifications and 16 documents, provided that correct attribution is given. As DMTF specifications may be revised from time to 17 time, the particular version and release date should always be noted. 18 Implementation of certain elements of this standard or proposed standard may be subject to third party 19 patent rights, including provisional patent rights (herein "patent rights"). DMTF makes no representations 20 to users of the standard as to the existence of such rights, and is not responsible to recognize, disclose, 21 or identify any or all such third party patent right, owners or claimants, nor for any incomplete or 22 inaccurate identification or disclosure of such rights, owners or claimants. DMTF shall have no liability to 23 any party, in any manner or circumstance, under any legal theory whatsoever, for failure to recognize, 24 disclose, or identify any such third party patent rights, or for such party’s reliance on the standard or 25 incorporation