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33Rd Edition 33rd Edition DIC : 2536 Glossary Strain point A temperature at which internal stress in glass is removed in several hours. Below this temperature thermal stress is not substantially generated, so this would be the standard temperature for heat resistance. Annealing point A temperature at which internal stress in glass is removed in several minutes. This would be the standard temperature for annealing. Transformation point A temperature at which the inclination of the thermal expansion curve suddenly changes. This corresponds to the transformation of glass from solid state to liquid state. Deformation point A temperature at which thermal expansion is not any more detected in the measurement because of softening of glass. It appears as a peak of the expansion curve. Softening point A temperature at which glass deforms noticeably by its own weight. There are two measurement methods, fiber elongation method and differential thermal analysis (DTA). The measurements from both methods do not coincide. Softening point for powder glass is usually measured with DTA. Working point A temperature at which viscosity of the glass is 104dPa・s. It is a standard temperature for glass forming such as tubing and pressing. Glass flowing point A temperature at which viscosity of the glass is 105dPa・s. Glass becomes soft enough to flow and spread. Sealing temperature/Firing temperature Processing temperature suitable for sealing or firing. Contents / Electronic Glass Materials 1. Glass Substrate/Cover Glass OA-10G / OA-11(Alkali-free Glass Substrate) ...................................2 Cover Glass Cover Glass Substrate/ G-Leaf TM (Ultra-thin Glass) ...............................................................4 Glass-ribbon ....................................................................................6 OA-31 (High Heat-resistant and Low Thermal Compaction Glass Substrate) .........8 HX-1 (High Refractive Index Glass Substrate) .................................9 DinorexTM (Glass for Chemical Strengthening) ..............................10 Neoceram N-0 (Glass-Ceramic Substrate) ....................................12 Soldered UV-C High-transmitting Glass Lid ..................................13 Reduction-Type Image Sensor Cover Glass ..................................14 Band Pass Filter .............................................................................15 Laser Diode Cover Glass ...............................................................16 IR Absorbing Filter .........................................................................17 2. Powder Glass/Glass Paste Glass Paste Glass/ Powder Low Temperature Sealing Glass 1 ................................................18 Low Temperature Sealing Glass 2 ................................................20 Granulated Glass for Metal Packages ............................................22 Passivation Glass ............................................................................24 Composite Powder for Low Temperature Cofired Ceramics ...............26 Powder Glass for Coating, Binding, and Sealing ..........................28 Tablet .............................................................................................29 Glass Paste ....................................................................................30 Glass Frit for Laser-Sealing of Ceramics Packages ......................32 Laser-sealing Technology Using Both Glass-ribbon and Glass Paste Optical Components Glass/Glass for Micro (Sealing Thin Material for Glass Substrates) ...................................34 3. Micro Glass/Glass for Optical Components Micro Rods (Gap Spacers for LCDs) .............................................36 Fine Sphere (Gap Spacers for LCDs).............................................38 Micro Beads (Lenses for LEDs) .......................................................39 Micro Ball (High Precision Ball Lens) .............................................40 Ball Lens Cap (Lens for Optical Devices) ......................................42 Ball Lens Unit (Lens for Low Cost Module) ..................................43 Micro Lens Array ...........................................................................44 Micro Prism ...................................................................................45 Micro Capillary (Optical Connectors & Splices) ...........................46 ............ Variously Shaped Micro Capillaries (Optical Connectors & Splices) 48 Glass Tube/Others Polygonal Capillary (Optical Connectors & Splices) ....................50 V-Groove Substrate .....................................................................51 Glass Ferrule BTF (Ferrule for Optical Connectors) .....................52 Glass-Ceramic Ferrule GCF/GCF-200S (Ferrule for Optical Connectors) ............53 VS Receptacle ...............................................................................54 FIX Stub /Long FIX ........................................................................55 Neoceram N-0 and N-11 (Coupler Housing for Optical Fiber) ..........56 4. Glass Tube/Others Glass Sleeves for Encapsulating Semiconductor (for Thermistors) ............................................................................58 High Infrared-Absorbing Glass Tubes (for Reed Switches) .............60 LamionTM (Ultra-thin Glass Laminated on Resin) ..........................62 Antibacterial Glass Powder ...........................................................64 Glass for Supporting Semiconductor Wafers ...............................65 Neoceram N-0 and N-11 (Carriers for Firing Electronic Parts and Jigs) .............................66 CERSAT (Negative Thermal Expansion Ceramic Substrate) ...........68 Negative CTE Filler ........................................................................69 TM (Zero CTE Glass) .............................................................70 LumiphousTM (Phosphor-Glass Composite) ................................71 Optical Isolator for High Power Lasers .......................................72 Alkali-free Glass Substrate Ref. No.1910-01E OA-10G/OA-11 Glass Substrate OA-10G and OA-11 are used as substrates for liquid crystal displays and OLED displays, as well as substrates for the formation of various thin films. OA-11 has particularly low deformation and deflection of gravity properties. The substrate is both very thin and highly useful. The high dimensional stability of this glass substrate allows it to withstand high temperature processes which makes it suitable for use in the LTPS and IGZO high-quality-next-generation displays. Features 1. Smooth surface Glass substrates formed using overflow technology exhibits flat precision surfaces. 2. Alkali-free With a maximum alkali oxide content of 0.1% each, these products do not degrade the thin-film characteristics of amorphous or polycrystalline silicon. 3. Thermal dimensional stability A high strain point and a low thermal expansion coefficient give OA-10G and OA-11 high thermal dimensional stability during TFT forming process and other heat treatment processes. 4. Chemically stable surface Inert to treating agents used in the semiconductor process and the TFT forming process, so surfaces retain pristine quality. 5. Environmentally friendly glass Environmentally friendly glass that does not contain environmentally hazardous substances, such as As and Sb. Properties Properties /Glass Code OA-10G OA-11 Density ×103kg/m3 2.46 2.52 Coefficient of thermal expansion 30-380°C ×10-7/K 38 37 Strain point °C 650 685 Young’s modulus GPa 73 78 Poisson’s ratio 0.2 0.2 Vickers hardness Hv 600 620 Volume resistivity Logρ 350°C Ω・cm 12.0 13.0 Dielectric constant 1MHz, RT 5.3 5.6 tan δ 1MHz, RT 0.001 0.001 Light transmittance λ=550nm % 92 92 Refractive index (nd) 587.6nm 1.52 1.53 10% HCl (80°C-60min) No visual change No visual change Chemical durability 63 BHF (20°C-3min) No visual change No visual change Alkali oxide content wt % 0.1 max. 0.1 max. As, Sb content wt % Less than 0.1 Less than 0.1 2 Glass Substrate Transmittance Dimensions (Thickness: 0.5 mm) (mm) (mm) 100 Length Thickness OA-10G L1 L2 t 80 Center Tolerance Center Tolerance Center Tolerance OA-10G OA-10G OA-11 370 ±OA-120.2 470 ±0.3 0.50 ±0.05OA-11 OA-11 （％） OA-12 60 550 ±0.35 650 ±0.4 0.40 ±0.04 730 ±0.5 920 ±0.6 0.30 ±0.03 40 110 0 ±0.7 1300 ±0.8 Can accommodate μ 1500 ±1.0 1850 ±1.2 requests down to 50 m. Transmittance (Please refer to the 20 1950 ±1.4 2250 ±1.6 OA-12next page.) 2200 ±1.6 2500 ±1.7 OA-11 0 Consult us for other dimensions. 200 400 600 800 Wavelength (nm) OA-10G Corner Cut Orientation Corner 1-C Chamfering Thermal Shrinkage 3-C 1 2 D (Heat treatment: 1 hour) 0 Center Tolerance Center Tolerance Simple Round Shape 1.5 ±1.0 4.0 ±1.0 0.05-0.55 Consult us for other shapes. OA-12 -50 L2 ） OA-11 OA-10G OA-11 R2 ppm OA-10G D （ -100 R1 L1 t Shrinkage -150 3-C -200 350 400 450 500 550 600 Surface Defects (Scratch, Dirt) Temperature（°C） None observed in surface inspection carried out using oblique illuminations as shown in the Flatness following table. Subjects Specifications Remarks Grade A Grade B Standard length 20mm Waviness 0.06μm max. (SEMI D15-1296) 10000 lx 1500 lx Surface Only on the pattern surface Ra: 0.2nm AFM Roughness Only on the pattern surface Processing Defects (Peripheral Chipping and Cracking) Size of Defects (mm) Maximum Number Allowed ＞ 1.0 None ≦ 1.0 Disregard There were no sign of chips nor cracks developing in the glass. Inspection conditions: Surface inspection at 1500 lux. 3 Ultra-thin Glass Ref. No.1910-02E G-Leaf TM Glass Substrate
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