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IEEE P802.15 Working Group for Wireless Personal Area Networks (Wpans)

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IEEE P802.15 Working Group for Wireless Personal Area Networks (Wpans) January, 2008 doc.: IEEE 802.15-08-0056-01-003c Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [SC-PHY MCS Updates of the baseline document] Date Submitted: [January 16, 2008] Source: [Hiroshi Harada,other contributors are listed in “Contributors” slides] Company [National Institute of Information and Communications Technology (NICT), and other contributors are listed in “Contributors” slides ] Address1[3-4 Hikari-no-oka, Yokosuka-shi, Kanagawa 239-0847, Japan] Voice 1:[+81-46-847-5074] , FAX1: [+81-46-847-5440] E-Mail:[[email protected], (other contributors are listed in “Contributors” slides)] Re: [] Abstract: [SC-PHY MCS Updates of the baseline document is shown.] Purpose: [To be considered in TG3C baseline document.] Notice: This document has been prepared to assist the IEEE P802.15. It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release: The contributors acknowledge and accept that this contribution becomes the property of IEEE and may be made publicly available by P802.15. Submission Slide 1 Various Authors January, 2008 doc.: IEEE 802.15-08-0056-01-003c Contributors (1/4) Name Affiliation E-mail Hiroshi Harada NICT [email protected] Ismail Lakkis Tensorcom Inc. [email protected] Yozo Shoji NICT [email protected] Fumihide Kojima NICT [email protected] Ryuhei Funada NICT [email protected] Ming Lei NICT [email protected] Yoshinori Nishiguchi NICT [email protected] Ryota Kimura NICT [email protected] Pyo Chang-Woo NICT [email protected] Zhou Lan NICT [email protected] Chin-Sean Sum NICT [email protected] Tuncer Baykas NICT [email protected] Junyi Wang NICT [email protected] Masahiro Umehira NICT [email protected] Shuzo Kato NICT [email protected] Akio Iso NICT [email protected] Hiroyo Ogawa NICT [email protected] Kazuaki Takahashi Matsushita Electric Ind. Co., Ltd. [email protected] Hiroyuki Nakase Tohoku University [email protected] Ichihiko Toyoda NTT Corp. [email protected] Ichirou Ida Fujitsu Limited [email protected] Yasuyuki Ooishi Fujitsu Limited [email protected] Tomohiro Seki NTT Corp. [email protected] Kaoru Yokoo Fujitsu Limited [email protected] Taisuke Matsumoto Matsushita Electric Ind. Co.,Ltd. [email protected] Raymond Yu Zhan Panasonic Singapore Laboratories [email protected] Michael Sim Panasonic Singapore Laboratories [email protected] Huang Lei Panasonic Singapore Laboratories [email protected] Submission Slide 2 Various Authors January, 2008 doc.: IEEE 802.15-08-0056-01-003c Contributors (2/4) Name Affiliation E-mail Yukimasa Nagai Mitsubishi Electric Corp. [email protected] Takahisa Yamauchi Mitsubishi Electric Corp. [email protected] Akinori Fujimura Mitsubishi Electric Corp. [email protected] Hideto Ikeda Oki Electric Industry Co., Ltd. [email protected] Tadahiko Maeda Oki Electric Industry Co., Ltd. [email protected] Kenichi Kawasaki Sony Corp. [email protected] Makoto Noda Sony Corp. [email protected] Hiroyuki Yamagishi Sony Corp. [email protected] Masashi Shinagawa Sony Corp. [email protected] Keitarou Kondou Sony Corp. [email protected] Masamune Takeda MASPRO DENKOH Corp. [email protected] Hiroyoshi Konishi MASPRO DENKOH Corp. [email protected] Shoichi Kitazawa ATR [email protected] Masazumi Ueba ATR [email protected] Amane Miura ATR [email protected] Kenichi Maruhashi NEC Corp. [email protected] Yoshitsugu Fujita KYOCERA Corp. [email protected] Hiroshi Uchimura KYOCERA Corp. [email protected] Makoto Ando Tokyo Institute of Technology [email protected] Jiro Hirokawa Tokyo Institute of Technology [email protected] Junichi Takada Tokyo Institute of Technology [email protected] Takuichi Hirano Tokyo Institute of Technology [email protected] Yoshio Aoki Eudyna Devices Inc [email protected] Kazufumi Igarashi Japan Radio Co., Ltd. [email protected] Tsukasa Yoneyama EMMEX, INC. [email protected] Yukihiro Shimakata TAIYO YUDEN Co., LTD. [email protected] Shoji Kuriki RICOH COMPANY, LTD. [email protected] Toyoo Tanaka Toyo System Engineering Co., Ltd. [email protected] Submission Slide 3 Various Authors January, 2008 doc.: IEEE 802.15-08-0056-01-003c Contributors (3/4) Name Affiliation E-mail Bruce Bosco Motorola, Inc. [email protected] Paul Gorday Motorola, Inc. [email protected] Tian-Wei Huang National Taiwan University [email protected] Ching-Kuang Tzuang National Taiwan University [email protected] Juinn-Horng Deng CSIST Co. [email protected] Yu-Min Chuang CSIST Co. [email protected] André Bourdoux IMEC [email protected] Jimmy Nsenga IMEC [email protected] Wim Van Thillo IMEC [email protected] Stefaan De Rore IMEC [email protected] Pascal Pagani France Telecom [email protected] Isabelle Siaud France Telecom [email protected] Wei Li France Telecom [email protected] Anne-Marie Ulmer-Moll France Telecom [email protected] Marie-Hélène Hamon France Telecom [email protected] Maxim Piz IHP [email protected] Eckhard Grass IHP [email protected] Klaus Tittelbach IHP [email protected] Frank Herzel IHP [email protected] Alberto Valdes Garcia IBM [email protected] Troy Beukema IBM [email protected] Yasunamo Katayama IBM [email protected] Brian Floyd IBM [email protected] Scott Reynolds IBM [email protected] Daiju Nakano IBM [email protected] AbbieMathew New LANs [email protected] Submission Slide 4 Various Authors January, 2008 doc.: IEEE 802.15-08-0056-01-003c Contributors (4/4) Name Affiliation E-mail Seongsoo Kim Samsung Electronics Co., [email protected] Edwin Kwon Samsung Electronics Co., Ltd. [email protected] Chiu Ngo Samsung Electronics Co., Ltd. [email protected] Huaning Niu Samsung Electronics Co., Ltd. [email protected] Jisung Oh Samsung Electronics Co., Ltd. [email protected] Sandra Qin Samsung Electronics Co., Ltd. [email protected] Huai-Rong Shao Samsung Electronics Co., Ltd. [email protected] Harkirat Singh Samsung Electronics Co., [email protected] Pengfei Xia Samsung Electronics Co., Ltd. [email protected] Su-Khiong Yong Samsung Electronics Co., [email protected] Dagnachew Birru Philips [email protected] Richard Chen Philips [email protected] Chun-Ting Chou Philips [email protected] Ciaran Connell Decawave [email protected] Seungsik Eom Korea University [email protected] Brian Gaffney Decawave [email protected] Jinkyeong Kim ETRI [email protected] Yongsun Kim ETRI [email protected] Kyeongpyo Kim ETRI [email protected] Hyoungjin Kwon ETRI [email protected] Young-Chai Ko Korea University [email protected] Joy Laskar GEDC [email protected] Wooyong Lee ETRI [email protected] Michael Mc Laughlin Decawave [email protected] Stephane Pinel GEDC [email protected] Alireza Seyedi Philips [email protected] Hong Zhai Philips [email protected] Arthur W. Astrin Astrin Radio Artisty [email protected] Jason Trachewsky Broadcom Corporation [email protected] Jeyhan Karaoguz Broadcom Corporation [email protected] Christopher Hansen Broadcom Corporation [email protected] Submission Slide 5 Various Authors January, 2008 doc.: IEEE 802.15-08-0056-01-003c SC-PHY MCS Updates of the baseline document Jan. 16, 2008 Submission Slide 6 Various Authors January, 2008 doc.: IEEE 802.15-08-0056-01-003c Summary • The number of Single Carrier (SC) Modulation and Coding Schemes (MCSs) is reduced from 40 in total to 10+2 based on many comments received: the number of MCSs is too high and a down-selection is necessary Submission Slide 7 Various Authors January, 2008 doc.: IEEE 802.15-08-0056-01-003c Why the number of MCS has to be reduced • The proposers have received many comments after Atlanta meeting: the number of MCSs is too high • The proposers took the comments seriously and have reduced the number of MCS Submission Slide 8 Various Authors January, 2008 doc.: IEEE 802.15-08-0056-01-003c Reasons for smaller number of MCS • Minimalist implementation preference of silicon implementers 1) To keep the architecture simple. 2) To reduce pre-tape-out design verification time. 3) To reduce the probability that chips must be re-spun to correct DV failures. 4) To reduce silicon bring-up time. 5) To reduce software driver complexity and development time. • Elimination of similar BER/PER performance MCSs for reducing difficulties in implementation selection • Reduction of market confusion Submission Slide 9 Various Authors January, 2008 doc.: IEEE 802.15-08-0056-01-003c MCS confirmed in Atlanta meeting • 40 MCSs – CR (Common rate: 50.6 Mbps) – MLR(Mandatory low rate: 1518.4 Mbps) – 17 LR (Low rate: up to 2 Gbps) including CR and MLR – 4 MR (Medium rate: from 2Gbps to 3 Gbps) – 15 HR (High rate: over 3Gbps) – 4 SC OOK • 8 different modulation schemes – π/2 BPSK, π/2 QPSK, Dual Rail Bipolar(DRB), π/2 star 8QAM, π/2- NSQAM, π/2 8PSK, π/2 16QAM, OOK • 7 different coding schemes –
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