Maskinvare Og Arkitektur
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Quickspecs Pacstation Plus
QuickSpecs PACStation Plus Overview 1. Power Button Array 4. Rear access Panel 2. Internal System Cooling 5. Side access Panel. Support Access only. 3. USB Port with QUAD Access. PACStation Plus — FL – Worldwide — Version 7 — January 1, 2017 Page 1 QuickSpecs PACStation Plus Overview 6. Internal CPU PODS 7. Front Grill and faceplate 8. Video Interface Module 9. External Video System Controller 10. Video Workflow Manager 11. Primary Cable Harness 12. Internal Voltage Regulator 13. USB Transfer Ports 14. External Video Array (See Placement on page 10 for installation process) 15. Network Management Module 16. Screen Management Controller Hot plug. PACStation Plus — FL – Worldwide — Version 7 — January 1, 2017 Page 2 QuickSpecs PACStation Plus Overview Overview Form Factor Tower Operating Systems Preinstalled: Windows 10 Pro 64-bit Windows 10 Pro 64 to Windows 7 Professional 64-bit \Windows 7 Professional 64-bit Windows 8.1 Pro 64-bit OS Supported: Windows 8/8.1 Enterprise 64-bit Windows 7 Enterprise 64-bit Windows 10 Pro 64-bit Windows 10 Pro 64 to Windows 7 Professional 64-bit Available Processors QPI Featuring Intel® Turbo Clock Memory Hyper Name Cores Cache (MB) Speed Intel® vProTM Boost TDP (W) Speed Speed (MT/s) Threading (GT/s) Technology Technology1 (GHz) Intel Core TM i3-5010U 2.1 GHz 2 3 1600 NO YES NO YES 65 Intel Core TM i5-5300U 2.3-2.9 GHz 2 3 1600 NO YES YES YES 65 Intel Core TM i7-5557U 3.1-3.4 GHz 2 4 1600 NO YES YES YES 65 The specifications shown in this column represent the following: (all core maximum turbo steps, one core maximum turbo steps). -
Storage Administration Guide Storage Administration Guide SUSE Linux Enterprise Server 12 SP4
SUSE Linux Enterprise Server 12 SP4 Storage Administration Guide Storage Administration Guide SUSE Linux Enterprise Server 12 SP4 Provides information about how to manage storage devices on a SUSE Linux Enterprise Server. Publication Date: September 24, 2021 SUSE LLC 1800 South Novell Place Provo, UT 84606 USA https://documentation.suse.com Copyright © 2006– 2021 SUSE LLC and contributors. All rights reserved. Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or (at your option) version 1.3; with the Invariant Section being this copyright notice and license. A copy of the license version 1.2 is included in the section entitled “GNU Free Documentation License”. For SUSE trademarks, see https://www.suse.com/company/legal/ . All other third-party trademarks are the property of their respective owners. Trademark symbols (®, ™ etc.) denote trademarks of SUSE and its aliates. Asterisks (*) denote third-party trademarks. All information found in this book has been compiled with utmost attention to detail. However, this does not guarantee complete accuracy. Neither SUSE LLC, its aliates, the authors nor the translators shall be held liable for possible errors or the consequences thereof. Contents About This Guide xii 1 Available Documentation xii 2 Giving Feedback xiv 3 Documentation Conventions xiv 4 Product Life Cycle and Support xvi Support Statement for SUSE Linux Enterprise Server xvii • Technology Previews xviii I FILE SYSTEMS AND MOUNTING 1 1 Overview -
For Immediate Release
an ellisys company FOR IMMEDIATE RELEASE SerialTek Contact: Simon Thomas, Director, Sales and Marketing Phone: +1-720-204-2140 Email: [email protected] SerialTek Debuts PCIe x16 Gen5 Protocol Analysis System and Web Application New Kodiak™ Platform Brings SerialTek Advantages to More Computing and Data Storage Markets Longmont, CO, USA — February 24, 2021 — SerialTek, a leading provider of protocol test solutions for PCI Express®, NVM Express®, Serial Attached SCSI, and Serial ATA, today introduced an advancement in the PCIe® test and analysis market with the release of the Kodiak PCIe x16 Gen5 Analysis System, as well as the industry’s first calibration-free PCIe x16 add-in-card (AIC) interposer and a new web-based BusXpert™ user interface to manage and analyze traces more efficiently than ever. The addition of PCIe x16 Gen5 to the Kodiak analyzer and SI-Fi™ interposer family brings previously unavailable analysis capabilities and efficiencies to computing, datacenter, networking, storage, AI, and other PCIe x16 Gen5 applications. With SerialTek’s proven calibration-free SI-Fi interposer technology, the Kodiak’s innovative state-of-the-art design, and the new BusXpert analyzer software, users can more easily set up the analyzer hardware, more accurately probe PCIe signals, and more efficiently analyze traces. Kodiak PCIe x16 Gen5 Analysis System At the core of the Kodiak PCIe x16 analyzer is an embedded hardware architecture that delivers substantial and unparalleled advancements in capture, search, and processing acceleration. Interface responsiveness is markedly advanced, searches involving massive amounts of data are fast, and hardware filtering is flexible and powerful. “Once installed in a customer test environment the Kodiak’s features and benefits are immediately obvious,” said Paul Mutschler, CEO of SerialTek. -
Dell EMC Poweredge T340 Technical Guide
Dell EMC PowerEdge T340 Technical Guide Regulatory Model: E60S Regulatory Type: E60S001 Dec. 2020 Rev. A07 Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2018 - 2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. 1 Product Overview Topics: • Introduction • New technologies Introduction The Dell EMC PowerEdge T340 is the reliable, easy to manage, and scalable 1-socket tower server for growing businesses and remote offices/ branch offices. New technologies The PowerEdge T340 equipped with Intel® Xeon® E-2100 and E-2200 product family processors support to help run applications faster and support for full-feature remote management (iDRAC9). The T340 is versatile enough to address many customer segments and workloads. Target workloads include ● Small and medium businesses and organizations: Collaboration/sharing productivity applications, databases, web serving, backup/recovery, and mail and messaging. ● ROBO: Applications and workloads specific to the particular industry, e.g. Retail, Healthcare, Finance, Education, etc. The following table shows the list of new technologies offered by the PowerEdge T340: New Technologies Detailed Descriptions Intel® C246 series chipset Please refer to the chipset section for details. Intel® Xeon® processor E- 2100 and E-2200 Product The Intel® processor that works with Intel® C246 series Family chipset. -
NVM Express Over Fabrics
NVM Express Over Fabrics Dave Minturn, Intel Corp. OFADevWorkshop NVMe in Fabric Environments • A primary use case for NVMe PCIe SSDs is in an all flash appliance • Hundreds or more SSDs may be attached – too many for PCIe based attach scale-out • Concern: Today remote SSD scale-out over a fabric attach uses SCSI based protocols: Requiring protocol translation Desire best performance and latency from NVMe SSD investment over fabrics like Ethernet with RDMA (iWARP,RoCE), InfiniBand™, and Intel® Omni-Path Architecture Realizing Benefit of Next Gen NVM over Fabrics • PCIe NVMe SSD latency may be < 10 µs with Next Generation NVM • Using a SCSI-based protocol for remote NVMe access ads over 100 µs* in latency • Usage models require efficient write mirroring of PCIe Next Gen NVMe SSDs over fabrics *Source: Intel measurements. Concern: Low latency of Next Gen NVM lost in (SCSI) translation. Why NVMe over Fabrics? Simplicity, Efficiency and End-to-End NVMe Model • Simplicity of protocol enables hardware automated I/O Queues – NVMe transport bridge • No translation to or from another protocol like SCSI (in firmware/software) • Inherent parallelism of NVMe multiple I/O Queues is exposed to the host • NVMe commands and structures are transferred end-to-end • Maintains the NVMe architecture across a range of fabric types • Maintains architecture and software consistency between fabric types by standardizing a common abstraction and encapsulation definition Performance Goal: Make remote NVMe access over fabrics equivalent to local PCIe attached NVMe, -
Delock External Enclosure for M.2 Nvme Pcie SSD with Superspeed USB 20 Gbps (USB 3.2 Gen 2X2) USB Type-C™ Female
Delock External Enclosure for M.2 NVMe PCIe SSD with SuperSpeed USB 20 Gbps (USB 3.2 Gen 2x2) USB Type-C™ female Description This enclosure by Delock enables the installation of anM.2 PCIe NVMe SSD in 2280 format, it can be connected via USB to the PC or laptop. Therobust metal housing with cooling fins ensures an optimum temperature of the memory. SuperSpeed USB 20 Gbps The enclosure allows a data transfer rate of 20 Gbps on the USB-C™ port. Specification Item no. 42000 • Connectors: EAN: 4043619420001 external: 1 x SuperSpeed USB 20 Gbps (USB 3.2 Gen 2x2) USB Type-C™ female internal: 1 x 67 pin M.2 key M slot Country of origin: China • Chipset: Asmedia ASM2364 • Supports M.2 modules in format 2280 with key M or key B+M based on PCIe (NVMe) Package: • Retail Box • Maximum height of the components on the module: 1.5 mm, application of double- sided assembled modules supported • Supports NVM Express (NVMe) • Data transfer rate up to 20 Gbps • LED indicator for power and access • Metal housing • Dimensions (LxWxH): ca. 99 x 50 x 18 mm • Hot Plug, Plug & Play System requirements • Android 9.0 or above • Chrome OS 78.0 or above • Linux Kernel 4.6 or above • Mac OS 10.15.3 or above • Windows 8.1/8.1-64/10/10-64 • PC or laptop with a free USB Type-C™ port • PC or laptop with a free Thunderbolt™ 3 port Package content • External enclosure M.2 • Mounting material • 1 x thermal conductive pad • Screwdriver • Cable USB-C™ male to USB-C™ male, length ca. -
Broadwell Skylake Next Gen* NEW Intel NEW Intel NEW Intel Microarchitecture Microarchitecture Microarchitecture
15 лет доступности IOTG is extending the product availability for IOTG roadmap products from a minimum of 7 years to a minimum of 15 years when both processor and chipset are on 22nm and newer process technologies. - Xeon Scalable (w/ chipsets) - E3-12xx/15xx v5 and later (w/ chipsets) - 6th gen Core and later (w/ chipsets) - Bay Trail (E3800) and later products (Braswell, N3xxx) - Atom C2xxx (Rangeley) and later - Не включает в себя Xeon-D (7 лет) и E5-26xx v4 (7 лет) 2 IOTG Product Availability Life-Cycle 15 year product availability will start with the following products: Product Discontinuance • Intel® Xeon® Processor Scalable Family codenamed Skylake-SP and later with associated chipsets Notification (PDN)† • Intel® Xeon® E3-12xx/15xx v5 series (Skylake) and later with associated chipsets • 6th Gen Intel® Core™ processor family (Skylake) and later (includes Intel® Pentium® and Celeron® processors) with PDNs will typically be issued no later associated chipsets than 13.5 years after component • Intel Pentium processor N3700 (Braswell) and later and Intel Celeron processors N3xxx (Braswell) and J1900/N2xxx family introduction date. PDNs are (Bay Trail) and later published at https://qdms.intel.com/ • Intel® Atom® processor C2xxx (Rangeley) and E3800 family (Bay Trail) and late Last 7 year product availability Time Last Last Order Ship Last 15 year product availability Time Last Last Order Ship L-1 L L+1 L+2 L+3 L+4 L+5 L+6 L+7 L+8 L+9 L+10 L+11 L+12 L+13 L+14 L+15 Years Introduction of component family † Intel may support this extended manufacturing using reasonably Last Time Order/Ship Periods Component family introduction dates are feasible means deemed by Intel to be appropriate. -
EMC’S Perspective: a Look Forward
The Performance Impact of NVM Express and NVM Express over Fabrics PRESENTATION TITLE GOES HERE Live: November 13, 2014 Presented by experts from Cisco, EMC and Intel Webcast Presenters J Metz, R&D Engineer for the Office of the CTO, Cisco Amber Huffman, Senior Principal Engineer, Intel Steve Sardella , Distinguished Engineer, EMC Dave Minturn, Storage Architect, Intel SNIA Legal Notice The material contained in this tutorial is copyrighted by the SNIA unless otherwise noted. Member companies and individual members may use this material in presentations and literature under the following conditions: Any slide or slides used must be reproduced in their entirety without modification The SNIA must be acknowledged as the source of any material used in the body of any document containing material from these presentations. This presentation is a project of the SNIA Education Committee. Neither the author nor the presenter is an attorney and nothing in this presentation is intended to be, or should be construed as legal advice or an opinion of counsel. If you need legal advice or a legal opinion please contact your attorney. The information presented herein represents the author's personal opinion and current understanding of the relevant issues involved. The author, the presenter, and the SNIA do not assume any responsibility or liability for damages arising out of any reliance on or use of this information. NO WARRANTIES, EXPRESS OR IMPLIED. USE AT YOUR OWN RISK. 3 What This Presentation Is A discussion of a new way of talking to Non-Volatile -
Intel® E7501 Chipset for Embedded Computing
Product Brief Intel® E7501 Chipset for Embedded Computing Product Overview The Intel® E7501 chipset represents the next step in high-performance chipset technology, supporting single- and dual-processor platforms optimized for the Intel® Xeon™ processor and Low Voltage Intel® Xeon™ processor. It also supports uni-processor platforms optimized for the Intel® Pentium® M processor. The design delivers maximized system bus, memory, and I/O bandwidth to enhance performance, scalability, and end-user productivity while providing a smooth transition to next-generation technologies. Features that Maximize Performance of an Intel® E7501 Chipset-based Platform I Dual Intel Xeon processors and a 400/533 MHz I Single or dual DDR266 memory channels system bus provide up to 4.3 GB/s of available provide up to 4.3 GB/s of memory bandwidth bandwidth I Three hub interface 2.0 connections provide Intel in I Intel Pentium M processors and a 400 MHz multiple high-bandwidth I/O configuration Communications system bus provide up to 3.2 GB/s of available options, yielding up to 3.2 GB/s of I/O bandwidth bandwidth Features Benefits Supports one or two Intel® Xeon™ processors I Intel® NetBurst™ microarchitecture and the Hyper-Threading Technology of or Low Voltage Intel® Xeon™ processors the Intel Xeon processor combine to deliver world-class performance. Supports one Intel® Pentium® M processor I New microarchitecture supports low power and high performance. 400/533 MHz system bus capability I Up to 4.3 GB/s system bus bandwidth for increased memory and I/O throughput. Intel hub architecture 2.0 connection I Point-to-point connection between the MCH and up to three P64H2 hub to the Memory Controller Hub (MCH) devices provides up to 3.2 GB/s of bandwidth. -
Delock External USB Type-C™ Combo Enclosure for M.2 Nvme Pcie Or SATA SSD - Tool Free
Delock External USB Type-C™ Combo Enclosure for M.2 NVMe PCIe or SATA SSD - tool free Description This enclosure by Delock enables the installation of anM.2 PCIe NVMe SSD or SATA M.2 SSD in 2280, 2260, 2242 and 2230 format. It can be connected directly via USB-C™ plug to the PC or laptop. Combo enclosure The big advantage of this Delock M.2 enclosure is that both SATA and PCIe (NVMe) M.2 SSDs can be inserted into the enclosure. The memory isautomatically recognized by the chipset and can then be used. SSD installation without tools The special feature of this enclosure is that no tools are required to install the M.2 SSD. The lid is pushed backwards and the SSD is plugged into the slot, the SSD will be attached to the PCB with a rubber nipple and then the lid is reattached until it locks. Specification Item no. 42635 • Connectors: EAN: 4043619426355 external: 1 x SuperSpeed USB 10 Gbps (USB 3.2 Gen 2) USB Type-C™ male internal: 1 x 67 pin M.2 key M slot Country of origin: China • Chipset: Realtek RTL9210B • Supports M.2 modules in format 2280, 2260, 2242 and 2230 with key M or key B+M Package: • Retail Box based on SATA or PCIe (NVMe) • Maximum height of the components on the module: 1.5 mm, application of double- sided assembled modules supported • Supports NVM Express (NVMe) • Bootable • Supports UASP • Data transfer rate up to 10 Gbps • LED indicator for power and access • Lanyard strip for cap • Dimensions (LxWxH): ca. -
General Nvme FAQ
General NVMe FAQ 1. What is NVMe? NVMe, more formally NVM Express, is an interface specification optimized for PCI Express based solid state drives. The interface is defined in a scalable fashion such that it can support the needs of Enterprise and Client in a flexible way. 2. Is NVMe an industry standard? NVM Express has been developed by an industry consortium, the NVM Express Workgroup. Version 1.0 of the interface specification was released on March 1, 2011. Over 80 companies participated in the definition of the interface. 3. What is the legal framework of the NVM Express organization? The legal framework is structured as a Special Interest Group (SIG). To join a company executes a Contributor/Adopter agreement. There are 11 member companies who have board seats and provide overall governance. The Governing board is called the NVM Express Promoters Group. There are seven permanent seats and six seats filled by annual elections. Contributor companies are all free to participate in regularly scheduled workinG sessions that develop the interface. All Contributors have equal input into the development of the specification. 4. Who are the companies that form the NVM Express Promoters Group? The Promoters Group is composed of 13 companies, Cisco, Dell, EMC, IDT, Intel, Marvell, Micron, NetApp, Oracle, Samsung, SanDisk, SandForce (now LSI) and STEC. Two elected seats are currently unfilled. 5. Who are the permanent board members? Cisco, Dell, EMC, IDT, Intel, NetApp, and Oracle hold the seven permanent board seats. 6. How is the specification developed? Can anyone contribute? The specification is developed by the NVM Express Working Group. -
SATA Express
1-512-256-0197 www.mindshare.com [email protected] SATA Express Let MindShare Bring “SATA Express” to Life for You MindShare brings the SATA Express course to life through its interactive classroom style and demonstrations. SATA Express bus interface supports both Serial ATA (SATA) and PCI Express (PCIe) storage devices, initially standardized in the SATA 3.2 specification. The SATA Express connector used on the host side is backward compatible with the standard SATA data connector. It also provides multiple PCI Express lanes as a pure PCI Express connection to the storage device. Three options are available for connection of storage devices, 1) Legacy SATA, 2) SATA Express using AHCI, 3) SATA Express using NVMe. This course assumes the student is familiar with both SATA and PCI Express protocol. The course focuses on connector and cable architecture as well as M.2 Device architecture. The course then covers the architecture of both AHCI and NVMe host controllers associated with SATA and PCIe connected storage devices. You Will Learn: • SATA Express connector and cable structure • M.2 devices and sockets/cards • Pertinent AHCI controller and commands • Pertinent NVMe controller and commands • Interrupt handling • Error handling • Power management Course Length: 2 Days Who Should Attend? Hardware designers, software developers, and system validation engineers will all benefit from this course. Both hardware and software requirements of a SATA Express subsystem are detailed and explained through numerous examples. Course Contents: