Module production activities in Dortmund
D. Dobos, C. Gößling, R. Klingenberg, M. Mass, S. Rajek University of Dortmund 20.02.04 – Pixel week Feb. 04 – Hybridization meeting
Daniel Dobos University of Dortmund Module production activities in Dortmund 20.02.04 1 Bare module probing in Dortmund
As already briefly presented at December pixel week eight FE-I1 bare modules have been tested at Dortmund
Bare module setup will be upgraded with new chip probe card to FE-I2/3 in about two weeks
Functionality of setup will be ensured after upgrade and receive of new TPLL & TPCC
Daniel Dobos University of Dortmund Module production activities in Dortmund 20.02.04 2 Dortmund module production
Five of these bare modules have been used to build modules in Dortmund
MCCs and Pigtails have been wirebonded at Bonn and the MCCs have been tested in Bonn
The MCCs have been retested in Dortmund and results cross-checked with results from Bonn -> no discrepancy found
FE wire bonds have been made at the GMA mbh company, Duisburg including pull tests -> mean of about 11 g
Visual inspections did not show any FE wire bonding problems FEs
Wire bonds of one MCC have been bended during production but this has been noticed before shipment to GMA -> modules will directly covered after gluing in future FEs &
Flex Flex
Daniel Dobos University of Dortmund Module production activities in Dortmund 20.02.04 3 module transportation
new transport box to transport up to ten modules to the bond company GMA, Duisburg
Daniel Dobos University of Dortmund Module production activities in Dortmund 20.02.04 4 module transportation
new transport box to transport up to ten modules to the bond company GMA, Duisburg
First transportation test:
Daniel Dobos University of Dortmund Module production activities in Dortmund 20.02.04 5 module transportation
new transport box to transport up to ten modules to the bond But we are still investigating other shipment methods: company GMA, Duisburg
First transportation test: Jonas
Captain
Modules
Daniel Dobos University of Dortmund Module production activities in Dortmund 20.02.04 6 Module testing and characterisation
Delay of one week caused by strangely working LVDS: MCC worked correctly up to about 2.0 V VDD, but all tests failed with voltages above 2.0 V; with moving the grounding connection to the flex readout card the MCC worked with higher VDDs but threshold scans showed very noisy s-curves by varying VDDA -> sensed Agilent was not able to compensate this and showed unreg. mode from time to time
All problems disappeared by changing the LVDS
A “work” type0 cable, made of xx wires, was helpful during diagnostics, because of its reduced voltage drop and mechanical stability
Initial digital and analogue scans have been made for all five modules and no degradation is visible compared to the bare module level
IV-Curves of two different modules have been measured concurrently with two self-made NTCHV cabels, routing NTC wires and HV to the module without flex readout card, but standard type0 cable. This allows to read out the NTC without risking to destroy the unpowered LVDS and multiplicity two IV curves measurements with 2 channel HV supply. HV ELCO connecto TPCC r “work” to type0 type0 cable cable
Daniel Dobos University of Dortmund Module production activities in Dortmund 20.02.04 7 Automatization
Since we have a non standard HV supply (2 Chan. ISEG) and an environmental chamber primitives have been written to make them usable in the TurboDAQ macro panel: Primitive to set the both HV supply channels
Primitive to load / save 2 chan. ISEG settings
Primitive to record an IV scan with 2 chan. ISEG
Primitive to set environmental chamber temperature and humidity
Primitive to load / save environmental chamber settings
Primitive to select the MCC Link
Primitive to initialize TPCC+TPLL, ResetTCC and reinitialize TPCC
Primitive to send email
-> possibility to create automatized & standardized module tests and characterizations -> possibility to run some tests / tunings over night -> by minimizing the necessary user interventions the operator can concentrate on analysis of data ->up to 2 FE-I1 or 3 FE-I2/3 entire module pre-burn-in test and characterizations per day should not be a problem
Daniel Dobos University of Dortmund Module production activities in Dortmund 20.02.04 8 Automatization
But the macros and all necessary user interventions have to be checked carefully (especially the hardware interventions), therefore some manual- / checklist- tables have been made. They ensure that all necessary hardware interventions have been done by the operator, all necessary scan parameters have been checked by the operator and the most important analysis steps have been done to decide if the automatized tests have been successful or have to be repeated
Daniel Dobos University of Dortmund Module production activities in Dortmund 20.02.04 9 Bare module probing - backup
eight FEI1 bare modules with thinned FEs (GDSI,USA) probed with new setup: no evidence for bumping problems caused by bending during flipping with maximal thinned FEs (about 160 μm)
Daniel Dobos University of Dortmund Module production activities in Dortmund 20.02.04 10