Texas Electronics Industry
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
OMAP2430 Applications Processor
TM Technology for Innovators OMAP2430 applications processor All-in-One Key features entertainment • Advanced Imaging, Video and Audio Accelerator (IVA™ 2) boosts video for 3G mobile performance in mobile phones by up to 4X and imaging performance by up to 1.5X phones • Delivering a multimedia experience with consumer electronics quality to the handset • Multi-engine parallel processing architecture for supporting complex usage scenarios • Built-in M-Shield™ mobile security technology enables value-added services and terminal security • Support for all major High Level Operating Systems (HLOS) aids applications development PRODUCT BULLETIN Leading imaging The new OMAP2430 processor from Texas Instruments (TI) delivers a new and video level of multimedia performance to third-generation (3G) mobile phones and performance other handheld systems. Leveraging TI’s proven OMAP™ 2 architecture, the OMAP2430 features an advanced imaging, video and audio accelerator (IVA™ 2) that provides a 4X improvement in video processing and 1.5X improvement in image processing over previously available solutions for mobile phones. The processor’s high video performance enables advanced codec algorithms that promote higher compression ratios allowing networks to support more data, bringing down costs for service providers and allowing them to deploy revenue- generating services such as mobile digital TV and mobile-to-mobile gaming. Support for these services, plus high-resolution, high-speed decode of standard video compression algorithms, brings a TV-like viewing quality and the familiar features of consumer electronics to mobile communications. The OMAP2430 is optimized for the complex applications characteristic of 3G wireless communications. Offering even higher performance than first-generation OMAP 2 processors while at a lower cost, the OMAP2430 processor provides the ultimate balance between multimedia performance, flexibility, power and cost. -
Quantum Imaging for Semiconductor Industry
Quantum Imaging for Semiconductor Industry Anna V. Paterova1,*, Hongzhi Yang1, Zi S. D. Toa1, Leonid A. Krivitsky1, ** 1Institute of Materials Research and Engineering, Agency for Science Technology and Research (A*STAR), 138634 Singapore *[email protected] **[email protected] Abstract Infrared (IR) imaging is one of the significant tools for the quality control measurements of fabricated samples. Standard IR imaging techniques use direct measurements, where light sources and detectors operate at IR range. Due to the limited choices of IR light sources or detectors, challenges in reaching specific IR wavelengths may arise. In our work, we perform indirect IR microscopy based on the quantum imaging technique. This method allows us to probe the sample with IR light, while the detection is shifted into the visible or near-IR range. Thus, we demonstrate IR quantum imaging of the silicon chips at different magnifications, wherein a sample is probed at 1550 nm wavelength, but the detection is performed at 810 nm. We also analyze the possible measurement conditions of the technique and estimate the time needed to perform quality control checks of samples. Infrared (IR) metrology plays a significant role in areas ranging from biological imaging1-5 to materials characterisation6 and microelectronics7. For example, the semiconductor industry utilizes IR radiation for non-destructive microscopy of silicon-based devices. However, IR optical components, such as synchrotrons8, quantum cascade lasers, and HgCdTe (also known as MCT) photodetectors, are expensive. Some of these components, in order to maximize the signal-to-noise ratio, may require cryogenic cooling, which further increases costs over the operational lifetime. -
OBS Transforming CX
Winning the Global Consumer Electronics Industry A checklist for global, consistent and secure CX "The Age of Experience will be defined by personalized technology that meets your needs… the devices you use will understand you as an individual, blurring the boundaries between the digital and physical worlds." HS KIM President and CEO of Consumer Electronics Division Samsung Electronics Smartphones, smart TVs, laptops and tablets, The global electrical appliances, wearable devices – the US$1 trillion consumer electronics industry permeates every aspect consumer of our lives. It is a proof of the incredible pace of Global consumer electronics innovation around us. electronics market The intense competition especially from many of the size in 2019 industry industry’s Asian leaders such as Samsung, Huawei, Sony, Xiaomi and LG, renders differentiation around product and pricing difficult. COVID-19 has accelerated competition as consumer behaviours shift from purchasing and in-person browsing to their digital equivalents. Companies are looking to create unique personalized Key trends: experiences that optimize every stage of the customer journey across each interaction, be it in-store, or via a Increased demand in website, a mobile app, social media, smartphones, or the emerging markets e-mail, to deliver the right experiences at the right Growing dominance time. Done well, enriched customer experiences will enable businesses in the consumer electronics of Asian companies industry to build customer loyalty in driving Convergence of sustainable competitive advantage in the long-term. technologies, devices and industries ¹ Consumer Electronics Market Size, Global Market Insights Key trends shaping the future Localization drives conversions As consumer electronics giants such as Xiaomi, Huawei, and Samsung compete for market shares in new geographies, a nuanced approach is crucial for building a strong brand presence across diverse markets. -
The Evolving Electronics Industry Courting the Customer Through Insight and Innovation
Smarter electronics Point of view The evolving electronics industry Courting the customer through insight and innovation Transistor by transistor, the electronics industry is literally changing the world. Consider this: today’s fastest computer can now achieve 17 quadril- lion calculations per second1, and by 2015 there will be more than seven billion mobile devices in the world consuming and generating massive amounts of data.2 Right now there are more than one billion transistors for each person on the planet.3 With innovations like these, it is no surprise that the electronics industry continues to be a leader in research and development investment across the world.4 However, despite an impressive track record of pioneering technology, today’s electronics industry is in a state of disruption. Product life-cycles are compressing, emphasizing the need to create innovative products and services faster and more cheaply than ever before. Competitive pressures are at an all-time high, with aggressive new entrants vying with a continuing need to contain operational costs. And though profit margins for some electronics segments remain relatively high, most are under heavy margin pressure. Together, these trends are driving electronics companies to find new growth opportunities. Many believe that the best way to do this—perhaps the only way to do it—is to transform their business models by getting closer to their customers. In fact, the 2012 IBM CEO study revealed that 86 percent of global electronics CEOs are implementing extensive changes in their organizations to deepen their understanding of individual customer needs, while enabling faster, more relevant responses to markets and individuals.5 CEOs realize that innovative products and services are only successful when they deliver on customer needs. -
2014 CORPORATE SOCIAL RESPONSIBILITY REPORT | 3 About This Report
2014 Corporate Social Responsibility freescale.com Table of Contents Introduction 3 Community Engagement 31 Message from President and CEO, Gregg Lowe 4 Employees in Action 32 Sustainability at a Glance 5 Focus on Science, Technology, Engineering and Math (STEM) 34 Corporate Governance 6 Freescale Foundation 35 Company Overview 8 Environment, Health and Safety Policy 36 Research and Development 9 Manufacturing Responsibility 37 Quality 10 E-Scrap Reclamation 41 Manufacturing 11 Environment Matters—Remediation Activities 42 Electronics Industry Citizenship Coalition (EICC) 14 Beyond EHS Compliance 43 Customers, Sales and Products 15 Recognized for Our EHS Excellence 44 Product Responsibility 22 How to Reach Us 45 Our Team 25 Inclusion: Leveraging the Power of One 26 Our Anti-Discrimination Policy 27 Our Commitment to Being a Great Place to Work 28 Our Commitment to University Recruiting 29 Employee Leadership and Development 30 INTRODUCTION 2014 CORPORATE SOCIAL RESPONSIBILITY REPORT | 3 About This Report This corporate social responsibility report provides an integrated overview of the economic, environmental and social aspects of Freescale Semiconductor’s (Freescale) business activities and products. Our corporate social responsibility report describes Freescale’s commitment to the communities in which we live and work, our employees and the environment and reflects the standards of the Freescale Code of Business Conduct and Ethics. Our commitment is to act with integrity, communicate openly and honestly and treat everyone with respect and fairness, including: • In the workplace, by placing a high value on diversity and inclusion, taking action against all forms of harassment or entities, customers, suppliers, employees and other business improper labor practices and promoting the health and partners) about our corporate social responsibility progress and well-being of our employees; initiatives. -
The Evolving Role of Semiconductor Consortia in the United States and Japan
Portland State University PDXScholar Business Faculty Publications and Presentations The School of Business Fall 1998 The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham University of California - Berkeley Greg Linden University of California - Berkeley Melissa M. Appleyard Portland State University, [email protected] Follow this and additional works at: https://pdxscholar.library.pdx.edu/busadmin_fac Part of the Business Administration, Management, and Operations Commons Let us know how access to this document benefits ou.y Citation Details Ham, R., Linden, G., & Appleyard, M. M. (1998). The Evolving Role of Semiconductor Consortia in the United States and Japan. California Management Review, 41(1), 137-163. This Article is brought to you for free and open access. It has been accepted for inclusion in Business Faculty Publications and Presentations by an authorized administrator of PDXScholar. Please contact us if we can make this document more accessible: [email protected]. The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham Greg Linden Melissa M. Appleyard ince the late 1970s, governments throughout the industrialized economics have proclaimed the benefits of research consortia. In the United States, tor example, ihe 1984 National Cooperative Research SAct (NCRA) relaxed U.S. antitrust laws to encourage the formation of research consortia hy firms in the same industry; by the end of 1995, over 575 consortia had heen registered under the NCRA in a variety of -
Global Semiconductor Industry | Accenture
GLOBALITY AND COMPLEXITY of the Semiconductor Ecosystem The semiconductor industry is a truly global affair. Around the world, semiconductor chip designers use intellectual property (IP) licenses and design verification to provide designs to wafer fabricators, which use raw silicon, photomasks, and equipment to create chips for package manufacturing to assemble with printed circuit board (PCB) substrates for delivery to end customers. In fact, components for a chip could travel more than 25,000 miles by the time it finds its way into a television set, mobile phone, automobile, computer, or any of the millions of products that now rely on chips to operate (Figure 1). 2 | Globality and Complexity of the Semiconductor Ecosystem Figure 1: Components for a chip could travel more than 25,000 miles before completion IP Licenses Euipment Modules Package Raw Silicon Manufacturing PC Substrates Asembly Standard Products and Test components Wafer Fabrication Equipment Chip Design Design Verification Photomask Wafer Manufacturing Fabrication The Global Semiconductor Alliance (GSA) and Accenture have teamed up to conduct a joint study on the globality and complexity of the semiconductor ecosystem to explore the interdependencies and benefits of the cross-border partnerships required to produce semiconductors, as well as to illustrate what’s needed to keep this global ecosystem operating efficiently and profitably. Industry executives can use this study to inform their company strategies, as well as to educate non-semiconductor partners, including policy makers, on the nature of their business to promote a better understanding of the important role semiconductors play in everyday life and on the globe-spanning ecosystem that’s needed to produce them. -
Portfolio Holdings Listing Select Semiconductors Portfolio As of June
Portfolio Holdings Listing Select Semiconductors Portfolio DUMMY as of August 31, 2021 The portfolio holdings listing (listing) provides information on a fund’s investments as of the date indicated. Top 10 holdings information (top 10 holdings) is also provided for certain equity and high income funds. The listing and top 10 holdings are not part of a fund’s annual/semiannual report or Form N-Q and have not been audited. The information provided in this listing and top 10 holdings may differ from a fund’s holdings disclosed in its annual/semiannual report and Form N-Q as follows, where applicable: With certain exceptions, the listing and top 10 holdings provide information on the direct holdings of a fund as well as a fund’s pro rata share of any securities and other investments held indirectly through investment in underlying non- money market Fidelity Central Funds. A fund’s pro rata share of the underlying holdings of any investment in high income and floating rate central funds is provided at a fund’s fiscal quarter end. For certain funds, direct holdings in high income or convertible securities are presented at a fund’s fiscal quarter end and are presented collectively for other periods. For the annual/semiannual report, a fund’s investments include trades executed through the end of the last business day of the period. This listing and the top 10 holdings include trades executed through the end of the prior business day. The listing includes any investment in derivative instruments, and excludes the value of any cash collateral held for securities on loan and a fund’s net other assets. -
GS40 0.11-Μm CMOS Standard Cell/Gate Array
GS40 0.11-µm CMOS Standard Cell/Gate Array Version 1.0 January 29, 2001 Copyright Texas Instruments Incorporated, 2001 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the materials, methods, techniques, or apparatus described herein are the exclusive property of Texas Instruments. No disclosure of information or drawings shall be made to any other person or organization without the prior consent of Texas Instruments. IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this war- ranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WAR- RANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. -
LPC47N267 Product Brief
LPC47N267 100-Pin LPC Super I/O with X-Bus Interface Product Features • Enhanced Digital Data Separator - 2 Mbps, 1 Mbps, 500 Kbps, 300 Kbps, 250 • 3.3 Volt Operation (5V tolerant) Kbps Data Rates • Programmable Wakeup Event Interface - Programmable Precompensation Modes (IO_PME# Pin) • Serial Ports • SMI Support (IO_SMI# Pin) - Two Full Function Serial Ports • GPIOs (29) - High Speed NS16C550 Compatible UARTs • Four IRQ Input Pins with Send/Receive 16-Byte FIFOs • X-Bus Interface - Supports 230k and 460k Baud - Supports up to 4 external components - Programmable Baud Rate Generator - Supports I/O cycles (No Memory Support) - Modem Control Circuitry - 8-Bit Data Transfer • Infrared Communications Controller - 16-Bit Address Qualification - IrDA v1.2 (4Mbps), HPSIR, ASKIR, Con- - Write Protection for each component sumer IR Support • XNOR Chain -2 IR Ports • PC99 and ACPI 1.0b Compliant - 96 Base I/O Address, 15 IRQ Options and 3 • 100-pin STQFP Package DMA Options • Intelligent Auto Power Management • Multi-Mode Parallel Port with ChiProtect • 2.88MB Super I/O Floppy Disk Controller - Standard Mode IBM PC/XT, PC/AT, and PS/2 - Licensed CMOS 765B Floppy Disk Controller Compatible Bidirectional Parallel Port - Software and Register Compatible with - Enhanced Parallel Port (EPP) Compatible - Microchip's Proprietary 82077AA Compatible EPP 1.7 and EPP 1.9 (IEEE 1284 Compliant) Core - IEEE 1284 Compliant Enhanced Capabilities - Supports One Floppy Drive Directly Port (ECP) - Configurable Open Drain/Push-Pull Output - ChiProtect Circuitry for -
Warburton, John Henry. (2010). Picture Radio
! ∀# ∃ !∃%& ∋ ! (()(∗( Picture Radio: Will pictures, with the change to digital, transform radio? John Henry Warburton Master of Philosophy Southampton Solent University Faculty of Media, Arts and Society July 2010 Tutor Mike Richards 3 of 3 Picture Radio: Will pictures, with the change to digital, transform radio? By John Henry Warburton Abstract This work looking at radio over the last 80 years and digital radio today will consider picture radio, one way that the recently introduced DAB1 terrestrial digital radio could be used. Chapter one considers the radio history including early picture radio and television, plus shows how radio has come from the crystal set, with one pair of headphones, to the mains powered wireless with built in speakers. These radios became the main family entertainment in the home until television takes over that role in the mid 1950s. Then radio changed to a portable medium with the coming of transistor radios, to become the personal entertainment medium it is today. Chapter two and three considers the new terrestrial digital mediums of DAB and DRM2 plus how it works, what it is capable of plus a look at some of the other digital radio platforms. Chapter four examines how sound is perceived by the listener and that radio broadcasters will need to understand the relationship between sound and vision. We receive sound and then make pictures in the mind but to make sense of sound we need codes to know what it is and make sense of it. Chapter five will critically examine the issues of commercial success in radio and where pictures could help improve the radio experience as there are some things that radio is restricted to as a sound only medium. -
Released in December 1957, the TR-63 Was Sony's First Pocket-Size Transistor Radio
Released in December 1957, the TR-63 was Sony's first pocket-size transistor radio. It's a 6-transistor superhet design with some interesting design features, including the use of Sony-manufactured NPN transistors in the circuit. Masaru Ibuka served with the Impe- used in schools and courts. much discussion, Sony's research labo- rial Navy Wartime Research Committee Following Ibuka's visionary 1952 ratory head, Mikato Kikuchi, suggested during World War 2, leaving in 1946 to trip to the USA to sign a licence with dropping Bells' preferred doping agent, join Akio Morita to form Tokyo Tsushin Western Electric, Sony acquired pat- indium, and substituting phosphorus Kogyo Kabushiki Kaisha, "Totsuko". ent rights for the transistor and subse- instead. When that didn't work, Morita Morita, a physics graduate, had served quently began manufacturing portable called for "more doping"! alongside Ibuka in the Research Com- radios in 1955. It soon paid off and Sony were able mittee, and their friendship laid the to produce the transistors used in their foundations for the international pow- Early difficulties first solid-state radios. Their TR-55 erhouse we now know simply as Sony. Sony preferred NPN transistors be- model, released in 1955, is now a rarity Tokyo Tsushin Kogyo's first prod- cause of their better high-frequency and the last one to be listed online some uct, a rice cooker, says a lot about the response but were initially unable to years ago had a price tag of $US1500. company. Japan had suffered massive produce working examples. One can only imagine the energy destruction during World War 2 due to NPN devices exploit the fact that invested by Sony to leap from Ibuka's bombing and people needed utensils to electrons move more quickly than licensing agreement to a marketable cook their staple food, which was rice.