Realtek Semiconductor Corp. No. 2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan Tel: +886-3-5780211; Fax: +886-3-5776047

NEWS RELEASE September 26, 2005 Editorial Contacts:

Thomas Chou Realtek Semiconductor Corp. +886-3-578-0211, x 3885 [email protected]

REALTEK INTRODUCES INTEGRATED SINGLE-CHIP ULTRAWIDEBAND SOLUTION, BASED ON WIMEDIA SPECIFICATION

World’s No. 1 IC Supplier Enters Market for Emerging WiMedia Ultrawideband Common Radio Platform

HSINCHU, Taiwan and IRVINE, Calif. – September 26, 2005 – Realtek Semiconductor Corp. (TSE: 2379), one of the world’s largest IC design houses, today announced it is entering the emerging Ultrawideband market with the RTL8170, a highly integrated, high performance Ultrawideband physical layer (PHY) solution based on the WiMedia Alliance PHY specification. The chip combines radio frequency (RF) and baseband (BB) components in a single CMOS chip.

The RTL8170 design includes a WiMedia MAC-PHY interface, and thus can be combined with any WiMedia (MAC) solution. With data rates up to 480 Mbps and support for Transmit Power Control and Link Quality Indication, the RTL8170 is suitable for immediate use in combination with MAC solutions implementing Certified USB (from the USB-IF), and WiNET (IP over UWB). The ultra-compact 7mm x 7mm size allows use in the most challenging form factors.

“Realtek’s WiMedia-based PHY solution is a significant step forward for the UWB industry and the WiMedia Alliance’s ecosystem,” said Stephen Wood, president of the WiMedia Alliance. “This IC design accelerates UWB productization and further promotes the viability of the WiMedia MAC-PHY interface.”

P. 0/3 Realtek Semiconductor Corp. No. 2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan Tel: +886-3-5780211; Fax: +886-3-5776047

”Small form factor Ultrawideband solutions will be instrumental for embedding into space-constrained products. We see Realtek bringing its extensive mass market CMOS production experience to bear onto the UWB playing field through its Ethernet chip leadership,” said Joyce Putscher, principal analyst for In-Stat. “We believe that support for both Wireless USB and IP over UWB will be important.”

“Realtek is a strong believer that the WiMedia Ultrawideband common radio platform has enormous potential for end-user functionality, and represents a major market opportunity,” said Ran Yan, Senior Vice President, Wireless Communications Technologies at Realtek. “In designing the RTL8170 we set our goal as an optimized ultrawideband PHY solution, maximizing feature set and performance, and minimizing form factor.”

The RTL8170 comes with a compact reference design providing support from MAC-PHY interface to antenna. The design has minimal external components and fits in a design footprint of 12mm x 12mm.

The RTL8170 will be exhibited at the Wireless USB Developers Conference held September 28-29 in Tokyo.

Availability The Realtek RTL8170 is planned to sample to customers in Q4 2005.

About Realtek

Realtek Semiconductor Corp. is one of the world's leading IC providers. It designs and develops a wide range of IC products for communications network, computer peripheral, and multimedia applications. The products include 10/100/1000M Ethernet

P. 0/3 Realtek Semiconductor Corp. No. 2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan Tel: +886-3-5780211; Fax: +886-3-5776047

Controllers, 10/100/1000M Ethernet Switch/Gateway Controllers, 10/100/1000M Ethernet PHYceivers, Wireless LAN Controllers & AP/Router SoC, ADSL Chips, VoIP Solutions, AC'97/High Definition Audio Codecs, Motherboard Clock Generators, LCD Monitor Controllers, and LCD TV Controllers. With advanced design expertise in RF, analog and mixed signal circuits, and strong manufacturing and system knowledge, Realtek offers full-featured, high-performance, and competitive total solutions for customers. More information on Realtek can be found on the web: www.realtek.com.tw.

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Realtek is a trademark of Realtek Semiconductor Corp. Any other trademarks or registered trademarks mentioned in this release are the intellectual property of their respective owners.

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