TABLE of CONTENTS
InChem Corp ...... 3 Introduction ...... 5
Product Listings Phenoxy Resin Products ...... 6 - 13
Application Guidelines Performance/Technology/Chemistry ...... 14 Coatings & Inks Selection Guide ...... 5 - 16 Adhesives Selection Guide ...... 17 - 18 Composites Selection Guide ...... 19 - 20 Plastics Selection Guide ...... 21 - 22
Charts & Tables Phenoxy Solution Viscosities ...... 23 - 25 Phenoxy Solvent Table ...... 26 Phenoxy Physical Properties ...... inside back cover
PKFE, PKHC, PKHH, PKHJ, PKHM, PKHS and PKHW are registered trademarks of InChem Corp. We urge you to review prior to any use the Material Safety Data Sheets for any InChem Corp products mentioned herein. These documents are available from your InChem Corp Sales Representative or distributor. This information is not to be taken as a warranty or representation for which we assume legal responsibility nor as permission or recommendation to practice any patented invention without a license. It is offered solely for your consideration, investigation and verification. 2002 InChem Corp. Company Description Technologies
InChem Corp is a global specialty resin and We have modified the Phenoxy molecule to offer surfactant manufacturer. Many of our resins have its superior adhesion, flexibility and chemical re- been used to enhance performance in coatings, sistance properties to water and solvent-borne, inks, adhesives, and composites for over 35 years powder, UV, EB and cationic cure systems. We and they continue to offer unique chemistries to also offer very low viscosity epoxy acrylates and ever-changing performance standards. epoxy methacrylates.
Our headquarters and ISO 9002 certified facility in Technical Services Rock Hill, South Carolina service customers world- wide along with additional production facilities in We have extensive technical capabilities in our Europe. InChem surfactant facilities are located in R&D and QC/QA laboratories. Our technical staff Portugal, France, and South Africa. are experts in their respective fields and are readily available to help solve the most challenging appli- Markets Served cation problems.
The InChem resin product line services can and Major Products container coatings, wire coatings, fiber sizings, inks, adhesives, composites and plastics manufactur- InChem produces the following chemicals along ing. We have direct sales and distribution through- with their derivatives: out North America, Asia, Europe and the Middle East. At InChem new product development is the Phenoxy (Polyhydroxyether) norm, not the exception. We foster an environ- Epoxy Acrylates and Methacrylates ment where creativity is encouraged. Polyesters
3 WORLD WIDE DISTRIBUTION
North America Europe cont.
Canada Colors & Chemicals Limited Organa Chemplast 80 Scarsdale Road, Don Mills Via Leonardo Da Vinci 43 Ontario M3B 2R7 Ph: 416-449-2600 20090 Trezzano, sul Naviglic Milan, Italy Ph: (39) 02-4861-5352 Eastech Chemical Inc. 5700 Tacony St. Quimidroga S.A. Philadelphia, PA 19135 Ph: 215-537-1000 Tuset, 26 08006 Barcelona, Spain Ph: (34) 93-236-3636 E.T. Horn Company 16141 Heron Avenue La Mirada, CA 90638 Ph: 714-523-8050 Asia
Lintech International Barrington Chemicals 7705 N.E. Industrial Blvd. Room 13, 10/F New Commerce Center Macon, GA 31297 Ph: 800-652-9297 19 Sum Street Shatin, Hong Kong Ph: (852) 2547-5190 Maroon Inc. 1390 Jaycox Road Kem Kote Ltd. Avon, OH 44011 Ph: 440-937-1000 100/78 Moo 4, Phuttamonthon 2 North Bangkhae, Bangkhae, Bangkok Matteson-Ridolfi 10160 Thailand Ph: (66) 2-454-5100 14450 King Road Riverview, MI 48192 Ph: 734-479-4500 Kingyorker Enterprises No. 58, 10th floor, Fu-Hsin North Road Mozel Incorporated Taipei, Taiwan Ph: (886) 2-2777-2369 1900 West Gate Drive Columbia, IL 62336 Ph: 618-281-2723 Sine Corporation Choong Ang Royal Officetel, Room 1408 P.T. Hutchins (for Mexico) 1355-8 Seocho-Dong, Seocho-Ku 6055 E. Washington Blvd. Seoul, Korea Ph: (82) 2-3474-1188 Los Angeles, CA 90040 Ph: 323-887-8508 Tomoe Engineering Daini Maruzen Building, 9-2 Nihonbashi 3- Europe Chome, Chuo-Ku, Tokyo 103 Japan Ph: (81) 3-3274-0411 Brenntag Eurochem GmbH T.R. Chemicals Pty. Ltd. Humboldtring 15, D45472 195 Briens Road, Northmead, N.S.W. 2152 Mulheim an der Ruhr Australia Ph: (612) 9630-7655 Germany Ph: (49) 208-782-8144
Group Arnaud 68 Av. du General Michel Bizot InChem Corp Home Office 75012, Paris, France Ph: (33) 1-4473-1000 800 Cel-River Road Rock Hill, South Carolina 29730 Hubron Specialty Products Ltd. Albion Street, Failsworth Manchester Customer Service: 803-329-8061 M350FP, England Ph: (44) 161-681-2691 Technical Service: 803-329-8050
also find us on the Web at: www.phenoxy.com
4 OH OH HO C C C O O C C C OH
n
Introduction InChemRez resins of Phenoxy type resins comb- ined with epoxies, polyethers, and polyesters pro- vide user friendly hybrids for formulation latitude InChemRez Phenoxy resins are tough and duc- and novel properties. tile thermoplastic materials having high cohesive strength and good impact resistance. The back- Modification of the Phenoxy resin backbone by bone ether linkages and pendant hydroxyl groups grafting onto the aliphatic carbon segments gener- promote wetting and bonding to polar substrates ates the family of anionically stabilized waterborne and fillers. Structurally, Phenoxy resin is a dispersions. These grades of Phenoxy (PKHW- polyhydroxyether having terminal alpha-glycol series) allow formulators significant latitude in de- groups. Weight-average molecular weight range signing VOC compliant coatings and adhesives. from approximately 25,000 to above 60,000. The Several are also FDA-compliant for use in packag- highest polymeric species exceed 250,000 ing and container coatings (direct and indirect food daltons. contact).
Polydispersity is very narrow, typically less than Modification by esterification of the backbone hy- 4.0. An average molecule contains forty or more droxyls generates a new family of high molecular regularly spaced hydroxyl groups suitable for weight resins having pendant primary hydroxyls, crosslinking for thermoset applications. These pen- vastly improved compatibility with ester-type sol- dant hydroxyls are excellent sites for crosslink-ing vents, and improved elasticity. Products of this in thermoset applications at elevated temperatures type are in the PKCP-series. These resins are not and even at ambient conditions. FDA-compliant however.
Phenoxy resins are compatible with many poly- Phenoxy resins are soluble in a variety of materi- mers and they are efficient flexibilizers for als including ketones, glycol ethers and glycol ether crosslinked phenolic and epoxy formulations in ad- esters. Phenoxy resins prefer polar aprotic sol- hesives, coatings, and composites. Phenoxy res- vents, however many aliphatic and aromatic mate- ins have shown utility in compatibilizing blends of rials will behave as diluents in conjunction with diverse plastic materials. Phenoxy resin has a strong solvents as above. Detailed solids/viscos- solubility parameter of 10.68 enabling excellent com- ity charts are illustrated in this guide for numerous patibility with polar materials and sufaces like poly- solvents and solvent combinations with different urethanes, polyesters, and nylons. Generally, the grades of Phenoxy. resin is incompatible with acrylics, olefins, and vi- nyls. Phenoxy has excellent vapor barrier properies Standard solutions of Phenoxy resin in methyl (water vapor, oxygen, carbon dioxide) and is com- ethyl ketone and in PM acetate are commercially pliant with 21CFR175.300 for direct and indirect food/ available from InChem Corp. InChem Corp. will beverage container coatings, as well as other para- consider alternate solvents for customer specific graphs pertinent to adhesives used in multilayer needs based on fit, volume, etc. packaging and plastic components for containers.
5 INCHEMREZ PHENOXY RESINS
STANDARD SOLID GRADES
ytisocsiV 1 Pc, sdiloS 2, roloC 1, ezaH 1, ,).va(nM ,).va(wM mroFlacisyhP 52ta oC %.tw AHPA % snotlad snotlad
noitacificeps noitacificeps .ceps .ceps noitacificeps lacipyt lacipyt
BHKP 082-081 .nim99 .xam002 .xam51 stellep 005,9 000,23
+BHKP 904-182 .nim99 .xam002 .xam51 stellep 005,01 000,73
CHKP 425-014 .nim99 .xam002 .xam51 stellep 000,11 000,34
HHKP 517-525 .nim99 .xam002 .xam51 stellep 000,31 000,25
JHKP 577-006 .nim99 .xam002 .xam51 stellep 000,61 000,75
EFKP 598-006 .nim99 3 .xam002 .xam51 stellep 000,61 000,06
002-PHKP 517-574 .nim99 .xam002 .xam51 redwop 000,31 000,25
08-PHKP 517-574 .nim99 .xam002 .xam51 redwop 000,31 000,25
001-BHKP 904-081 .nim99 .xam002 .xam51 redwop 000,01 000,53
003-BHKP 904-081 .nim99 .xam002 .xam51 redwop 000,01 000,53
1 20% solution in cyclohexanone 2 gravimetric, 3 hours at 135oC 3 gravimetric, 3 hours at 80oC, then 1 hour at 220oC
STANDARD SOLUTION GRADES
Pc,ytisocsiV ,sdiloS ,roloC ,ezaH ).va(nM 4, ).va(wM 4, mroFlacisyhP 52ta oC %.tw rendraG % snotlad snotlad
noitacificeps noitacificeps .ceps .ceps noitacificeps lacipyt lacipyt
suocsiv AMP03-SHKP 000,51-000,5 0.13-0.92 .xam1 .xam51 000,11 000,34 diuqil
suocsiv 04-SHKP 000,7-005,4 0.14-0.93 .xam1 .xam51 000,31 000,25 diuqil
4 on polymeric portion (GPC, versus polystyrene)
6 Phenoxy Resin Polymers shown below are TSCA listed INCHEMREZ NOTES as CAS# 25068-38-6
Theoretical OH equivalent weight: 284
,gT o ,C xednItleM ytisocsiVtleM 5, cificepS stnemmoC )CSD( 002ta oC 002taesioP oC ytivarg 6
lacipyt lacipyt lacipyt lacipyt
48 .nim01/g06 211 81.1 elbaliavaedargthgiewralucelomtsewolehT
78 03< ----- 81.1 edargthgiewralucelomwol-muideM
98 51< ----- 81.1 edargthgiewralucelommuidemesopruplareneG
29 4 564 81.1 snoitacilppatsomrofedargdradnatS
59 4< ----- 81.1 edargthgiewralucelomhgih-muideM
89 4< ----- 81.1 noisurtxemlifrof;edargthgiewralucelomhgih-artlU
29 4 564 81.1 .vanorcim011;snorcim002<;edargHHKPdezinorciM
29 4 564 81.1 .vanorcim06;snorcim08<;edargHHKPdezinorciM
68 06-03 ----- 81.1 .vanorcim06;snorcim001<;edarg+B/BHKPdezinorciM
68 06-03 ----- 81.1 egnarnorcim003ot051;edarg+B/BHKPdezinorciM
5 at 1034 s-1 6 fused, at 25oC
,.tPgnilioB ,.tPhsalF tnevloS cificepS stnemmoC oC o CCMP,F ]#SAC[ ytivarg
lacipyt lacipyt noitacificeps lacipyt
etatecaMP 531 411 30.1 yxonehPedargCHKPfonoituloS ]6-56-081[
KEM 08 12 569.0 edargHHKPfonoituloS ]3-39-87[
INCHEMREZ NOTES
Special solvent packages with Phenoxy resins available on request (drums and/or bulk)
7 INCHEMREZ PHENOXY RESINS WATERBORNE DISPERSIONS
ytisocsiV 1 Pc, sdiloS 2, eziSelcitraP lacisyhP ,.oNdicA Hp 52ta oC %.tw snorcim mroF )sdilos(
noitacificeps noitacificeps .ceps .lacipyt noitacificeps lacipyt
53-WHKP 000,4-005,1 0.23-0.03 8.7-8.6 5.1 noisrepsidladiolloc 75
43-WHKP 006,1-008 0.53-0.33 8.7-8.6 90.0 noisrepsidladiolloc 74
63-WHKP 005,6-005,3 3 0.43-0.23 8.7-8.6 11.0 noisrepsidladiolloc 05
1 Brookfield RVT, #4 at 50 rpm 2 gravimetric, 1 hours at 200oC 3 Brookfield RVT, #4 at 20 rpm PHENOXY/POLYESTER BLENDS
ytisocsiV 4 Pc, sdiloS 5, roloC 4, ezaH 4, lacisyhP lyxordyH 52ta oC %.tw AHPA % mroF rebmun
noitacificeps noitacificeps .ceps .ceps noitacificeps lacipyt
03-MHKP 003-001 .nim99 .xam002 .xam51 stellep 751
103-MHKP 003-001 .nim99 .xam002 .xam51 stellep 261
58-MHKP 30-000,0 00,05 6 .nim99 .xam001 A/N diuqilsuocsiv 012
38-MHKP 000,55-000,53 6 .nim99 .xam001 A/N diuqilsuocsiv 771
4 20% solution in cyclohexanone 5 gravimetric, 3 hours at 135oC 6 Brookfield RVT 7 (below) at 25oC LIQUID EPOXY/PHENOXY BLENDS
tnecreP Pc,ytisocsiV ,sdiloS ,roloC yxonehP EPW mroFlacisyhP 04ta oC %.tw rendraG )sdilos(
noitacificeps lacipyt lacipyt .ceps noitacificeps .ceps
BH-REL 000,05-000,02 01 001 412-202 diuqilsuocsiv .xam2
HH-REL .nim000,53 01 001 412-202 diuqilsuocsiv .xam2
BH-NEL 000,54-000,03 01 001 691-281 diuqilsuocsiv .xam2
VLBH-NEL 000,61-000,11 01 001 691-281 diuqilsuocsiv .xam2
WBH-REL 0007-0005 7 01 38 572-552 diuqilsuocsiv noisrepsid
8 s'COV gnizilartueN stnevlos-oC stnemmoC .lag/blni enima
lacipyt noitacificeps noitacificeps
0.2 rehtelytublocylgenelyhte AEMD 8 snoitalumroftesomrehtrofnoisrepsiddradnatS
0.2 PnP;HOuB-n 7 AEMD stnevlos-ocPAH-non;noisrepsideziselcitrapwol-artlU
0.2 PnP;HOuB-n AET 9 snoitalumrofgniructneibmarofgTwoL
7 propyleneglycol n-propyl ether 8 dimethyl ethanolamine 9 triethylamine
lyxordyH s'COV cificepS 1(rebmun o) stnemmoC .lag/blni ytivarg ).clac(
lacipyt lacipyt lacipyt
0 9 91.1 loylopepyt-retseylophtiwyollaedarg-diloS
0 41 91.1 loylopepyt-retseylophtiwyollaedarg-diloS
0 081 01.1 loylopepyt-retseylophtiwerutximedarg-diuqiL
0 441 20.1 loylopepyt-rehteylophtiwerutximedarg-diuqiL
INCHEMREZ NOTES
Reduced viscosity versions of InChemRez LER-HB with epoxy diluents available on request
s'COV ytilanoitcnuF cificepS stnemmoC .lag/blni )tnenopmocyxopE( ytivarg
lacipyt lacipyt lacipyt
0 2 81.1 BHKPyxonehPhtiwdeifidomniseryxopediuqilcisaB
0 2 81.1 edargHHKPhtiwdeifidomniseryxopediuqilcisaB
0 3.2 81.1 edargBHKPhtiwdeifidomnisercalovonyxopediuqiL
0 1.2 81.1 edargBHKPhtiwdeifidomNPEytisocsivwoL
0 2 01.1 dnelbyxonehP/yxopefonoisrepsidsuoeuqA
9 SOLID EPOXY/PHENOXY BLENDS
ytisocsiV 1 Pc, tnecreP ,roloC lacisyhP ,gT oC EPW 571ta oC yxonehP rendraG mroF )CSD(
lacipyt lacipyt .ceps .ceps noitacificeps lacipyt
01-RES 0054 01 .xam2 568-577 elunarg/ekalf 05
P01-RES 0054 01 .xam2 568-577 redwop 05
52-RES 0081 2 52 .xam2 525-574 elunarg/ekalf 03<
1 ICI cone/plate 2 ICI cone/plate at 200oC
CAPROLACTONE-MODIFIED PHENOXY RESINS
lyxordyH ytisocsiV 3 Pc, sdiloS 4, roloC 3, ezaH 3, lacisyhP rebmun 52ta oC %.tw AHPA % mroF ).clac(
lacipyt noitacificeps .ceps .ceps noitacificeps lacipyt
08-PCKP 021 .nim79 .xam002 .xam51 stellep 061-551
76-PCKP 011 .nim79 .xam002 .xam51 dilos-imes 531-031
3 20% solution in cyclohexanone 4 gravimetric, 2 hours at 200oC
EPOXY RESIN SOLUTIONS & CROSSLINKERS
tnelaviuqE Pc,ytisocsiV ,sdiloS ,roloC cificepS thgiew mroFlacisyhP 52ta oC %.tW rendraG ytivarG )sdilosno(
lacipyt lacipyt .ceps lacipyt noitacificeps lacipyt
697-PE 000,64 06 .xam2 0012 diuqilsuocsiv 40.1
53-SE 000,6 53 .nim1 A/N diuqilsuocsiv A/N
05-SE .nim000,53 05 .xam2 0053 diuqilsuocsiv 30.1
56-RP 0002 07 .xam5 061 diuqilytisocsivwol 0.1
10 Pc,ytisocsiV stnemmoC 041ta oC
lacipyt
000,11 sgnitaocredwopevitaroceddnalanoitcnufroF
000,11 foedargdezinorciM 01-RESzeRmehCnI
----- yollaniseryxopetnetnocyxonehPhgiH
,gT o ,C stnemmoC )CSD(
lacipyt
03 niseryxonehPdetfarg-enotcalorpacgTwol-muideM
2 yxonehPdetfarg-enotcalorpacgTwoL
INCHEMREZ NOTES
Caprolactone-modified Phenoxy resins have pendant branches with terminal primary hydroxyls resulting from random grafting of e-caprolactone monomer onto the Phenoxy backbone. The esterification also results in lower glass transition temperatures and lower product viscosities. (See page 12)
tnevloS stnemmoC
noitacificeps
BE 5 KEMdna noitulosnidnelbyxonehP/yxopethgiewralucelomhgiH
AMPdnaKEM 6 noitulosnidnelbyxope/yxonehPthgiewralucelomhgiH
001-AdnaBE 7 noitulosniseryxopethgiewralucelomhgiH
lonatub-n slemanegnikabrofnisercilonehP
5 ethyleneglycol butylether 6 propyleneglycol n-propylether acetate 7 Aromatic 100 solvent
11 CYCLOALIPHATIC EPOXY /PHENOXY RESIN BLENDS
Pc,ytisocsiV yxonehP ,sdiloS ,roloC EPW mroFlacisyhP 52ta oC %.tw %.tw rendraG
lacipyt lacipyt .ceps .ceps noitacificeps .ceps
BH-REC 000,51-000,8 01 951-541 .nim99 diuqilsuocsiv .xam2
76PC-REC 008,4 01 951-541 .nim79 diuqilsuocsiv.dem .xam2
INCHEMREZ NOTES
The PKCP-series of caprolactone modified Phenoxy resin are structurally represented below and modeled on page 13. The random branches (typically x is about 2) produce resins with lower glass transitions than unmodified Phe- noxy, and enhance the compatibility with alkyl esters and polyesters.
PHENOXY PKCP-series STRUCTURE
Phenoxy with e-Caprolactone Side Chain Grafting
12 ytilanoitcnuF cificepS HO stnemmoC )remogilO( ytivarG rebmun
lacipyt lacipyt lacipyt
2 81.1 02 sniseryxonehPdnayxopecitahpilaolcycfodnelB
2 71.1 31 dnelbyxonehPdeifidom-enotcalorpac/yxopecitahpilaolcyC
INCHEMREZ NOTES
The structural models below illustrate the comb-like structure of the caprolactone-modified Phenoxy resin wherein random secondary hydroxyls are converted to primary hydroxyls pendant on relatively short side chains compared to the longer Phenoxy backbone
CAPROLACTONE MODIFIED PHENOXY
13 APPLICATION GUIDELINES: Performance/Technology/Chemistry
The next sections of this guide show the diver- sity of applications of the InChemRez family of products and the expected performance features & benefits that may be realized with their use in coatings, adhesives, plastics, and composites. Additionally, the many possible chemistries in which the InChemRez line can be incorporated is suggested.
HOW TO USE TABLES
The following tables are arranged in two fash- ions: product selections (in bold for best recom- mendation) are listed for performance attribute ver- sus application technology, followed by product selections for numerous chemical approaches ver- sus application technology. WATERBORNE RESINS
The Phenoxy line of products find many uses Waterborne Phenoxy resins are colloidal dis- as modifiers to other chemistries as well as utility persions dependant on pH maintenance above 6.5. as the sole resinous vehicles in coatings, adhe- Generally they are compatible with colloidal dis- sives, etc. Compatibilty with urethanes and epoxy persions of other polmers stabilized in the same resins is excellent. In many cases modification manner such as polyurethanes, polyesters, acryl- with Phenoxy resin and its many derivatives is ics, and epoxy esters. With waterborne epoxies sufficient to upgrade the properties of the formula- poor shelf stability is observed due to gelling tion. In those cases where crosslinking can occur tendencies of the contained epoxy species because with hydroxyl functionality the Phenoxy resins will of the slightly basic nature of the Phenoxy further enhance properties like hardness, abrasion dispersions. resistance, and chemical resistance. TABLE SUMMARY SOLVENTS and DILUENTS Coatings & Inks: pages 15 - 16 Phenoxy resins favor polar, aprotic type sol- Adhesives: pages 17 - 18 vents in solventborne applications although incor- Composites: pages 19 - 20 poration into formulations having hydrocarbon or Plastics: pages 21 - 22 aromatic solvents is quite possible if sufficient po- lar solvents can also be used. The preparation of TYPICAL PHENOXY APPLICATIONS most solventborne solutions of Phenoxy resins is usually straightforward given adequate agitation. - Zinc-rich primers For faster results some heating is required com- - Food & beverage can coatings mensurate with the solvent choice. - Maintenance coatings (metal & concrete) - Coil coatings - Marine coatings - Automotive refinish - Powder coatings - Cationic & UV cure - Tielayers - Heatseal adhesives - Structural adhesives
14 Coatings & Inks Selection Guide
In coatings applications InChemRez Phenoxy resins, polyester modified Phenoxy resins, epoxy/Phenoxy hybrid Solvent-borne resins, and InChemRez caprolactone modified resins offer a wide selection for your chosen technology. Phenoxy Water-borne resins find use in can and container coat- ings, drum linings, zinc-rich coatings and air dry maintenance primers, shop primers, glass thermoset and plastic coatings, wood coatings, and coatings for flexible substrates including PET, metal foils, paper and cloth. Powder Water-borne grades of Phenoxy permit formulations to low VOC’s and select solid grade Phenoxy resins are useful in High Solids thermoplastic and thermoset powder coatings.
APPLICATION GUIDE: COATINGS FEATURE & TECHNOLOGY
enrobtnevloS enrobretaW redwoP sdiloShgiH serutaeF
HHKP 53-WHKP 08-PHKP 76PC-REC noisehdA 04-SHKP 43-WHKP 001-BHKP 52-RES noitomorp AMP03-SHKP WBH-REL 01-RES
JHKP 53-WHKP 08-PHKP HH-REL &ytilibixelF 03-MHKP 43-WHKP 001-BHKP ssenhguot 103-MHKP 52-RES
JHKP 53-WHKP 002-PHKP BH-REC noisorroC 697-PE WBH-REL BH-NEL ecnatsiser
03-MHKP 43-WHKP 002-PHKP BH-REL roloCwoL 04-SHKP
EFKP 43-WHKP 01-RES BH-REC ssendraH JHKP WBH-REL P01-RES BH-NEL
AMP03-SHKP 43-WHKP 01-RES BH-REL ssolG HHKP
04-SHKP 53-WHKP 001-BHKP VLBH-NEL tnemgiP AMP03-SHKP 08-PHKP gnidaol
15 APPLICATION GUIDE: COATINGS CHEMISTRY TYPE & TECHNOLOGY
enrobtnevloS enrobretaW redwoP sdiloShgiH yrtsimehC
HHKP WBH-REL 76PC-REC enimA/yxopE 04-SHKP BH-REC tneibmaK2 BH-NEL VLBH-NEL
002-PHKP WBH-REL 08-PHKP BH-NEL reknil-X/yxopE 001-BHKP 001-BHKP VLBH-NEL tnetalK1 BH-REL 01-RES BH-NEL
AMP03-SHKP 63-WHKP 58-MHKP OCN/retseyloP 103-MHKP 43-WHKP 38-MHKP tneibmaK2 03-MHKP
AMP03-SHKP 43-WHKP 08-PHKP 76-PCKP OCN/retseyloP 103-MHKP 63-WHKP 001-BHKP 58-MHKP dekcolbK1 03-MHKP 38-MHKP
HHKP 53-WHKP 08-PHKP 03-MHKP enimaleM 04-SHKP 43-WHKP 001-BHKP 103-MHKP tesomreht 103-MHKP 63-WHKP 58-MHKP
HHKP 53-WHKP 01-RES cilonehP 03-MHKP 04-SHKP 43-WHKP P01-RES 103-MHKP tesomreht 56-RP 56-RP 58-MHKP
BH-REC yxopE BH-REC 76PC-REC 76PC-REC cinoitaC BH-REL BH-NEL
enidirizA 63-WHKP deknilssorc 43-WHKP
/sdyklA 43-WHKP sretseyxopE 63-WHKP
43-WHKP scilyrcA 63-WHKP
enahteruyloP 43-WHKP snoisrepsid 63-WHKP
BH-REL BH-REC /yxopE BH-NEL 76PC-REC edirdyhna 01-RES
InChemRez Phenoxy resins can be used as the as hardness and flexibility. Usually the level of sole resin vehicle in coatings formulations. For crosslinker or hardener is about 10 to 15 phr (parts crosslinked systems using the pendant secondary per hundred) on a solids basis. Typical crosslinkers hydroxyls on the Phenoxy backbone it is recom- used in thermoset applications are melamine-form- mended to empirically determine the best level of aldehyde resins, phenolics, blocked isocyanates, crosslinker for a balance of coatings properties such and polycarboxylic acids.
16 Adhesives Selection Guide
In adhesives applications InChemRez Phenoxy Solventborne based resins offer a wide selection for your chosen technology. Phenoxy resins are used to add superior adhe- Water-borne sion promotion to a wide variety of substrates. The air dry large number of secondary hydroxyls give Phenoxy the “bite” that many systems require. The linear thermoset thermoplastic nature of Phenoxy provides flexibil- ity to rigid crosslinked systems. Hot melt Phenoxy resins find use in aerospace and auto- motive latent cure and hotmelt adhesives by improving adhesion and flexibility of epoxy-based High solids compounds, and circuit board laminating adhesives by increasing bond strength to the boards. thermoset air-dry 2k
APPLICATION GUIDE: ADHESIVES FEATURE & TECHNOLOGY
enrobtnevloS enrobretaW tlemtoH sdiloshgiH serutaeF
dilosllA 53-WHKP dilosllA 76PC-REC noisehdA sedargtellep 43-WHKP sedargtellep BHKP noitomorp WBH-REL VLBH-NEL
JHKP 53-WHKP BH-REC &ytilibixelF 03-MHKP 43-WHKP EFKP ssenhguot 103-MHKP 52-RES
JHKP 53-WHKP dilosllA BHKP evisehoC 697-PE sedargtellep 52-RES htgnerts
EFKP 53-WHKP EFKP BH-REC taeH JHKP ecnatsiser
dilosllA 53-WHKP dilosllA BHKP reirrabropaV sedargtellep sedargtellep seitreporp
neerG dilosllA WBH-REL BHKP 01-RES sedargtellep htgnerts
EFKP 53-WHKP EFKP 52-RES leeP JHKP JHKP VLBH-NEL htgnerts
EFKP WBH-REL dilosllA HH-REL erutsioM 53-WHKP sedargtellep ecnatsiser
17 APPLICATION GUIDE: ADHESIVES CHEMISTRY TYPE & TECHNOLOGY
enrobtnevloS enrobretaW tlemtoH sdiloShgiH yrtsimehC
HHKP WBH-REL 76PC-REC enimA/yxopE 04-SHKP BH-REC tneibmaK2 BH-NEL 76PC-REC
002-PHKP WBH-REL 01-RES BH-NEL reknil-X/yxopE 001-BHKP 52-RES tnetalK1 BH-REL 08-PHKP BH-NEL BH-REL
AMP03-SHKP 63-WHKP 58-MHKP OCN/retseyloP 38-MHKP tneibmaK2
AMP03-SHKP 43-WHKP 103-MHKP 76-PCKP OCN/retseyloP 63-WHKP BHKP 58-MHKP dekcolbK1 08-PCKP 38-MHKP
HHKP 53-WHKP 03-MHKP enimaleM 04-SHKP 43-WHKP 103-MHKP tesomreht 63-WHKP 58-MHKP
HHKP 53-WHKP cilonehP 03-MHKP 04-SHKP 43-WHKP 103-MHKP tesomreht 56-RP 56-RP 58-MHKP
BH-REC yxopE BH-REC 76PC-REC 76PC-REC cinoitaC BH-REL BH-NEL
BHKP BHKP AVE 103-MHKP 001-BHKP tlemtoh 08-PCKP 08-PHKP
08-PHKP 002-PHKP UPT 08-PCKP HHKP tlemtoh BHKP BHKP
InChemRez Phenoxy resins can be used as the ated at levels as low as 10% to act as antiplastizers sole resin vehicle in adhesives formulations. For imparting properties such as stiffness and cohe- crosslinked systems using the pendant second- sive strength. ary hydroxyls on the Phenoxy backbone it is rec- ommended to empirically determine the best level For modifying epoxy systems, the powder grades of crosslinker for a balance of coatings properties of Phenoxy are easy to incorporate. Alternatively, such as hardness and flexibility. Usually the level the liquid and solid blends offered by InChem pro- of crosslinker or hardener is about 10 to 15 phr vide a “user friendly” avenue. Phenoxy behaves as (parts per hundred) on a solids basis. Typical a “hard plasticizer” in many epoxy matrices used crosslinkers used in thermoset applications are as adhesives by interpenetration. In acid cured melamine-formaldehyde resins, phenolics, blocked and anhydride-cured systems Phenoxy may par- isocyanates, and polycarboxylic acids. InChem tially tie into the cured matrix. now provides a phenolic crosslinker called InChemRez PR-65 (see page 10) useful for ther- moset coatings and adhesives based on hydroxyl functional vehicles like solid grade epoxies, OH- functional polyesters, and Phenoxy resins.
In hot melt applications with thermoplastic ure- thanes (TPU’s) and copolyethylene vinyl acetate resins (EVA’s) Phenoxy resins can be incorpor-
18 Composites Selection Guide
InChemRez Phenoxy resins have specific uses in composites applica- tions both in fiber sizing and in matrix resin compostions. Phenoxy resins Solventborne have excellent adhesion to glass and carbon fibers. Phenoxy sizings enable exellent compatibilty with epoxy-based Water-borne matrix resins, and with viny ester based resins. High solids Because of the pendant backbone hy- droxyls, Phenoxy can be thermoset with select crosslinkers to provide maxi- mum strength, heat resistance, and chemical resistance. Phenoxy can also be formulated into epoxy and urethane based composite formulations to provide toughness and adhesion to the reinforcement.
APPLICATION GUIDE: COMPOSITE FEATURE & TECHNOLOGY
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JHKP 53-WHKP BHKP elisneT EFKP 52-RES htgnerts
01-RES 63-WHKP BH-REC eruC BH-REL 58-MHKP deeps
dilosllA 53-WHKP BHKP taeH sedargtellep ecnatsiser
dilosllA BH-NEL sedargtellep scinoiwoL VLBH-NEL
EFKP 53-WHKP BH-NEL erutsioM 56-RP ecnatsiser
19 APPLICATION GUIDE: COMPOSITE CHEMISTRY TYPE & TECHNOLOGY
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HHKP WBH-REL VLBH-NEL enimA/yxopE 04-SHKP BH-REC tneibmaK2 52-RES BH-NEL 01-RES 52-RES
002-PHKP WBH-REL BH-NEL reknil-X/yxopE 52-RES VLBH-NEL tnetalK1 01-RES 52-RES BH-NEL 01-RES
AMP03-SHKP 63-WHKP 58-MHKP OCN/retseyloP 43-WHKP 38-MHKP tneibmaK2
AMP03-SHKP 43-WHKP 76-PCKP OCN/retseyloP 63-WHKP 58-MHKP dekcolbK1 38-MHKP
BHKP etalyrcA erucedixorep
HHKP 53-WHKP cilonehP 03-MHKP 04-SHKP 43-WHKP 103-MHKP tesomreht 56-RP 56-RP 58-MHKP
BH-REC yxopE BH-REC 76PC-REC 76PC-REC cinoitaC BH-REL BH-NEL
HHKP BHKP 43-WHKP enimaleM 04-SHKP 001-BHKP 53-WHKP tesomreht 76-PCKP 08-PHKP
20 Plastics Selection Guide
In plastics applications InChemRez Phenoxy resins offer a wide selection for your chosen technology. Phenoxy resins find use in blends of PBT, PET, PPO, Processing Aid nylon, and polycarbonate resins for modi- fying physical properties such as tensile, flexural, and impact strengths. The addition Blends of Phenoxy improves pigment/filler wetting for appearance and rheology control. Additionally Phenoxy resins are useful as Compatibilizer compatibilizing agents for dissimilar plastics like polyolefins and polyesters. Tie-layer Because of transesterification reactions Phenoxy resin can behave as processing aids with polyesters such as polyethylene terephthalate during extrusion.
APPLICATION GUIDE: PLASTICS FEATURE & TECHNOLOGY
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JHKP EFKP HHKP JHKP elisneT EFKP JHKP EFKP suludom
JHKP EFKP HHKP EFKP laruxelF EFKP htgnerts
EFKP EFKP HHKP JHKP laruxelF JHKP EFKP suludom
EFKP EFKP BHKP HHKP tcapmI 08-PCKP EFKP htgnerts
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HHKP HHKP ytiralC HHKP HHKP rolocdna
dilosllA EFKP ropaV EFKP sedargtellep HHKP reirrab HHKP
21 APPLICATION GUIDE: PLASTIC CHEMISTRY TYPE & TECHNOLOGY
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HHKP BHKP BHKP HHKP EFKP EFKP EFKP TEP/TBP
HHKP EFKP EFKP HHKP -lynehpyloP EFKP edixoene
EFKP EFKP EFKP EFKP nolyN HHKP
EFKP EFKP HHKP etanobracyloP
EFKP snifeloyloP
EFKP -lynivyloP EFKP larytub HHKP
lynivyloP EFKP HHKP enodilorryp BHKP
HHKP HHKP CHKP s'UPT EFKP BHKP
EFKP HHKP enelyklayloP HHKP sedixo
HHKP HHKP -orpacyloP EFKP EFKP HHKP enotcal HHKP
Because of its unique structure and properties Alloys made with Phenoxy have been shown to Phenoxy resins, when used as additives in plas- possess improved thermal stability. The tough- tics applications, can greatly improve not only the ness of Phenoxy resins also imparts improved processability of these materials but also improve mechanical performance to finished products. As the quality and performance of the finished a result, the addition of Phenoxy resins can re- product. sult in cost reductions as less material (thinner cross sections) is required to achieve the desired During processing the addition of Phenoxy can performance. The excellect vapor barrier proper- help to control process rheology as well as the heat ties of Phenoxy resins can be beneficial in plastic distortion temperatures in extrusion, molding and film applications where protection against mois- film formation operations. The amorphous nature of ture or oxygen is required. Phenoxy resin can also be helpful in controlling the crystallization kinetics of thermoplastic materials.
22 Viscosity/solids relationships for standard grades of Phenoxy resins in common solvents and solvent mixtures are shown on pages 23-25. On page 26 a list of common solvents and diluents for standard Phenoxy resin is tabulated. Where noted, the solubility of Phenoxy resins may be limited, es- pecially in situations where the solvent is in high excess (low solids region). For example, with methyl ethyl ketone, phase out will occur with Phenoxy resin (PKHH, PKHB) below about 22% solids. Interestingly, the phase out can be rectified with a small addition of water (about 1%).
VISCOSITY PROFILES FOR PHENOXY RESINS IN CYCLOHEXANONE AND METHYL ETHYL KETONE
10000000
1000000
C PKHJ Cyclohexanone o 100000 PKHH
10000 PKHB
1000
Viscosity, cP at 25 cP Viscosity, Methyl ethyl ketone
100
10 0 1020304050 Percent solids
23 VISCOSITY PROFILES FOR PHENOXY RESINS IN PM SOLVENT AND PM ACETATE
1000000
100000 PM Solvent C o PKHJ
10000 PKHH
PM Acetate 1000 PKHB Viscosity, cP at 25 cP at Viscosity,
100
10 0 5 10 15 20 25 30 35 40 45 Percent Solids
VISCOSITY PROFILES FOR PHENOXY RESINS IN BINARY SOLVENT BLEND: MEK AND AROMATIC 100
100000
SOLVENT BLEND IS: 3:2 by weight MEK Aromatic 100 PKHH
10000 C o
1000
PKHB
Viscosity, in cP at 25 cP in Viscosity, 100
10 0 1020304050 Percent Solids
24 VISCOSITY PROFILES FOR PHENOXY RESINS IN PM ACETATE/AROMATIC 100 (3/2)
1000000
PKHH C o 100000
Weight ratio of PM Acetate to Aromatic 100 solvents PKHB is 3 parts to 2 parts
Insoluble mixtures below this point 10000 at 25oC Viscosity, in cP at 25
1000 0 102030405060 Percent Solids
VISCOSITY PROFILES FOR PHENOXY RESINS IN LOW VOC TERNARY SOLVENT BLENDS
100000
SOLVENT BLEND IS: 1:1:1 by weight cyclohexanone PKHH acetone (VOC exempt) 10000 methyl acetate (VOC exempt) C o
PKHB 1000
Viscosity, in cP at 25 100
10 0 102030405060 Percent Solids
25 PHENOXY SOLVENT TABLE
Phenoxy Resin Comments Solubility Solvent Type:
Ketones: cyclohexanone Excellent methy ethyl ketone (MEK) Good Phase separation below 22% solids methyl isobutyl ketone (MIBK) Insoluble (at 25% NV) methyl amyl ketone (MAK) Insoluble (at 25% NV) acetone Insoluble (at 25% NV) Soluble at > 45% NV
Alcohols: methanol, ethanol, butanol Insoluble isopropanol Insoluble benzyl alcohol Good
Glycol ethers: ethyleneglycol alkyl ethers Excellent Cellosolve, butyl Cellosolve, etc. (Dow) diethyleneglycol alkyl ethers Excellent Carbitol, butyl Carbitol, etc. (Dow) propyleneglycol alkyl ethers Excellent dipropyleneglycol al kyl ethers Excellent phenoxypropanol Excellent Dowanol PPh (Dow)
Esters: alkyl acetates Insoluble methyl , or ethyl , or butyl acetate, etc. ethyl lactate Good dibasic esters Good DBE (DuPont) ethyleneglycol ethylether acetate Good diethyleneglycol ethylether acetate Good propyleneglycol methylether acetate Good ethoxyethyl propionate Good Ektapro EEP (Eastman) phenoxyethyl acrylate Good tripropyleneglycol diacrylate Good hexanediol diacrylate Poor
Hydrocarbons: toluene Insoluble These materials are useful diluents xylene Insoluble for Phenoxy when combined with Aromatic 100 Insoluble polar, aprotic solvents; use at 40% hexane Insoluble maximum on solvent basis
Miscellaneous: tetrahydrofuran Excellent N-methyl pyrrolidone Excellent p-chloro benzotrifluoride Insoluble diacetone alcohol Good cresyl glycidylether Good butyl glycidylether Insoluble methylene chloride Good
26 PROPERTIES OF INCHEMREZ PHENOXY PKFE SOLID GRADE
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