New Microarchitecture for 4Th Gen Intel® Core™ Processor Platforms
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Dual-Core Intel® Xeon® Processor 3100 Series Specification Update
Dual-Core Intel® Xeon® Processor 3100 Series Specification Update — on 45 nm Process in the 775-land LGA Package December 2010 Notice: Dual-Core Intel® Xeon® Processor 3100 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this Specification Update. Document Number: 319006-009 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. -
Microcode Revision Guidance August 31, 2019 MCU Recommendations
microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. -
HP Engage Flex Pro-C Retail System Your Retail Workhorse, Now Available in a Handy Miniature Size
Datasheet HP Engage Flex Pro-C Retail System Your retail workhorse, now available in a handy miniature size Efficiently manage your retail business from the store floor to the back office with the petite but powerful HP Engage Flex Pro-C. Our stable, secure, and highest-performing compact retail platform is 30% smaller than its predecessor and still delivers maximum flexibility for a range of deployments. Build your best solution for even the smallest spaces HP recommends Windows 10 Pro for business Configure the perfect fit for your space, users, and environment— point of sale, video surveillance, processing/controlling, digital Windows 10 Pro1 signage or OEM needs—with flexible connectivity, graphics, and networking options and a suite of retail peripherals.2 Poised to perform and expand with your business Tackle every retail challenge with a powerful 8th Gen Intel® processor3 and Intel® Optane™ memory.4 Adjust capacity as your needs change with endless storage options like an Intel® Optane™ SSD, SATA or M.2—up to four total drives per system.2 Secure, manageable, and reliable out of the box Reduce the cost and complexity of managing your platforms and secure your critical assets with innovative, integrated, and proactive security and manageability features for your system and its data. Featuring Stick with an OS you know with your choice of Windows 10 Pro, Windows IoT or FreeDOS. Get hardware-enforced self-healing protection from HP Sure Start Gen4, manage your system across the OS with HP Manageability Integration Kit, maintain critical OS processes with HP Sure Run, and restore your image over a network with HP Sure Recover. -
Single Board Computer
Single Board Computer SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) SBC-C66 and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs High-performing, flexible solution for intelligence at the edge HIGHLIGHTS CONNECTIVITY CPU 2x USB 3.1; 4x USB 2.0; NVMe SSD Slot; PCI-e x8 Intel® 8th gen. Core™ / Xeon® and 9th gen. Core™ / port (PCI-e x16 mechanical slot); VPU High Speed Xeon® / Pentium® / Celeron® CPUs Connector with 4xUSB3.1 + 2x PCI-ex4 GRAPHICS MEMORY Intel® UHD Graphics 630/P630 architecture, up to 128GB DDR4 memory on 4x SO-DIMM Slots supports up to 3 independent displays (ECC supported) Available in Industrial Temperature Range MAIN FIELDS OF APPLICATION Biomedical/ Gaming Industrial Industrial Surveillance Medical devices Automation and Internet of Control Things FEATURES ® ™ ® Intel 8th generation Core /Xeon (formerly Coffee Lake H) CPUs: Max Cores 6 • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Max Thread 12 HyperThreading • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Intel® QM370, HM370 or CM246 Platform Controller Hub Chipset Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), (PCH) with HyperThreading • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB 2x DDR4-2666 or 4x DDR4-2444 ECC SODIMM Slots, up to 128GB total (only with 4 SODIMM modules). Cache, 45W TDP (35W cTDP) Memory ® ™ ® ® ECC DDR4 memory modules supported only with Xeon Core Information subject to change. Please visit www.seco.com to find the latest version of this datasheet Information subject to change. -
"PCOM-B216VG-ECC.Pdf" (581 Kib)
Intel® Arrandale processor based Type II COM Express module support ECC DDR3 SDRAM PCOM-B216VG-ECC with Gigabit Ethernet 204pin ECC DDR3 SODIMM socket ® Intel QM57 ® Intel Arrandale processor FEATURES GENERAL CPU & Package: Intel® 45nm Arrandale Core i7/i5/i3 or Celeron P4505 ® Processor The Intel Arrandale and QM57 platform processor up to 2.66 GHz with 4MB Cache in FC-BGA package with turbo boost technology to maximize DMI x4 Link: 4.8GT/s (Full-Duplex) CPU & Graphic performance Chipset/Core Logic Intel® QM57 ® Intel Arrandale platform support variously System Memory Up to 8GB ECC DDR3 800/1066 SDRAM on two SODIMM sockets powerful processor from ultra low power AMI BIOS to mainstream performance type BIOS Storage Devices SATA: Support four SATA 300 and one IDE Supports Intel® intelligent power sharing Expansion Interface VGA and LVDS technology to reduce TDP (Thermal Six PCI Express x1 Design Power) LPC & SPI Interface High definition audio interface ® ® Enhance Intel vPro efficiency by Intel PCI 82577LM GbE PHY and AMT6.0 Hardware Monitoring CPU Voltage and Temperature technology Power Requirement TBA Support two ECC DDR3 800/1066 SDRAM on Dimension Dimension: 125(L) x 95(W) mm two SODIMM sockets, up to 8GB memory size Environment Operation Temperature: 0~60 °C Storage Temperature: -20~80 °C Operation Humidity: 5~90% I/O ORDERING GUIDE MIO N/A IrDA N/A PCOM-B216VG-ECC ® Standard Ethernet One Intel 82577LM Gigabit Ethernet PHY Intel® Arrandale processor based Type II COM Express module with ECC DDR3 SDRAM and Audio N/A Gigabit Ethernet USB Eight USB ports Keyboard & Mouse N/A CPU Intel® Core i7-610E SV (4M Cache, 2.53 GHz) Support List Intel® Core i7-620LE LV (4M Cache, 2.00 GHz) Intel® Core i7-620UE ULV (4M Cache, 1.06 GHz) Intel® Core i5-520E SV (3M Cache, 2.40 GHz) Intel® Celeron P4505 SV (2M Cache, 1.86 GHz) DISPLAY Graphic Controller Intel® Arrandale integrated Graphics Media Accelerator (Gen 5.75 with 12 execution units) * Specifications are subject to change without notice. -
Deskmini H470 Series.Pdf
Version 1.0 Published June 2020 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. CALIFORNIA, USA ONLY The Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/ perchlorate” AUSTRALIA ONLY Our goods come with guarantees that cannot be excluded under the Australian Consumer Law. You are entitled to a replacement or refund for a major failure and compensation for any other reasonably foreseeable loss or damage caused by our goods. You are also entitled to have the goods repaired or replaced if the goods fail to be of acceptable quality and the failure does not amount to a major failure. The terms HDMI™ and HDMI High-Definition Multimedia Interface, and the HDMI logo are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries. Contents Chapter 1 Introduction 1 1.1 Package Contents 1 1.2 Specifications 2 Chapter 2 Product Overview 4 2.1 Front View 4 2.2 Rear View 5 1.3 Motherboard Layout 6 Chapter 3 Hardware Installation 13 3.1 Begin Installation 13 3.2 -
HP Proone 400 G6 20 All-In-One PC Ready for Versatile Work Environments
Datasheet HP ProOne 400 G6 20 All-in-One PC Ready for versatile work environments Easy to deploy, sleek, and feature-rich, the HP ProOne 400 20 All-in-One PC features a contemporary design with business-class performance, collaboration, security, and manageability features. Functionality for the multi-device world HP recommends Windows 10 Pro for Provide users with multiple devices options for how they work and stay productive. New business flexibility is delivered by the HP ProOne 400 20 AiO that can be used as a full PC or as an additional display for another desktop or laptop PC.2 1 HP recommends Windows 10 Pro for Sleek, elegant design business Featuring a sleek design, this AiO undergoes MIL-STD 810H testing3 and still suits the front 2 desk or an owner’s office. The anti-glare 19.5-inch diagonal display provides plenty of Intel® Core™ processors workspace. HP exclusive security and manageability Help prevent data breaches and downtime with HP Sure Sense4, HP Sure Click5, and HP BIOSphere Gen5.6 Simplify management with the HP Manageability Integration Kit.7 Ease fleet deployment and management with the optional Intel® Q470 chipset and Intel® vPro™.8 Powerful options Choose a high-performance 10th Gen Intel® Core™ processor9 with optional PCIe NVMe™ SSD storage10 and high-speed DDR4 memory10 or Intel® Optane™ memory H1011, and optional high-end discrete graphics.10 Support a commitment to create and use more sustainable products. The high-efficiency power supply, use of ocean-bound plastics in the speaker box and molded pulp packaging help reduce the impact on the environment.12 Malware is evolving rapidly, and traditional antivirus can’t always recognize new attacks. -
HP 250 Notebook PC
HP 250 Notebook PC Our value-priced notebook PC with powerful essentials ideal for everyday computing on the go. HP recommends Windows. Built for mobile use Designed for productivity For professionals on the move, the HP 250 features a Connect with colleagues online and email from the durable chassis that helps protect against the rigors of office or from your favorite hotspots with Wi-Fi the day. CERTIFIED™ WLAN.5 Carry the HP 250 from meeting to meeting. Enjoy great From trainings to sales presentations, view high-quality views on the 15.6-inch diagonal HD2 display, without multimedia and audio right from your notebook with sacrificing portability. preinstalled software and the built-in Altec Lansing speaker. Powered for business Tackle projects with the power of the Intel® third Make an impact with presentations when you connect 2 6 7 generation Core™ i3 or i5 dual-core processors.3 to larger HD displays through the HDMI port. Develop stunning visuals without slowing down your notebook, thanks to Intel’s integrated graphics. 4 HP, a world leader in PCs brings you Windows 8 Pro designed to fit the needs of business. HP 250 Notebook PC HP recommends Windows. SPECIFICATIONS Operating system Preinstalled: Windows 8 644 Windows 8 Pro 644 Ubuntu Linux FreeDOS Processor 3rd Generation Intel® Core™ i5 & i33; 2nd Generation Intel® Core™ i33; Intel® Pentium® 3; Intel® Celeron® 3 Chipset Mobile Intel® HM70 Express (Intel® Pentium® and Celeron® processors) Mobile Intel® HM75 Express (Intel® Core™ i3 and i5 processor) Memory DDR3 SDRAM (1600 MHz) -
Intel® Xeon® Processor 5600 Series Specification Update February 2015 Contents
Intel® Xeon® Processor 5600 Series Specification Update Febuary 2015 Reference Number: 323372-017US You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Intel technologies may require enabled hardware, specific software, or services activation. Check with your system manufacturer or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm%20 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details See the http://processorfinder.intel.com/ or contact your Intel representative for more information. -
Discover, Develop, Deliver with the New Intel® Celeron® Processor
Product Brief The New Intel® Celeron® Processor THE NEW INTEL® CELERON® PROCESSOR DISCOVER DEVELOP DELIVER The new Intel® Celeron® processor built around Intel’s latest microarchitecture and manufactured on Intel’s state-of-the-art 14nm process technology delivers Intel level performance that lets you enjoy entertainment and get your work done. Get performance and value you can count on with an Intel Celeron processor. When paired with the latest Intel® H110 Chipset, Intel Celeron processor-based PCs are an ideal choice for editing photos one minute and watching movies the next, and going from spreadsheets to gaming in a flash. That’s serious processing. Only with Intel Inside®. Product Brief The New Intel® Pentium® MAKES VIDEO CREATION AND TECHNOLOGY The new 14nm Intel Celeron processor brings support for the latest CONVERSION technologies such as DDR4 RAM memory that enables PCs to have a high memory data transfer speed at a lower power as compared to FAST AND EASY DDR3. Intel HD graphics 510 delivers some great graphics with support up to 4K resolution and 3 independent displays. Intel Quick Sync Video technology delivers amazing hardware acceleration that makes video conversion and creation fast and easy. 2 INTEL ® CELERON® PROCESSOR FEATT URES A A GLANCE INTEL ® CELERON® G39XX FEATURES BENEFITS Socket LGA 1151 Dual-Core Runs two independent processor cores in Manufacturing 14nm Processing one physical package at the same frequency. Process Intel® Smart The shared cache is dynamically allocated Processor Base Up to 2.9 GHz Cache to each processor core, based on workload. Frequency on G39XX Efficient last-level cache data usage and instant communication between the core Intel® Smart Cache 2 MB L3 shared and memory. -
Intel Unveils All New 2010 Intel® Core™ Processor Family
Intel Unveils All New 2010 Intel® Core™ Processor Family Industry's Smartest, Most Advanced Technology Available in Variety of Price Points LAS VEGAS, Jan 07, 2010 (BUSINESS WIRE) -- Intel Corporation: NEWS HIGHLIGHTS 1 ● Mainstream processors now offer Intel(R) Turbo Boost Technology , automatically adapting to an individual's performance needs ● First 32 nanometer processors and first time Intel is mass-producing a variety of chips at mainstream prices at start of new manufacturing process, reflecting last year's $7 billion investment during economic recession 4 ● Intel(R) Core(TM) i5 processors are about twice as fast as comparable existing PCs for visibly faster video, photo and music downloading experience ● Historic milestone: select processors integrate graphics directly on processors; also include Intel's second generation high-k metal gate transistors ● Beyond laptops and PCs, processors also target ATMs, travel kiosks, digital displays ● More than 10 new chipsets and new 802.11n WiFi and WiMAX products with new Intel(R) My WiFi features Intel Corporation introduced its all new 2010 Intel(R) Core(TM) family of processors today, delivering unprecedented integration and smart performance, including Intel(R) Turbo Boost Technology1 for laptops, desktops and embedded devices. The introduction of new Intel(R) Core(TM) i7, i5 and i3 chips coincides with the arrival of Intel's groundbreaking new 32 nanometer (nm) manufacturing process - which for the first time in the company's history - will be used to immediately produce and deliver processors and features at a variety of price points, and integrate high-definition graphics inside the processor. This unprecedented ramp and innovation reflects Intel's $7 billion investment announced early last year in the midst of a major global economic recession. -
Variation Among Processors Under Turbo-‐Boost
Variation Among Processors Under Turbo-Boost Bilge Acun, Ph.D. Candidate Department of Computer Science University of Illinois at Urbana-Champaign This talk is based on the publicaon: Bilge Acun, Phil Miller, Laxmikant Kale. ICS 2016. 1 “Variaon Among Processors under Turbo Boost in HPC Systems”. Motivation: Performance Variation 16% Performance Only 1% VariaEon on Variaon on Edison, Blue Waters! Cab, Stampede! ��������������������������� ���� ���� �������� ���� ��� ���� ������ ���� ���� ���� ���� Acun, Miller, Kale. “Variaon Among Processors under Turbo ���� Boost in HPC Systems” [ICS 2016] �������������������� �� ���� ���� ���� ���� ���� ���� ���� ���� 2 ������� • 16K cores running local DGEMM kernel of Intel-MKL What is Dynamic Overclocking? • Processor changes the frequency opportunis3cally since it cannot run at the highest limit all the 3me. • E.g. Intel Turbo Boost Technology • Factors effec3ng the dynamic frequency: • Type of the workload • Number of ac3ve cores • Current consump3on �������������������������� • Power consump3on ��� • Temperature Acun, Miller, Kale. “Variaon Among Processors under Turbo Boost in HPC Systems” [ICS 2016] ��� ��������������� �������� ���� ���� 3 �� ���� ���� ���� ���� ���� ���������� Motivation: Frequency Variation ������������������������������ ���� ������ ��������������� ���� ��� ��������������� ���� �������� ��������������� ���� ���� ���� �������������� ���� ���� Acun, Miller, Kale. “Variaon Among Processors under Turbo ���� ���� ���� ���� ���� ���� �� ���� ���� Boost in HPC Systems” [ICS 2016] ���������������