Marrying Many-Core Accelerators and Infiniband for a New Commodity Processor
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Computer Architectures an Overview
Computer Architectures An Overview PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 25 Feb 2012 22:35:32 UTC Contents Articles Microarchitecture 1 x86 7 PowerPC 23 IBM POWER 33 MIPS architecture 39 SPARC 57 ARM architecture 65 DEC Alpha 80 AlphaStation 92 AlphaServer 95 Very long instruction word 103 Instruction-level parallelism 107 Explicitly parallel instruction computing 108 References Article Sources and Contributors 111 Image Sources, Licenses and Contributors 113 Article Licenses License 114 Microarchitecture 1 Microarchitecture In computer engineering, microarchitecture (sometimes abbreviated to µarch or uarch), also called computer organization, is the way a given instruction set architecture (ISA) is implemented on a processor. A given ISA may be implemented with different microarchitectures.[1] Implementations might vary due to different goals of a given design or due to shifts in technology.[2] Computer architecture is the combination of microarchitecture and instruction set design. Relation to instruction set architecture The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the execution model, processor registers, address and data formats among other things. The Intel Core microarchitecture microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. -
Warwick.Ac.Uk/Lib-Publications MENS T a T a G I MOLEM
A Thesis Submitted for the Degree of PhD at the University of Warwick Permanent WRAP URL: http://wrap.warwick.ac.uk/102343/ Copyright and reuse: This thesis is made available online and is protected by original copyright. Please scroll down to view the document itself. Please refer to the repository record for this item for information to help you to cite it. Our policy information is available from the repository home page. For more information, please contact the WRAP Team at: [email protected] warwick.ac.uk/lib-publications MENS T A T A G I MOLEM U N IS IV S E EN RS IC ITAS WARW The Readying of Applications for Heterogeneous Computing by Andy Herdman A thesis submitted to The University of Warwick in partial fulfilment of the requirements for admission to the degree of Doctor of Philosophy Department of Computer Science The University of Warwick September 2017 Abstract High performance computing is approaching a potentially significant change in architectural design. With pressures on the cost and sheer amount of power, additional architectural features are emerging which require a re-think to the programming models deployed over the last two decades. Today's emerging high performance computing (HPC) systems are maximis- ing performance per unit of power consumed resulting in the constituent parts of the system to be made up of a range of different specialised building blocks, each with their own purpose. This heterogeneity is not just limited to the hardware components but also in the mechanisms that exploit the hardware components. These multiple levels of parallelism, instruction sets and memory hierarchies, result in truly heterogeneous computing in all aspects of the global system. -
Mapping China's Semiconductor Ecosystem in Global Context
June 2021 ∙ John Lee & Jan-Peter Kleinhans Mapping China’s semiconductor ecosystem in global context Strategic Dimensions and Conclusions Policy Brief June 2021 China’s semiconductor ecosystem Executive Summary Historically, the semiconductor value chain has flourished thanks to transnational divisions of labor that supported high levels of economic efficiency and innovation. As a result, interdependencies throughout this value chain exist between different regions around the globe. The US-China technology rivalry, the COVID19 pandemic and global shortages in semiconductors have led many governments to scrutinize these interdependencies in the transnational semiconductor value chain. The US government for example has completed a review of the semiconductor supply chain. Europe’s new industrial strategy focuses on assessing and managing strategic de- pendencies in different technology ecosystems, including semiconductors. China’s capabilities in the semiconductor value chain play a key role in these con- siderations. China’s government is making great efforts to raise the competitiveness of Chinese industry in the semiconductor sector, building on and supporting China’s role in global electronics manufacturing and emerging technological ecosystems. With growing strategic concerns in the US and Europe about China, a better un- derstanding and systematic assessment of China’s capabilities in producing semi- conductors is needed. What is the position within the semiconductor value chain of Chinese companies? In which areas is China highly reliant on foreign technology providers? How likely is China to catch up within this decade in a particular produc- tion step? This report provides a framework for assessing the national interest vis-à-vis Chi- na’s role in the semiconductor value chain. -
D5.5 Innovative HPC Trends and the Hidalgo Benchmarks
HiDALGO D5.5 Innovative HPC Trends and the HiDALGO Benchmarks Document Identification Status Final Due Date 31/05/2020 Version 1.0 Submission Date 19/06/2020 Related WP WP5 Document Reference D5.5 Related D3.1, D3.2, D5.1, Dissemination Level (*) PU Deliverable(s) D5.2, D5.3 Lead Participant PSNC Lead Author Marcin Lawenda Contributors PSNC Reviewers Konstantinos Nikas USTUTT (ICCS) ECMWF Nabil Ben Said ICCS (MOON) Keywords: New promising technologies, HPC, benchmarks, scalability, efficiency, Exascale, Global Challenges, Global Systems Science This document is issued within the frame and for the purpose of the HiDALGO project. This project has received funding from the European Union’s Horizon2020 Framework Programme under Grant Agreement No. 824115. The opinions expressed and arguments employed herein do not necessarily reflect the official views of the European Commission. The dissemination of this document reflects only the author’s view and the European Commission is not responsible for any use that may be made of the information it contains. This deliverable is subject to final acceptance by the European Commission. This document and its content are the property of the HiDALGO Consortium. The content of all or parts of this document can be used and distributed provided that the HiDALGO project and the document are properly referenced. Each HiDALGO Partner may use this document in conformity with the HiDALGO Consortium Grant Agreement provisions. (*) Dissemination level: PU: Public, fully open, e.g. web; CO: Confidential, restricted under conditions set out in Model Grant Agreement; CI: Classified, Int = Internal Working Document, information as referred to in Commission Decision 2001/844/EC.