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Take a Closer Look at Viasystems Tran S Form a Tio

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Take a Closer Look at Viasystems Tran S Form a Tio s s ynergy gr wth gr 2010 Annual Report tio a ction succe Viasystems Annual Report 2010 Viasystems form Take a Closer Look at Viasystems s trategy tran Viasystems Group, Inc. 101 South Hanley Road St. Louis, MO 63105 (314) 727-2087 Markets Served Board of Directors Christopher J. Steffen Robert F. Cummings, Jr. Edward Herring Chairman of the Board Vice Chairman of Investment Banking, Partner, HM Capital Partners LLC JP Morgan Chase & Co. David M. Sindelar William C. McCormick Chief Executive Offi cer Kirby A. Dyess Retired Chairman and Chief Executive Automotive 35% Principal, Austin Capital Management LLC Offi cer, Precision Castparts Corp. Timothy L. Conlon Telecom 24% President and Chief Operating Offi cer Peter E. Frank Richard A. McGinn President and Senior Managing Director, General Partner, RRE Ventures, LLC Industrial & Michael D. Burger GSC Group, LLC Instrumentation 24% President and Chief Executive Offi cer, John K. Pruellage Cascade Microtech, Inc. Jack D. Furst Member and Chairman of Lewis, Computer & Datacom 13% Former Partner, HM Capital Partners LLC Rice & Fingersh, L.C. Military & Aerospace 4% Officers Board Committees David M. Sindelar Audit Compensation Geography Where Sold Chief Executive Offi cer Christopher J. Steffen, Interim Chair Richard A. McGinn, Chair William C. McCormick Robert F. Cummings, Jr. Timothy L. Conlon Richard A. McGinn Kirby A. Dyess President and John K. Pruellage Christopher J. Steffen Chief Operating Offi cer Nominating and Executive Gerald G. Sax Governance Christopher J. Steffen, Chair Senior Vice President and Christopher J. Steffen, Chair Robert F. Cummings, Jr. Chief Financial Offi cer Robert F. Cummings, Jr. Jack D. Furst Americas 43% Kirby A. Dyess David M. Sindelar Brian W. Barber William C. McCormick Asia 33% Senior Vice President, Operations – PCB and Europe 24% Supply Chain Management Richard B. Kampf Senior Vice President, Sales and Marketing Geography Where Manufactured Shareholder Information Corporate Office Annual Meeting Viasystems Group, Inc. The annual meeting of shareholders Independent Registered 101 South Hanley Road of Viasystems Group, Inc., will be held Public Accounting Firm St. Louis, MO 63105 on May 3, 2011, at 7:30 a.m. local time, at: Ernst & Young LLP 314-727-2087 The Ritz-Carlton, St. Louis 190 Carondolet Plaza, Suite 1300 100 Carondelet Plaza St. Louis, MO 63105 St. Louis, MO 63105 Asia 79% Investor Relations Contact Dee Johnson Market Information Americas 21% Vice President, Investor Relations Transfer Agent The company’s common stock is and Communications Computershare Trust Company, N.A. traded on the NASDAQ stock exchange 314-719-1869 250 Royall St. under the symbol VIAS and has been [email protected] Canton, MA 02021 since February 17, 2010. 877-282-1168 www.computershare.com Pro forma combined Viasystems and Merix Fellow Shareholders: The year 2010 was transformational for Viasystems Group, and Merix, 2010 sales reflected 30% organic growth. We Inc. In February, we completed the acquisition of Merix experienced significant cost inflation in both labor and Corporation, recapitalized our company, and became a materials but were able to balance cost pressures with price publicly traded company on the NASDAQ stock exchange. increases and cost-saving activities to maintain and improve We integrated the two companies quickly and successfully, our margins. Adjusted EBITDA1 of $142 million exceeded achieved our synergy goals, and now operate as one global our 2010 goal of 15% of sales. company. The business combination brought us involvement We now have 14,800 employees and ten manufacturing in new markets, including the military & aerospace market facilities providing PCBs and electro-mechanical assemblies and the North American quick-turn market for printed circuit to the global automotive, telecommunications, industrial & instrumentation, computer & datacom, and military & aerospace end markets. In addition to achieving our financial goals in 2010, we are very pleased with our strategic position and our progress in forming a company with one successful culture. We are one of the world’s largest and most capable suppliers of printed circuit boards and backplanes. We excel at complex, high-layer-count boards with very high reliability requirements as found in products such as automotive safety systems and < Adjusted EBITDA1 in 2010 was $142 mil- lion compared with $58 million in 2009. David Sindelar, Chief Executive Officer boards (PCBs), and raised the number of active customers from approximately 125 to more than 800. % At the same time, overall economic recovery and a lot of hard work enabled us to achieve consolidated net sales143 of $929 million for 2010, an 87% increase year-over-year. 1 Adjusted EBITDA, a non-GAAP measure, is defined Compared with the combined 2009 sales of Viasystems and reconciled to operating income on pages 36-37 of the Annual Report on form 10-K included in this document. 1 Viasystems 2010 Annual Report aircraft controls. Now that we have two of the finest quick- quick-turn plants to learn firsthand the product offerings that turn PCB operations in North America as well as both quick- were new to them. We are working hard to identify, qualify turn and low-cost, high-volume PCB capacity in China, we and quote many additional E-M Solutions products for our offer customers a full life-cycle capability from new product PCB customers. Likewise, for many longstanding Viasystems introduction (NPI) through the ramp-up to high-volume customers, our North American PCB quick-turn capability production and maturity. We have extensive technical exper- now provides an additional opportunity for us to be involved tise and production capability for PCBs requiring advanced in the earliest stages of new products and programs, helping materials including heavy copper for high-power applications us to further solidify strong relationships. like electric vehicles. Our Electro-Mechanical (E-M) Solutions business is a verti- Pushing the cally integrated, cost effective provider of assembly and Technology Envelope integration services for products ranging from backplane assemblies (BPAs) to telecommunications cabinets to medical Viasystems offers an and industrial finished goods. We provide sheet-metal racks unparalleled combination of technical capabilities and cabinets, busbars, cable assemblies, BPAs, design support, and technical support around the world for printed circuit boards, full-system integration and testing services with a focus on backplanes and Electro-Mechanical Solutions. large, sophisticated, high-value products. We have a distinct Advanced Materials. Our expertise with a wide variety of capability to do NPI and product refinements for manufactur- advanced PCB materials enables us to meet current and future customer needs. ability and cost savings. Thermal Management Systems. Viasystems offers Our two segments, Printed Circuit Boards and Assembly a comprehensive array of PCB thermal solutions including heavy copper, press-fit and coin-attached heat sinks, and (E-M Solutions), are highly complementary, and synergies our patented embedded e-Coin technology. are a key to our growth plans. We moved quickly after the HDI and More. Our high-technology solutions give customers extensive design options including high-density merger to launch a cross-selling effort to bring the combined interconnect (HDI) with blind, buried and stacked vias, large- capabilities and benefits of our PCB and E-M Solutions busi- format backplanes with up to 60 layers, and circuit track widths as narrow as two mils. nesses to more of our customers. Salespeople joining us from Putting It All Together. Viasystems’ Electro-Mechanical Merix traveled to our China-based E-M Solutions and PCB Solutions group provides design support, fabrication, plants, and Viasystems salespeople visited the North American assembly, full-system integration and test for highly complex intermediate and finished industrial goods. < 2010 net sales were $929 million compared % with $496 million in 2009. 87 Viasystems 2010 Annual Report 2 Market Growth Outlook • Growing our market share in the military & aerospace and Cost Inflation market. 2 Industry analysts estimate that the compound annualized • Managing our investment in capacity to maximize our average growth rate for both the global PCB market and the sales opportunity and meet the needs of customers. overall market for electronic systems will be about 6% from • Providing best-in-class quality, service and delivery, 2010 through 2015. The automotive PCB market, which today so that we capture and retain increasing shares of our accounts for about 35% of our sales, has attractive growth customers’ purchases. prospects because of both the growth in vehicle production and the increasing electronic content per vehicle. One of our significant purchased material categories is copper-clad laminates (CCL), which contain a significant We have set an internal target to grow our sales at twice amount copper along with glass fiber, resins and other raw the market rate. To do this, we are focused on: materials. As copper reached historic high price levels in • Growing sales with existing customers by pursuing recent months, our industry faced challenging cross-selling opportunities with our E-M Solutions and material cost increases. Labor costs, PCB quick-turn capabilities. too, increased for us: the majority of 2 Prismark Partners, LLC, Printed Circuit Report, February 2011. Growing Outside the Box Viasystems’ goal is to Green Markets.
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