Real-Time Digital Signal Processing Laboratory
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Carrier Grade Virtualization
Carrier Grade Virtualization Leveraging virtualization in Carrier Grade Systems Abstract Network Equipment Providers (NEPs) have been building networking infrastructure equipment able to deliver “carrier grade” services, typically mission-critical services such as voice telephony. In decades past, NEPs have achieved high degrees of availability through purpose-built hardware and software implementations. Today they increasingly build on COTS (Commercial Off The Shelf) hardware and Open Source Software (OSS), freeing their engineering resources to focus on core telephony competencies. The move to COTS and OSS requires that these hardware and software components be available from an ecosystem of suppliers, and that they interoperate seamlessly. Bodies such as The Linux Foundation (LF), the Service Availability Forum (SA Forum) and PICMG have defined standards and specifications such as carrier grade OSes (CGLinux), Service Availability Forum APIs and AdvancedTCA hardware to target carrier grade applications. Recent advances have made virtualization appealing for carrier class equipment by permitting significant cost reduction through consolidation of workloads and of physical hardware. Virtualization also transparently lets NEPs and other OEMs (Original Equipment Manufacturers) leverage multi-core processors to run legacy software designed for uniprocessor hardware. However, virtualization needs to meet specific requirements to enable network equipment deploying this technology to meet industry expectations for carrier grade systems. This -
Paradigm Shift: the Winners Are
PARADIGM SHIFT: THE WINNERS ARE Dr. Jeremy Wang Asia Pacific Executive Director, GSA July 30, 2008 GSA Mission Accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation. GSA Board of Directors Dwight Decker Sanjay Jha Jodi Shelton Danny Biran Rick Cassidy Guillame Aart de Geus Conexant Qualcomm Altera TSMC North d’Eyssautier Synopsys, America picoChip Inc. Jack Harding Colin Harris Kenneth Joyce Fu Tai Liou Steven Longoria Dr. Nicky Lu Chris eSilicon Corp PMC-Sierra, Amkor UMC IBM Etron Malachowsky Inc. Technology, Inc. NVIDIA Vahid Manian Michael Rekuc Walden Rhines Naveed Vincent Tong Dr. Albert Wu Dr. Tien Wu Broadcom Chartered Mentor Graphics Sherwani Xilinx Marvell ASE, Inc. Corporation Open-Silicon Asia-Pacific Leadership Council Chairman Dr. Chintay Shih Xiaolang Yan Ming Kai Tsai H.P. Lin Qin-Sheng Wang K.C. Shih Dr. Nicky Lu Special Advisor College of MediaTek Faraday IC China Semiconductor Global Unichip Etron Information Industry Association Science and Engineering Zhejiang University Special Advisor Gordon Gau Chou-Chye Wen-Chi Chen Dr. Woodward Dr. Zhonghan Dr. Shaojun Wei Holtek Huang VIA Yang (John) Deng Phoenix Sunplus Silicon7 Vimicro Microelectronics Jordan Wu Dr. Ki Soo Lun Zhao Dr. Ping Wu Himax Hwang Datang Spreadtrum Technologies Core Logic, Inc. Microelectronics Communications Inc. EMEA Leadership Council David Milne Jalal Bagherli David Baillie Kobi Ben-Zvi Stan Boland Wolfson Dialog CamSemi Wintegra Icera Microelectronics Semiconductor Warren East Guillame d’Eyssautier Danny Hachoen Gennady Krasnikov Chris Ladas ARM, Inc. picoChip DSP Group Mikron JSC CSR Key Topics •Analog/Mixed Signal •Wireless •Automotive Eric Mayer John Schmitz Infineon NXP Semiconductor VC Advisory Council Wayne Cantwell Steve Domenik Phillip T. -
Comparison of Platform Virtual Machines - Wikipedia
Comparison of platform virtual machines - Wikipedia... http://en.wikipedia.org/wiki/Comparison_of_platform... Comparison of platform virtual machines From Wikipedia, the free encyclopedia The table below compares basic information about platform virtual machine (VM) packages. Contents 1 General Information 2 More details 3 Features 4 Other emulators 5 See also 6 References 7 External links General Information Name Creator Host CPU Guest CPU Bochs Kevin Lawton any x86, AMD64 CHARON-AXP Stromasys x86 (64 bit) DEC Alphaserver CHARON-VAX Stromasys x86, IA-64 VAX x86, x86-64, SPARC (portable: Contai ners (al so 'Zones') Sun Microsystems (Same as host) not tied to hardware) Dan Aloni helped by other Cooperati ve Li nux x86[1] (Same as parent) developers (1) Denal i University of Washington x86 x86 Peter Veenstra and Sjoerd with DOSBox any x86 community help DOSEMU Community Project x86, AMD64 x86 1 of 15 10/26/2009 12:50 PM Comparison of platform virtual machines - Wikipedia... http://en.wikipedia.org/wiki/Comparison_of_platform... FreeVPS PSoft (http://www.FreeVPS.com) x86, AMD64 compatible ARM, MIPS, M88K GXemul Anders Gavare any PowerPC, SuperH Written by Roger Bowler, Hercul es currently maintained by Jay any z/Architecture Maynard x64 + hardware-assisted Hyper-V Microsoft virtualization (Intel VT or x64,x86 AMD-V) OR1K, MIPS32, ARC600/ARC700, A (can use all OVP OVP Imperas [1] [2] Imperas OVP Tool s x86 (http://www.imperas.com) (http://www.ovpworld compliant models, u can write own to pu OVP APIs) i Core Vi rtual Accounts iCore Software -
CHIPS for EVERYTHING: Britain’S Opportunities in a Key Global Market FRONT COVER (See Paragraphs 4.5 and 4.6)
HOUSE OF LORDS Select Committee on Science and Technology CHIPS FOR EVERYTHING: Britain’s opportunities in a key global market FRONT COVER (see paragraphs 4.5 and 4.6) 1 The first illustration shows a technician holding a 300 mm wafer of silicon on which several hundred chips will be fabricated. 2 The second is a Cirrus Logic chip incorporating an ARM920T core, enlarged from its actual size of about a centimetre square. Over 600 such chips — each containing tens of millions of transistors — could be fabricated on one 300 mm wafer. 3 The third is an electron micrograph showing the layered structure of a chip built up in the 20 or so stages of the fabrication process. Most obvious are three layers of metal interconnect, but field-effect transistors are visible at the lowest levels towards the bottom left corner. The image is highly magnified. 2002 technology allows the strips of metal interconnect to be no more than 200 nanometres wide, about one five-hundredth of the thickness of the paper on which this Report is printed. At the same magnification, the image of the whole 300 mm wafer would be nearly 4 kilometres across and that of the Cirrus/ARM920T chip would be about 125 metres across. 1 International SEMATECH: Austin, TX, 2001. © Semiconductor Industry Association, reproduced by permission. 2 © ARM Ltd UK and Cirrus Logic Inc USA, reproduced by permission. 3 Image (rights reserved) by courtesy of the Semiconductor Equipment Assessment, an EU-funded project, as published by European Semiconductor magazine. REAR COVER (see paragraph 4.15) A typical table from the International Technology Roadmap for Semiconductors (ITRS), 2001 edition. -
Partitioned System with Xtratum on Powerpc
Tesina de M´asteren Autom´aticae Inform´aticaIndustrial Partitioned System with XtratuM on PowerPC Author: Rui Zhou Advisor: Prof. Alfons Crespo i Lorente December 2009 Contents 1. Introduction1 1.1. MILS......................................2 1.2. ARINC 653..................................3 1.3. PikeOS.....................................6 1.4. ADEOS....................................7 2. Overview of XtratuM 11 2.1. Virtualization and Hypervisor........................ 11 2.2. XtratuM.................................... 12 3. Overview of PowerPC 16 3.1. POWER.................................... 16 3.2. PowerPC.................................... 17 3.3. PowerPC in Safety-critical.......................... 19 4. Main PowerPC Drivers to Virtualize 20 4.1. Processors................................... 20 4.2. Timer..................................... 21 4.3. Interrupt.................................... 23 4.4. Memory.................................... 24 5. Porting Implementation 25 5.1. Hypercall................................... 26 5.2. Timer..................................... 27 5.3. Interrupt.................................... 28 5.4. Memory.................................... 31 5.5. Partition.................................... 32 6. Benchmark 34 7. Conclusions and Future Work 38 Abstract Nowadays, the diversity of embedded applications has been developed into a new stage with the availability of various new high-performance processors and low cost on-chip memory. As the result of these new advances in hardware, there is a -
A Practical Look at Micro-Kernels and Virtual Machine Monitors
A Practical Look at Micro-Kernels and Virtual Machine Monitors François Armand, Michel Gien, Member, IEEE of the main drivers is the need to run new or feature-rich open Abstract — In this paper, we look at two different approaches system software while maintaining existing legacy software used to provide embedded system support for virtualization and that has been already tested and validated in their own virtual machine monitors for consumer electronics and mobile operating environment. Such open software commonly devices. We compare the micro-kernel approach, which has been includes Linux and more established operating systems such a popular choice for building embedded operating systems with the Virtual Machine Monitor (VMM) or hypervisor approach as Windows or Symbian where developers want to run the widely deployed in general purpose computing environments operating system unchanged while also extending their device such as desktops and data center servers. Comparison criteria security and manageability at all levels. are based on virtualization use cases that are typical of Consumer Co-existence of several operating environments on the same Electronics (CE) systems such as mobile devices and IPTV. These hardware platform is one of the main purposes of hardware approaches are further evaluated based on performance and on virtualization software, made possible by the provision of a their ability to allow re-use of existing (often real-time) software as well as modern open operating systems such as Linux while virtual image of the hardware to each operating system, which remaining as transparently as possible. Such transparency can believes it is running alone on the underlying hardware. -
Family of Solutions for HSPA Enterprise Femtocell Applications
New single-chip, multicore DSP solution for HSPA enterprise femtocell applications Product Bulletin Key features The TMS320TCI6489 from Texas Instruments is a high-performance, cost-competitive, TMS320TCI6489 high-performance DSP single-chip digital signal processor (DSP) solution. Targeted at the demanding enterprise • Three 850-MHz, TMS320C64x+™ cores femtocell market, the TCI6489 is capable of supporting PHY and MAC layer processing provide flexible processing for supporting different standards for 2G, 3G and 4G femtocell base stations, and offers substantial development Built-in UMTS receiver accelerator coprocessor (RAC) benefits for manufacturers. Optimized for wireless baseband applications with turbo and Viterbi The TCI6489 DSP includes three cores and In the office femtocell base stations enhance decoder coprocessors is capable of supporting 32 users on a single the wireless experience by bringing higher 1 MB of internal L2 memory per core WCDMA carrier. Designed to run both PHY data rates, better coverage and lower cost sGMII Gigabit Ethernet and higher layer processing, it is also capable plans to the user. A typical femtocell network Four antenna interface lanes supporting of supporting 32 users on a single WCDMA architecture is shown on next page. The either OBSAI or CPRI carrier. With a broad selection of available femtocell architecture allows a mobile phone DDR2 667 MHz McBSP – Two McBSP links, each at analog RF components, the TCI6489 user in enterprise to be connected to a femto 100 Mbps enterprise platform is ideally suited for base station. This femto base station uses McBSP can be used for multichannel any femtocell original equipment the existing landline connection (typically clocked serial communications manufacturer (OEM). -
A State-Of-The-Art Survey on Real-Time Issues in Embedded Systems Virtualization
Journal of Software Engineering and Applications, 2012, 5, 277-290 277 http://dx.doi.org/10.4236/jsea.2012.54033 Published Online April 2012 (http://www.SciRP.org/journal/jsea) A State-of-the-Art Survey on Real-Time Issues in Embedded Systems Virtualization Zonghua Gu, Qingling Zhao College of Computer Science, Zhejiang University, Hangzhou, China. Email: {zgu, ada_zhao}@zju.edu.cn Received January 1st, 2012; revised February 5th, 2012; accepted March 10th, 2012 ABSTRACT Virtualization has gained great acceptance in the server and cloud computing arena. In recent years, it has also been widely applied to real-time embedded systems with stringent timing constraints. We present a comprehensive survey on real-time issues in virtualization for embedded systems, covering popular virtualization systems including KVM, Xen, L4 and others. Keywords: Virtualization; Embedded Systems; Real-Time Scheduling 1. Introduction on L4Ka::Pistachio microkernel; in turn, unmodified guest OS can run on top of QEMU; Schild et al. [2] used Platform virtualization refers to the creation of Virtual Intel VT-d HW extensions to run unmodified guest OS Machines (VMs), also called domains, guest OSes, or on L4. There are also Type-2, para-virtualization solu- partitions, running on the physical machine managed by tions, e.g., VMWare MVP (Mobile Virtualization Plat- a Virtual Machine Monitor (VMM), also called a hyper- form) [3], as well as some attempts at adding para-virtu- visor. Virtualization technology enables concurrent exe- alization features to Type-2 virtualization systems to im- cution of multiple VMs on the same hardware (single or prove performance, e.g., task-grain scheduling in KVM multicore) processor. -
Inter Design Technology Review
T E C H N O L O G Y R E V I E W I N T E R D E S I G N A wireless world? Demand for wireless connectivity drives comms industry innovations. By Graham Pitcher. he world continues to be driven by the need ± almost the demand T ± to communicate and we're get- ting our `fix' through a range of wireless communication options. The more obvious wireless communi- cations are the ones used in our day to day affairs ± the mobile phone and one of the WiFi variants; IEEE802.11a, b or g. But, as the BBC is careful to say when dis- cussing its magazines, other wireless com- munication methods are available. And there were interesting developments in the Bluetooth, ultrawideband, ZigBee and zlik said: ªWiFi and Bluetooth wireless Philips Research created a ©fully functional© IEEE802.20 worlds. technologies are already working side by 13.56MHz rfid tag based entirely on The Bluetooth Special Interest Group side in applications across the globe. We plastic electronics. The device could see (SIG) announced its intention to work see this as a trend that will only increase barcodes being obsoleted. with ultrawide band developers in May and acknowledge the potential in the 2005. That turned out to be the first of future for the technologies to work not a number of approaches designed to inte- just concurrently but jointly to achieve for less than a second. Sharing a phone call, grate Bluetooth technology into other more advanced wireless applications.º pairing a new headset, or setting up wire- communications protocols. -
Dynamic Management of Multiple Operating Systems in an Embedded Multi-Core Environment
AALTO UNIVERSITY SCHOOL OF SCIENCE AND TECHNOLOGY Faculty of Electronics, Communications and Automation Department of Signal Processing and Acoustics Aleksi Aalto Dynamic management of multiple operating systems in an embedded multi-core environment Master's Thesis submitted in partial fulfillment of the requirements for the degree of Master of Science in Technology. Espoo, May 7, 2010 Supervisor: Professor Jorma Skytt¨a Instructors: Professor Tatsuo Nakajima and D.Sc. (Tech) Vesa Hirvisalo AALTO UNIVERSITY ABSTRACT OF THE SCHOOL OF SCIENCE AND TECHNOLOGY MASTER'S THESIS Author: Aleksi Aalto Name of the Thesis: Dynamic management of multiple operating systems in an embedded multi-core environment Date: May 7, 2010 Number of pages: xi + 69 Faculty: Faculty of Electronics, Communications and Automation Professorship: S-88 Signal Processing Supervisor: Prof. Jorma Skytt¨a Instructors: Prof. Tatsuo Nakajima and D.Sc. (Tech.) Vesa Hirvisalo Modern embedded devices, such as smartphones, have grown into complex computer systems that provide a rich set of functionality for their users while still maintain- ing real-time responsiveness for their low level functions such as radio communication or camera control. The embedded market is very competitive, especially in end-user mobile devices, making it desirable to reduce manufacturing costs without compromis- ing device performance wherever possible. The ever-growing user demand for more computing-intensive applications coupled with tight energy budgets has led the em- bedded manufacturers to seek performance gains from multi-core architectures, much like their desktop counterparts. However, multi-core architectures have little to provide in performance gains when used with applications developed with traditional software design methods that are aimed at single-core archictures. -
Universidade Federal Do Rio De Janeiro Instituto De Química Programa De Pós-Graduação Em Ciência De Alimentos
UNIVERSIDADE FEDERAL DO RIO DE JANEIRO INSTITUTO DE QUÍMICA PROGRAMA DE PÓS-GRADUAÇÃO EM CIÊNCIA DE ALIMENTOS Compostos bioativos recuperados de farelo de soja (Glycine max) por extração aquosa: compostos fenólicos e peptídeos antimicrobianos e antitumorais Cyntia da Silva de Freitas Rio de Janeiro 2018 Cyntia da Silva de Freitas Compostos bioativos recuperados de farelo de soja (Glycine max) por extração aquosa: compostos fenólicos e peptídeos antimicrobianos e antitumorais Tese de Doutorado apresentada ao Programa de Pós-graduação em Ciência de Alimentos, Instituto de Química, Universidade Federal do Rio de Janeiro, como requisito parcial à obtenção do título de Doutor em Ciência de Alimentos. Orientadores: Profa .Dra . Vânia Margaret Flosi Paschoalin Prof. Dr. Eduardo Mere Del Aguila Dra. Patricia Ribeiro Pereira Rio de Janeiro 2018 Freitas, Cyntia da Silva de. Compostos bioativos recuperados de farelo de soja (Glycine max) por extração aquosa: compostos fenólicos e peptídeos antimicrobianos e antitumorais. / Cyntia da Silva de Freitas. – Rio de Janeiro: UFRJ, 2014. p., il. Tese (Doutorado em Ciência de Alimentos) – Universidade Federal do Rio de Janeiro, Instituto de Química, 2018. Orientadores: Eduardo Mere Del Aguila, Vânia Margaret Flosi Paschoalin e Patricia Ribeiro Pereira. 1. Glycine max. 2. Farelo da soja. 3. Peptídeos antimicrobianos. I. Del Aguila, Eduardo Mere. II. Paschoalin, Vânia Margaret Flosi. III. Pereira, Patricia Ribeiro. III. Universidade Federal do Rio de Janeiro. Programa de Pós Graduação em Ciência de Alimentos. IV. Título. Cyntia da Silva de Freitas COMPOSTOS BIOATIVOS RECUPERADOS DE FARELO DE SOJA (GLYCINE MAX) POR EXTRAÇÃO AQUOSA: COMPOSTOS FENÓLICOS E PEPTÍDEOS ANTIMICROBIANS E ANTITUMORAIS Profa. Dra. Vânia Margaret Flosi Paschoalin Prof. -
Microwave Engineering Europe
european November/December 2011 business press engineeringengineering europeeurope Radar MEMS/Nanotechnology Low Power RF www.microwave-eetimes.com The European journal for the microwave and wireless design engineer 2 NEWS Performance vs. price? At last, resistive parts that make a priority of both. World needs over 10 million small cells by 2015 Chicago will need approximately demand for data is often high- 84,500 small cells to deliver est. Other sites include airports, truly high-speed LTE by 2015, stations, office buildings and with acceptable coverage and outdoor sites providing wider speeds, according to analysis coverage in busy street areas. from Picochip. To provide LTE The report was put together Got a resistive component priority checklist by Picochip’s CTO Dr Pulley, who of your own? Include Anaren on your RFQ everywhere in the US around list, and we’ll show you how we measure up! 1.8 million small cells would be also concluded that worldwide required, based on estimations there would need to be in excess Designed specifi cally for on data growth and usage across of ten million small cells to deliver commercial wireless the country. This is in addition to comparable performance. bands – and priced more residential femtocells and Wi-Fi. The US is already seeing wide- competitively than ever The analysis models what will spread deployment of LTE, with before – Anaren’s new be required to deliver the adver- basestations being deployed now wireless resistive compo- tised data rates consistently to to deliver next generation ser- nents are the answer when users wherever they are.