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Smartphone Design Win Quarterly Monitor Q1 2021

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Smartphone Design Win Quarterly Monitor Q1 2021 QUARTERLY TECHNOLOGY MONITOR Smartphone Design Win Quarterly Monitor Q1 2021 A first ever smartphone technology monitor on the latest components, packaging and silicon chip choices of the smartphone makers. This smartphone monitor utilizes data from wins (17% of total design wins) and package representative phones (65+ phones per year footprint consumption (21%). Snapdragon torn down in the System Plus Consulting processors and RF components (transceivers, Phone Teardown Track Module) and follows RFFEM) explain this. the OEM market share, which means that the Regarding die area consumption, Samsung selected phones are a good representation of leads (30% of total die area) thanks to the market. Also provided is the detailed memories and image sensors. design wins and related supply chain for the BGA and LGA packages are the main eight phones being analyzed, along with packaging platform, with 37% of package supply chain alternatives for the main devices. footprint consumption. For each device and module, you get access to U.S.-based companies account for 47% of IC Title: Smartphone the technology choices of the manufacturers. Design Win Quarterly design wins and 43% of total die area Monitor - Q1 2021 This monitor offers a clear view of the market- (Qualcomm, Qorvo, Skyworks, Texas leading semiconductor companies and a direct Instruments and Cirrus Logic have the Pages: 150 comparison between OEMs. This includes: majority). Even though Korea represents only Date: April 2021 oDesign wins for the top smartphones' OEM 6% of the IC design wins number, it represents Format: (per Mfr., nationality, type of device…) 33% in terms of the total die area. Memory o PDF with graphs and oPackaging evolution in terms of type, players Samsung and SK Hynix drive this result. analyses footprint, pitch… 300mm (12-inch) wafer represents 69% of o Web-based dynamic oDie area evolution per function, technology total die area used in Q1 2021, with leading- dashboard node, wafer size… edge technology nodes (14nm down to 5nm) o Direct access to the oFocus per category (processor, camera, Analyst representing 30% of the total die area. memory, sensor…) According to Q1 2021 smartphone shipments, Reference: SPM21001 During a full year you will receive an updated 300M wafers account for 5M units shipped for Smartphones analyzed: Technology Monitor on a quarterly basis. the 8 systems under analysis. o Apple iPhone 12 Pro Q1 2020 shows Qualcomm leading in design Max US o Apple iPhone 12 5G US o Google Pixel 4a Q1 2021 DIE AREA o Huawei nova 7 SE 5G 3 500 3 123 Youth 3 000 o Microsoft Surface Duo 2 500 2 031 o Samsung Galaxy Z 2 000 1 500 Fold2 5G mm2 1 000 681 597 o 361 325 292 Samsung Galaxy 500 267 267 233 220 202 200 161 158 Note 20 5G 0 o Vivo X50 Pro COMPOUND SEMICONDUCTORS - COMPUTING & SOFTWARE – DISPLAY – IMAGING – LIGHTING – MEMORY – PACKAGING - PHOTONICS - POWER ELECTRONICS - RF - MANUFACTURING - SENSING SMARTPHONE DESIGN WIN QUARTERLY MONITOR - Q1 2021 COMPLETE MONITOR WITH o A web-based dynamic dashboard o A PDF slide deck with graphs and o Direct access to the System Plus database with historical data from comments/analyses to explain the analyst past years and the last quarter, main technology evolutions in the including at least six new smartphone market smartphones TABLE OF CONTENTS Overview/Methodology eBoM Cost Focus on Application Processors Executive Summary • eBoM Cost per Category • Focus on Application Processors Design Wins ✓ Smartphone details, OEM • OEM Evolution • Design Wins per Vendors evolution (Apple, Samsung, Focus on Memory ✓ Smartphone details, OEM Huawei) • Focus on NAND evolution (Apple, Samsung, Die, Wafer & Technology • Focus on DRAM Huawei) • Die Area per Vendor • OEM Evolution • Design Wins per Nationality ✓ Smartphone details, OEM Focus on Sensors ✓ Smartphone details, OEM evolution (Apple, Samsung, • Focus on Sensors: CMOS Image evolution (Apple, Samsung, Huawei) Sensors Huawei) • Die Area per Nationality Packaging ✓ Smartphone details, OEM • Focus on Sensors: Others • Package Footprint per Vendors evolution (Apple, Samsung, • OEM Evolution ✓ Smartphone details, OEM Huawei) Focus on RF evolution (Apple, Samsung, • Die Area per Category • Focus on RF Huawei) ✓ Smartphone details, OEM • OEM Evolution • Package Footprint per Category evolution (Apple, Samsung, Focus on Passives • Package Footprint per Family Huawei) • Focus on Capacitors • Package Footprint : OEM • Wafer Size repartition • Focus on Resistors Evolution (Apple, Samsung, • Wafer Material Repartition • Focus on Inductors Huawei) • Technology Node Repartition AUTHORS Romain Fraux is the CEO of System Audrey Lahrach serves as a Technology & Plus Consulting. Supporting industrial Cost Analyst, MEMS, Sensors & Display. companies in their development, With significant expertise in these fields Romain and his team are offering a Audrey produces reverse engineering & complete range of services, costing costing analyses while also running custom. tools and reports. Romain has been Utilizing her knowledge in a combination of working for System Plus Consulting MEMS, sensing and imaging, Audrey is for more than 12 years and was overseeing the development of the new previously the company’s CTO. Smartphone Monitor. RELATED PRODUCTS Camera Modules Comparison Phone Track Module Processor Quarterly Market 2021 – Vol. 1 Teardown Track Monitor Technology, Process & Cost Report Unmached teardowns of phone Market & Technology Monitor Technology and cost comparison systems with bill-of-material, While finding new application, of visual spectrum cameras in block diagram and high- and sustaining the established the 2020 flagships: the Apple resolution photos. Access ones, CPUs, GPUs, and APUs iPhone 12 Pro Max, Samsung comprehensive and full parts list hold the keys to the next ten Galaxy S20 Ultra, and Huawei with easy-to-navigate links to all years of the processor market. P40 Pro. semiconductor components in March 2021 April 2021 each system. QUATERLY TECHNOLOGY MONITOR SMARTPHONE REFERENCES USED Q1 2021 : Samsung Galaxy Vivo X50 Pro Apple iPhone Galaxy Z Fold 2 5G 256GB Note 20 5G US 128GB 12 5G US 64GB 128GB Apple iPhone 12 Huawei nova 7 Google Pixel Microsoft Surface Duo 128GB Pro Max 5G US SE 5G Youth 4a 128GB 128GB The monitor takes into account 32 smartphones: Q2 2020 : Q3 2020 : Q4 2020 : o HTC Desire 19s o Huawei Mate Xs o Apple iPhone SE (2020) o Huawei Mate 30 Pro 5G o LG Electronics V60 ThinQ 5G o Huawei P40 Pro 5G o Motorola One Hyper o Motorola Razr 2019 o Motorola Edge+ o Oppo Reno3 Pro 5G o Oppo Find X2 5G o OnePlus 8 5G o Samsung Galaxy A51 o Samsung Galaxy S20 Ultra 5G o Realme X50 5G o Vivo X30 Pro 5G o Samsung Galaxy Z Flip o Samsung Galaxy M31 o Xiaomi Mi Note 10 Global o Vivo Nex 3s 5G o Sharp AQUOS R5G o ZTE Blade 10 Prime o Xioami Mi 10 Pro 5G o ZTE Nubia Red Magic 5G ABOUT SYSTEM PLUS CONSULTING WHAT IS A REVERSE COSTING®? System Plus Consulting is specialized Reverse Costing® is the process of disassembling a device (or a in the cost analysis of electronics system) in order to identify its technology and calculate its from semiconductor devices to manufacturing cost, using in-house models and tools. electronic systems. A complete range of services and costing tools to provide in-depth production cost studies and to estimate the objective selling price of a product is available. CONTACTS Our services: Headquarters America Sales Office Asia Sales Office • STRUCTURE & PROCESS 22, bd Benoni Goullin Steven LAFERRIERE Takashi ONOZAWA ANALYSES Nantes Biotech Western USA & Japan & Rest of Asia 44200 Nantes Canada +81 80 4371 4887 • TEARDOWN TRACKS France +1 310-600-8267 [email protected] • CUSTOM ANALYSES +33 2 40 18 09 16 [email protected] • COSTING SERVICES [email protected] Mavis WANG • COSTING TOOLS Chris YOUMAN Greater China • TRAININGS Europe Sales Office Eastern USA & Canada TW +886 979 336 809 Lizzie LEVENEZ +1 919-607-9839 CN +8613661566824 www.systemplus.fr Frankfurt am Main [email protected] [email protected] [email protected] Germany +49 151 23 54 41 82 Peter OK [email protected] Korea +82 10 4089 0233 [email protected] TERMS AND CONDITIONS OF SALES Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of 3.5 In the event of termination of the contract, or of misconduct, during the sale in their entirety. It is done by signing the purchase order which mentions “I hereby contract, the Seller will have the right to invoice at the stage in progress, and to take accept Yole Développement’s Terms and Conditions of Sale”. legal action for damages. “Buyer”: Any business user (i.e. any person acting in the course of its business activities, for 4. LIABILITIES its business needs) entering into the following general conditions to the exclusion of 4.1 The Buyer or any other individual or legal person acting on its behalf, being a business consumers acting in their personal interests. user buying the Products for its business activities, shall be solely responsible for choosing “Contracting Parties” or “Parties”: The Seller on one hand and the Buyer on the other hand. the Products and for the use and interpretations he makes of the documents it purchases, “Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, of the results he obtains, and of the advice and acts it deduces thereof. including any patents, trademarks, registered models, designs, copyrights, inventions, 4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by commercial secrets and know-how, technical information, company or trading names and the Products or arising from a material breach of this agreement any other intellectual property rights or similar in any part of the world, notwithstanding the 4.3 In no event shall the Seller be liable for: fact that they have been registered or not and including any pending registration of one of a) Damages of any kind, including without limitation, incidental or consequential damages the above mentioned rights.
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