An Effective DRAM Cache Architecture for Scale-Out Servers
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INTGRATING PROCESSING IN-MEMORY (PIM) TECHNOLOGY INTO GENERAL PURPOSE GRAPHICS PROCESSING UNITS (GPGPU) FOR ENERGY EFFICIENT COMPUTING A Thesis Presented to the Faculty of the Department of Electrical Engineering University of Houston In Partial Fulfillment of the Requirements for the Degree Master of Science in Electrical Engineering by Paraag Ashok Kumar Megharaj August 2017 INTGRATING PROCESSING IN-MEMORY (PIM) TECHNOLOGY INTO GENERAL PURPOSE GRAPHICS PROCESSING UNITS (GPGPU) FOR ENERGY EFFICIENT COMPUTING ________________________________________________ Paraag Ashok Kumar Megharaj Approved: ______________________________ Chair of the Committee Dr. Xin Fu, Assistant Professor, Electrical and Computer Engineering Committee Members: ____________________________ Dr. Jinghong Chen, Associate Professor, Electrical and Computer Engineering _____________________________ Dr. Xuqing Wu, Assistant Professor, Information and Logistics Technology ____________________________ ______________________________ Dr. Suresh K. Khator, Associate Dean, Dr. Badri Roysam, Professor and Cullen College of Engineering Chair of Dept. in Electrical and Computer Engineering Acknowledgements I would like to thank my advisor, Dr. Xin Fu, for providing me an opportunity to study under her guidance and encouragement through my graduate study at University of Houston. I would like to thank Dr. Jinghong Chen and Dr. Xuqing Wu for serving on my thesis committee. Besides, I want to thank my friend, Chenhao Xie, for helping me out and discussing in detail all the problems -
Beyond Relational Databases
EXPERT ANALYSIS BY MARCOS ALBE, SUPPORT ENGINEER, PERCONA Beyond Relational Databases: A Focus on Redis, MongoDB, and ClickHouse Many of us use and love relational databases… until we try and use them for purposes which aren’t their strong point. Queues, caches, catalogs, unstructured data, counters, and many other use cases, can be solved with relational databases, but are better served by alternative options. In this expert analysis, we examine the goals, pros and cons, and the good and bad use cases of the most popular alternatives on the market, and look into some modern open source implementations. Beyond Relational Databases Developers frequently choose the backend store for the applications they produce. Amidst dozens of options, buzzwords, industry preferences, and vendor offers, it’s not always easy to make the right choice… Even with a map! !# O# d# "# a# `# @R*7-# @94FA6)6 =F(*I-76#A4+)74/*2(:# ( JA$:+49>)# &-)6+16F-# (M#@E61>-#W6e6# &6EH#;)7-6<+# &6EH# J(7)(:X(78+# !"#$%&'( S-76I6)6#'4+)-:-7# A((E-N# ##@E61>-#;E678# ;)762(# .01.%2%+'.('.$%,3( @E61>-#;(F7# D((9F-#=F(*I## =(:c*-:)U@E61>-#W6e6# @F2+16F-# G*/(F-# @Q;# $%&## @R*7-## A6)6S(77-:)U@E61>-#@E-N# K4E-F4:-A%# A6)6E7(1# %49$:+49>)+# @E61>-#'*1-:-# @E61>-#;6<R6# L&H# A6)6#'68-# $%&#@:6F521+#M(7#@E61>-#;E678# .761F-#;)7-6<#LNEF(7-7# S-76I6)6#=F(*I# A6)6/7418+# @ !"#$%&'( ;H=JO# ;(\X67-#@D# M(7#J6I((E# .761F-#%49#A6)6#=F(*I# @ )*&+',"-.%/( S$%=.#;)7-6<%6+-# =F(*I-76# LF6+21+-671># ;G';)7-6<# LF6+21#[(*:I# @E61>-#;"# @E61>-#;)(7<# H618+E61-# *&'+,"#$%&'$#( .761F-#%49#A6)6#@EEF46:1-# -
Peering Over the Memory Wall: Design Space and Performance
Peering Over the Memory Wall: Design Space and Performance Analysis of the Hybrid Memory Cube UniversityDesign of Maryland Space andSystems Performance & Computer Architecture Analysis Group of Technical the Hybrid Report UMD-SCA-2012-10-01 Memory Cube Paul Rosenfeld*, Elliott Cooper-Balis*, Todd Farrell*, Dave Resnick°, and Bruce Jacob† *Micron, Inc. °Sandia National Labs †University of Maryland Abstract the hybrid memory cube which has the potential to address The Hybrid Memory Cube is an emerging main memory all three of these problems at the same time. The HMC tech- technology that leverages advances in 3D fabrication tech- nology leverages advances in fabrication technology to create niques to create a CMOS logic layer with DRAM dies stacked a 3D stack that contains a CMOS logic layer with several on top. The logic layer contains several DRAM memory con- DRAM dies stacked on top. The logic layer contains several trollers that receive requests from high speed serial links from memory controllers, a high speed serial link interface, and an the host processor. Each memory controller is connected to interconnect switch that connects the high speed links to the several memory banks in several DRAM dies with a vertical memory controllers. By stacking memory elements on top of through-silicon via (TSV). Since the TSVs form a dense in- controllers, the HMC can deliver data from memory banks to terconnect with short path lengths, the data bus between the controllers with much higher bandwidth and lower energy per controller and banks can be operated at higher throughput and bit than a traditional memory system. -
Database Solutions on AWS
Database Solutions on AWS Leveraging ISV AWS Marketplace Solutions November 2016 Database Solutions on AWS Nov 2016 Table of Contents Introduction......................................................................................................................................3 Operational Data Stores and Real Time Data Synchronization...........................................................5 Data Warehousing............................................................................................................................7 Data Lakes and Analytics Environments............................................................................................8 Application and Reporting Data Stores..............................................................................................9 Conclusion......................................................................................................................................10 Page 2 of 10 Database Solutions on AWS Nov 2016 Introduction Amazon Web Services has a number of database solutions for developers. An important choice that developers make is whether or not they are looking for a managed database or if they would prefer to operate their own database. In terms of managed databases, you can run managed relational databases like Amazon RDS which offers a choice of MySQL, Oracle, SQL Server, PostgreSQL, Amazon Aurora, or MariaDB database engines, scale compute and storage, Multi-AZ availability, and Read Replicas. You can also run managed NoSQL databases like Amazon DynamoDB -
Oracle Nosql Database EE Data Sheet
Oracle NoSQL Database 21.1 Enterprise Edition (EE) Oracle NoSQL Database is a multi-model, multi-region, multi-cloud, active-active KEY BUSINESS BENEFITS database, designed to provide a highly-available, scalable, performant, flexible, High throughput and reliable data management solution to meet today’s most demanding Bounded latency workloads. It can be deployed in on-premise data centers and cloud. It is well- Linear scalability suited for high volume and velocity workloads, like Internet of Things, 360- High availability degree customer view, online contextual advertising, fraud detection, mobile Fast and easy deployment application, user personalization, and online gaming. Developers can use a single Smart topology management application interface to quickly build applications that run in on-premise and Online elastic configuration cloud environments. Multi-region data replication Enterprise grade software Applications send network requests against an Oracle NoSQL data store to and support perform database operations. With multi-region tables, data can be globally distributed and automatically replicated in real-time across different regions. Data can be modeled as fixed-schema tables, documents, key-value pairs, and large objects. Different data models interoperate with each other through a single programming interface. Oracle NoSQL Database is a sharded, shared-nothing system which distributes data uniformly across multiple shards in a NoSQL database cluster, based on the hashed value of the primary keys. An Oracle NoSQL Database data store is a collection of storage nodes, each of which hosts one or more replication nodes. Data is automatically populated across these replication nodes by internal replication mechanisms to ensure high availability and rapid failover in the event of a storage node failure. -
Object Databases As Data Stores for High Energy Physics
OBJECT DATABASES AS DATA STORES FOR HIGH ENERGY PHYSICS Dirk Düllmann CERN IT/ASD & RD45, Geneva, Switzerland Abstract Starting from 2005, the LHC experiments will generate an unprecedented amount of data. Some 100 Peta-Bytes of event, calibration and analysis data will be stored and have to be analysed in a world-wide distributed environment. At CERN the RD45 project has been set-up in 1995 to investigate different approaches to solve the data storage problems at LHC. The focus of RD45 soon moved to the use of Object Database Management Systems (ODBMS) as a central component. This paper gives an overview of the main advantages of ODBMS systems for HEP data stores. Several prototype and production applications will be discussed and a summary of the current use of ODBMS based systems in HEP will be presented. The second part will concentrate on physics data analysis based on an ODBMS. 1 INTRODUCTION 1.1 Data Management at LHC The new experiments at the Large Hadron Collider (LHC) at CERN will gather an unprecedented amount of data. Starting from 2005 each of the four LHC experiments ALICE, ATLAS, CMS and LHCb will measure of the order of 1 Peta Byte (1015 Bytes) per year. All together the experiments will store and repeatedly analyse some 100 PB of data during their lifetimes. Such an enormous task can only be accomplished by large international collaborations. Thousands of physicists from hundreds of institutes world-wide will participate. This also implies that nearly any available hardware platform will be used resulting in a truly heterogeneous and distributed system. -
Database Software Market: Billy Fitzsimmons +1 312 364 5112
Equity Research Technology, Media, & Communications | Enterprise and Cloud Infrastructure March 22, 2019 Industry Report Jason Ader +1 617 235 7519 [email protected] Database Software Market: Billy Fitzsimmons +1 312 364 5112 The Long-Awaited Shake-up [email protected] Naji +1 212 245 6508 [email protected] Please refer to important disclosures on pages 70 and 71. Analyst certification is on page 70. William Blair or an affiliate does and seeks to do business with companies covered in its research reports. As a result, investors should be aware that the firm may have a conflict of interest that could affect the objectivity of this report. This report is not intended to provide personal investment advice. The opinions and recommendations here- in do not take into account individual client circumstances, objectives, or needs and are not intended as recommen- dations of particular securities, financial instruments, or strategies to particular clients. The recipient of this report must make its own independent decisions regarding any securities or financial instruments mentioned herein. William Blair Contents Key Findings ......................................................................................................................3 Introduction .......................................................................................................................5 Database Market History ...................................................................................................7 Market Definitions -
First Draft of Hybrid Memory Cube Interface Specification Released
First Draft of Hybrid Memory Cube Interface Specification Released August 14, 2012 BOISE, Idaho and SAN JOSE, Calif., Aug. 14, 2012 (GLOBE NEWSWIRE) -- The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology, Inc. (Nasdaq:MU), and Samsung Electronics Co., Ltd., today announced that its developer members have released the initial draft of the Hybrid Memory Cube (HMC) interface specification to a rapidly growing number of industry adopters. Issuance of the draft puts the consortium on schedule to release the final version by the end of this year. The industry specification will enable adopters to fully develop designs that leverage HMC's innovative technology, which has the potential to boost performance in a wide range of applications. The initial specification draft consists of an interface protocol and short-reach interconnection across physical layers (PHYs) targeted for high-performance networking, industrial, and test and measurement applications. The next step in development of the specification calls for the consortium's adopters and developers to refine the specification and define an ultra short-reach PHY for applications requiring tightly coupled or close proximity memory support for FPGAs, ASICs and ASSPs. "With the draft standard now available for final input and modification by adopter members, we're excited to move one step closer to enabling the Hybrid Memory Cube and the latest generation of 28-nanometer (nm) FPGAs to be easily integrated into high-performance systems," said Rob Sturgill, architect, at Altera. "The steady progress among the consortium's member companies for defining a new standard bodes well for businesses who would like to achieve unprecedented system performance and bandwidth by incorporating the Hybrid Memory Cube into their product strategies." The interface specification reflects a focused collaboration among several of the world's leading technology providers. -
HAAG$) for High Performance 3D DRAM Architectures
History-Assisted Adaptive-Granularity Caches (HAAG$) for High Performance 3D DRAM Architectures Ke Chen† Sheng Li‡ Jung Ho Ahn§ Naveen Muralimanohar¶ Jishen Zhao# Cong Xu[ Seongil O§ Yuan Xie\ Jay B. Brockman> Norman P. Jouppi? †Oracle Corporation∗ ‡Intel Labs∗ §Seoul National University #University of California at Santa Cruz∗ ¶Hewlett-Packard Labs [Pennsylvania State University \University of California at Santa Barbara >University of Notre Dame ?Google∗ †[email protected] ‡[email protected] §{gajh, swdfish}@snu.ac.kr ¶[email protected] #[email protected] [[email protected] \[email protected] >[email protected] [email protected] TSVs (Wide Data Path) ABSTRACT Silicon Interposer 3D-stacked DRAM has the potential to provide high performance DRAM and large capacity memory for future high performance comput- Logic & CMP ing systems and datacenters, and the integration of a dedicated HAAG$ logic die opens up opportunities for architectural enhancements such as DRAM row-buffer caches. However, high performance Figure 1: The target system design for integrating the HAAG$: a hyb- and cost-effective row-buffer cache designs remain challenging for rid 3D DRAM stack and a chip multiprocessor are co-located on a silicon 3D memory systems. In this paper, we propose History-Assisted interposer. Adaptive-Granularity Cache (HAAG$) that employs an adaptive caching scheme to support full associativity at various granularities, and an intelligent history-assisted predictor to support a large num- 1. INTRODUCTION ber of banks in 3D memory systems. By increasing the row-buffer Future high performance computing demands high performance cache hit rate and avoiding unnecessary data caching, HAAG$ sig- and large capacity memory subsystems with low cost. -
Intel PSG (Altera) Commitment to SKA Community
Intel PSG (Altera) Enabling the SKA Community Lance Brown Sr. Strategic & Technical Marketing Mgr. [email protected], 719-291-7280 Agenda Intel Programmable Solutions Group (Altera) PSG’s COTS Strategy for PowerMX High Bandwidth Memory (HBM2), Lower Power Case Study – CNN – FPGA vs GPU – Power Density Stratix 10 – Current Status, HLS, OpenCL NRAO Efforts 2 Altera == Intel Programmable Solutions Group 3 Intel Completes Altera Acquisition December 28, 2015 STRATEGIC RATIONALE POST-MERGER STRUCTURE • Accelerated FPGA innovation • Altera operates as a new Intel from combined R&D scale business unit called Programmable • Improved FPGA power and Solutions Group (PSG) with intact performance via early access and and dedicated sales and support greater optimization of process • Dan McNamara appointed node advancements Corporate VP and General Manager • New, breakthrough Data Center leading PSG, reports directly to Intel and IoT products harnessing CEO combined FPGA + CPU expertise 4 Intel Programmable Solutions Group (PSG) (Altera) Altera GM Promoted to Intel VP to run PSG Intel is adding resources to PSG On 14nm, 10nm & 7nm roadmap with larger Intel Enhancing High Performance Computing teams for OpenCL, OpenMP and Virtualization Access to Intel Labs Research Projects – Huge Will Continue ARM based System-on-Chip Arria and Stratix Product Lines 5 Proposed PowerMX COTS Model NRC + CEI + Intel PSG (Altera) Moving PowerMX to Broader Industries Proposed PowerMX COTS Business Model Approaching Top COTS Providers PowerMX CEI COTS Products A10 PowerMX -
An Energy-Efficient Technique to Reduce Refresh Overhead in Hybrid Memory Cube Architectures
2016 29th International Conference on VLSI Design and 2016 15th International Conference on Embedded Systems Massed Refresh: An Energy-Efficient Technique to Reduce Refresh Overhead in Hybrid Memory Cube Architectures Ishan G Thakkar, Sudeep Pasricha Department of Electrical and Computer Engineering Colorado State University, Fort Collins, CO, U.S.A. {ishan.thakkar, sudeep}@colostate.edu Abstract— This paper presents a novel, energy-efficient In this paper, we propose massed refresh, a novel energy-ef- DRAM refresh technique called massed refresh that simul- ficient DRAM refresh technique that intelligently leverages taneously leverages bank-level and subarray-level concur- bank-level as well as subarray-level parallelism to reduce re- rency to reduce the overhead of distributed refresh opera- fresh cycle time overhead in the 3D-stacked Hybrid Memory tions in the Hybrid Memory Cube (HMC). In massed re- Cube (HMC) DRAM architecture. We have observed that due fresh, a bundle of DRAM rows in a refresh operation is com- to the increased power density and resulting high operating tem- posed of two subgroups mapped to two different banks, with peratures, the effects of periodic refresh commands on refresh the rows of each subgroup mapped to different subarrays cycle time and energy-efficiency of 3D-stacked DRAMs, such within the corresponding bank. Both subgroups of DRAM as the emerging HMC [1], are significantly exacerbated. There- rows are refreshed concurrently during a refresh command, fore, we select the HMC for our study, even though the concept which greatly reduces the refresh cycle time and improves of massed refresh can be applied to any other 2D or 3D-stacked bandwidth and energy efficiency of the HMC. -
An Evaluation of Key-Value Stores in Scientific Applications
AN EVALUATION OF KEY-VALUE STORES IN SCIENTIFIC APPLICATIONS A Thesis Presented to the Faculty of the Department of Computer Science University of Houston In Partial Fulfillment of the Requirements for the Degree Master of Science By Sonia Shirwadkar May 2017 AN EVALUATION OF KEY-VALUE STORES IN SCIENTIFIC APPLICATIONS Sonia Shirwadkar APPROVED: Dr. Edgar Gabriel, Chairman Dept. of Computer Science, University of Houston Dr. Weidong Shi Dept. of Computer Science, University of Houston Dr. Dan Price Honors College, University of Houston Dean, College of Natural Sciences and Mathematics ii Acknowledgments \No one who achieves success does so without the help of others. The wise acknowledge this help with gratitude." - Alfred North Whitehead Although, I have a long way to go before I am wise, I would like to take this opportunity to express my deepest gratitude to all the people who have helped me in this journey. First and foremost, I would like to thank Dr. Gabriel for being a great advisor. I appreciate the time, effort and ideas that you have invested to make my graduate experience productive and stimulating. The joy and enthusiasm you have for research was contagious and motivational for me, even during tough times. You have been an inspiring teacher and mentor and I would like to thank you for the patience, kindness and humor that you have shown. Thank you for guiding me at every step and for the incredible understanding you showed when I came to you with my questions. It has indeed been a privilege working with you. I would like to thank Dr.