TECHNICAL PROGRAM Technical Program: Sunday–Thursday

2015 INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALY SIS CONFERENCE & EXPOSITION

OREGON CONVENTION CENTER | PORTLAND, OREGON, USA NOVEMBER 1–5, 2015

FINAL PROGRAM AND SHOW DIRECTORY

ORGANIZED BY 2015 INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS CONFERENCE & EXPOSI TION

Sunday, November 1–Thursday, November 5 | Oregon Convention Center | Portland, Oregon, USA REGISTRATION HOURS Saturday: 5:00–7:00 p.m. Monday: 7:00 a.m.–6:00 p.m. Wednesday: 7:00 a.m.–6:00 p.m. Sunday: 7:00 a.m.–5:00 p.m. Tuesday: 7:00 a.m.–6:30 p.m. Thursday: 7:00 a.m.–12:00 p.m. TECHNICAL PROGRAM Technical Program: Sunday–Thursday. Dedicated Tutorials on Sunday; integrated Tutorials throughout the Technical Program. For more conference details see pages 7–21. Policy on Cell Phone Usage: In consideration of fellow event attendees and presenters, we request your cooperation in setting cellular phones and/or other electronic devices to ‘silent mode’ in the meeting rooms. Policy on Audio/Video Recording: EDFAS™ prohibits any unauthorized audio or video recording, or still photography of presentations at ISTFA. EXPOSITION Tools-of-the-Trade Tour–Monday (Pre-Registration Required)...... 5:00–6:45 p.m. Exhibit Hours—Tuesday ...... 9:00 a.m.–6:40 p.m. Lunch...... 12:00–1:30 p.m. Expo Networking Reception...... 5:00–6:40 p.m. Exhibit Hours—Wednesday ...... 9:30 a.m.–3:30 p.m. Exhibitor Dessert Reception, Poster and Video Contest...... 1:30–3:30 p.m. 1 GET CONNECTED Want to be hands free at ISTFA? There’s an app for that! Download the ISTFA 2015 mobile app to view the technical program, exhibitor information, networking opportunities and attendee survey. Don’t forget to complete the attendee survey on the mobile app and connect with fellow attendees. Available for Apple and Android devices—visit the iTunes and Google Play Store to download it now. In addition to the attendee survey, be sure to complete a survey for each tutorial presentation. SESSION CHAIR & AUTHORS’ COFFEE/BRIEFING Please join us for coffee, pastries and a program briefing on the day of your presentation in Meeting Room D133. The room will open at 7:00 a.m. to allow you to meet and network with other participants. Tuesday briefing at 8:30 a.m. The program briefing will begin at 7:30 a.m. to review the program layout, presentation and A/V guidelines, and any final conference details. Poster authors please join us on Wednesday morning. YOUR ATTENDANCE IS VERY IMPORTANT. REFRESHMENT BREAKS Sunday–Monday...... Meeting Space Foyer Tuesday–Wednesday...... Exhibit Hall D Thursday...... Meeting Space Foyer CAREER/RESUME BOARDS Stop by Registration to post job openings, find talented people in the industry or to post a resume on the Career/Resume Board. CONTENTS Convention Center Floor Plan...... 2 Exhibit Hall Floor Plan...... 25 2015 Organizing Committee...... 3–4 Tools-of-the-Trade Tour...... 26–27 Technical Program Schedule...... 7–21 Company Descriptions...... 28–37 Education Short Courses...... 21 Author Index...... 38 Show Directory...... 23–48 Product/Services Index...... 40 Exhibitor List...... 24 Oregon Convention Center - Level 1

ISTFA Exhibit Hall

Oregon Convention Center - Level 2 ISTFA 2015 ORGANIZING COMMITTEE General Chair

Dr. James J. Demarest IBM

Vice General Chair Technical Program Chair Tutorial & Short Course Chair Exposition Chair

Dr. Martin Keim Dr. Sam Subramanian Ms. Susan Li Ms. Efrat Moyal Mentor Graphics Freescale Semiconductor Spansion Inc. LatticeGear LLC 3

n this industry, we meticulously follow the data on the technical symposium, tutorial groups, in our investigations to arrive at the best conclu- equipment exposition, and education courses. I sions, often innovating our way around prob- am also happy to announce that Albert Yu-Min Lin, Ilems never before encountered. That’s why I invite National Geographic Explorer, has agreed to be you to follow the data to Portland, Oregon this our keynote speaker this year. Lin is doing ground- November for ISTFA, the symposium dedicated breaking work—without breaking ground—by to the semiconductor failure analysis and related using noninvasive computer techniques to explore industries. Now in its 41st iteration, ISTFA consis- archaeological sites, including that of Genghis tently provides a platform for the best and bright- Khan. His talk is sure to be both fascinating and est in the industry to come together, share ideas, insightful. and investigate the evidence on where the industry is headed.

The organizing committee has been hard at work putting together this year’s show, and it is shaping ISTFA 2015 Chairman up to be outstanding. We have incorporated some Jay Demarest, Ph.D. exciting new initiatives this year, such as a student IBM—Albany Nanotech poster contest, while sticking to our core strengths Physical Characterization ISTFA 2015 ORGANIZING COMMITTEE continued

Activities Chairs and Vice Chairs

Mr. David Grosjean Mr. Kendall Scott Wills Dr. Felix Beaudoin Ms. Becky Holdford Ms. Rose Ring Mr. Dan Bodoh Panel Chair Panel Vice Chair Attendee Chair AV Chair Movie Chair & User Past Chair Qualcomm Consultant GLOBALFOUNDRIES Texas Instruments, Inc Group Vice Chair Freescale GLOBALFOUNDRIES Semiconductor

Dr. Lihong Cao Dr. Mayue Xie Nicholas Antoniou Mr. Rick Livengood David Su International Chair Tutorial & Short User Group Chair Local Arrangements Chair International Co-Chair AMD Course Vice Chair Revera Inc. Intel TSMC Intel

Technical Program Session Chairs 3D Device Device Failure Analysis Fault Isolation Microscopy Packaging and Failure Analysis Victoria Bruce, Qualcomm Michael Bruce, Consultant Carl Nail, Evans Analytical Assembly Level FA Frank Altmann, Incorporated Paiboon Tangyunyong, Group Lihong Cao, Advanced Fraunhofer Institute for Ted Kolasa, Orbital Sandia National Tom Schamp, Hitachi High Micro Devices Mechanics of Materials Sciences Corporation Laboratories Technology America Inc Bhanu P. Sood, CALCE, Yan Li, Intel University of Maryland Diagnostic Testing, FIB Circuit Analysis Nanoprobing Board and System Scanning and Debug and Edit and Electrical Sample Preparation and Level FA Geir Eide, Mentor Jason Benz, Characterization Device Deprocessing Victoria Bruce, Qualcomm Graphics GLOBALFOUNDRIES Kent Erington, Freescale Roger Alvis, FEI Company Incorporated Mark E. Kimball, Maxim Michael DiBattista, Semiconductor Jake E. Klein, Texas Ted Kolasa, Orbital Integrated Products, Inc. Qualcomm, Inc. Randal E. Mulder, Silicon Instruments Sciences Corporation Labs 4 Electrical and Yield FIB Sample Preparation Scanning Probe Analysis Case Studies and the FA Gregory M. Johnson, Carl Nail, Evans Analytical Package and Physical Terence Kane, IBM Process GLOBALFOUNDRIES Group Analysis Challenges Phil Kaszuba, Zhigang Song, Jenny Ma, Intel Tom Schamp, Hitachi High Tutorial GLOBALFOUNDRIES GLOBALFOUNDRIES Technology America Inc. Susan Li, Cypress Rose Ring, Emerging FA Techniques Semiconductor Technology Specific FA GLOBALFOUNDRIES and Concepts Metrology and In-line Chris Richardson, Allied Tutorial Sandia Malta Terence Kane, IBM Device Characterization High Tech Products Mark Jenkins, National Laboratories Phil Kaszuba, Bryan Tracy, Evans Detecting Counterfeit Globalfoundries Analytical Group Corey Senowitz, Microelectronics Huimeng Wu, Carl Zeiss Qualcomm Technologies Robert Champaign, FA Lab Management Microscopy Raytheon Network Rose Ring, Centric Systems GLOBALFOUNDRIES Joe Colangelo, Raytheon Malta Network Centric Systems Zhigang Song, GLOBALFOUNDRIES

Tutorial Session Chairs Package and Physical Electrical and Yield Fault Isolation Microscopy Technology Specific FA Analysis Challenges Gregory M. Johnson, David Vallett, Jake E. Klein, Texas Mark Jenkins, Sandia Susan Li, Spansion Inc. GLOBALFOUNDRIES PeakSource Analytical, Instruments National Laboratories Chris Richardson, Allied Jenny Ma, Intel LLC Carl Nail, Evans Analytical Corey Senowitz, High Tech Products, Mayue Xie, Intel Group, LLC Qualcomm Technologies Inc. Inc. SPECIAL EVENTS

Tools-of-the-Trade Tour Panel Discussion—1st Silicon Debug: Rapid Identifica- Monday, November 2, 2015 tion and Correction of Product Systematic Failures 5:00–6:45 p.m. • Exhibit Hall D Wednesday, November 4, 2015 • 10:10 a.m.–12:10 p.m. What is the Tools-of-the-Trade Tour? Demonstrations of the The panel presentations will cover key topics that are essential latest products and services. Learn useful information and see in achieving successful 1st silicon debug: fault isolation firsthand the latest tools in the industry. Take part in the parallel challenges, test coverage, design issues, managing the foundry technical session and see equipment in action right on the show relationship, and business requirements. This will be followed floor before the expo opens. Separate registration required. by a discussion examining how these issues are managed organizationally to insure rapid resolution of 1st silicon failures Punch Bowl Social and successful introduction of new products. Included will be Monday, November 2, 2015 • 7:00–9:30 p.m. how to settle contention behind contributors to the 1st silicon of a product (both internal and external). Included with full conference registration, join us for a night of fun, food and games! Use the Max Pass to follow the signs leading you to the fun at the Punch Bowl Social Portland. EDFAS Luncheon and General Membership Meeting Wednesday, November 4, 2015 • 12:10–1:30 p.m. The Max Light Rail system runs every 15 minutes from Join us to hear the president’s report on the current status 4 a.m.–12 a.m. every day. of and future vision for EDFAS; to meet the new EDFAS Directions: officers and board members; and to congratulate the 2014 DoubleTree Hotel to Punch Bowl Social Photo Contest winners. We look forward to seeing you there! • Walk towards Max stop “NE 7th Ave.” on Holladay Park The meeting is open to all EDFAS members, exhibitors and • Get on Max Red line (City Center/Beaverton) or Blue line interested prospective members. One ticket is included with full (City Center/Hillsboro) conference and exhibitor personnel registrations. • Get off on Max stop “Morrison/SW 3rd Ave.” • Walk across SW 3rd Ave. and the Punch Bowl Social will Exhibitor Dessert Reception, Poster and Video Contest be located inside the mall, top level Wednesday, November 4, 2015 • 1:30–3:30 p.m. Punch Bowl Social to DoubleTree Hotel Exhibit Hall D • Walk towards Max stop “Mall/SW 4th Ave” on SW Yamahill St. View the 2015 Poster Presentations and meet the authors during 5 • Get on Max Red line (Airport) or Blue line (Gresham) this dedicated Poster and Video Session inside the Expo Hall. • Get off on Max stop “NE 7th Ave.” or “Lloyd Center/NE 11th Also enjoy a selection of sweet treats while exploring the hall. Be Ave”—Both stops are near our hotel sure to vote for your favorite poster and video! Winners will be • Walk towards 9th or 11th Ave. to the DoubleTree Hotel announced after the event.

Special Plenary Session User Group Sessions Tuesday, November 3, 2015 • 9:00–10:30 a.m. Monday, November 2, 2015, 3:40–5:40 p.m. Albert Yu-Min Lin, Research Scientist/Engineer from the Contactless Fault Isolation User Group California Institute for Telecommunications and Information Sponsored by: DCG Systems and Checkpoint Technology Technology (Calit2), has been named as the ISTFA 2015 Keynote Monday, November 2, 2015, 3:40–5:40 p.m. Speaker! FIB User Group Sponsored by: Hitachi High Technologies America, Inc. Expo Networking Reception Tuesday, November 3, 2015 • 5:00–6:40 p.m. Thursday, November 5, 2015, 2:05–4:05 p.m. Exhibit Hall D Sample Prep User Group Sponsored by: DC-Digit Concepts You’re cordially invited to attend the Expo Networking Reception located in the Exhibit Hall. Join us and mingle with Thursday, November 5, 2015, 2:30–4:30 p.m. the exhibitors at the Networking Reception Tuesday afternoon. Nanoprobing User Group PLEASE NOTE: A Remote Pilot Vehicle will be on the exhibit floor Sponsored by: DCG Systems taking aerial shots of the event during the Expo Networking Reception. View the technical program details for more information Sponsored by: Mentor Graphics and Nisene Technology Group regarding the 2015 User Groups. TECHNICAL PROGRAM DETAILS SUNDAY, NOVEMBER 1, 2015 Technical Program Time Room Electrical and Yield 8:00 a.m.–2:00 p.m. D137 & 138

Fault Isolation 8:00 a.m.–2:30 p.m. D135 SUNDAY Package and Physical Analysis Challenges 8:00–11:30 a.m. D139 & 140 Refreshment Break 10:00–10:30 a.m. Meeting Space Foyer Lunch 11:30 a.m.–1:00 p.m. Lobby E Microscopy 12:30–5:30 p.m. D139 & 140 Technology Specific FA 2:00–5:00 p.m. D137 & 138 Refreshment Break 3:30–4:00 p.m. Meeting Space Foyer

ELECTRICAL AND YIELD FAULT ISOLATION 8:00 a.m.–2:00 p.m. • D137 & 138 8:00 a.m.–2:30 p.m. • D135 Session Chairs: Session Chairs: Mr. Gregory M. Johnson Dr. Mayue Xie GLOBALFOUNDRIES Intel Hopewell Junction, NY, USA Chandler, AZ, USA Dr. Jenny Ma Mr. David Vallett Intel PeakSource Analytical, LLC Chandler, AZ, USA Fairfax, VT, USA 8:00 a.m. 8:00 a.m. Accelerating Yield Ramp Using Wafer-Level Dynamic Fault Defect Localization by Lock-in-Thermography: Mr. Frank Isolation Approach: Dr. SH Goh, Technology Development— Altmann, Center for Applied Microstructure Diagnostics (CAM), New Technology Prototyping, GlobalFoundries, Singapore, Fraunhofer Institute for Mechanics of Materials, Halle, Germany 7 Singapore 9:00 a.m. 9:00 a.m. Photonic Localization Techniques: Prof. Christian Boit The Role of Nanoprobing in Yield and Failure Analysis: Mr. and Dr. Arkadiusz Glowacki, Semiconductor Devices, Berlin Randal E. Mulder, Device Analysis Lab, Silicon Labs, Austin, University of Technology, Berlin, Germany TX, USA 10:00 a.m. 10:00 a.m. Refreshment Break Meeting in Space Foyer Refreshment Break in Meeting Space Foyer 10:30 a.m. 10:30 a.m. FA Technique Selection for Front End Defect Localization in Yield Basics for FA: Mr. David Albert1 and Mr. Tracy Myers2, Bulk Semiconductor (Si) FA: Mr. Gregory M. Johnson and Mr. 1Department 06YA, IBM, Hopewell Junction, NY, 2Corporate Christopher D’Aleo, Physical Failure Analysis, GlobalFoundries, R&D, MTS, ON Semiconductor, Gresham, OR, USA Hopewell Junction, NY, USA 12:00–1:00 p.m. 12:00–1:00 p.m. Lunch Lobby E Lunch Lobby E 1:00 p.m. 1:00 p.m. What is New in 3D, Digital Testing?: Dr. Martin Keim, Silicon LADA and SDL: Powerful Techniques for Marginal Failures: Test Solutions, Mentor Graphics, Wilsonville, OR, USA Mr. Dan Bodoh and Mr. Kent Erington, New Product and Technology Diagnostic Center, Freescale Semiconductor, Austin, TX, USA

Programs are tentative: papers, authors, and order of presentations are subject to change. 2:00 p.m. PACKAGE AND PHYSICAL Scanning Electron Microscopy and Materials Analysis: Dr. William E. Vanderlinde, Office of the Director of National ANALYSIS CHALLENGES Intelligence (ODNI), Intelligence Advanced Research Projects 8:00–11:30 a.m. • D139 & 140 Activity, Washington, DC, USA Session Chairs: 3:30 p.m. Ms. Susan Li Refreshment Break in Meeting Space Foyer Cypress Semiconductor SUNDAY San Jose, CA, USA 4:00 p.m. Transmission Electron Microsocpy: Dr. Sam Subramanian, Mr. Chris Richardson Freescale Semiconductor, Inc., Austin, TX, USA Allied High Tech Products, Inc. Rancho Dominguez, CA, USA TECHNOLOGY SPECIFIC FA 8:00 a.m. 2:00–5:00 p.m. • D137 & 138 Failure Analysis Challenges for Chip Scale Packages: Ms. Susan Li, Failure Analysis Lab, Cypress Semiconductor, San Session Chairs: Jose, CA, USA Mr. Corey Senowitz Qualcomm Technologies Inc. 9:00 a.m. San Diego, CA, USA Flip-Chip and Backside Techniques: Dr. Edward I. Cole Jr.1, Dr. Daniel L. Barton1 and Dr. Karoline Bernhard-Hofer2, Mr. Mark Jenkins 1Science and Technology, Sandia National Laboratories, Sandia National Laboratories Albuquerque, NM, USA; 2Infineon, Regensburg, Germany Albuquerque, NM, USA 10:00 a.m. 2:00 p.m. Refreshment Break in Meeting Space Foyer Emerging Failure Modes of Advanced Technology: Mr. Terence Kane, IBM, Hopewell Junction, NY, USA 10:30 a.m. SAM vs X-Ray: Dr. Thomas M. Moore, Waviks, Inc., Dallas, TX, 3:30 p.m. USA Refreshment Break Meeting in Space Foyer 11:30 a.m.–12:30 p.m. 4:00 p.m. Lunch Lobby E Oil and Gas Microelectronics Failure Analysis: 8 Methodologies and Selected Case Studies: Mr. John Bescup, MICROSCOPY Weatherford Drilling Services, Houston, TX, USA 12:30–5:30 p.m. • D139 & 140 Session Chairs: Mr. Jake E. Klein Texas Instruments Tucson, AZ, USA Mr. Carl Nail Evans Analytical Group, LLC Irvine, CA, USA 12:30 p.m. Focused Ion Beam (FIB) for Circuit Edit, Fault Isolation and Sample Preparation: Mr. Steven B. Herschbein1, Mr. Carmelo F. Scrudato1, Mr. George K. Worth1, Mr. Edward S. Hermann1, Dr. Shida Tan2, Mr. Chris Scheffler2, Mr. Richard Livengood2 and Mr. Oleg Sidorov3, 1GlobalFoundries, Hopewell Junction, NY, USA; 2Intel Corporation, Santa Clara, CA, USA; 3FEI Company, Hillsboro, OR, USA

Programs are tentative: papers, authors, and order of presentations are subject to change. MONDAY, NOVEMBER 2, 2015 Technical Program Time Room Opening Session 8:00–9:10 a.m. D135 & 136 Refreshment Break 9:10–9:30 a.m. Meeting Space Foyer Emerging FA Techniques and Concepts 9:30–10:45 a.m. D135 & 136 Fault Isolation I 10:45 a.m.–12:00 p.m. D135 & 136 Lunch 12:00–1:00 p.m. Lobby E

FIB Sample Preparation 1:00–2:15 p.m. D137 & 138 MONDAY Scanning Probe Analysis 1:00–1:50 p.m. D139 & 140 Fault Isolation II 1:50–3:30 p.m. D139 & 140 FIB Circuit Analysis and Edit 2:15–3:30 p.m. D137 & 138 Refreshment Break 3:30–3:40 p.m. Meeting Space Foyer FIB User Group 3:40–5:40 p.m. D137 & 138 Contactless Fault Isolation User Group 3:40–5:40 p.m. D139 & 140 Tools of the Trade Tour* 5:00–6:45 p.m. Exhibit Hall D ISTFA Social Event 7:00–9:30 p.m. Punch Bowl Social *Separate Registration Required

OPENING SESSION EMERGING FA TECHNIQUES 8:00–9:10 a.m. • D135 & 136 AND CONCEPTS 8:00 a.m. 9:30–10:45 a.m. • D135 & 136 Opening Remarks: Jay Demarest, Ph.D., IBM—Albany Nano- tech, Physical Characterization Session Chairs: Mr. Phil Kaszuba GLOBALFOUNDRIES 8:10 a.m. Essex Junction, VT, USA ISTFA 2014 Best and Outstanding Paper Awards: Jay Demarest, Ph.D., IBM—Albany Nanotech, Physical Characterization Mr. Terence Kane IBM 9 8:15 a.m. Hopewell Junction, NY, USA Technical Program Chair Introduction: Sam Subramanian, 9:30 a.m. Freescale Semiconductor, Inc. Visible Light LVP on Bulk Silicon Devices: Dr. Joshua 1 1 1 8:20 a.m. Beutler , Dr. Edward I. Cole Jr. , Mr. V. Carter Hodges , Mr. Joe Clement1, Mr. Jeff Stevens1, Mr. Scott Silverman2 and Dr. IPFA Best Paper Presentation: Fault Isolation using 2 1 by S.H. Goh, B. L. Yeoh, Robert D. Chivas , Science and Technology, Sandia National Electrically-Enhanced LADA (EeLADA) 2 G.F. You, H. Hao, W.L. Sio, J. Lam and C.M. Chua Laboratories, Albuquerque, NM, USA; Varioscale, Inc, San Marcos, CA, USA 8:45 a.m. 2015 ESREF Best Paper Presentation 9:55 a.m. Electrically-Enhanced LADA (EeLADA) Technique: Dr. SH 9:10 a.m. Goh, Technology Development—New Technology Prototyping, Refreshment Break in Meeting Space Foyer GlobalFoundries, Singapore, Singapore 10:20 a.m. Laser Logic State Imaging Using Transient Voltage Collapse Circuits: Dr. Gwanghyeon Baek, Dr. John Keane and Dr. Martin von Haartman, Logic Technology Development, Intel Corporation, Hillsboro, OR, USA

Programs are tentative: papers, authors, and order of presentations are subject to change. 1:50 p.m. FAULT ISOLATION I Turning Sample Into (Re)Solution: Focused Ion Beam 10:45 a.m.–12:00 p.m. • D135 & 136 Shaped Solid Immersion Lenses: Dr. Philipp Scholz1, Michael Sadowski1, Sebastian Kupijai2, Marvin Henniges2, Session Chairs: Christoph Theiss2,3, Stefan Meister2,3, David Stolarek4, Harald Dr. Paiboon Tangyunyong H. Richter4, Mahyar Boostandoost5 and Prof. Christian Boit1; Sandia National Laboratories 1Semiconductor Devices, Berlin University of Technology, Albuquerque, NM, USA Berlin, Germany; 2Institut für Optik und Atomare Physik, Berlin 3 Dr. Michael Bruce University of Technology, Berlin, Germany; Sicoya GmbH, c/o MONDAY 4 Consultant TU Berlin, Berlin, Germany; IHP, Frankfurt (Oder), Germany; 5 Austin, TX, USA Dialog Semiconductor, Kirchheim, Germany 10:45 a.m. Pulsed Laser Stimulation Coupled with Optical Failure SCANNING PROBE ANALYSIS Analysis Technique: A Methodology for Helping Space 1:00–1:50 p.m. • D139 & 140 Application Electronics Designers: Dr. Guillaume Bascoul1 and Dr. Kevin Sanchez2, 1Intraspec Technologies, Toulouse, Session Chairs: Mr. Phil Kaszuba France; 2Laboratories and Expertise, Quality Assurance, Centre GLOBALFOUNDRIES National d’Etudes Spatiales (CNES), Toulouse, France Essex Junction, VT, USA 11:10 a.m. Mr. Terence Kane Soft Defect Localization on Analog and Mixed-Signal ICs IBM Using an OBIRCH Tool: Mr. Chunlei Wu1, Mr. Yi Che2 and Hopewell Junction, NY, USA Xiaocui Li2, 1Analog & Sensors Group, Freescale Semiconductor (China) Limited, Tianjin, China; 2Product Analysis Laboratory, 1:00 p.m. Freescale Semiconductor (China) Limited, Tianjin, China Near Field EMC Scanning Method Based on an E-Field Collapse Method: N/A Jeffrey C. Dunnihoo1, Mr. Pasi 11:35 a.m. Tamminen2 and Mr. Toni Viheriäkoski3; 1Pragma Design, Inc., Combinational Logic Analysis Using Laser Voltage Probing: Bertram, TX, USA; 2Microsoft, Redmond, WA, USA;3 Cascade Mr. Venkat Ravikumar1, S.L. Phoa1, Mr. W Lua1, Ms. YX Seah2 Metrology, Lohja, Finland and Mr. Gopinath Ranganathan2, 1Advanced Micro Devices— Singapore Pte Ltd, Singapore, Singapore, 2Advanced Micro 1:25 p.m. Devices—Singapore Pte Ltd1, Singapore, Singapore Extending Electrical Scanning Probe Microscopy 10 Measurements of Semiconductor Devices Using Microwave 12:00–1:00 p.m. Impedance Microscopy: Mr. Benedict Drevniok1, Sinjin Lunch Lobby E Dixon-Warren1, Oskar Amster2, Stuart L Friedman2 and Yongliang Yang2; 1Chipworks Inc., Ottawa, ON, Canada; 2Prime FIB SAMPLE PREPARATION Nano, Palo Alto, CA, USA 1:00–2:15 p.m. • D137 & 138 FAULT ISOLATION II Session Chairs: 1:50–3:30 p.m. • D139 & 140 Dr. Tom Schamp

Hitachi High Technology America Inc. Session Chairs: Dr. Michael Bruce Dallas, TX, USA Consultant Mr. Carl Nail Austin, TX, USA Evans Analytical Group, LLC Dr. Paiboon Tangyunyong Irvine, CA, USA Sandia National Laboratories 1:00 p.m. Albuquerque, NM, USA Vacuum Assisted Ex Situ Lift Out for Manipulation of FIB 1:50 p.m. Prepared Specimens: Dr. Lucille A. Giannuzzi1, Dr. Trevor Comparison of Photon and Thermal Emission Microscopy Clark2 and Mr. Dustin Hess2, 1EXpressLO LLC, Lehigh Acres, FL, for Dynamic Fault Isolation: Dr. SH Goh, Technology USA; 2The Pennsylvania State University, University Park, PA, Development—New Technology Prototyping, GlobalFoundries, USA Singapore, Singapore 1:25 p.m. 2:15 p.m. How Xe and Ga FIB Differ in Inducing Lateral Damage Unique Approaches to Isolate Nano-Scale Defect in Snake- on TEM Samples: Dr. Tomas Hrncir1, Dr. Jozef Vincenc Comb Test Structure: Dr. Sujing Xie1, Mr. Nathan Wang2, Obona2, Dr. Christian Lang3, Dr. Martin Petrenec2 and Dr. Ms. Chaoying Chen2 and Ms. Qindi Wu2, 1Maxim Integrated, Jan Michalička4; 1R&D—Physics, TESCAN, Brno, Czech Hillsboro, OR, USA; 2Maxim Integrated, San Jose, CA, USA Republic; 2R&D—Applications, TESCAN, Brno, Czech Republic; 3Nanoanalysis, Oxford Instruments, High Wycombe, United Kingdom; 4TESCAN Orsay Holding, Brno, Czech Republic

Programs are tentative: papers, authors, and order of presentations are subject to change. 2:40 p.m. Optical Fault Isolation and Nanoprobing Monday,Techniques for NovemberFIB USER 10, GROUP 2014 the 10nm Technology Node and Beyond: Dr. Martin von 3:40–5:40 p.m. • D137 & 138 Haartman, Dr. Samia N Rahman, Dr. Satyaki Ganguly, Dr. Chair: Steve Herschbein, GLOBALFOUNDRIES Jai Verma, Dr. Ahmad Umair and Dr. Tristan Deborde, Logic Co-Chair: Jeff Ditto, University of Oregon Technology Development, Intel Corporation, Hillsboro, OR, Sponsored by: Hitachi High Technologies America, Inc. USA 3:05 p.m. CONTACTLESS FAULT ISOLATION

Device Ioff Mapping: Analysis of Ring Oscillator by Optical MONDAY Beam Induced Resistance Change: Mr. Gregory M. Johnson1, USER GROUP Mr. Christopher D’Aleo2 and Dr. Ziyan Xu3, 1Physical Failure 3:40–5:40 p.m. • D139 & 140 Analysis, GlobalFoundries, Hopewell Junction, NY, USA; Chair: Patrick Pardy, Intel 2Physical Failure Analysis, IBM, Hopewell Junction, NY, USA; Co-Chair: Dan Bockelman, Intel 3Device Characterization, IBM, Hopewell Junction, NY, USA Sponsored by: DCG Systems and Checkpoint Technologies TOOLS-OF-THE-TRADE TOUR* FIB CIRCUIT ANALYSIS AND EDIT 5:00–6:45 p.m. • Exhibit Hall D 2:15–3:30 p.m. • D137 & 138 *Separate Registration Required Session Chairs: Mr. Jason M. Benz PUNCH BOWL SOCIAL PORTLAND IBM Microelectronics 7:00–9:30 p.m. Essex Jct, VT, USA Included with full conference registration, join us for a night Dr. Michael DiBattista of fun, food and games! Use your Max Pass to follow the signs Qualcomm, Inc. leading you to the fun. San Diego, CA, USA Sponsored by: Mentor Graphics 2:15 p.m. Directions: Alleviating Sample Charging During FIB Operation: Dr. DoubleTree Hotel to Punch Bowl Social Qing Liu, Ms. H. B. Kor, Ms. Y. W. Siah and Prof. Chee Lip • Walk towards Max stop “NE 7th Ave.” on Holladay Park Gan, Temasek Laboratories@NTU, Nanyang Technological • Get on Max Red line (City Center/Beaverton) or Blue line University, Singapore, Singapore (City Center/Hillsboro) • Get off on Max stop “Morrison/SW 3rd Ave.” 11 2:40 p.m. • Walk across SW 3rd Ave. and the Punch Bowl Social will Circuit Tracing on an Integrated Circuit Using FIB be located inside the mall, top level Passive Voltage Contrast Effect: Mr. Alexander Sorkin1, Mr. Christopher A. Pawlowicz2, Mr. Alex Krechmer1 and Mr. Punch Bowl Social to DoubleTree Hotel Michael W. Phaneuf3; 1R&D, Techinsights, Ottawa, ON, Canada; • Walk towards Max stop “Mall/SW 4th Ave” on SW Yamahill St. 2Lab Services, Techinsights, Ottawa, ON, Canada; 3Fibics • Get on Max Red line (Airport) or Blue line (Gresham) Incorporated, Ottawa, ON, Canada • Get off on Max stop “NE 7th Ave.” or “Lloyd Center/NE 11th Ave”—Both stops are near our hotel 3:05 p.m. • Walk towards 9th or 11th Ave. to the DoubleTree Hotel In-Situ Infrared Microscope for a Focused Ion Beam Workstation—Circuit Edit and Backside Edit Applications: Mr. Matthew Weschler1, Mr. Michael Durller2 and Mr. Alexander Richards3; 1Marketing and Applications, Technical Sales Solutions LLC, Beaverton, OR, USA; 2Cyber Focused Tools Innovation Unit, Battelle Memorial Institute, Columbus, OH, USA; 3Engineering, Technical Sales Solutions LLC, Beaverton, OR, USA

Programs are tentative: papers, authors, and order of presentations are subject to change. TUESDAY, NOVEMBER 3, 2015 Technical Program Time Room Plenary Session 9:00–10:30 a.m. Exhibit Hall D Refreshment Break 10:30–11:10 a.m. Exhibit Hall D Board and System Level FA 11:10 a.m.–12:00 p.m. D137 & 138 Microscopy 11:10 a.m.–12:00 p.m. D139 & 140 Lunch 12:00–1:30 p.m. Exhibit Hall D

TUESDAY Refresh and Energize Break 1:30–2:55 p.m. Exhibit Hall D 3D Devices Failure Analysis I 2:55–4:05 p.m. D139 & 140 Detecting Counterfeit Microelectronics I 2:55–5:00 p.m. D137 & 138 Expo Networking Reception 5:00–6:40 p.m. Exhibit Hall D

PLENARY SESSION MICROSCOPY 9:00–10:30 a.m. 11:10 a.m.–12:00 p.m. • D139 & 140 Exhibit Hall D Session Chairs: 9:15 a.m. Mr. Carl Nail Expo Welcome, Efrat Moyal, Lattice Gear LLC Evans Analytical Group, LLC Irvine, CA, USA 9:20 a.m. Introduction of Albert Lin, Jay Demarest, IBM Nanotech Physical Dr. Tom Schamp Characterization Hitachi High Technology America Inc. Dallas, TX, USA 9:25 a.m. Albert Yu-Min Lin, Research Scientist/Engineer from the 11:10 a.m. California Institute for Telecommunications and Information Detection and Measurement of Intermetallic Thin Films Using Technology EDX Line Scanning: Mr. Carl Nail, Failure Analysis Services, MTE Division, Evans Analytical Group, LLC, Irvine, CA, USA 10:30–11:10 a.m. Refreshment Break in Exhibit Hall D 11:35 a.m. Quantitative SiGe TEM Elemental Analysis in FinFET Test 12 Structures: Dr. James J. Demarest1 and Dr. John Bruley2; BOARD AND SYSTEM LEVEL FA 1IBM, Albany, NY, USA; 2IBM T.J. Watson Research Center, 11:10 a.m.–12:00 p.m. • D137 & 138 Yorktown Heights, NY, USA Session Chairs: 12:00–1:30 p.m. Ms. Victoria Bruce Lunch • Exhibit Hall D Qualcomm Incorporated San Diego, CA, USA 1:30–2:55 p.m. Refresh and Energize Break • Exhibit Hall D Mr. Ted Kolasa Orbital Sciences Corporation Chandler, AZ, USA 3D DEVICES FAILURE ANALYSIS I 2:55–4:05 p.m. • D139 & 140 11:10 a.m. TDR-Case Studies in Electrical Failure Isolation: Mr. Session Chairs: Stephen T. Fasolino and Mr. Jason Wheeler, Failure Analysis Mr. Frank Altmann Lab, Raytheon, Mckinney, TX, USA Fraunhofer Institute for Mechanics of Materials Halle, Germany 11:35 a.m. Failure Analysis of Yellow Banding on Optically Bonded Dr. Yan Li Touch Screen: Mr. Qing Gu, Mr. J. lewis and Dr. Danhua Xu, Intel Microsoft Corporation, Redmond, WA, USA Chandler, AZ, USA 12:00–1:30 p.m. 2:55 p.m. Lunch • Exhibit Hall D Failure and Stress Analysis of Cu TSVs Using GHz-Scanning Acoustic Microscopy and Polariscopy: Prof. Ingrid De Wolf1,2, 1:30–2:55 p.m. Mr. Ahmad Khaled1,2, Dr. Martin Herms3, Dr. Matthias Wagner3, Refresh and Energize Break • Exhibit Hall D Dr. Tatjana Djuric4, Dr. Peter Czurratis4 and Dr. Sebastian Brand5; 1IMEC, Leuven, Belgium; 2Materials Engineering, KU Leuven, Leuven, Belgium; 3PVA Metrology and Plasma Solutions GmbH, Jena-Maua, Germany; 4PVA Tepla Analytical Systems GmbH, Westhausen, Germany; 5Characterization of Microsystems, Fraunhofer Institute of Material Mechanics, Halle, Germany

Programs are tentative: papers, authors, and order of presentations are subject to change. 3:20 p.m. 3:20 p.m. Fast Feature Based Nondestructive Fault Isolation in 3D Analyzing the Impact of X-Ray Tomography for IC Packages Utilizing Virtual Known Good Device: Dr. Ka Nondestructive Counterfeit Detection: Mr. Halit Dogan1, Chung Lee1, Dr. Jesse Alton1, Mr. Martin Igarashi1 and Mr. Mr. Mahbub Alum2, Dr. Navid Asadizanjani2, Dr. Sina Stephane Barbeau2; 1TeraView Limited, Cambridge, United Shahbazmohamadi, PhD3, Prof. Domenic Forte, PhD2 and Prof. Kingdom; 2IBM Microelectronics, Bromont, QC, Canada Mark Tehranipoor, PhD2, 1Electrical and Computer Engineering, University of Connecticut, Storrs, CT, USA; 2Electrical and 3:45 p.m. Computer Engineering, University of Florida, Gainesville, FL, Failure Analysis Strategies for Multi-Stacked Memory USA; 3Mechanical Engineering, Manhattan College, Riverdale, Devices with TSV Interconnects: Mr. Frank Altmann1, Mr. NY, USA TUESDAY Christian Grosse1, Mr. Falk Naumann1, Mr. Jens Beyersdorfer2 and Mr. Tony Veches3; 1Center for Applied Microstructure 3:45 p.m. Diagnostics (CAM), Fraunhofer Institute for Mechanics of Non-Destructive PCB Reverse Engineering Using X-Ray Materials, Halle, Germany; 2Centre for Applied Microstructure Micro Computed Tomography: Dr. Navid Asadizanjani1, Diagnostics (CAM), Fraunhofer Institute for Mechanics of Dr. Sina Shahbazmohamadi, PhD2, Prof. Mark Tehranipoor, Materials, Halle, Germany; 3Micron Technology, Inc., Boise, ID, PhD1 and Prof. Domenic Forte, PhD1, 1Electrical and Computer USA Engineering, University of Florida, Gainesville, FL, USA; 2Mechanical Engineering, Manhattan College, Riverdale, NY, DETECTING COUNTERFEIT USA 4:10 p.m. MICROELECTRONICS I 2010–2015: The Evolving Counterfeit Machine: Mr. Tom 2:55–5:00 p.m. • D137 & 138 Sharpe, SMT Corp., Sandy Hook, CT, USA Session Chairs: 4:35 p.m. Mr. Joe Colangelo Functional Electronic Clones—The Most Dangerous New Raytheon Counterfeit Threat Facing the Entire Electronics Industry McKinney, TX, USA Today: Mr. Tom Sharpe, SMT Corp., Sandy Hook, CT, USA Mr. Robert Champaign Raytheon Network Centric Systems EXPO NETWORKING RECEPTION McKinney, TX, USA 5:00–6:40 p.m.• Exhibit Hall D 2:55 p.m. Sponsored by: Mentor Graphics and Nisene Technology Group Update on Draft SAE AS6171 Standard—Tools and 13 Techniques for Detection and Mitigation of Counterfeit Electronics: Dr. William E. Vanderlinde1 and Mr. Bhanu P. Sood2, 1Laboratory for Physical Sciences, College Park, MD, USA; 2Mechanical Engineering, CALCE, University of Maryland, College Park, MD, USA

Programs are tentative: papers, authors, and order of presentations are subject to change. WEDNESDAY, NOVEMBER 4, 2015 Technical Program Time Room Metrology and In-Line Device Characterization 8:00–8:50 a.m. D139 & 140 Medical Device Tutorial 8:00–9:30 a.m. D137 & 138 Refreshment Break 9:30–10:10 a.m. Exhibit Hall D Panel Discussion—1st Silicon Debug: Rapid Identification and 10:10 a.m.–12:10 p.m. D139 & 140 Correction of Product Systematic Failures EDFAS Membership Meeting and Luncheon 12:10–1:30 p.m. Ballroom 251/258 (2nd Floor) Dessert Reception Poster/Video Session 1:30–3:30 p.m. Exhibit Hall D 3D Device Failure Analysis II 3:30–4:45 p.m. D137 & 138 WEDNESDAY Diagnostic Testing, Scanning and Debug 3:30–4:45 p.m. D139 & 140 Detecting Counterfeit Microelectronics II 4:45–6:00 p.m. D137 & 138 Device FA 4:45–6:00 p.m. D139 & 140

MEDICAL DEVICE TUTORIAL PANEL DISCUSSION—1ST SILICON 8:00–9:30 a.m. • D137 & 138 DEBUG: RAPID IDENTIFICATION 8:00 a.m. Test Methods and Analytical Techniques for Wearable AND CORRECTION OF PRODUCT Devices: Dr. John Clark McNulty, CRE, P.E., Materials & Corrosion Engineering Practice, Exponent, Inc., Menlo Park, CA, SYSTEMATIC FAILURES USA 10:10 a.m.–12:10 p.m. • D139 & 140

9:30–10:10 a.m. Session Chair: Mr. Tracy Myers Refreshment Break in Exhibit Hall D ON Semiconductor Gresham, OR, USA METROLOGY AND IN-LINE DEVICE 10:10 a.m. 14 CHARACTERIZATION Panelist: Izak Kapilevich, DCG Systems 8:00–8:50 a.m. • D139 & 140 10:40 a.m. Session Chairs: Panelist: Ryan Ross 303-200, NASA Jet Propulsion Laboratory Mr. Bryan Tracy 11:10 a.m. Evans Analytical Group Panelist: Jerry Downey, ON Semiconductor Sunnyvale, CA, USA 11:40 a.m. Dr. Huimeng Wu Panelist: Geir Eide, Mentor Graphics Carl Zeiss Microscopy, LLC Peabody, MA, USA To meet time-to-market requirements, a company must be successful in identifying the root cause of failure on 1st silicon 8:00 a.m. product at wafer final test. Long diagnostic delays due to lack of In-Line Detection of Deep Trench Moat Underetch Defects preparation, improper skill sets, and inadequate equipment can 1 Using E-Beam Inspection: Mr. Richard Hafer , Mr. Brian significantly reduce return on investment. Similarly, deciding 1 1 1 Messenger , Mr. Mark Dekker , Dr. Oliver D. Patterson , on the functional area (fab, design, test) that must implement 2 2 1 Mr. Xiaohu Tang , Mr. Shuen-Cheng Lei and Yi Feng , corrective actions can cause further delays. It is a task with both 1 2 GlobalFoundries, Hopewell Junction, NY, USA; Hermes technical and organizational challenges. Microvision Inc, San Jose, CA, USA The panel presentations will cover key topics that are 8:25 a.m. essential in achieving successful 1st silicon debug: fault SIMS Quantitative Analysis and Optimization for Ion isolation challenges, test coverage, design issues, managing Implantation Angle Deviation: Mr. Jiangbei Shi, Dr. Weiting the foundry relationship, and business requirements. This will Chien, Mr. Qihua Zhang, Mr. Zhenyuan Li, Mr. Xiaogang Zheng be followed by a discussion examining how these issues are and Mr. Aimin Li, Failure Analysis Laboratory, Semiconductor managed organizationally to insure rapid resolution of 1st Manufacturing International (Tianjin) Corporation, TianJin, silicon failures and successful introduction of new products. China Included will be how to settle contention behind contributors to the 1st silicon of a product (both internal and external). 9:30–10:10 a.m. For anyone involved in new product introduction, this will be Refreshment Break in Exhibit Hall D a panel discussion not to miss!

Programs are tentative: papers, authors, and order of presentations are subject to change. EDFAS MEMBERSHIP DEVICE FA—POSTERS Session Chairs: MEETING AND LUNCHEON Ms. Victoria Bruce 12:10–1:30 p.m. • Ballroom 251/258 (2nd Floor) Qualcomm Incorporated Join us to hear the president’s report on the current status San Diego, CA, USA of and future vision for EDFAS; to meet the new EDFAS officers and board members; and to congratulate the 2014 Mr. Ted Kolasa Photo Contest winners. We look forward to seeing you there! Orbital Sciences Corporation The meeting is open to all EDFAS members, exhibitors and Chandler, AZ, USA interested prospective members. One ticket is included with full conference and exhibitor personnel registrations. Failure Analysis Induced by Bit Line Sense Amplifier Noise in High Density DRAM: Mr. Myungjae Lee, DRAM Product

Engineering Team, Samsung Electronics, Hwaseong-Si, South WEDNESDAY POSTER SESSION AND Korea DESSERT RECEPTION Analysis of Write Recovery Time Degradation Caused by 1:30–3:30 p.m. • Exhibit Hall D Adjacent Storage Node Data in DRAM: Mr. Kwangwon Lee, DRAM Product Engineering Team, Memory Division, Samsung Electronics,Co., Ltd, Hwaseong, South Korea 3D DEVICES FAILURE ANALYSIS—POSTER EMERGING FA TECHNIQUES AND Session Chairs: Dr. Yan Li CONCEPTS—POSTER Intel Session Chairs: Chandler, AZ, USA Mr. Terence Kane IBM Mr. Frank Altmann Hopewell Junction, NY, USA Fraunhofer Institute for Mechanics of Materials Halle, Germany Mr. Phil Kaszuba Globalfoundries MOFM : Magneto-Optical Frequency Mapping System For Essex Junction, VT, USA Very Low Resistance Short Failure Current Imaging: Dr. 15 Tomonori Nakamura, Hamamatsu Photonics, Hamamatsu, Laser Stimulation Effect on Fin Fet and Case Study: Mr. Japan Kyeongju Jin, Product and Test engineering Team, Samsung Electronics, Hwaseong-Si, South Korea

CASE STUDIES AND FA FA LAB MANAGEMENT—POSTERS PROCESS—POSTERS Session Chairs: Session Chairs: Dr. Zhigang Song Dr. Zhigang Song GLOBALFOUNDRIES GLOBALFOUNDRIES Hopewell Junction, NY, USA Hopewell Junction, NY, USA Ms. Rose Ring Ms. Rose Ring GLOBALFOUNDRIES Malta GLOBALFOUNDRIES Malta Stillwater, NY, USA Stillwater, NY, USA Implementation of a Visual System to Manage and A Case Study of Failure Analysis on ESD-Induced Improve Failure Analysis Work Flow: Mr. Jason M. Benz, Degradation of 405nm LD: Prof. Hongmin Liu, National Mr. Kevin A. Distelhurst, Mr. Doug B. Hunt, and Dr. Rick Kontra, Space Science Center, Chinese Academy of Sciences, Beijing, GlobalFoundries, Essex Jct, VT, USA China Failure Analysis of Embedded Non-Volatile Memory with Nano- and Micro-Probing Techniques: Xiang-Dong Wang, Ping Wang, Arnold Yazzie, Laurel Will, John Buchert and Scott Guisinger, Freescale Semiconductor, Inc., Chandler, AZ, USA Magnetic Current Imaging Power Short Localization: Mr. Jan Gaudestad, Ms. Florencia Rusli and MengChi Pun, Avago, Penang, Malaysia

Programs are tentative: papers, authors, and order of presentations are subject to change. FAULT ISOLATION—POSTERS METROLOGY AND IN-LINE Session Chairs: Dr. Paiboon Tangyunyong CHARACTERIZATION—POSTERS Sandia National Laboratories Session Chairs: Albuquerque, NM, USA Mr. Bryan Tracy Evans Analytical Group Dr. Michael Bruce Sunnyvale, CA, USA Consultant Austin, TX, USA Dr. Huimeng Wu Carl Zeiss Microscopy, LLC IR Thermography for Temperature Measurements and Peabody, MA, USA Fault Location on AlGaN/GaN HEMTs and MMICs: Mr. Leny WEDNESDAY Baczkowski1, Mr. Dominique Carisetti2, Dr. Laurent Brunel3, Failure Mechanism Studies and Elimination of Galvanic Mr. Franck vouzelaud1, Prof. Christophe Gaquiere4, Dr. Benoit Corrosion (Al-Cu Cell)on Microchip Al Bondpads in Cupper Lambert3, Dr. Nicolas Sarazin2 and Mr. Jean-Claude Clement2; Process: Dr. Younan Hua, WinTech Nano-Technology Services 1Thales Airborne Systems, Elancourt, France; 2Thales Research Pte. Ltd., Singapore, Singapore 3 and Technology, Palaiseau, France; United Monolithic Characterization of 88/144 nm SOI Wafers Produced by 4 Semiconductors, Villebon-sur-Yvette, France; IEMN, Villeneuve Separate Process Technologies Using Optical Second d’Ascq, France Harmonic Generation: Mr. Marc Kryger and Mr. John Changala, Femtometrix, Santa Ana, CA, USA Logic LIVA Fault Isolation in Synthesized Logic: Mr. Tim J. Pifer1 and Dr. Travis M. Eiles2; 1TMG, Intel, Hillsboro, OR, USA; Oxygen Analysis in Antireflective Coatings on Solar Cells 2TMG Labs, Intel Corp., Hillsboro, OR, USA via X-ray Photoelectron Spectroscopy and Transmission Electron Microscopy: Matthew Hughes and Zhiqiang Chen, How to Locate Resistance VIA by Analyzing Schematic Center for Electron Microscopy and Nanofabrication, Portland Combined with EMMI Result on Integrated Circuit Failed State University Portland OR, USA at Cold Temperature: Mr. Gaojie Wen, PA Lab, Freescale semiconductor, Tianjn, China Comparison of Magnetic Field Imaging and Thermal Laser MICROSCOPY—POSTERS Stimulation for Detecting Electrically Shorting Defects Session Chairs: within a Die BEOL: Mr. Kevin A. Distelhurst, GlobalFoundries, Mr. Carl Nail Essex Jct, VT, USA Evans Analytical Group, LLC 16 Irvine, CA, USA Isolating Electrically Open Defects Using Space Domain Spectometry With A SQUID: Mr. Kevin A. Distelhurst, Dr. Tom Schamp GlobalFoundries, Essex Jct, VT, USA Hitachi High Technology America Inc. Dallas, TX, USA Symptom or Cause? A Case Study: Ms. Anuradha Swaminathan, Dr. Joy Y. Liao and Mr. Howard Lee Marks, Study of How Different FIB Beam Current Intensities Locate Silicon Failure Analysis Lab, nVIDIA Corporation, Santa Clara, Possible Defects: Mr. Wen Chen Hsu1 and Mr. Yu Hsiang CA, USA shu1,2; 1Failure Analysis, United Microelectronics Corporation, Hsinchu, Taiwan; 2Product Engineer Department, United FIB CIRCUIT ANALYSIS Microelectronics Corporation, Ltd., Hsinchu County, Taiwan Studies on A Qualification Method (OSSD) of Microchip AND EDIT—POSTER Al Bondpads: Dr. Younan Hua, WinTech Nano-Technology Session Chairs: Services Pte. Ltd., Singapore, Singapore Dr. Michael DiBattista Qualcomm, Inc. San Diego, CA, USA NANOPROBING AND ELECTRICAL Mr. Jason M. Benz CHARACTERIZATION—POSTERS GLOBALFOUNDRIES Session Chairs: Essex Jct, VT, USA Mr. Kent Erington Freescale Semiconductor A Combination Continuous Wave and Pulse Laser Assisted Austin, TX, USA Chemical Etching Processes through Encapsulated IC Packaging: Mr. Matthew M. Mulholland1 and Mr. Scott Mr. Randal E. Mulder Silverman2, 1Post Silicon Validation, Intel Corporation, Santa Silicon Labs Clara, CA, USA; 2Varioscale, Inc, San Marcos, CA, USA Austin, TX, USA

The Application of Pulse IV Function in Nano-Prober System: Mr. YuTe Lee, Mr. Jeng Hung Pan, Mr. Shih-Yuan Liu, Mr. Yu-Pang Chang and Mr. Jian-Chang Lin, Failure Analysis Dept, PED, UMC, Tainan County, Taiwan

Programs are tentative: papers, authors, and order of presentations are subject to change. PACKAGING AND ASSEMBLY SCANNING PROBE LEVEL FA— POSTERS ANALYSIS—POSTERS Session Chairs: Session Chairs: Dr. Lihong Cao Mr. Phil Kaszuba Advanced Micro Devices GLOBALFOUNDRIES Austin, TX, USA Essex Junction, VT, USA Mr. Bhanu P. Sood Mr. Terence Kane CALCE, University of Maryland IBM College Park, MD, USA Hopewell Junction, NY, USA

Application of Scanning Acoustic Microscopy for Micro De- Case Study—Doping Profile Analysis for 30nm DRAM WEDNESDAY Lamination Detection: Mr. Hyunsoo Kim, Mr. Seunghyuck Devices Using SCM and SSRM: Mr. Hsiu-Pin Chen1, Dr. Lee, Mr. Hakbeom Kim and Mrs. Sanga Kim, Failure Analysis Jian-Shing Luo1, Ms. Ching-Shan Sung1, Mr. Chen-Kang Wei2, Engineering Team, QRT Inc., Gyeonggi-do, South Korea Mr. Kai-Lun Chiang3, Dr. Chia-Ming Yang4, Mr. Hsueh-Chun Liao4, Mr. Jahson Suo5 and Mr. Shifeng Lu5; 1Physical Failure Analysis Department, Inotera Memories, Inc., Taoyuan, SAMPLE PREPARATION AND DEVICE Taiwan; 2Diffusion Process Department, Inotera Memories, Inc., Taoyuan, Taiwan; 3Device Engineering Department, Inotera DEPROCESSING— POSTERS Memories, Inc., Taoyuan, Taiwan, 4Chang Gung University, Session Chairs: Taoyuan, Taiwan; 5Micron Technology, Boise, ID, USA Mr. Roger Alvis FEI Company Environmental Control Scanning Nonlinear Dielectric Hillsboro, OR, USA Microscopy Measurements of p-n Structures, epi-Si Wafers, and SiC Crystal Defects: Dr. Jing-Jiang Yu1, Dr. Takehiro Mr. Jake E. Klein Yamaoka2, Mr. Satoshi Hasumura3, Dr. Ryusuke Hirose3, Mr. Texas Instruments Kazunori Ando3 and Mr. Katsunori Mizuguchi2; 1Hitachi High Tucson, AZ, USA Technologies America, Inc., Clarksburg, MD, USA; 2Hitachi High- 3 TEM Sample Preparation Tricks for Advanced DRAMs: Ms. Tech Science Corporation, Tokyo, Japan; Hitachi High-Tech Ching-Shan Sung, Ms. Hsiu-Ting Lee and Dr. Jian Shing Luo, Science Corporation, Suntogun, Japan Physical Failure Analysis Department, Inotera Memories, Inc., Carrier Redistribution Analysis of Gate-Biased SiC Power- Taoyuan, Taiwan MOSFET Using Super-Higher-Order Scanning Nonlinear 17 Selective Etching of Highly-P-Doped Si Substrate Using Dielectric Microscopy: Mr. Norimichi Chinone and Prof. Low-p-doped Si epi as an Etch Stop Layer: Mrs. Valentina Yasuo Cho, Research Institute of Electrical Communication, Korchnoy, FA, Intel Israel (74) Ltd, Haifa, Israel Tohoku University, Sendai, Japan A More Rapid Approach in Revealing the Physical Status of Observation of Polarization and Two Dimensional Electron Polyfuses and Thin Film Fuses in a Multi-Layer Integrated Gas in AlGaN/GaN Heterostructure Using Scanning Circuit: Mr. Jason H. Lagar, Mr. Rudolf A. Sia and Ms. Melanie Nonlinear Dielectric Microscopy: Mr. Kotaro Hirose, Mr. S. Cajita, Worldwide Product Analysis, Analog Devices Gen. Norimichi Chinone and Prof. Yasuo Cho, Research Institute of Trias, Inc., Philippines, Cavite, Philippines Electrical Communication, Tohoku University, Sendai, Japan

Programs are tentative: papers, authors, and order of presentations are subject to change. 3D DEVICE FAILURE ANALYSISTuesday, II NovemberDETECTING 11, 2014 COUNTERFEIT 3:30–4:45 p.m. • D137 & 138 MICROELECTRONICS II Session Chairs: 4:45–6:00 p.m. • D137 & 138 Dr. Yan Li Intel Session Chairs: Chandler, AZ, USA Mr. Robert Champaign Raytheon Network Centric Systems Mr. Frank Altmann McKinney, TX, USA Fraunhofer Institute for Mechanics of Materials Halle, Germany Mr. Joe Colangelo Raytheon 3:30 p.m. McKinney, TX, USA WEDNESDAY 3D Integrated Power—A Discrete Perspective: Mr. Ian Kearney, Texas Instruments, Bethlehem, PA, USA 4:45 p.m. Techniques for Reverse Engineering and Functionality 3:55 p.m. Extraction of Mixed-Signal ICs for Security Applications: Imaging Techniques Comparison For Advanced 3Di Dr. Franco Stellari1, Dr. Chung-Ching Lin2, Lynne Gignac3, Devices Characterization: Dr. Frederic Lorut, Dr. Nicolas Dr. Raphael Robertazzi1, Alan Weger1 and Dr. Peilin Song3; Hotellier, Dr. Sandrine Lhostis and Dr. Fabienne Ponthenier, 1IBM Research, Yorktown Heights, NY, USA; 2IBM T.J. Watson STMicroelectronics, Crolles, France Research Center, Yorktown Heights, NY, USA; 3Circuit Test and Diagnostics Technology, IBM T.J. Watson Research Center, 4:20 p.m. Yorktown Heights, NY, USA Analysis of Integrated Current Sense in Multiphase Buck Converters: Mr. Ian Kearney, Texas Instruments, Bethlehem, 5:10 p.m. PA, USA WISE and ICARUS—New X-Ray Algorithms to Improve the Detection of Counterfeit Components: Dr. Bill Cardoso, DIAGNOSTIC TESTING, Creative Electron, San Marcos, CA, USA 5:35 p.m. SCANNING AND DEBUG Materials Analyses for Parts Validation: Dr. W. John 3:30–4:45 p.m. • D139 & 140 Wolfgong1 and Mr. James Izzo2; 1Space and Airborn Systems, Raytheon, McKinney, TX, USA; 2McKinney FA Lab, Raytheon, Session Chairs: McKinney, TX, USA 18 Mr. Geir Eide Mentor Graphics Wilsonville, OR, USA DEVICE FA Mr. Mark E. Kimball 4:45–6:00 p.m. • D139 & 140 Mentor Graphics Session Chairs: Wilsonville, OR, USA Mr. Ted Kolasa 3:30 p.m. Orbital Sciences Corporation Tester Assisted Multiple Emission Microscopy: Dr. Christian Chandler, AZ, USA Hollerith, Mr. Gerhard Borgmann, Wolfgang Schaller, Ms. Victoria Bruce Christof Brillert and Mr. Christian Burmer, Infineon Tech. AG, Qualcomm Incorporated Neubiberg, Germany San Diego, CA, USA 3:55 p.m. 4:45 p.m. FASTKIT—A Software Tool for Easy Design Visibility and A Case Study: Improving FIB Passive Voltage Contrast Diagnostic Enhancement for Failure Analysis: Mr. Etienne Imaging for Deep N-well Circuits: Mr. Randal E. Mulder, Auvray and Mr. Paul Armagnat, ST Microelectronics, Grenoble, Device Analysis Lab, Silicon Labs, Austin, TX, USA France 5:10 p.m. 4:20 p.m. Fault Isolation and TEM Study in the State-of-Art Thin-Film Strategy To Address Low DPPM Failure Mechanisms On Transistor: Dr. Yongkai Zhou1, Ms. Shik Lin Lee1, Mr. Chao Automotive Grade WI-FI Radio Frequency Devices: Dr. Kai Fu1, Dr. Younan Hua2 and Mr. Xiaomin Li1, 1Physical Analysis 1 2 1 1 Wang , Ms. Sadia lone and Mr. Rhys Weaver ; Operation, CSR Division, WinTech Nano-Technology Services Pte. Ltd., 2 plc, Cambridge, United Kingdom; Chip Design Central, CSR Singapore, Singapore, 2WinTech Nano-Technology Services plc, Cambridge, United Kingdom Pte. Ltd., Singapore, Singapore 5:35 p.m. Analysis Approach on DMOS Transistor VTH Mismatch Due to Trapped Charges: Mr. Ismail Hashim1, Mr. Chung Keow Ang1 and Mr. Chye Siong Kenny Gan2; 1Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia, 2Infineon Technologies AG, Neubiberg, Germany

Programs are tentative: papers, authors, and order of presentations are subject to change. THURSDAY, NOVEMBER 5, 2015 Technical Program Time Room Package FI Tutorial 8:00–9:00 a.m. D137 & 138 Nanoprobing and Electrical Characterization 8:00–10:05 a.m. D139 & 140 Packaging and Assembly Level FA I 9:00–10:15 a.m. D137 & 138 Refreshment Break 10:05–10:25 a.m. Meeting Space Foyer Packaging and Assembly Level FA II 10:25–11:40 a.m. D137 & 138 Sample Preparation and Device Deprocessing I 10:25–11:40 a.m. D139 & 140 Lunch 11:40 a.m.–12:40 p.m. Lobby E

Sample Preparation and Device Deprocessing II 12:40–1:55 p.m. D137 & 138 THURSDAY Case Studies and FA Process 12:40–2:20 p.m. D139 & 140 Refreshment Break 1:55–2:30 p.m. Meeting Space Foyer Sample Prep / 3D Package Prep User Group 2:05–4:05 p.m. D137 & D138 Nanoprobing User Group 2:30–4:30 p.m. D139 & D140

9:40 a.m. PACKAGE FI TUTORIAL Nonvisible Defect Analysis by the Nanoprobing 8:00–9:00 a.m. • D137 & 138 Methodology: Dr. Changqing Chen, Failure Analysis, Product Failure Analysis, GlobalFoundries, Singapore 8:00 a.m. Package Level Fault Isolation: Dr. Lihong Cao, Quality & 10:05–10:25 a.m. Reliability Engineering, Advanced Micro Devices, Austin, TX, Refreshment Break in Meeting Space Foyer USA

NANOPROBING AND ELECTRICAL PACKAGING AND ASSEMBLY LEVEL FA I CHARACTERIZATION 9:00–10:15 a.m. • D137 & 138 8:00–10:05 a.m. • D139 & 140 Session Chairs: Session Chairs: Dr. Lihong Cao Mr. Randal E. Mulder Advanced Micro Devices Silicon Labs Austin, TX, USA 19 Austin, TX, USA Mr. Bhanu P. Sood Mr. Kent Erington CALCE, University of Maryland Freescale Semiconductor College Park, MD, USA Austin, TX, USA 9:00 a.m. 8:00 a.m. Corrosion Mechanisms of Cu Bond Wires on AlSi 1 2 High Resolution Electron Beam Induced Resistance Pads: Dr. Wentao Qin , Dr. Harold Anderson , Dr. Tom 1 3 1 Change for Fault Isolation with 100nm2 Localization: Mr. Anderson , Dr. George Chang and Ms. Denise Barrientos ; 1 Brett A. Buchea, Dr. H. J. Ryu, Dr. Martin von Haartman, Mr. Technology Assessment and Characterization Lab, ON 2 Christopher S. Butler and Dr. Tom X. Tong, Logic Technology Semiconductor, Phoenix, AZ, USA; Packaging Development, 3 Development, Intel, Hillsboro, OR, USA ON Semiconductor, Phoenix, AZ, USA; Corporate Program Management, ON Semiconductor, Phoenix, AZ, USA 8:25 a.m. Plasma FIB DualBeam™ Delayering for Atomic Force 9:25 a.m. nanoProbing™ of 14 nm FinFET Devices in an SRAM Array: Failure Modes Associated with Plastic Packages and Mr. Roger Alvis1, Mr. Trevan Landin1, Dr. Chad Rue1, Mr. Andy Cu Bond Wires: Mr. Sultan Lilani, Analytical Solutions, Erickson2, Mr. Sean Zumwalt2, Mr. Sinjin USA; Dixon-Warren3, Wan- Albuquerque, NM, USA 4 4 4 4 Yi Liu , Shih-Hsin Chang , Te-Fu Chang , Mr. Chia-Hsiang Yen , Pau- 9:50 a.m. Sheng Kuo4 and Dr. C H Chu4; 1FEI Company, Hillsboro, OR, USA; 2 3 X-Ray Microscopy and Root Cause Analysis in Electronic Multiprobe, Santa Barbara, CA, USA; Chipworks, Ottawa, ON, 1 2 4 Packaging: Dr. Laura Mirkarimi , Dr. Allen Gu , Mr. Gabe Canada; Materials Analysis Technology Inc., Hsinchu, Taiwan Guevara3, Dr. Rajesh Katkar3, Long Huynh3 and Mr. Luke 2 1 8:50 a.m. Hunter ; Marketing, Carl Zeiss X-Ray Microscopy, Pleasanton, 2 Nanoprobing Applications with Capacitance-Voltage (C-V) CA, USA; Applications, Carl Zeiss X-Ray Microscopy, 3 and Pulsed Current-Voltage (PI-V) Measurements for Device Pleasanton, CA, USA; Failure Analysis, Invensas Corporation, Failure Analysis: Mr. Li-Lung Lai, Product Engineering, San Jose, CA, USA Semiconductor Manufacturing International (Shanghai) 10:05–10:25 a.m. Corporation, Shanghai, China Refreshment Break in Meeting Space Foyer 9:15 a.m. Advanced Failure Analysis of Junction Profile Defect by using EBAC_EBIC: Mr. Jong Hak Lee, R&D Division, SK hynix, Icheon-Si, South Korea Programs are tentative: papers, authors, and order of presentations are subject to change. 11:15 a.m. PACKAGING AND ASSEMBLYWednesday, NovemberThe Changing 12, 2014 Role of Advanced Sample Preparation in X-Ray Inspection Supporting 2.5D and 3D Sample Failure LEVEL FA II Analysis: Ms. Rosanne M. LaVoy1, Mr. Matthew M. Mulholland2 10:25–11:40 a.m. • D137 & 138 and Mr. Scott Silverman3; 1Research and Development, SVXR, San Jose, CA, USA; 2Post Silicon Validation, Intel Corporation,

Session Chairs: Santa Clara, CA, USA; 3Varioscale, Inc, San Marcos, CA, USA Mr. Bhanu P. Sood CALCE, University of Maryland 11:40 a.m.–12:40 p.m. College Park, MD, USA Lunch Lobby E Dr. Lihong Cao

THURSDAY Advanced Micro Devices Austin, TX, USA SAMPLE PREPARATION AND 10:25 a.m. DEVICE DEPROCESSING II

Acid Decapsulation for Silver Bonded Wire Package: Mr. 12:40–1:55 p.m. • D137 & 138 Satoshi Suzuki, Sales, Nippon Scientific Co., LTD., Tokyo, Session Chairs: Japan Mr. Roger Alvis FEI Company 10:50 a.m. Hillsboro, OR, USA What Happens to Electrostatic Sensitive Devices in Case of Direct ESD from Plastics?: Prof. Peter Jacob, Principal Mr. Jake E. Klein Engineer Microstructure Failure Analysis, Dept. Electronics/ Texas Instruments Metrology—Reliability-Center, EMPA Duebendorf, Duebendorf, Tucson, AZ, USA Switzerland; Q/A, EM Microelectronic Marin S.A., Marin- Epagnier, Switzerland 12:40 p.m. LASER Combined with Plasma Will It Be the Future Green 11:15 a.m. and Safe ICs Decapsulation Method?: Mr. P. Poirier1 and Mr. Root Cause Analysis of a Connector Pin Time-Delayed Michael Obein2; 1FA, Digit Concept SA, Secqueville en Bessin, Fracture: Dr. Prabjit Singh, PhD1 and Dr. Robert Davis, France; 2Digit Concept, Secqueville en Bessin, France PhD2; 1Materials and Processes, IBM, Poughkeepsie, NY, USA; 2Surface Analysis, IBM, Hopewell Junction, NY, USA 1:05 p.m. Decapsulation of Multi-Chip BOAC Devices with Exposed 20 11:40 a.m.–12:40 p.m. Copper Metallization Using Atmospheric Pressure Lunch Lobby E Microwave Induced Plasma: Dr. J. Tang1, Mr. Kristopher D. Staller2 and Prof. C.I.M. Beenakker3; 1JIACO Instruments B.V., Delft, Netherlands;2 Tucson Device Analysis Operations SAMPLE PREPARATION AND Laboratory, Texas Instruments, Tucson, AZ, USA; 3Delft DEVICE DEPROCESSING I University of Technology, Delft, Netherlands 10:25–11:40 a.m. • D139 & 140 1:30 p.m. Repeatable Method for Automated Decapsulation of Silver Session Chairs: Alloy Wire Packages: Dr. Matthew J. Lefevre1, Mr. Emmanuel Dr. Sam Subramanian Noraz2 and Dr. Damien Veychard2; 1JP Kummer, Evry, France; Freescale Semiconductor, Inc. 2ST Microelectronics, Grenoble, France Austin, TX, USA Mr. Izak Kapilevich 1:55 p.m. DCG Systems Refreshment Break in Meeting Space Foyer Fremont, CA, USA 10:25 a.m. A Simple Method to Fabricate a Tunable In-Situ SIL: Mr. Mark Kimball, Failure Analyisis, Maxim Integrated, Hillsboro, OR, USA 10:50 a.m. Adaptive Grinding and Polishing of Silicon Integrated Circuits to Ultrathin Remaining Thickness: Dr. Robert D. Chivas1, Mr. Scott Silverman1 and Dr. Michael DiBattista2; 1Varioscale, Inc, San Marcos, CA, USA; 2Qualcomm, Inc., San Diego, CA, USA

Programs are tentative: papers, authors, and order of presentations are subject to change. CASE STUDIES AND FA PROCESSWednesday, NovemberEDUCATION 12, SHORT 2014 COURSES 12:40–2:20 p.m. • D139 & 140 All Short Courses for ISTFA are taking place on Saturday, October 31, 2015 at the DoubleTree by Hilton Portland Session Chairs: Dr. Zhigang Song Course Title: Fault Isolation GLOBALFOUNDRIES Instructor: David Vallett Hopewell Junction, NY, USA Time: 8:30 a.m.–4:30 p.m. Mrs. Rose Ring Course Description: Technology development, yield learning, GLOBALFOUNDRIES Malta and reliability engineering are critical to the microelectronics Saratoga Springs, NY, USA

and now nanoelectronics business. All are highly dependent THURSDAY 12:40 p.m. on fault isolation and failure analysis. With higher density Resistive Contrast Imaging, the Tool, Technique, and packaging, transistor counts into the billions, scaling below 22 Applications on Leading-Edge Semiconductor Technology nanometers, and new materials; however, analysis of root cause Devices: Mrs. Rosalinda-Mendoza Ring1, Mr. Andreas of failures is becoming exceedingly challenging. This course Rummel2, Edward C. Carper3, Randy Newkirk1, Kevin Davidson1, examines both traditional and recently developed tools and James Capriola1 and Dr. Jeremy D. Russell4; 1Quality, techniques for isolating defects on simple and advanced ICs and GlobalFoundries Malta, Saratoga Springs, NY, USA; 2Kleindiek microelectronic devices. Nanotechnik, Reutlingen, Germany; 3FEI Company, Hillsboro, OR, USA; 4Engineering Analytical Services, GlobalFoundries Course Title: Beam-Based Defect Localization Malta, NY, USA Instructor: Dr. Edward Cole, FASM Time: 1:00–4:30 p.m. 1:05 p.m. Failure Analysis Methodology on Circular Patch Functional Course Description: This short course discusses SEM and SOM Failure Due to Device Parametric Drift: Dr. Alfred C.T. Quah, techniques for IC failure analysis. All of these techniques can Dr. C.Q. Chen, Mr. Ghim Boon Ang, Mr. D. Nagalingam, Ms. H.P. Ng, be performed on a standard SEM or SOM (using the proper Mr. P.T. Ng, Dr. SeungJe Moon, Ms. Angela Teo, Mr. K.H. Yip, Dr. laser wavelengths). The use of advanced electron beam test Jeffrey Lam and Dr. Z.H. Mai, Product, Test and Failure Analysis, systems will also be discussed. The goal is to provide beneficial GlobalFoundries Singapore Pte Ltd, Singapore, Singapore information to both novice and experienced failure analysts. Topics are: 1) Standard techniques—secondary electron imaging 1:30 p.m. for surface topology, backscattered electron imaging, voltage Failure Analysis of ILD Delamination—Uncovering Multiple contrast, capacitive coupling voltage contrast, x-ray analysis 1, Mr. Thomas Zirilli1, Mr. 21 Root Causes: Dr. Marie Castignolles and electron beam induced current imaging; 2) Specialized Eric Cattey2, Mr. Justin C Lewenstein2, Dr. Stephen N Schauer3, SEM techniques—novel voltage contrast applications, resistive Dr. Wei Liu3, Mr. Jianfeng Chen3, Mr. Jacob Hammett3 and Dr. contrast imaging, and charge-induced voltage alteration Sam Subramanian4; 1ASG FA Lab, Freescale Semiconductor, (both high and low energy versions); and 3) SOM techniques— Inc., Toulouse, France; 2Freescale Semiconductor, Inc., Tempe, light-induced voltage alteration, thermally-induced voltage AZ, USA; 3Freescale Semiconductor, Inc., Chandler, AZ, USA; alteration/optical beam induced resistance change, Seebeck 4Freescale Semiconductor, Inc., Austin, TX, USA Effect imaging, soft defect localization/laser-assisted device 1:55 p.m. alteration, and solid immersion lens applications. Invisible Defect Root Cause Identification with Electrical and Chemical Analyses: Dr. Zhigang Song, Dr. Yunyu Wang and Ms. Sweta Pendyala, GlobalFoundries, Hopewell Junction, NY, USA 2:20 p.m. Refreshment Break in Meeting Space Foyer

SAMPLE PREP/3D PACKAGE PREP USER GROUP 2:05–4:05 p.m. • D137 & D138 Chair: Jake Klein, TI Co-Chair: Rose Ring, GLOBALFOUNDRIES Sponsored by: DC-Digit Concepts

NANOPROBING USER GROUP 2:30–4:30 p.m. • D139 & D140 Chair: John Sanders, DCG Systems Co-Chair: Nicholas Antoniou, ReVera Sponsored by: DCG Systems

Programs are tentative: papers, authors, and order of presentations are subject to change. 2015 INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALY SIS EXHIBIT DATES AND TIMES: CONFERENCE & EXPOSITION Tuesday, November 3 • 9:00 a.m.–6:40 p.m. Refreshment Break • 10:30–11:10 a.m. Lunch • 12:00–1:30 p.m. Refresh and Energize Break • 1:30–2:55 p.m. in Exhibit Hall D SHOW Networking Reception • 5:00–6:40 p.m. Wednesday, November 4 • 9:30 a.m.–6:00 p.m. Refreshment Break • 9:30–10:10 a.m. Lunch • 12:10–1:30 p.m. DIRECTORY Dessert Reception/Poster Session • 1:30–3:30 p.m.

23 We appreciate and acknowledge the following sponsors:

PREMIER SPONSOR

SPONSORS EXHIBITOR LIST & FLOOR PLAN The ISTFA Exposition designations are: Red listing indicates Premier Sponsor. Green listing indicates Sponsor.

Booth Exhibitor Booth Exhibitor 434 Advanced Circuit Engineers 529 MUEGGE GmbH 212 Agilent Technologies 433 Nanolab Technologies 531 Akrometrix, LLC 206 Nanosurf Inc. 127 Allied High Tech Products, Inc. 234 Neocera, LLC 201 Analytical Solutions, Inc. 535 Nippon Scientific Co., Ltd 317 Angstrom Scientific, Inc. 318 Nisene Technology Group 306 Applied Beams, LLC 115 Nordson DAGE 500 ASM/EDFAS Membership Booth 532 Olympus America 518 Attolight AG 204 ONAMI Technology Labs 513 Balazs NanoAnalysis—Air Liquide 217 Oxford Instruments 303 Bruker Corporation 205 Priority Labs 420 BSET EQ 319 Quantum Focus Instruments 332 Carl Zeiss Microscopy, LLC 416 Quartz Imaging Corp 333 Carl Zeiss Microscopy, LLC 313 RKD Engineering Corporation, Inc 135 Checkpoint Technologies, LLC 236 Robson Technologies, Inc. 216 Control Laser Corp. 202 Sage Analytical Lab 337 DC-Digit Concept 308 Samco, Inc. 233 DCG Systems, Inc. 437 SELA USA Inc 218 E.A. Fischione Instruments, Inc. 334 SEMICAPS 520 Electron Microscopy Sciences 300 Sonoscan, Inc. 335 Evans Analytical Group 435 South Bay Technology 521 EXpressLO LLC 426 SPI Supplies 133 FEI Company 213 Synopsys, Inc. 24 534 Flir Systems, Inc. 304 Ted Pella, Inc. 214 Fraunhofer CAM 105 TeraView Ltd. 101 Gatan, Inc. 312 TESCAN USA 536 Hadland Technologies 109 TMC AMETEK 119 Hamamatsu Corporation 103 Trion Technology 432 HiLevel Technology 419 ULTRA TEC 107 Hitachi—HDI Solutions 519 Varioscale, Inc. 427 Hitachi High Technologies America, Inc. 428 XEI Scientific 209 ibss Group, Inc. 200 Yxlon Feinfocus 113 IR Labs 207 Zurich Instruments AG 327 JEOL USA 527 JIACO Instruments 326 Keysight Technologies 220 LatticeGear LLC 313 Left Coast Instruments 316 Leica Microsystems 208 Materials Analysis Technology Inc. 227 Mentor Graphics Corporation 203 Micromanipulator 517 Micronet Solutions Inc. EXHIBITOR LIST & FLOOR PLAN

ISTFA 2015 • NOVEMBER 3-4, 2015 OREGON CONVENTION CENTER • EXHIBIT HALL D

QUANTUM FOCUS INSTRUMENTS 319

Because there may have been some late changes in booth assignments, Reasonable precautions have been taken to avoid errors in and omis- some exhibitors may have a different booth number than was shown sions from this Directory, but ASM International does not guarantee list- on their invitations and advertising. Please check this Directory for the ings herein and shall not be responsible for errors in or omission in this most-up-to-date listings, as well as onsite signage. Directory. TOOLS-OF-THE-TRADE TOUR What: Scheduled Tours: Demonstrations of the latest products and services. Learn use- Alllied High Tech RKD Engineering Corp ful information and see firsthand the latest tools in the industry. Digit Concept SELA Semiconductor Engineering Take part in the parallel technical session and see equipment in Hitachi High Technologies LAboratories, USA, Inc. action right on the show floor … LatticeGear LLC ULTRA TEC Where: Exhibit Hall D • Show Floor Mentor Graphics Varioscale, Inc. When: Monday, November 2, 2015 Nisene Technology Group Time: 5:00–6:45 p.m. Must register in advance to attend. Space is limited. First come, first served

LatticeGear Allied High Tech Products, Inc. Booth # 220 Booth #127 Product Name: FlipScribe™ High Precision Backside Scribing for Product Name: X-Prep Mechanical Milling Machine Cleaving Front Side Targets Product Description: Automated, 5-axis mechanical milling machine Product Description: LatticeGear’s FlipScribe™ offers a new method for for failure analysis (backside/frontside thinning and delayering), die ex- scribing crystalline and amorphous materials. Using a stationary scribe traction, materials research, and more. tip, FlipScribe allows the user to make a clean, straight scribe line on the Overview of Demonstration: Tour attendees will be able to see a dem- back side for accurate cleaving of front side targets, delivering repeat- onstration of the X-Prep removing a specific amount of material from able accuracy on bonded wafers and other substrates where damage the backside of a chip package and be shown the new high-definition and contamination to the front side is unacceptable. camera that has been added. Overview of Demonstration: The demonstration will begin with an introduction to the features of the FlipScribe™: a stage-based diamond scriber; sample platform; horizontal and vertical fence guides. This will be followed by a live demonstration of scribing and cleaving on a variety of sample sizes and materials. Pre-recorded video will be presented to further illustrate the diversity of samples and dimensions that can be 26 DC-Digit Concept processed with FlipScribe. Booth # 337 Product Name: Sesame 2015—New range of products Product Description: DC, a worldwide Leader in IC Decapsulation equipment with 25 years of experience, provides the right tool and recipes for the four ways to decapsulate. Overview of Demonstration: After 2 years of research we will introduce our new range of all SESAME products. This fully new range integrates innovative techniques dedicated to the new FA challenges. Mentor Graphics Booth # 227 Product Name: Tessent Diagnosis Product Description: The Tessent Diagnosis software accelerates defect identification in digital semiconductor devices. The new cell-aware technology enables diagnosis at transistor level, which is critical for Fin- Hitachi High Technologies FET technologies. Failure analysis engineers will now know in advance what to look for in PFA. Booth # 427 Overview of Demonstration: Attendees will be introduced to the di- Product Name: The Hitachi NX9000 L-Shape FIB-SEM System agnosis flow and see how Tessent Diagnosis software can be used to Product Description: The world’s first L-shape designed FIB-SEM sys- identify several types of defects in digital semiconductor devices based tem for high-resolution imaging in the Third Dimension (HR3D), and on design and failure data. The focus will be on the new transistor level nanoscale analysis. The NX9000 offers top down imaging often reserved (cell-aware) capability. for dedicated FE-SEM systems with ion material processing functions, allowing high precision 3D structural analysis that had previously been difficult to achieve. Overview of Demonstration: Tool Tour participants will hear a discussion of Hitachi’s latest design innovation and how it will revolutionize materials analysis and influence the development of new materials, along with an overview of the NX9000 FIB-SEM. “Follow the Data” and discover why the NX9000 is the ideal instrument for use in testing and failure analysis, Nisene Technology Group, Inc. Booth # 318 incorporating an unprecedented orthogonal design consisting of three Product Name: PlasmaEtch columns oriented in a perpendicular configuration, enabling stable col- Product Description: Nisene's PlasmaEtch is a revolutionary gas-based lection of images that represent the true structure of the sample. A high semiconductor etching system. Utilizing microwaved gases to incite brightness cold field emission electron source and high sensitivity detec- chemical radicals for isotropic etching, the PlasmaEtch delivers the tion system, provide high contrast, high resolution observation of a wide most green, cost-effective and versatile etching solution available. The variety of samples, from biological tissue to magnetic samples such as PlasmaEtch etches reliably today’s most challenging IC devices, wheth- steel, and of course, semiconductors. Hitachi is pleased to participate in er the sample features gold, copper, or silver wires. this year’s Tools Tour at ISTFA 2015. Find out more at the Hitachi booth to “inspire the next” failure analysis tool in your lab! TOOLS-OF-THE-TRADE TOUR

ULTRA TEC RKD Engineering Corp Booth # 419 Booth # 313 Product Name: ENDPOINTING & PEEC for ASAP-1 IPS Product Name: I53 dispense pump Product Description: PEEC for ASAP-1 IPS is a patent pending system Product Description: Preservation of silver wires during decapsilation upgrade that uses electronic data, gathered from the polishing tip, to Overview of Demonstration: Will demonstrate this item provide REALTIME through-silicon characterization of the device under test (DUT) – thus achieving a specific remaining silicon thickness (RST) in the low single digits, and below. Overview of Demonstration: PEEC is suitable for dies which have al- ready been thinned below 20 microns and offers PARAMETRIC, PLOT and OSCILLOSCOPE modes to achieve a higher level of confidence than traditional “cut-image-then-cut-some-more” techniques, by removing the SELA Semiconductor Engineering need to continually transfer the part between polisher and microscope. LAboratories USA, Inc. Booth # 437 Product name: New MC10 smart precise cleaving system Product description: Precise cleaving technology is now available on the new smart, table top, compact MC10 system which delivers high quality, natural cleaving with high accurate cross-sectioning of 5um in just a minute. Varioscale, Inc Overview of Demonstration: Tool Tour attendees will be introduced to Booth # 519 three cleaving technologies which provide comprehensive solutions for Product Name: VarioMill cross-sectioning with high accuracy, high quality and high throughput, Product Description: Adaptive 5-axis CNC Tool that Grinds and Polishes followed by a demonstration of the advanced performance of the advanced package ICs. Global backside sample preparation to ultra-thin precise cleaving technology on the new MC10 smart cleaving system remaining silicon (<5 um). VIS light spectrometer enables in situ mea- on wafer samples of different sizes. surement of Si down to < 0.5 um thickness. Automatic tool exchange enables multi-step processing from rapid grind to final optical polish. Overview of Demonstration: We will be showing video clips of the tool in operation performing 5-axis CNC grinding, in situ measurement with adaptive shape feedback, as well as tool exchange and polishing. Dem- onstrate ultra-thin silicon measurement live. 27

Mobile Cubic Downstream Asher Redefining Clean

The Mobile Cubic Downstream Asher houses a portable DS plasma center for TEM Holders and SEM sample DS plasma cleaning and storage. The DS Plasma source is fitted with Qwk-Switch™ mounting to facilitate source transfer to SEM chambers. The MCDS Asher is controlled by tablet or Windows PC via user friendly ibss Group software. For convenient and uncomplicated hydrocarbon free samples and e-beam chambers, the MCDS Asher is an essential investment.

ibss Group, Inc. www.ibssgroup.com COMPANY DESCRIPTIONS Advanced Circuit Engineers ASM/EDFAS Membership Booth Time to focus on 7nm at Booth# 434 Booth# 500 Established in 2004, ACE specialists have the highest level of expertise in The Electronic Device Failure Analysis Society (EDFAS) mission is to foster the industry performing circuit edit and dual beam FIB services across a education and communication in the failure analysis community working slew of industries with extremely high success rates. for the technology advancement and the improved performance and reli- www.acellc.net ability of devices and materials for the electronics industry. www.asminternational.org Agilent Technologies ISTFA 2015 Booth# 212 Attolight AG Agilent Technologies, a leader in chemical and materials testing, Booth# 518 provides a wide range of non-destructive testing solutions for polymers Attolight, inventor of quantitative cathodoluminescence microscopy, and advanced materials. Agilent’s bench, microscopy, and handheld develops innovative characterization tools and metrology solutions for FTIR solutions allows for the identification, contamination analysis, or research laboratories and semiconductor industries, with a wide range degradation determination of materials at the sample site. of performance and reliability assessment applications for LEDs, laser, www.agilent.com power, nano-electronic devices or solar cells and provides analytical services in its privately owned Swiss laboratory. Akrometrix, LLC www.attolight.com Booth# 531 Akrometrix is the leader in thermal warpage and strain metrology for Balazs NanoAnalysis—Air Liquide front-end/back-end wafer, back-end packaging/assembly, and the PCB Booth# 513 panel/component markets. Akrometrix provides both capital equip- BalazsTM NanoAnalysis, a division of Air Liquide Electronics U.S. LP, op- ment and test services for measuring warpage, flatness, and strain in erates ISO 17025 accredited laboratories that specialize in identifying temperatures from -50°C to 300°C on substrates/samples up to 600mm². ultra-trace level contamination. Balazs’ expertise covers materials used Contact [email protected] or visit in the electronics and other high-tech industries. With each analysis, www.akrometrix.com Balazs brings over 30 years of experience to help engineers control their process. Allied High Tech Products, Inc. www.balazs.com Sponsor Bruker Corporation Booth# 127 Booth# 303 For over 32 years, Allied High Tech Products has provided sample Bruker is a performance leader in analytical systems, providing a range preparation products for microscopic evaluation. Items on display of technological solutions for testing and failure analysis. Trusted solu- 28 include Allied’s state-of-the-art X-Prep® Precision Polishing/Grinding/ tions include Optical and X-Ray Spectroscopy, Microanalysis and Atomic Milling Machine, MultiPrep™ Polishing System, sectioning saws and Zeiss Force Microscopy and Microscopy in key applications: elemental defect microscopes. A range of consumable products will also be shown. Visit analysis, nanoelectrical characterization, and microscopy solutions for Booth#127 in the exhibit hall. structure elucidation. www.alliedhightech.com www.bruker.com Analytical Solutions, Inc. BSET EQ Booth # 201 Booth# 420 Analytical Solutions, an Integra Technologies company, located in The world leader in package opening for failure analysis and counterfeit Welcome to Portland, Oregon! Albuquerque New Mexico is an industry leader in providing product prevention using gas plasma technologies, BSET EQ manufactures gas evaluation services through Destructive Physical Analysis; Construc- plasma systems and develops key process technologies used through- tion / Failure Analysis; Electrical; Qualification and Counterfeit Device out the industries. BSET EQ specializes in plasma cleaning applications Investigation of semiconductor devices. Our customers include Military, for improving packaging yields and package decapsulation or delayer- The home of electron microscopy innovation, the highest number Avionics, Space, Medical, Automotive and Fabless Semiconductor ing for failure analysis. companies. www.bsetplasmas.com www.asinm.com of microbreweries per capita, the inventor of the computer mouse, Carl Zeiss Microscopy, LLC Angstrom Scientific, Inc. Booth# 317 Sponsor the second-largest hammered copper statue in America, the largest Angstrom Scientific Inc., provides nanotech and materials Booth# 332 and 333 characterization solutions. Specifically: Kleindiek Nano-manipulators, As the world’s only manufacturer of light, X-ray and electron/ion Hitachi Tabletop-SEM/EDX, Bionavis Surface Plasmon Resonance microscopes, ZEISS offers tailor-made microscope systems for 3D independent bookstore in the world, and over 700 food carts. Spectroscopy, DENSsolutions TEM heating stages, Deben Microscopy imaging in biomedical research, life sciences and healthcare. A well- Accessories, Microtrac Particle Analyzers, & Evactron Plasma Cleaners. trained sales force, an extensive support infrastructure and a responsive Additionally, we buy/sell used electron microscopes and FIBs. service team enable customers to use their ZEISS microscopes to their But remember—don’t pump your own gas! (It’s a $500 fine.) www.angstrom.us full potential. www.zeiss.com/microscopy Applied Beams, LLC Visit us at booth 133 Booth# 306 Checkpoint Technologies, LLC We provide custom-configured SEM and FIB systems, micromachining Sponsor and analytical services, and bring new life to your microscope with products which extend and enhance system performance. Our HyperFIB sys- Booth# 135 tem is the only plasma FIB upgrade on the market for legacy FIB tools. Checkpoint Technologies is the world leader in optical based semicon- Browse our high quality yet affordable consumables online. ductor failure analysis, fault isolation and circuit debugging. Check- www.appliedbeams.com point’s LSM and emission tools lead the market in sensitivity and resolution. www.checkpointtechnologies.com/ Discover more at FEI.com Control Laser Corp. Flir Systems, Inc. Booth# 216 Booth# 534 www.controllaser.com Managing heat dissipation in PCBs without sacrificing performance or budget presents challenges during design, especially as components DC-Digit Concept continue to shrink. Thanks to FLIR Thermal Imaging, engineers now can Premier Sponsor easily visualize and quantify heat patterns, simplifying development and helping prevent faults and expensive recalls later. See FLIR first- Booth# 337 hand at ISTFA 2015. Worldwide Leader in IC DECAPSULATION equipment’s, over 23 years of www.flir.com experience, we can provide the right tool and recipe for full or part De- capsulation, Bonding cut, Cross Sectioning, with a full range of equip- Fraunhofer Cam ment: • SESAMEACID™ • SESAMELASER™ • SESAMEPLASMA™ • SESAMEM- Booth# 214 ECHANICAL™ You need SUPPORT, UP-GRADE, TRADE-IN , visit us!!! Based on twenty years of experience in microstructure diagnostics and www.digit-concept.com material assessment for semiconductor technologies, microelectronic components, microsystems and nano-structured materials, Fraunhofer DCG Systems, Inc. CAM is tying the entire flow from non-destructive defect localization to Sponsor high precision target preparation right up to cutting edge nanoanalytics Booth# 233 supplemented by micro-mechanical testing and numerical simulation. DCG Systems is the industry’s leading supplier of systems that enable www.cam.fraunhofer.de direct localization and characterization of electrical faults in integrated circuits, packages and board assemblies. These systems are used Gatan, Inc. Booth# 101 worldwide throughout the electronics product life cycle, for process and Gatan designs and manufactures instruments and products for product development, design debug and yield enhancement. advanced microelectronics testing and analysis in electron microscopy. http://dcgsystems.com/ Gatan’s products are used in a broad range of failure analysis E.A. Fischione Instruments, Inc. applications, including those for semiconductors (micro- and nano- Booth# 218 electronics), nano-materials, and optoelectronic devices. Conventional preparation products, contamination solutions, and ion www.gatan.com milling systems for semiconductor failure analysis. The user-friendly SEM Mill provides top-down delayering and cross-section polishing ca- Hadland Technologies Booth# 536 pabilities; while the WaferMill™ ion beam delayering solution provides Hadland Technologies provides high-quality, 3-D inspection services nearline CD-SEM capabilities. The PicoMill® TEM specimen preparation using X-ray computed tomography for use in research and development, system reveals the smallest of defects precisely and repeatably. failure analysis, and academia. X-ray CT is a nondestructive technique www.fischione.com useful for material segmentation, porosity/inclusion analysis, geometric Electron Microscopy Sciences measurement, and defect detection. The company has over 20 years of 30 Booth# 520 experience in microfocus X-ray technology. Electron microscopy sciences will have on display their complete line www.hadtek.com of accessories, chemicals, supplies and equipment for all fields of microscopy, biological research and general laboratory requirements. As Hamamatsu Corporation Booth# 119 well as our full line of tools, tweezers and dissecting equipment Hamamatsu Corporation is the North American subsidiary of www.emsdiasum.com Hamamatsu Photonics K.K. (Japan), a leading manufacturer of devices Evans Analytical Group for the generation and measurement of infrared, visible, UV light, Booth# 335 and x-rays. We offer specialized systems for semiconductor failure EAG, the leader for Electrical Test, Failure Analysis, Reliability and analysis and other applications. We also offer photomultiplier tubes, Materials Analysis. EAG reduces cycle time, cost of new product photodiodes, image sensors, cameras, and light sources. introduction, and supports your test and analysis needs throughout www.hamamatsu.com the life cycle of your products. All backed by EAG’s extensive capital equipment, infrastructure, and engineering expertise. HiLevel Technology Booth# 432 www.eag.com/mte HiLevel Technology, Inc. is a privately-held company head-quartered EXpressLO LLC in Irvine, California. We have been building world-class test equipment Booth# 521 since 1979. Our goal has always been to offer the best sys¬tems at the EXpressLO LLC offers expert ex situ lift out solutions offering full systems most affordable cost, and to provide unsurpassed support. HiLevel is and upgrades including the patented EXpressLO™ grids and methods classified as “small business,” and the advantages of this tight-knit are which negate the need for a thin film support. The Pick&Place™ holder reflected in our swift response to customer needs. kit and the Aspirato™ module facilitates lift out for fast, easy, and reliable www.hilevel.com lift outs. www.EXpressLO.com Hitachi—HDI Solutions Booth# 107 FEI Company We offer HITACHI FineSAT acoustic imaging systems for electronics packaging industry. These high resolution high speed systems are used Sponsor in failure analysis and quality assurance of various structures from Booth# 133 TSV or MEMs to IGBT power devices. High speed systems incorporate Get accurate, high-quality answers in the semiconductor device analysis transducer arrays to inspect a JEDEC tray in a minute. lab or fab for optimizing IC design and production ramp. Industry- www.hdi-solutions.com leading FEI imaging and analysis solutions combined with in-depth application expertise help you speed process defect root-cause analysis, reduce yield loss, and accelerate time-to-market for today’s-and tomorrow’s—electronic devices. www.fei.com/ Hitachi High Technologies America, Inc. Left Coast Instruments Booth# 313 Sponsor Left Coast Instruments exclusively offers the entire RKD Engineering Booth# 427 product line worldwide. Our network of representatives and international Hitachi High Technologies America provides technologically distributors are highly knowledgeable in all aspects advanced imaging solutions to the materials science, biological of these products and their applications. research, academic research, and industrial manufacturing sectors. www.leftcoastinstruments.com Our innovative and reliability-proven instrumentation includes SEM, analytical and biological TEM, dedicated STEM, FIB, Ion Milling Leica Microsystems instrumentation, Atomic Force microscopes, tabletop microscopes, and Booth# 316 microanalysis sample preparation systems. Visit the Leica Microsystems booth to see the latest in digital microscopy, www.hitachi-hightech.com the Leica DVM6 digital microscope, and a range of sample preparation equipment for all of your microscopy needs. See how Leica’s 160 years of ibss Group, Inc. precision optical development fused with leading-edge digital imaging Booth# 209 technology can improve your inspection and measurement processes. Develops and produces the GV10x Downstream Plasma Cleaner www.leica.microsystems.com models and related products used successfully in EM and Synchrotron labs around the world. The GV10x reduces carbon and hydrocarbon Materials Analysis Technology Inc. contamination 10 to 20x more effectively than traditional methods Booth# 208 at vacuum pressure safe for TMP operation. FIB/SEM/TEM/SIMS/XPS/ Materials Analysis Technology Inc. (MA-tek) is a leading laboratory in Review SEM materials analysis. Accompanying with the fast growing pace of business www.ibssgroup.com development, MA-tek has successfully expanded to provide Failure Analysis and Reliability Testing. Now MA-tek has set up 7 laboratories and 1 sales IR Labs office worldwide, providing around-the clock services in logistic support Booth# 113 and technical services. IRLabs is a subsidiary of Infrared Laboratories; a premier designer, www.ma-tek.com supplier, and integrator of cryogenic systems, Infrared Detectors, IR and NIR low light level imaging for astronomy, aerospace, IR and Photon Mentor Graphics Corporation Emission Microscopes for semiconductor applications, founded 1967. Sponsor www.infraredlaboratories.com Booth# 227 JEOL USA, Inc. Tessent Silicon Learning software products are specialized for Booth# 327 understanding and identifying yield loss from test data, maximizing High resolution electron microscopes and tools for quality control, failure analysis success rate, and accelerating test bring-up of digital failure analysis, product inspection and semiconductor/nanotech semiconductor devices. Learn about the newest products and R&D. Full range of SEMs and TEMs for high throughput analysis with technology highlighting new features of the most comprehensive silicon 32 nanoscale and atomic-level imaging and high-speed mapping. Other test and yield analysis solutions. products: surface analyzers, correlative microscopy solutions, analytical www.mentor.com/products/silicon-yield/silicon-learning/ equipment and specimen preparation equipment. Applications/service expertise available. Micromanipulator www.jeolusa.com Booth# 203 The first name in analytical probing, Micromanipulator delivers the JIACO Instruments tools and life cycle support the semiconductor industry depends on. Booth# 527 Micromanipulator invented analytical probing in 1956. Since then we’ve JIACO Instruments decapsulation system is a breakthrough innovation: established a significant global presence with a substantial product Automated atmospheric pressure Microwave-Induced-Plasma (MIP) installation base. decapsulation utilising O2-only recipes. The system has been proven for Cu, www.micromanipulator.com PdCu, Au bond wires and for advanced package types like 3D, SiP, WLCSP, BOAC; all without process induced damage for reliable failure analysis and Micronet Solutions Inc. quality control. Booth# 517 MicroNet Solutions, Inc has over 25 years of experience focused on rapid, www.jiaco-instruments.com/ state-of-the art reverse engineering of complex integrated circuits, de- Keysight Technologies veloped a suite of software tools (Pix2Net) which allows for the complete Booth# 326 functional extraction of circuits, as well as patent infringement services and Keysight Technologies (NYSE:KEYS) is a global electronic measurement anti-tamper design and analysis. technology and market leader dedicated to transforming its customers’ www.micronetsol.net measurement experience. This includes both a compact FE-SEM with EDS and powerful benchtop instruments to verify electrical devices and MUEGGE GmbH characterize materials. The business had revenues of $2.9 billion in fiscal Booth# 529 year 2014. MUEGGE GmbH is a top international OEM in the field of industrial microwave technology. Our portfolio includes turn-key microwave plasma www.keysight.com systems, microwave generators and components for various applications LatticeGear, LLC including industrial microwave heating and plasma technology. MUEGGE Booth# 220 product developments include large area linear plasma sources, remote Scribing and cleaving should be easy and fast, with low cost alternatives plasma sources, modular plasma arrays and various small, medium and available when hand held tools fall short. Make clean, straight back side large area industrial heating applications. Beginning at the end of 2008, scribe lines to accurately cleave front side targets, bonded wafers and MUEGGE was incorporated into Roth&Rau AG, which itself is part of Meyer other substrates, with our new FlipScribe™. Go from wafers to analysis- Burger Technology AG since 2011. ready samples in minutes, repeatedly, using our LatticeAx™ cleaving www.muegge.de machine. www.latticegear.com Nanolab Technologies Oxford Instruments Booth# 433 Booth# 217 Nanolab Technologies’ new analytical lab provides opti-mum Oxford Instruments designs, supplies and supports high-technology performance for all analytical services including: TEM/STEM/ tools and systems with a focus on research and industrial applications. EELS;SEM;EDS;XPS;DBFIB;CIRCUIT EDIT FIB;FA (electrical and physical); Its technologies include chemical and electrical microanalysis, atomic CSAM;2 AND 3D XRAY, etc. force microscopy/scanning microwave impedance microscopy (sMIM), www.nanolab1.com nanomanipulators and industry leading dry etch de-processing systems that enable failure modes to be examined at the micro- and nano-scale. Nanosurf Inc. www.oxford-instruments.com Booth# 206 Nanosurf is a Swiss high-tech company providing scanning probe Priority Labs microscopes to customers around the globe. Our comprehensive product Booth# 205 range spans compact instruments to fully customized, state-of-the- For over 1O years, Priority Labs Inc. has provided quality, timely and art research systems. Our academic and industrial partners value the cost-effective Failure Analysis services for the semiconductor industry. innovative approach, the modularity, and the ease of use of our products. Now, Priority Labs offers the PLCT625 curve trace system. Powered by www.nanosurf.com a simple GUI interface, semiconductors can be compared against other units. Data is easily exportable for analysis or reports. Neocera, LLC www.prioritylabs.com Booth# 234 Magma Electrical Fault Isolation is a dual magnetic field imaging system Quantum Focus Instruments that can find Shorts, Leakages (Magnetic Current Imaging) and Opens Booth# 319 (Space Domain Reflectometry) with a sensitivity of 500nA and with a front QFI manufactures Failure Analysis (FA) and Temperature Measurement side die resolution of less than 500nm; making it the best nondestructive Microscopes. Our modular QuantumScope FA microscopes offer emmi 3D Fault Isolation tool. photoemission, XIVA Laser Signal Injection Microscopy, and Thermal- www.neocera.com HS MWIR hot spot detection. Temperature measurement techniques include MWIR (InfraScope) and thermoreflectance (T°Imager). QFI Nippon Scientific Co., Ltd systems have earned a strong reputation for flexibility, sensitivity, Booth# 535 accuracy, and durability. Nippon Scientific, founded in 1987 and headquartered in Japan, is a www.quantumfocus.com leading IC decapsulation equipment provider serving the semiconductor failure analysis industry. We manufacture laser, acid and plasma Quartz Imaging Corp systems to support advanced failure analysis. Please visit our website for Sponsor more information. Contact: Mamiko Yamaguchi, Sales Manager E-mail : [email protected] Booth# 416 www.nscnet.co.jp/ Quartz Imaging Corp. provides Specialized Solutions for Electronic Device Labs & Analysis. Quartz FA-LIMS is the only Laboratory 34 Nisene Technology Group Information Management System build specifically for Failure Analysis Sponsor and Material Characterization Labs. RE-LIMS is designed for Reliability and QA Labs. PCI-AM - Automated Measurement software is designed for Booth# 318 semiconductor features. Nisene Technology Group is committed to providing innovative, high www.quartimaging.com quality products that address the changing needs of failure analysis professionals. Our mission is to continue to provide products and RKD Engineering Corporation, Inc services that meet the requirements of our customers, and to offer fast, Booth# 313 precise, reproducible and safe package deprocessing. Semiconduct Test Equipment EliteEtch Elite Etch Cu Elite Etch Cu ESD www.nisene.com NanoMill II Mount Plate UltraPrep VersionII Mega Etch www.rkdengineering.com Nordson DAGE Booth# 115 Robson Technologies, Inc. Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) Booth# 236 manufactures and supports a range of award winning X-ray inspection Robson Technologies, Inc. provides integrated test hardware solutions systems and bondtesters for failure analysis which are recognised as the that bridge the gap between your device under test and your test/ Industry Standard. Nordson DAGE continues to invest significantly in measurement system. RTI has provided solutions incorporating research and development to remain at the cutting edge of technology. custom test sockets, test fixtures, automated curve tracing hardware/ www.nordsondage.com software, and more since 1989. RTI is located in Morgan Hill, California, south of Silicon Valley. Olympus America www.testfixtures.com Booth# 532 Olympus is a leader in industrial microscopy, with its recognized Sage Analytical Lab innovation, optical quality, customer support and training. Olympus Booth# 202 industrial microscopes and metrology systems play a vital role in Sage’s world-class laboratory is dedicated to providing the best-in- precision R&D, engineering and manufacturing applications in fields as class analytical techniques and state of the art equipment for analyzing diverse as the aerospace, automotive, electronics, materials science/ and diagnosing all levels of failures in today’s highly integrated and metallurgy, medical device, photovoltaics and semiconductor arenas. advanced devices. With decades of practical expertise and best www.olympus-ims.com practices, we provide advanced procedures to expose failure sites. www.sagefalab.com ONAMI Technology Labs Booth# 204 Samco, Inc. ONAMI Technology Labs offers companies, consultants and researchers Booth# 308 access to technology experts and sophisticated instruments at 7 differ- SAMCO provides a wide selection of etching systems for de-processing ent labs at Portland State University, Oregon State University, and the semiconductor and related devices. We offer a variety of cost-effective RIE University of Oregon. Take a video tour, review the list of available in- and ICP etching systems for removal of passivation, ILD and metal layers in struments and connect directly with the labs at our website. packaged devices, individual die, as well as for full 200 or 300 mm wafers. www.ONAMI.us/technology-labs/ www.samcointl.com SELA USA INC Synopsys, Inc. Booth# 437 Booth# 213 SELA is a world leader in providing cutting edge solutions for physical Avalon from Synopsys, is the next-generation CAD navigation standard failure analysis and characterization. SELA’s proven micro, precise, for failure analysis, design debug and low-yield analysis. Avalon and perfect cleaving technologies deliver comprehensive solutions for optimizes the resources of semiconductor failure analysis (FA) labs by cross-section preparation. We are pleased to present the new cleaving providing easy to use software interface and navigation capabilities for system which bridges the gap between high-end automatic and almost every type of test and analytical failure analysis equipment. manual cleaving capabilities. www.synopsys.com www.sela.com SEMICAPS Ted Pella, Inc. Booth# 334 Booth# 304 SEMICAPS is a developer and manufacturer of world-leading Ted Pella, Inc. is the premier manufacturer and distributor of fault localization and defect characterization equipment for the consumable and specimen preparation equipment for electron semiconductor industry. With the semiconductor technology node microscopy, AFM and FIB. Ted Pella, Inc. also offers the most progressing towards 22nm and 14nm, more demand is anticipated for comprehensive selection of specimen mounts and holders for SEM and our leading edge machines to help customers analyse their advance FIB systems. Distributors for the complete line of compact desktop node products.Our products include LTP, SOM and PEM. Cressington EM coating systems. www.semicaps.com www.tedpella.com Sonoscan, Inc. TeraView Ltd. Booth# 300 Booth# 105 Sonoscan is a leader and innovator in Acoustic Microscopy (AM) TeraView is the world leader in THz based solutions. TeraView recently technology. Sonoscan manufactures acoustic microscope instruments introduced IC substrate mold resin thickness metrology system which and provides laboratory services to nondestructively inspect and measures mold resin thickness to +/- 1 micron accuracy. TeraView’s analyze materials, devices, components and products. Sonoscan’s C-SAM systems provide unmatched accuracy for the inspection of EOTPR THz TDR system is widely accepted by leading semiconductor products for hidden internal defects, such as delamination, etc. and OSAT customers for 5 micron accuracy non-destructive fault www.sonoscan.com isolation. www.teraview.com South Bay Technology Booth# 435 TESCAN USA www.southbaytech.com Booth# 312 TESCAN USA is a leading supplier in North America of Scanning Electron SPI Supplies Microscopes, Light Microscopy, and Focused Ion Beam workstations. Booth# 426 Celebrating 40 years of excellence and innovation, SPI Supplies The quality, performance and reliability of our products are the is a worldwide leading manufacturer and distributor of sample foundation of our business, serving customers in academia, industry and preparation equipment and consumable supply items for routine the government sector. 36 operation of microscopy laboratories. The Plasma Prep III Low www.tescan-usa.com Temperature Plasma Etcher offers a bench top solution for etching, cleaning and preparation needs. www.2spi.com TMC AMETEK Varioscale, Inc. Booth# 109 Booth# 519 TMC designs and manufactures advanced building floor vibration Leader in scalable laser micromachining, novel metrology, and isolation systems for problems caused by ambient floor vibration, advanced IC prep for failure analysis. VarioMill: Adaptive 5-axis CNC Tool magnetic fields, and acoustics. Products include STACIS® III active that Grinds and Polishes advanced package ICs. Global backside sample piezoelectric vibration cancellation for semiconductor manufacturing, preparation to ultra-thin remaining silicon (< 0.5 um. Everstill™ bench-top vibration cancellation, SEM-Base™ floor platforms www.varioscale.com for SEMS and CleanBench™ with Gimbal Piston vibration isolation lab tables. XEI Scientific www.techmfg.com Booth# 428 XEI Scientific, Inc. manufactures and sells anti-contamination Trion Technology systems for the Electron Microscope Community. The Evactron(R) De- Booth# 103 Contaminator line was introduced in 1999 and provides a faster and Manufacturer of custom Plasma Etch and Deposition Equipment for over more complete cleaning process, solving hydrocarbon contamination 25 years. Markets include: Failure Analysis, Compound Semiconductor, problems in electron microscopes and other high vacuum systems. MEMS and Opto-Electronics. Equipment ranges from full-blown www.evactron.com production cluster tools to simple laboratory tools. Equipment features the smallest footprint and lowest cost systems in the industry with Yxlon FeinFocus proven production reliability. Booth# 200 www.triontech.com YXLON is a leading supplier of industrial X-Ray inspection and CT solutions for the non-destructive testing of materials and electronics. ULTRA TEC The YXLON portfolio includes the Cheetah and Cougar which offer Sponsor effortless high-quality X-Ray imaging for a wide range of continuous inspection tasks. The Cheetah/Cougar combine proprietary FeinFocus Booth# 419 technology with advanced high-speed flat panel detector technology. Manufacturer and Worldwide supplier of SAMPLE PREPARATION www.yxlon.com equipment & CONSUMABLES. Our ASAP-1 Selected Area Preparation equipment has become the the de-facto standard for BACKSIDE Zurich Instruments AG PREPARATION and MECHANICAL DECAPSULATION. ULTRAPOL Advance Booth# 207 offers a clear technical advantage for IC DE-PROCESSING & CROSS- Zurich Instruments makes lock-in amplifiers and phase-locked loops SECTION POLISHING. that have revolutionized instrumentation in the high-frequency and www.ultratecusa.com ultra-high-frequency ranges by combining frequency-domain tools and time-domain tools within each product. This reduces the complexity of laboratory setups, thus removing sources of potential problems and so allows researchers to focus on their experiments. The new MFLI instrument for low-frequencies makes these advantages available to a wider range of users. 37 www.zhinst.com AUTHOR INDEX Albert, David ...... 7 Herschbein, Steven B...... 8, 11 Moore, Thomas M...... 8 Altmann, Frank ...... 7, 13 Hirose, Kotaro ...... 17 Mulder, Randal E...... 7 Alvis, Roger ...... 19 Hrncir, Tomas ...... 10 Mulholland, Matthew M...... 16 Asadizanjani, Navid ...... 13 Hsu, Wen Chen ...... 16 Nail, Carl ...... 12 Auvray, Etienne ...... 18 Hua, Younan ...... 16 Nakamura, Tomonori ...... 15 Baczkowski, Leny ...... 16 Izzo, James ...... 18 Pifer, Tim J...... 16 Baek, Gwanghyeon ...... 9 Jacob, Peter ...... 20 Poirier, P...... 20 Bascoul, Guillaume ...... 10 Jin, Kyeongju ...... 15 Qin, Wentao ...... 19 Benz, Jason M...... 15 Johnson, Gregory M...... 7, 11 Quah, Alfred C.T...... 21 Bescup, John ...... 8 Kane, Terence ...... 8 Ravikumar, Venkat ...... 10 Beutler, Joshua ...... 9 Kearney, Ian ...... 18 Ring, Rosalinda-Mendoza ...... 21 Bodoh, Dan ...... 7 Keim, Martin ...... 7 Scholz, Philipp ...... 10 Boit, Christian ...... 7, 10 Kim, Hyunsoo ...... 17 Sharpe, Tom ...... 13 Borgmann, Gerhard ...... 18 Kimball, Mark ...... 20 Shi, Jiangbei ...... 14 Buchea, Brett A...... 19 Korchnoy, Valentina ...... 20 Singh, Prabjit ...... 20 Cao, Lihong ...... 19 Kryger, Marc ...... 16 Song, Zhigang ...... 21 Cardoso, Bill ...... 18 Lagar, Jason H...... 17 Sorkin, Alexander ...... 11 Castignolles, Marie ...... 21 Lai, Li-Lung ...... 19 Stellari, Franco ...... 18 Chen, Changqing ...... 10 LaVoy, Rosanne M...... 20 Subramanian, Sam ...... 8, 9 Chinone, Norimichi ...... 17 Lee, Jong Hak ...... 19 Sung, Ching-Shan ...... 17 Chivas, Robert D...... 9, 20 Lee, Ka Chung ...... 13 Suzuki, Satoshi ...... 20 Cole Jr., Edward I...... 8, 9 Lee, Kwangwon ...... 15 Tang, J...... 20 De Wolf, Ingrid ...... 12 Lee, Myungjae ...... 15 Vanderlinde, William E...... 8, 13 Demarest, James J...... 9, 12 Lee, YuTe ...... 16 von Haartman, Martin ...... 11 Distelhurst, Kevin A...... 15, 16 Lefevre, Matthew J...... 20 Wang, Kai ...... 18 Drevniok, Benedict ...... 10 Li, Susan ...... 8 Wang, Xiang-Dong ...... 15 Dunnihoo, Jeffrey C...... 10 Liao, Joy Y...... 16 Wen, Gaojie ...... 16 Fasolino, Stephen T...... 12 Lilani, Sultan ...... 19 Weschler, Matthew ...... 11 Giannuzzi, Lucille A...... 10 Liu, Hongmin ...... 15 Wu, Chunlei ...... 10 Goh, SH ...... 7, 9, 10 Liu, Qing ...... 11 Xie, Sujing ...... 10 Gu, Qing ...... 12 Lorut, Frederic ...... 18 Yu, Jing-Jiang ...... 17 Hafer, Richard ...... 14 McNulty, John Clark ...... 14 Zhou, Yongkai ...... 18 38 Hashim, Ismail ...... 18 Mirkarimi, Laura ...... 19 PRODUCTS & SERVICES INDEX Analytical Probe Stations (instruments, Gatan, Inc...... 101 equipment, accessories) Mentor Graphics Corporation ...... 227 Angstrom Scientifici, Inc...... 317 Nordson DAGE ...... 115 DCG Systems, Inc...... 233 Oxford Instruments ...... 217 Evans Analytical Group...... 335 TeraView LTD...... 105 Hamamatsu Corporation...... 119 Microhardness Testing Hitachi High Technologies America, Inc...... 427 Allied High Tech Products, Inc...... 127 Nanosurf Inc...... 206 Evans Analytical Group ...... 335 SEMICAPS ...... 334 TeraView LTD...... 105 Microscopes (scanning electron, acoustic, confocal, upright, inverted & stereo) DUT Boards & Fixtures Allied High Tech Products, Inc...... 127 Evans Analytical Group ...... 335 Angstrom Scientifici, Inc...... 317 Priority Labs ...... 205 DCG Systems, Inc...... 233 Robson Technologies, Inc...... 236 Evans Analytical Group ...... 335 Failure Analysis Laser Cutter: FEI Company ...... 133 Micro Electronics Laser Hamamatsu Corporation ...... 119 BSET EQ ...... 420 HDI Solutions ...... 107 DC (DIGIT CONCEPT) ...... 337 Hitachi High Technologies America, Inc...... 427 Evans Analytical Group ...... 335 Materials Analysis Technology Inc...... 208 Materials Analysis Technology Inc...... 208 Nanosurf Inc...... 206 Neocera, LLC ...... 234 Failure Analysis Test Sockets Nordson DAGE ...... 115 Evans Analytical Group ...... 335 Olympus ...... 532 Materials Analysis Technology Inc...... 208 Oxford Instruments ...... 217 Priority Labs ...... 205 Sonoscan, Inc...... 300 Robson Technologies, Inc...... 236 TESCAN USA ...... 312 Quantum Focus Instruments ...... 319 FTIR Equipment Evans Analytical Group ...... 335 Specialized Objectives Materials Analysis Technology Inc...... 208 Mentor Graphics Corporation ...... 227 Robson Technologies, Inc...... 236 40 Image Analysis Systems & Software Allied High Tech Products, Inc...... 127 Specimen Preparation Equipment Angstrom Scientifici, Inc...... 317 Allied High Tech Products, Inc...... 127 BSET EQ ...... 420 BSET EQ ...... 420 DCG Systems, Inc...... 233 DC (DIGIT CONCEPT) ...... 337 Evans Analytical Group ...... 335 E.A. Fischione Instruments, Inc...... 218 FEI Company ...... 133 EXpressLO LLC ...... 521 Gatan, Inc...... 101 FEI Company ...... 133 Hamamatsu Corporation ...... 119 Gatan, Inc...... 101 Mentor Graphics Corporation ...... 227 Hitachi High Technologies America, Inc...... 427 Nanosurf Inc...... 206 JIACO Instruments ...... 527 Nordson DAGE ...... 115 LatticeGear ...... 220 Sonoscan, Inc...... 300 SELA USA INC ...... 437 Synopsys, Inc...... 213 Varioscale, Inc...... 519 TeraView LTD...... 105 Surface Analysis Systems and Services Quantum Focus Instruments ...... 319 Evans Analytical Group ...... 335 Yxlon FeinFocus ...... 200 Hitachi High Technologies America, Inc...... 427 Infrared Thermal Imaging Systems: Materials Analysis Technology Inc...... 208 Thermal Inducing Systems Nanosurf Inc...... 206 DCG Systems, Inc...... 233 Sonoscan, Inc...... 300 Evans Analytical Group ...... 335 TeraView LTD...... 105 Hamamatsu Corporation ...... 119 Trion Technology ...... 103 Quantum Focus Instruments ...... 319 Testing Labs Laser Signal Injection Microscopy BSET EQ ...... 420 DCG Systems, Inc...... 233 DC (DIGIT CONCEPT) ...... 337 Evans Analytical Group ...... 335 Evans Analytical Group ...... 335 Varioscale, Inc...... 519 JIACO Instruments ...... 527 Quantum Focus Instruments ...... 319 Materials Analysis Technology Inc...... 208 Mentor Graphics Corporation ...... 227 Microanalysis and Digital Imaging Nordson DAGE ...... 115 Systems for Materials Analysis Priority Labs ...... 205 Angstrom Scientifici, Inc...... 317 SEMICAPS ...... 334 Evans Analytical Group ...... 335 Sonoscan, Inc...... 300 FEI Company...... 133 Yxlon FeinFocus ...... 200