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TECHNICAL PROGRAM Technical Program: Sunday–Thursday 2015 INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALY SIS CONFERENCE & EXPOSITION OREGON CONVENTION CENTER | PORTLAND, OREGON, USA NOVEMBER 1–5, 2015 A B D C FINAL PROGRAM AND SHOW DIRECTORY ORGANIZED BY 2015 INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS CONFERENCE & EXPOSI TION Sunday, November 1–Thursday, November 5 | Oregon Convention Center | Portland, Oregon, USA REGISTRATION HOURS Saturday: 5:00–7:00 p.m. Monday: 7:00 a.m.–6:00 p.m. Wednesday: 7:00 a.m.–6:00 p.m. Sunday: 7:00 a.m.–5:00 p.m. Tuesday: 7:00 a.m.–6:30 p.m. Thursday: 7:00 a.m.–12:00 p.m. TECHNICAL PROGRAM Technical Program: Sunday–Thursday. Dedicated Tutorials on Sunday; integrated Tutorials throughout the Technical Program. For more conference details see pages 7–21. Policy on Cell Phone Usage: In consideration of fellow event attendees and presenters, we request your cooperation in setting cellular phones and/or other electronic devices to ‘silent mode’ in the meeting rooms. Policy on Audio/Video Recording: EDFAS™ prohibits any unauthorized audio or video recording, or still photography of presentations at ISTFA. EXPOSITION Tools-of-the-Trade Tour–Monday (Pre-Registration Required) .....................................5:00–6:45 p.m. Exhibit Hours—Tuesday ......................................................................9:00 a.m.–6:40 p.m. Lunch ....................................................................................12:00–1:30 p.m. Expo Networking Reception ................................................................5:00–6:40 p.m. Exhibit Hours—Wednesday ...................................................................9:30 a.m.–3:30 p.m. Exhibitor Dessert Reception, Poster and Video Contest ........................................1:30–3:30 p.m. 1 GET CONNECTED Want to be hands free at ISTFA? There’s an app for that! Download the ISTFA 2015 mobile app to view the technical program, exhibitor information, networking opportunities and attendee survey. Don’t forget to complete the attendee survey on the mobile app and connect with fellow attendees. Available for Apple and Android devices—visit the iTunes and Google Play Store to download it now. In addition to the attendee survey, be sure to complete a survey for each tutorial presentation. SESSION CHAIR & AUTHORS’ COFFEE/BRIEFING Please join us for coffee, pastries and a program briefing on the day of your presentation in Meeting Room D133. The room will open at 7:00 a.m. to allow you to meet and network with other participants. Tuesday briefing at 8:30 a.m. The program briefing will begin at 7:30 a.m. to review the program layout, presentation and A/V guidelines, and any final conference details. Poster authors please join us on Wednesday morning. YOUR ATTENDANCE IS VERY IMPORTANT. REFRESHMENT BREAKS Sunday–Monday ....................................................................................................................................... Meeting Space Foyer Tuesday–Wednesday ................................................................................................................................ Exhibit Hall D Thursday .................................................................................................................................................... Meeting Space Foyer CAREER/RESUME BOARDS Stop by Registration to post job openings, find talented people in the industry or to post a resume on the Career/Resume Board. CONTENTS Convention Center Floor Plan ...........................................2 Exhibit Hall Floor Plan .....................................................25 2015 Organizing Committee ......................................... 3–4 Tools-of-the-Trade Tour .............................................26–27 Technical Program Schedule .......................................7–21 Company Descriptions ...............................................28–37 Education Short Courses .................................................21 Author Index .....................................................................38 Show Directory ...........................................................23–48 Product/Services Index ....................................................40 Exhibitor List .....................................................................24 Oregon Convention Center - Level 1 ISTFA Exhibit Hall Oregon Convention Center - Level 2 ISTFA 2015 ORGANIZING COMMITTEE General Chair Dr. James J. Demarest IBM Vice General Chair Technical Program Chair Tutorial & Short Course Chair Exposition Chair Dr. Martin Keim Dr. Sam Subramanian Ms. Susan Li Ms. Efrat Moyal Mentor Graphics Freescale Semiconductor Spansion Inc. LatticeGear LLC 3 n this industry, we meticulously follow the data on the technical symposium, tutorial groups, in our investigations to arrive at the best conclu- equipment exposition, and education courses. I sions, often innovating our way around prob- am also happy to announce that Albert Yu-Min Lin, Ilems never before encountered. That’s why I invite National Geographic Explorer, has agreed to be you to follow the data to Portland, Oregon this our keynote speaker this year. Lin is doing ground- November for ISTFA, the symposium dedicated breaking work—without breaking ground—by to the semiconductor failure analysis and related using noninvasive computer techniques to explore industries. Now in its 41st iteration, ISTFA consis- archaeological sites, including that of Genghis tently provides a platform for the best and bright- Khan. His talk is sure to be both fascinating and est in the industry to come together, share ideas, insightful. and investigate the evidence on where the industry is headed. The organizing committee has been hard at work putting together this year’s show, and it is shaping ISTFA 2015 Chairman up to be outstanding. We have incorporated some Jay Demarest, Ph.D. exciting new initiatives this year, such as a student IBM—Albany Nanotech poster contest, while sticking to our core strengths Physical Characterization ISTFA 2015 ORGANIZING COMMITTEE continued Activities Chairs and Vice Chairs Mr. David Grosjean Mr. Kendall Scott Wills Dr. Felix Beaudoin Ms. Becky Holdford Ms. Rose Ring Mr. Dan Bodoh Panel Chair Panel Vice Chair Attendee Chair AV Chair Movie Chair & User Past Chair Qualcomm Consultant GLOBALFOUNDRIES Texas Instruments, Inc Group Vice Chair Freescale GLOBALFOUNDRIES Semiconductor Dr. Lihong Cao Dr. Mayue Xie Nicholas Antoniou Mr. Rick Livengood David Su International Chair Tutorial & Short User Group Chair Local Arrangements Chair International Co-Chair AMD Course Vice Chair Revera Inc. Intel TSMC Intel Technical Program Session Chairs 3D Device Device Failure Analysis Fault Isolation Microscopy Packaging and Failure Analysis Victoria Bruce, Qualcomm Michael Bruce, Consultant Carl Nail, Evans Analytical Assembly Level FA Frank Altmann, Incorporated Paiboon Tangyunyong, Group Lihong Cao, Advanced Fraunhofer Institute for Ted Kolasa, Orbital Sandia National Tom Schamp, Hitachi High Micro Devices Mechanics of Materials Sciences Corporation Laboratories Technology America Inc Bhanu P. Sood, CALCE, Yan Li, Intel University of Maryland Diagnostic Testing, FIB Circuit Analysis Nanoprobing Board and System Scanning and Debug and Edit and Electrical Sample Preparation and Level FA Geir Eide, Mentor Jason Benz, Characterization Device Deprocessing Victoria Bruce, Qualcomm Graphics GLOBALFOUNDRIES Kent Erington, Freescale Roger Alvis, FEI Company Incorporated Mark E. Kimball, Maxim Michael DiBattista, Semiconductor Jake E. Klein, Texas Ted Kolasa, Orbital Integrated Products, Inc. Qualcomm, Inc. Randal E. Mulder, Silicon Instruments Sciences Corporation Labs 4 Electrical and Yield FIB Sample Preparation Scanning Probe Analysis Case Studies and the FA Gregory M. Johnson, Carl Nail, Evans Analytical Package and Physical Terence Kane, IBM Process GLOBALFOUNDRIES Group Analysis Challenges Phil Kaszuba, Zhigang Song, Jenny Ma, Intel Tom Schamp, Hitachi High Tutorial GLOBALFOUNDRIES GLOBALFOUNDRIES Technology America Inc. Susan Li, Cypress Rose Ring, Emerging FA Techniques Semiconductor Technology Specific FA GLOBALFOUNDRIES and Concepts Metrology and In-line Chris Richardson, Allied Tutorial Sandia Malta Terence Kane, IBM Device Characterization High Tech Products Mark Jenkins, National Laboratories Phil Kaszuba, Bryan Tracy, Evans Detecting Counterfeit Globalfoundries Analytical Group Corey Senowitz, Microelectronics Huimeng Wu, Carl Zeiss Qualcomm Technologies Robert Champaign, FA Lab Management Microscopy Raytheon Network Rose Ring, Centric Systems GLOBALFOUNDRIES Joe Colangelo, Raytheon Malta Network Centric Systems Zhigang Song, GLOBALFOUNDRIES Tutorial Session Chairs Package and Physical Electrical and Yield Fault Isolation Microscopy Technology Specific FA Analysis Challenges Gregory M. Johnson, David Vallett, Jake E. Klein, Texas Mark Jenkins, Sandia Susan Li, Spansion Inc. GLOBALFOUNDRIES PeakSource Analytical, Instruments National Laboratories Chris Richardson, Allied Jenny Ma, Intel LLC Carl Nail, Evans Analytical Corey Senowitz, High Tech Products, Mayue Xie, Intel Group, LLC Qualcomm Technologies Inc. Inc. SPECIAL EVENTS Tools-of-the-Trade Tour Panel Discussion—1st Silicon Debug: Rapid Identifica- Monday, November 2, 2015 tion and Correction of Product Systematic Failures 5:00–6:45 p.m. • Exhibit Hall D Wednesday, November 4, 2015 • 10:10 a.m.–12:10 p.m. What is the Tools-of-the-Trade Tour? Demonstrations of the The panel presentations will cover key topics that are essential latest products
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