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Electronic Costing & Technology Experts Power electronics – MEMS & Sensors – LED & Optoelectronics – Advanced Packaging – System ADVANCED RF PACKAGING TECHNOLOGY TRENDS ON THE WAY TO 5G AND MMWAVE APPLICATIONS Advanced Packaging & System Integration Technology Symposium Apr. 22-23, 2019 Shanghai, China Romain Fraux CEO – System Plus Consulting 6 COMPANIES TO SERVE YOUR BUSINESS Yole Group of Companies Market, technology and strategy Manufacturing costs analysis IP analysis consulting Teardown and reverse engineering Patent assessment Cost simulation tools www.yole.fr www.systemplus.fr www.knowmade.fr Design and characterization of innovative optical systems Innovation and business maker Due diligence www.bmorpho.com www.piseo.fr www.yole.fr Advanced Packaging & System Integration Technology Symposium, April 23, 2019 2 OUR GLOBAL ACTIVITY Europe office Frankfurt Paris Nantes Yole Korea Yole Inc. HQ in Lyon Seoul Phoenix Vénissieux Yole Japan Tokyo Nice Greater Palo Alto China office 40% Hsinchu of our business 30% 30% of our business of our business Advanced Packaging & System Integration Technology Symposium, April 23, 2019 3 BUSINESS MODEL Reverse Costing Teardown + Cost Analysis Customer Catalog Specific Costing Tools Training Advanced Packaging & System Integration Technology Symposium, April 23, 2019 4 FIELDS OF EXPERTISE UV LED Lamp White/Blue Discrete Module Compound (GaN, SiC) Power RF Pressure Sensor Gyro/Accelero Automotive IMU/Combo Consumer Oscillators/Compass Energy Environment Medical Gas Sensor Telecom Fingerprint Microphone
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