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February 21, 2011 Safe Harbor February 21, 2011 Safe Harbor During the course of this meeting, we may make projections or other forward-looking statements regarding future events or the future financial performance of the Company and the industry. We wish to caution you that such statements are predictions and that actual events or results may differ materially. We refer you to the documents the Company files on a consolidated basis from time to time with Securities and Exchange Commission, specifically the Company’s most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for the Company on a consolidated basis to differ materially from those contained in our projections or forward-looking statements. These certain factors can be found at http://www.micron.com/certainfactors. Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements. We are under no duty to update any of the forward-looking statements after the date of the presentation to conform these statements to actual results. February 21, 2011 ©2011 Micron Technology, Inc. | 2 2011 Micron Winter Analyst Conference Steve Appleton Chairman and CEO ©2011 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron‟s production data sheet specifications. Information, products, and/or specifications are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings are not to scale. Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. February 21, 2011 ©2011 Micron Technology, Inc. | 3 Micron Evolution ► Recognized Need for Strategic Shift ► Leverage Technology Expertise ► Pursue Efficient Capital Deployment (cheap assets with scale & partnerships) ► Product Portfolio Expansion FY2010 All NOR Toshiba DRAM IMFT FY2006 MeiYa / Revenue $8.4B Resources Revenue $5.3B Inotera Income $1.85B to NAND Income $408M Cash Flow $3.0B E.P.S. $0.57 E.P.S. $1.85 Photobit (Aptina) Lexar Numonyx 2001 2002 2005 2006 2008 2010 ► Decrease in Long Term DRAM Annual Bit Growth to < 50% year ► First Bankruptcy and Liquidation of a DRAM Company in History ► Customer Consolidation in Computing ► Government Subsidized Companies February 21, 2011 ©2011 Micron Technology, Inc. | 4 Application Revenue Diversification 100% 4% 5% 4% 2% 9% 90% 11% 11% 17% 80% 15% 23% 18% 15% AIMM 70% Networking & Storage 60% 20% 15% Server 26% 50% 26% 10% Consumer 40% 24% 6% 5% Mobile 30% Personal Systems 20% 40% 33% 34% 27% 10% 0% FY08 FY09 FY10 FY11 Includes DRAM, NAND, and NOR; NOR does not include purchase accounting adjustments February 21, 2011 ©2011 Micron Technology, Inc. | 5 Segment Revenue Diversification DRAM NAND NOR Imager 100% 4% 3% 12% 11% 11% 5% 17% 19% 80% 6% 23% 34% 35% 39% 31% 60% 40% 77% % of Micron Total Revenues of Micron % 65% 57% 54% 50% 47% 20% 0% FY 2006 FY 2007 FY 2008 FY 2009 FY 2010 FQ1 2011 February 21, 2011 ©2011 Micron Technology, Inc. | 6 Organization Structure Chairman & CEO President & COO DRAM NAND Embedded Wireless Solutions Solutions Solutions Solutions WW Sales WW Operations, Procurement Memory Architecture, Process R&D, Engineering Corp. Dev., Finance, HR, Integration, Legal February 21, 2011 ©2011 Micron Technology, Inc. | 7 February 21, 2011 DRAM Solutions Group Brian Shirley Vice President February 21, 2011 ©2011 Micron Technology, Inc. | 9 DRAM Solutions Group - DSG Networking Server Graphics Personal Computing & Storage ► Cloud computing and ► High-end routers running ► Visual enhancements are ► PC’s converted to DDR3 virtualization driving need past traditional DRAM driving increased DRAM and up to 4GB for more cores limits needs ► Tablets using DDR2 today, ► Further drives DRAM ► Customer premise ► New game console soon DDR3 and early density, performance equipment market planning underway with DDR4 due to power needs, and power exploding (CPE) unparalleled speed needs concerns ► Sandy Bridge integrates ► Exploding demand from ► Speed requirements GPU on to CPU, pushing up ► Intel’s Romley launch Storage market increasing to 2Gbps +… main memory needs in 2H’11 February 21, 2011 ©2011 Micron Technology, Inc. | 10 DRAM Solutions Group - DSG Networking Server Graphics Personal Computing & Storage ► Cloud computing and ► High-end routers running ► Visual enhancements are ► PC’s converted to DDR3 virtualization driving need past traditional DRAM driving increased DRAM and up to 4GB for more cores limits needs ► Tablets using DDR2 today, ► Further drives DRAM ► Customer premise ► New game console soon DDR3 and early density, performance equipment market planning underway with DDR4 due to power needs, and power exploding (CPE) unparalleled speed needs concerns ► Sandy Bridge integrates ► Exploding demand from ► Speed requirements GPU on to CPU, pushing up ► Intel’s Romley launch Storage market increasing to 2Gbps +… main memory needs in 2H’11 Increasing need for high density, high speed, low power DRAM solutions: Micron’s DRAM portfolio drives the world’s infrastructure February 21, 2011 ©2011 Micron Technology, Inc. | 11 Leading in New Applications: Tablets Tablet Shipment Growth One of the Hottest Items at CES 2011 250 3,000 2011 Tablet shipments 200 2,400 projected to grow 3x 150 1,800 Projected to out-ship desktops by 2014 100 1,200 MB/System Utilize a wide range of DRAM Millions Systems Shipped Millions 50 600 Power is Key for Tablets 0 0 2010 2011 2012 2013 2014 Tablet Systems Shipped Tablet Memory Content Source: Gartner 4Q‟10; Micron Market Research February 21, 2011 ©2011 Micron Technology, Inc. | 12 Leading with New Interfaces: DDR4 …optimized for power and performance DDR4 Market Introduction The next major standard 100% 80% DDR4 introduction expected in 2012 60% ▶ Main interest in power sensitive applications 40% Key improvements over DDR3 20% ▶ Higher Bandwidth: Up to 3.2 Gbps 0% ▶ Power Consumption: 1.2V drives big improvement 2009 2010 2011 2012 2013 2014 SDR DDR DDR2 DDR3 DDR4 ▶ High Density: 128Gb in single-stack, single-load Ideal Memory for variety of applications Potential DDR4 Lead Applications ▶ Server ideal due to power & performance benefits ▶ Tablet PC benefit from low voltage ▶ Fast introduction in Notebooks expected Micron fully committed to DDR4 introduction Servers Notebooks Tablet PCs ▶ Driving JEDEC standardization ‣Best solution for high ‣Further power saving ‣Ideal application to use ▶ Early development of DDR4 with introduction density DIMMs due to 1.2V low power features in 1H‟2012 ‣Significant power ‣Performance increase ‣Fast adoption due to reduction to address future variety of controller applications vendors Source: Gartner 4Q‟10 February 21, 2011 ©2011 Micron Technology, Inc. | 13 Leading with New Technology: 3x nm Improved Performance, Power-efficiency and Cost • High-performance 1Gb, 2Gb and 4Gb DDR3 products for broad range of applications across all market segments • Further power reductions and functionality down to 1.2V • ~50% more 4Gb chips per wafer versus 42nm • Enabling standard module densities of up to 64GB • Lead Technology for DDR4 Introduction Key Features and Portfolio Roll-out • Key features: ‣ High speed operation up to 1866 Gbps DDR3 and 2400 Gbps DDR4 ‣ Fully 1.50V and 1.35V compatible DDR3 and 1.20V on DDR4 ‣ Technology and circuit design related power improvements for best-in-class power • First samples available now February 21, 2011 ©2011 Micron Technology, Inc. | 14 Leading with New Form Factors: LRDIMM Fully Populated System Higher-density modules at improved performance ► IT, virtualization, and datacenters need for higher 67% Higher Bandwidth density 50% Higher System Capacity ► Standard DIMMS limit scaling of capacity and performance 512GB 800 768GB 1333 ► Micron‟s new LRDIMM technology delivers a high Mbps Mbps Standard DIMM Micron LRDIMM performance, cost effective solution to address today‟s IT system challenges Happening Now Roll-out of Portfolio Roll-out of Portfolio ► Broad Standard and VLP Portfolio ► Module Densities up to 64GB ► Samples available now February 21, 2011 ©2011 Micron Technology, Inc. | 15 Leading with New Products: RLDRAM3 The best low-latency DRAM gets better • Unprecedented performance for high-end networking • Comparable to SRAM access time at superior cost and density • Easy transition path from RL2 platforms • High interest of customers and key enablers Extended success of RLDRAM2 with RLDRAM3 • Improved performance: ‣ random access time down to 10ns write and 2.5ns read ‣ doubled sustainable bandwidth of 2133 Gbps ‣ power-efficiency and high memory density • Memory densities of 576Mb and 1.1Gb • Samples available mid 2011, production in 2H 2011 • 2nd source partner identified February 21, 2011 ©2011 Micron Technology, Inc. | 16 Leading with New Innovations Revolutionary Approach to Break Through the “Memory Wall” • Evolutionary DRAM roadmaps hit limitations of bandwidth and power efficiency • Micron introduces a new class of memory: Hybrid Memory Cube • Unique combination of DRAMs on Logic smashes through the wall TSV connections Key Features and Roll-Out • How did we do it? ► Micron-designed logic controller ► High speed link to CPU ► Massively parallel “Through Silicon Via” connection to DRAM • Unparalleled performance: ► Up to 20X the bandwidth of a full DDR3 DIMM ► Using a 10th of the power per bit ► Occupying an 8th of
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