TECHNICAL PROGRAMME COMMITTEE Jaume Abella, Barcelona Supercomputing Center, ES Masoud Daneshtalab, KTH Royal Institute of Technology, SE Jacob Abraham, University of Texas, US Jean-Luc Danger, Secure IC, FR Deji Akinwande, University of Texas, US Luca Daniel, MIT, US Baris Aksanli, San Diego State University, US Raphaël David, CEA LIST, FR Mohammad Abdullah Al Faruque, University of California Irvine, US Vivek De, Intel, US Armin Alaghi, University of Washington, US Florent de Dinechin, INSA de Lyon, FR Josep Altet, Universitat Politècnica de Catalunya, ES Elke De Mulder, Cryptography Research, US Sebastian Altmeyer, University of Amsterdam, NL Dionisio de Niz, Carnegie Mellon University, US Luca Amaru, Synopsys, US Flavio M. de Paula, IBM Corporation, US Lorena Anghel, TIMA, FR Bjorn De Sutter, Ghent University, BE Costin Anghel, Institut supérieur d'électronique de Paris, FR Giuseppe Desoli, STMicroelctronics, IT Giovanni Ansaloni, Universitá della Svizzera Italiana, CH Mario Diaz-Nava, STMicroelectronics, FR Davide Appello, ST Microelectronics, IT Giorgos Dimitrakopoulos, University of Thrace, GR Karl-Erik Årzén, Lund University, SE Pedro Diniz, University of Southern California, US Jose L. Ayala, Complutense University of Madrid, ES Christian Drewes, Intel Mobile Communications, DE Manuel Barragán, TIMA, FR Elena Dubrova, KTH, SE Alberto A. Barrio del, Universidad Complutense de Madrid: UCM, ES Nikil Dutt, University of California, Irvine, US Andrea Bartolini, University of Bologna, IT Stephan Eggersglüß, University of , DE Iain Bate, University of York, UK Petru Eles, Linköping University, SE Lejla Batina, Radboud University Nijmegen, NL Natalie Enright Jerger, University of Toronto, CA Lars Bauer, Karslruhe Institute of Technology, DE Rolf Ernst, TU Braunschweig, DE Tobias Becker, Maxeler Technologies, UK Adrian Evans, IROC, FR Giovanni Beltrame, École Polytehcnique de Montréal, CA Suhaib Fahmy, Nanyang Technological University, SG Luca Benini, ETHZ, CH Ylies Falcone, University Grenoble Alpes, FR Mladen Berekovic, TU Braunschweig, DE Luca Fanucci, University of Pisa, IT Anna Bernasconi, Universita' di Pisa, IT Elisabetta Farella, Fondazione Bruno Kessler - ICT center, IT Valeria Bertacco, University of Michigan, US Fabrizio Ferrandi, Politecnico di Milano, IT Koen Bertels, Delft University of Technology, NL Leandro Fiorin, IBM Research, NL Marko Bertogna, University of Modena, IT Wieland Fischer, Infineon Technologies, DE Viktor Michal Bidlo, Brno University of Technology, CZ Fischer, Hubert Curien Laboratory, FR Sebastian Armin Biere, Johannes Kepler University, AT Fischmeister, University of Waterloo, CA Gerhard Michaela Blott, XILINX, IE Fohler, TU Kaiserslautern, DE Cristiana Bolchini, Politecnico di Milano, IT William Fornaciari, Politecnico di Milano, IT Borzoo Bonakdarpour, McMaster University, CA Aurélien Francillon, EURECOM, FR Alberto Bosio, LIRMM - University of Montpellier 2, FR Pierre-Emmanuel Gaillardon, University of Utah, US Christos Bouganis, Imperial College, UK Kris Gaj, George Mason University, US David Boyle, Imperial College London, UK Alberto Garcia-Ortiz, Univ. Bremen, DE Elaheh (Eli) Bozorgzadeh, UC Irvine, US Siddharth Garg, New York University, US Florian Brandner, Télécom ParisTech, FR Pantelis Georgious, Imperial College London, GB Oliver Bringmann, Universität Tübingen, DE Andreas Gerstlauer, University of Texas at Austin, US Philip Brisk, University of California, Riverside, US Georges Gielen, Katholieke Universiteit Leuven, BE Davide Brunelli, DISI - University of Trento, IT Bastien Giraud, CEA-Leti, FR Andreas Burg, EPFL, CH Alain Girault, INRIA, FR Andrea Calimera, Politecnico di Torino, IT Tony Givargis, University of California, Irvine, US Ramon Canal, Universitat Politècnica de Catalunya (UPC), ES Michael Glass, Universität Ulm, DE Luca Carloni, Columbia, US Elena Gnani, University Bologna, IT Jeronimo Castrillon, Technische Universität Dresden, DE Kees Goossens, Eindhoven University of Technology, NL Francisco Cazorla, CSIC - BSC, ES Paul Gratz, Texas A&M university, US Krish Chakrabarty, Duke, US Alberto Griggio, Fondazione Bruno Kessler, IT Vikas Chandra, ARM, US Christoph Grimm, University of Kaiserslautern, DE Naehyuck Chang, KAIST, KR Patrick Groeneveld, Synopsys, US Jian-Jia Chen, TU Dortmund, DE Daniel Grosse, , DE Wu-Tung Cheng, Mentor, US Radu Grosu, Vienna University of Technology, AT Cheng Cheng-Mou (Doug), National Taiwan University, TW Kim N. Grüttner, OFFIS, DE Kiyoung Choi, Seoul National Univ., KR Nan Guan, Hong Kong Polytechnic University, HK Alessandro Cilardo, University of Naples Federico II, IT Tim Güneysu, University of Bremen, DE Fabien Clermidy, CEA-Leti, FR Frank K. Gürkaynak, ETH Zürich, CH Marcello Coppola, STMicroelectronics, IT Timo Hämäläinen, Tampere University of Technology, FI Said Hamdioui, TU Delft, NL Wenchao Li, Boston University, US Jie Han, University of Alberta, CA Yun Eric Liang, Peking University, CN Frank Hannig, Friedrich-Alexander-Universität Erlangen-Nürnberg, DE Mark Po-Hung Lin, National Chung Cheng University, TW Andreas Hansson, ARM Ltd., UK Yongpan Liu, Tsinghua University, CN Yuko Hara-Azumi, Tokyo Institute of Technology, JP Riccardo Locatelli, STMicroelectronics, FR Jim Harkin, University of Ulster, GB marie-Minerve Louerat, UNiversity Pierre & Marie Curie, LIP6, FR Arne Heittmann, RWTH Aachen University, DE Enno Luebbers, Intel Corporation, US Sybille Hellebrand, University of , DE Roman Lysecky, University of Arizone, US Deukhyoun Heo, Washington State University, US Alberto Macii, Politecnico di Torino, IT Andreas Herkersdorf, Technische Universität München, DE Roel Maes, Intrinsic-ID, NL Marijn Heule, The University of Texas at Austin, US Michele Magno, ETHZ Zurich, CH Marc Heyns, IMEC, BE Frédéric Mallet, Université Nice Sophia Antipolis, FR Tsung-Yi Ho, National Tsing Hua University, TW Cristell Maneux, University of Bordeaux, FR Houman Homayoun, George Mason University, US Stefan Mangard, TU Graz, AT Nuno Horta, Insituto de Telecomunicaçöes, Instituto Superior Técnico -- Hans Manhaeve, Ridgetop Europe, BE TU Lisbon, PT Andrea Marongiu, ETH Zurich, CH Shiyan Hu, Michigan Technological University Houghton, US Dmitri Maslov, University of Waterloo, CA Michael Hübner, Ruhr-Universität Bochum, DE Hiroki Matsutani, Keio University, JP Daniele Ielmini, Politecnico di Milano, IT Dorin Maxim, ISEP, PT André Ivanov, University of British Columbia, CA Marcel Medwed, NXP Semiconductors, AT Ravi Iyer, Intel's lab, US Pascal Meinerzhagen, Intel Labs, US Viacheslav Izosimov, The Royal Institute of Technology (KTH), SE Filippo Melzani, STMicroelectronics, IT Jörn W. Janneck, Lund University, SE Gokhan Memik, Northwestern University, US Axel Jantsch, Technische Universität Wien, AT Nele Mentens, ESAT/COSIC and iMinds, KU Leuven, BE Maksim Jenihhin, Tallinn University of Technology, EE Geoff Merrett, University of Southampton, GB Ahmed Jerraya, CEA Leti, FR Cecilia Metra, University of Bologna, IT Reiley Jeyapaul, ARM, US Brett Meyer, McGill University, CA Maria Li Jiang, Shanghai JiaoTong University, CN Michael, University of Cyprus, CY Barbara Jobstmann, VERIMAG, FR Antonio Miele, Politecnico di Milano, IT Timothy Jones, University of Cambridge, UK Shahriar Mirabbasi, UBC, CA Jorge Guajardo, Bosch Research and Technology Center, Robert Bosch Subhasish Mitra, Stanford University, US LLC, US José Monteiro, INESC, PT Ajay Joshi, Boston University, US Amir Moradi, , DE Seiji Kajihara, Kyushu Institute of Technology, JP Fernando Moraes, PUC-RS, BR Kyungsu Kang, EPFL, CH Orlando Moreira, Intel, NL Rohit Kapur, Synopsys, US Rajeev Murgai, Synopsys, IN Georgios Karakonstantis, Queen's University Belfast, GB David Naccache, ENS, FR Ryan Kastner, University of California San Diego, US Hiroshi Nakamura, University of Tokyo, JP Paul Kaufmann, Paderborn University, DE Kazutero Namba, Chiba University, JP Martin Keim, Mentor Graphics, US Alberto Nannarelli, DTU, DK Georgios Keramidas, Think Silicon S.A./Technological Educational Vijaykrishnan Narayanan, Pennsylvania State University, US Institute of Western Greece, GR Alessandra Nardi, Cadence Design Systems, US Mehran Mozaffari Kermani, RIT, US Thomas Nolte, MRTC/Malardalen University, SE Jae-Joon Kim, POSTECH, KR Umit Ogras, University of Arizona, US John Kim, KAIST, KR Seda Memik, Northwestern University, US Veit B. Kleeberger, Infineon Technologies, DE David Oswald, University of Birmingham, UK Dirk Koch, University of Manchester, UK Gianluca Palermo, Politecnico di Milano, IT Tushar Krishna, GeorgiaTech, US Ioannis Papaefstathiou, Technical University of Crete, GR Bram Kruseman, NXP Semiconductors, NL Steffen Paul, Universität Bremen, DE Akash Kumar, Technische Universitaet Dresden, DE Rodolfo Pellizzoni, University of Waterloo, CA Sandip Kundu, University of Massachusetts, US Frédéric Pétrot, TIMA Laboratory, FR Fadi Kurdahi, University of California at Irvine, US Laurence Pierre, TIMA, FR Kai Lampka, University of Uppsala, SE Jose Pineda de Gyvez, NXP Semiconductors, NL Luca Larcher, Università di Modena e Reggio Emilia, IT Christian Plessl, University of Paderborn, DE Guilhem Larrieu, CNRS-LAAS, FR Dionisos Pnevmatikatos, TU Crete, GR Erik Larsson, Lund University, SE Ilia Polian, Universität Passau, DE Florian Sebastien Le Beux, ECL, FR Pölzlbauer, Virtual Vehicle, AT Massimo Gildas Leger, IMSE-CNM-CSIC, ES Poncino, Politecnico di Torino, IT Hai (Helen) Li, University of Pittsburgh, US Huawei Li, Chinese Academy of Sciences, CN Bing Li, Technische Universität München, DE Paul Pop, Technical University of Denmark, DK Mehdi Tahoori, Karlsruhe Institute of Technology, DE Jean-Michel Portal, IM2NP, FR Sheldon Tan, UC Riverside, US Laura Pozzi, USI Lugano, CH Mark M. Tehranipoor, University of Florida, US Graziano Pravadelli, EDALab, IT Jürgen Teich, Friedrich-Alexander-Universität Erlangen-Nürnberg, DE Thomas Preußer, Technische Universität Dresden, DE Theo Theocharides, University of Cyprus, CY Mihalis Psarakis, University of Piraeus, GR Lothar Thiele, ETH Zurich, CH Martin Radetzki, , DE David Thomas, Imperial College London, UK Praveen Raghavan, IMEC, BE Aida Todri, CNRS, Fr Wenjing Rao, University of Illinois at Chicago (UIC), US Hiroyuki Tomiyama, Ritsumeikan University, JP Arijit Raychowdhury, Georgia Institute of Technology, US Martin Albrecht Trefzer, University of York, UK Joaquín Recas, Computense University of Madrid, ES Antonino Tumeo, Pacific Nortwestern National Laboratory, US Sylvie Renaud, IMS Bordeaux, FR Andy Tyrrell, University of York, UK Pedro Reviriego, Universidad Antonio de Nebrija, ES Jerzy Tyszer, Poznan University of Technology, PL Heike Riel, IBM Research - Zurich, CH René Van Leuken, Delft University of Technology, NL Salvatore Rinaudo, STMicroelectronics, IT Gerd Vandersteen, Vrije Universiteit Brussel, BE Francisco Rincon, EPFL, CH Shobha Vasudevan, University of Illinois at Urbana-Champaign, US Tanguy Risset, INSA Lyon, FR Elena Ioana Vatajelu, TIMA Laboratory, FR Rosa Rodriguez, Universitat Politècnica Catalunya, ES Naveen Verma, Princeton, US Olivier Romain, ENSEA, FR Bart Vermeulen, NXP Semiconductors, NL Tajana Simunic Rosing, UCSD, US Tiziano Villa, Universita' di Verona, IT Sanghamitra Roy, Utah State University, US Eugenio Villar, University of Cantabria, ES Jaijeet Roychowdhury, University of California at Berkeley, US Sara Vinco, Politecnico di Torino, IT Antonio Rubio, Universitat Politècnica de Catalunya, ES Pascal Vivet, CEA-LETI, FR Mohamed Sabry, Stanford University, US Yu Wang, Tsinghua University, CN Li.- Manoj Sachdev, University of Waterloo, CA C. Wang, UC Santa Barbara, US Yanzhi Ingo Sander, Royal Institute of Technology, SE Wang, Syracuse University, US Walter Chiara Sandionigi, CEA-LIST, FR Weber, Namlab, DE Toshinori Sato, Fukuoka University, JP Pieter Weckx, IMEC vzw, BE Gunar Schirner, Northeastern University, US Norbert Wehn, University of Kaiserslautern, DE Julien Schmaltz, Eindhoven University of Technology, NL Christian Weis, University of Kaiserslautern, DE Christoph Scholl, , DE Xiaoqing Wen, Kyushu Institute of Technology, JP Jean-Pierre Seifert, Technische Universität , DE Kai-Chiang Wu, National Chiao Tung University, ES Lukas Sekanina, Brno University of Technology, CZ Jiang Xu, Hong Kong University of Science and Technology, CN Alper Sen, Bogazici University, TR Cong Xu, HP Lab, US Shreyas Sen, Purdue University, US Jingling Xue, University of New South Wales, AU Olivier Sentieys, CAIRN,IRISA, FR Sotoris Xydis, National Technical University of Athens, GR Martha Johanna Sepulveda Florez, Technical University of Munich, DE Chia-Lin Yang, National Taiwan University, TW Muhammad Shafique, Technische Universität Wien, AT Hailong Yao, Tsinghua University, CN Zili Shao, Hong Kong Polytechnic University, HK Sungjoo Yoo, Seoul National University, KR Donghwa Shin, Department of Computer Engineering, Yeungnam Shusuke Yoshimoto, Osaka University, JP University, KR Hao Yu, Nanyang Technical University, SG Aviral Shrivastava, Arizona State University, US Huafeng Yu, Boeing, US Max Shulaker, Stanford U, US Weisheng Zhao, Beihang Univ., CN Cristina Silvano, Politecnico di Milano, IT Qi Zhu, UCR, US Luis Miguel Silveira, Inesc, PT Daniel Ziener, University of Technology, DE Ozgur Sinanoglu, New York University - Abu Dhabi, AE Vladimir Zolotov, IBM T.J. Watson Research Center, US Sergei Skorobogatov, University of Cambridge, GB Stefan Slesazeck, NaMLab gGmbH, DE Frank Slomka, Ulm University, DE Hayden So Kwok-Hay, University of Hong Kong, HK Oleg Sokolsky, University of Pennsylvania, US Matteo Sonza Reorda, Politecnico di Torino, IT Ioannis Sourdis, Chalmers University of Technology, SE Sebastian Steinhorst, Technical University of Munich, DE Andreas Steininger, Vienna University of Technology, AT Daryl Stewart, ARM, GB Marc Stöttinger, Continental, DE Cliff Sze, IBM, US Mostafa Taha, Western University, CA