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Workshop on Computational Physics and Materials Science
Workshop on Computational Physics and Materials Science: Total Energy and Force Methods 2020 Donostia-San Sebastián, Spain January 8-10, 2020 Institutional support and funding Preface This workshop is organized within the well-established “Total Energy and Force” conference series, which is held at ICTP in Trieste every odd year, and at a different place in the world every even year. The previous most recent workshops of this series outside Trieste took place in Barcelona (2012), Lausanne (2014), Luxembourg (2016) and Cambridge (2018). The main objective of this event is to identify new developments and topics in the field of electronic-structure methods from the first-principles perspective, their diverse applications, and its mathematical foundations. As such, it provides a great opportunity to assemble a wide range of leading scientists working on different aspects of computational material science. The workshop aims to cover the following topics: • Electron-phonon • Dielectrics • 2D materials • Correlation effects • Superconductivity • Topological materials • Transport properties • Excitations Organizing committee • Aran Garcia-Lekue, DIPC • Ivo Souza, UPV/EHU • Ion Errea, UPV/EHU Scientific advisory board • O. Akin-Ojo, University of Ibadan • E. Artacho, University of Cambridge & Nanogune • W. Andreoni, Ecole Polytechnique Fédérale de Lausanne • S. Biermann, Ecole Polytechnique, Palaiseau • R. Car, Princeton University • C. Filippi, University of Twente • M. Finnis, Imperial College • R. Gebauer, International Centre for Theoretical Physics • X.-G. Gong, Fudan University • J. Ihm, Seoul National University • E. Koch, Forschungszentrum Jülich • G. Kresse, University of Vienna • R. M. Martin, Stanford University • F. Mauri, University “La Sapienza” • A. Mostofi, Imperial College London • S. Narasimhan, JNCASR Bangalore • J. B. -
Kavli-Maart 2014 V2.Indd
KAVLI NEWSLETTER No.09 Kavli Institute of Nanoscience Delft March 2014 IN THIS ISSUE: How we became a Kavli Institute • 10 years of Kavli Delft • Kavli Colloquium Hongkun Park Introduction new faculty: Marileen Dogterom and Greg Bokinsky FROM THE DIRECTOR Philanthropist Fred A full newsletter again this month! First, our frontpage news that our benefactor Fred Kavli passed away. Kavli passed away I very well remember when I met him for the fi rst time, in 2003: Fred was a soft spoken and kind man, with a strong determination to use his busi- ness-generated fortune to advance science for the benefi t of humanity by supporting scientists and their work. Throughout the years I inter- acted with him a number of times, where this fi rst impression was re- confi rmed time and again. Now he has passed away. We will miss him, and continue the nanoscien- ce at Delft that he has supported so generously. Also, this month, we celebrate our 10-year birthday as a Kavli Insti- tute. For this occasion, Hans Mooij recalls the history of the start of our institute - a very interesting story in- deed, read it on page 6-7. Finally, this newsletter features our Kavli Colloquium speaker Hongkun Park, introductory self-interviews by Marileen Dogterom and Greg On 21 November 2013, the Kavli Foundation announced that its Bokinsky, wonderful columns, and more. founder Fred Kavli has passed away peacefully in his home in Santa Enjoy! Barbara at the age of 86. As philanthropist, physicist, entrepreneur, • Cees Dekker business leader and innovator, Fred Kavli established The Kavli Foun- dation to advance science for the benefi t of humanity. -
Nextflex Project Call 4.0 Guidebook
PROJECT CALL 4.0 Release Date: August 6, 2018 TABLE OF CONTENTS 1. FHE Definition 2. Introduction and Background 3. FHE Roadmap 4.0 4. Project Call Topics 4.1. Manufacturing Thrust Area (MTA) 4.2. Technology Platform Demonstrator (TPD) 5. Proposal Submission Process 5.1. Proposal Format Guidelines 5.2. Project Call 4.0 Timeline 5.3. Pre-Proposal Guidelines and Table of Contents 5.4. Full Proposal Guidelines and Table of Contents 6. Administrative Topics 6.1. Confidential Information 6.2. Financial and Cost Share Requirements 6.3. Work Requirements 6.4. Membership Requirements 7. Proposal Evaluation Criteria 7.1. General Overview and Guidelines 8. Contact Information 9. Reference Documents 10. Glossary of Terms Appendix A: Cover Sheet Template Appendix B: Instructions for Filling Out Proposal Cost Calculations Excel Workbook Appendix C: Pre-Proposal Evaluation Criteria Appendix D: Full Proposal Evaluation Criteria PROJECT CALL 4.0 SECTION 1. FHE DEFINITION This section is provided as an introduction to potential members of NextFlex® (“Institute” or “the Institute”) who may not be familiar with Flexible Hybrid Electronics (FHE) and the scope of our efforts in the Manufacturing USA network. NextFlex describes FHE as the intersection of additive circuitry, passive devices, and sensor systems that may be manufactured using printing methods (sometimes referred to as printed electronics) and thin flexible silicon chips or multichip interposer structures. These devices take advantage of the power of silicon and the economies and unique capabilities of printed circuitry to form a new class of devices for IoT, medical, robotics, consumer and communication markets. FHE devices conform to any shape, but are also bendable, twistable, and stretchable. -
Front Cover Sis V2.Indd 1 24/06/2014 11:56 LITHOGRAPHY SOLUTIONS for HIGH-VOLUME MANUFACTURING
Volume 36 Issue 2 2014 @siliconsemi www.siliconsemiconductor.net Directed self assembly Wafer cleaning legislation Innovation in materials recovery Getting more out of graphene Chip spending increases MEMS microphones Features, News Review, Industry Analysis, Research News and much more. Free Weekly E News round up , go to www.siliconsemiconductor.net Front Cover SiS v2.indd 1 24/06/2014 11:56 LITHOGRAPHY SOLUTIONS FOR HIGH-VOLUME MANUFACTURING Advanced Packaging for Logic and Memory Ultra-High Throughput and Productivity Mid-End and Back-End Interconnect Applications GET IN TOUCH to discuss your manufacturing needs www.EVGroup.com Untitled-1 1 26/03/2014 12:11 executiveview by Rich Rogoff, Vice President and General Manager, Lithography Systems Group, Rudolph Technologies, Inc. We must think “outside of the box” for new approaches in advanced packaging AS SEMICONDUCTOR DEVICES have continued to shrink Moving from round wafers to rectangular substrates in back- in size and grow in complexity, manufacturers have had to end advanced packaging saves corner space, delivering a develop advanced packaging techniques to accommodate roughly 10% improvement in surface utilization. In the case of the rapidly increasing number and density of connections lithography, the larger size of the substrate and the improved required to communicate with the outside world. Often these fit between the reticle and substrate can reduce the handling technologies have developed as adaptations of front-end and processing overhead by a factor of five. These productivity methods. While there is certainly value to be found improvements more than offset any potential reduction in using these well characterized processes, in throughput resulting from an increase in the number of we must be careful not to carry along old alignment points required for these larger substrates. -
Eindhoven University of Technology MASTER Concept Design for Reel To
Eindhoven University of Technology MASTER Concept design for reel to reel flex foil handling on a component mounting machine Wakker, R. Award date: 2005 Link to publication Disclaimer This document contains a student thesis (bachelor's or master's), as authored by a student at Eindhoven University of Technology. Student theses are made available in the TU/e repository upon obtaining the required degree. The grade received is not published on the document as presented in the repository. The required complexity or quality of research of student theses may vary by program, and the required minimum study period may vary in duration. General rights Copyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights. • Users may download and print one copy of any publication from the public portal for the purpose of private study or research. • You may not further distribute the material or use it for any profit-making activity or commercial gain Concept design for reel to reel flex foil handling on a component mounting machine DCT 2005.93 Remko Wakker s454659 Concept design for reel to reel flex foil handling on a component mounting machine Master thesis committee: prof.dr.ir.M.Steinbuch chairmain dr.ir.P.C.J.N.Rosielle, coach TU/e ing.W.Wesseling, coach Assembl¶eon B.V. ir.F.G.A. Homburg TU/e TECHNISCHE UNIVERSITEIT EINDHOVEN DEPARTMENT OF MECHANICAL ENGINEERING SECTION CONTROL SYSTEMS TECHNOLOGY CONSTRUCTIONS AND MECHANISMS Eindhoven, 24th June 2005 Preface and acknowledgements This report describes the concept design for a reel to reel flex foil production line, that is developed during my Master thesis project at the Technische Universiteit Eindhoven, faculty Mechanical engineering, group Constructions and Mechanisms. -
Project Call 6.0 Guidebook B
PROJECT CALL 6.0 GUIDEBOOK Online Cover Sheet Submission Deadline: 3/29/2021 Proposal Submission Deadline: 4/6/2021 Original Release Date: February 15, 2021 v1.0 PROJECT CALL 6.0 PROJECT CALL 6.0 TABLE OF CONTENTS Preface 3 SECTION 1. FHE Definition ................................................................................................................ 3 SECTION 2. Introduction and Background .......................................................................................... 3 SECTION 3. FHE Roadmap – 2020 Update ........................................................................................ 6 SECTION 4. Project Call Topics .......................................................................................................... 7 4.1 NextFlex-Funded Topics .............................................................................................................. 8 4.2 DoD Agency-Funded Topics ...................................................................................................... 14 SECTION 5. PROPOSAL SUBMISSION PROCESS ......................................................................... 15 5.1 Project Call 6.0 Timeline ............................................................................................................ 15 5.2 Proposal Format Guidelines ...................................................................................................... 16 5.3 Proposal Guidelines ................................................................................................................. -
Call for Papers | 2022 MRS Spring Meeting
Symposium CH01: Frontiers of In Situ Materials Characterization—From New Instrumentation and Method to Imaging Aided Materials Design Advancement in synchrotron X-ray techniques, microscopy and spectroscopy has extended the characterization capability to study the structure, phonon, spin, and electromagnetic field of materials with improved temporal and spatial resolution. This symposium will cover recent advances of in situ imaging techniques and highlight progress in materials design, synthesis, and engineering in catalysts and devices aided by insights gained from the state-of-the-art real-time materials characterization. This program will bring together works with an emphasis on developing and applying new methods in X-ray or electron diffraction, scanning probe microscopy, and other techniques to in situ studies of the dynamics in materials, such as the structural and chemical evolution of energy materials and catalysts, and the electronic structure of semiconductor and functional oxides. Additionally, this symposium will focus on works in designing, synthesizing new materials and optimizing materials properties by utilizing the insights on mechanisms of materials processes at different length or time scales revealed by in situ techniques. Emerging big data analysis approaches and method development presenting opportunities to aid materials design are welcomed. Discussion on experimental strategies, data analysis, and conceptual works showcasing how new in situ tools can probe exotic and critical processes in materials, such as charge and heat transfer, bonding, transport of molecule and ions, are encouraged. The symposium will identify new directions of in situ research, facilitate the application of new techniques to in situ liquid and gas phase microscopy and spectroscopy, and bridge mechanistic study with practical synthesis and engineering for materials with a broad range of applications. -
Carbon Nanotube Biosensors: the Critical Role of the Reference Electrode ͒ Ethan D
APPLIED PHYSICS LETTERS 91, 093507 ͑2007͒ Carbon nanotube biosensors: The critical role of the reference electrode ͒ Ethan D. Minot,a Anne M. Janssens, and Iddo Heller Kavli Institute of Nanoscience, Delft University of Technology, 2628 CJ Delft, The Netherlands Hendrik A. Heering Leiden Institute of Chemistry, Leiden University, Einsteinweg 55, 2333 CC Leiden, The Netherlands and Kavli Institute of Nanoscience, Delft University of Technology, 2628 CJ Delft, The Netherlands Cees Dekker and Serge G. Lemay Kavli Institute of Nanoscience, Delft University of Technology, 2628 CJ Delft, The Netherlands ͑Received 30 May 2007; accepted 1 August 2007; published online 28 August 2007͒ Carbon nanotube transistors show tremendous potential for electronic detection of biomolecules in solution. However, the nature and magnitude of the sensing signal upon molecular adsorption have so far remained controversial. Here, the authors show that the choice of the reference electrode is critical and resolves much of the previous controversy. The authors eliminate artifacts related to the reference electrode by using a well-defined reference electrode to accurately control the solution potential. Upon addition of bovine serum albumin proteins, the authors measure a transistor threshold shift of −15 mV which can be unambiguously attributed to the adsorption of biomolecules in the vicinity of the nanotube. © 2007 American Institute of Physics. ͓DOI: 10.1063/1.2775090͔ Biosensors based on nanoscale field-effect transistors determining redox couple.13 Sensors for biomolecule binding have the potential to significantly impact drug discovery, dis- are generally operated in buffer solutions where the redox ease screening, biohazard screening, and fundamental species are not controlled and the background redox reac- 1 science. -
First Choice for Advanced Applications AT&S at a GLANCE
Thick Copper IMS ECP® HSMtec Multilayer mSAP Double sided PTH Flexible & Rigid Flexible 2.5D® High Frequency HDI Any-Layer Metal Core IC substrates HDI Microvia First choice for advanced applications AT&S AT A GLANCE AT&S is one of the world’s leading suppliers of high-value AT&S cultivates the tradition of European engineering in a printed circuit boards and IC substrates highly industrialised setting AT&S has the most advanced high-tech facility for mass pro- The Group spends more than 5% of its annual revenues on duction of HDI printed circuit boards in China, the centre of research and development, enabling it to anticipate the ap- electronics manufacturing. Other plants, in Austria, India and plications of tomorrow. Highly qualified employees as well as Korea, concentrate on small and medium-sized batches for numerous partnerships with universities and international industrial and automotive customers. research institutes ensure that these activities meet the re- quired standards of excellence. AT&S uses problem-solving skills to add value AT&S’s broad portfolio of technologies allows it to provide AT&S is committed to the highest quality standards cutting edge, user-orientated solutions – from prototypes to All of AT&S’s production facilities are certified in accordance printed circuit boards for rapid application in industrial man- with ISO 9001 and/or ISO/TS 16969. AT&S is one of only a ufacturing – acting as a one-stop-shop. This results in major handful of printed circuit board manufacturers that also has reductions in product development lead times for customers, certification according to the EN ISO 13845 standard for med- meaning that AT&S adds value for customers above and be- ical products and the EN 9100 for the aerospace industry. -
Nanofabricated Structures and Microfluidic Devices for Bacteria: from Techniques to Biology Cite This: DOI: 10.1039/C5cs00514k Fabai Wu and Cees Dekker*
Chem Soc Rev View Article Online TUTORIAL REVIEW View Journal Nanofabricated structures and microfluidic devices for bacteria: from techniques to biology Cite this: DOI: 10.1039/c5cs00514k Fabai Wu and Cees Dekker* Nanofabricated structures and microfluidic technologies are increasingly being used to study bacteria because of their precise spatial and temporal control. They have facilitated studying many long-standing questions regarding growth, chemotaxis and cell-fate switching, and opened up new areas such as probing the effect of boundary geometries on the subcellular structure and social behavior of bacteria. Received 30th June 2015 We review the use of nano/microfabricated structures that spatially separate bacteria for quantitative DOI: 10.1039/c5cs00514k analyses and that provide topological constraints on their growth and chemical communications. These approaches are becoming modular and broadly applicable, and show a strong potential for dissecting www.rsc.org/chemsocrev the complex life of bacteria at various scales and engineering synthetic microbial societies. Key learning points (1) Microfabricated structures can spatially isolate and separate bacteria for single-cell analyses, for drug discovery by cultivating natural species on chips, and for lineage tracking that reveals the rules governing cell growth, cell-fate decisions, and antibiotic resistance. (2) Microfluidic devices that separate bacteria with semipermeable materials allow dissecting the effect of chemical communication between bacteria that exchange metabolic -
Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable Textile Applications
materials Article Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable Textile Applications Ramona Nolden * , Kerstin Zöll and Anne Schwarz-Pfeiffer Research Institute for Textile and Clothing, Hochschule Niederrhein-University of Applied Sciences, Webschulstraße 31, 41065 Mönchengladbach, Germany; [email protected] (K.Z.); [email protected] (A.S.-P.) * Correspondence: [email protected] Abstract: Embroidery is often the preferred technology when rigid circuit boards need to be con- nected to sensors and electrodes by data transmission lines and integrated into textiles. Moreover, conventional circuit boards, like Lilypad Arduino, commonly lack softness and flexibility. One approach to overcome this drawback can be flexible sequins as a substrate carrier for circuit boards. In this paper, such an approach of the development of flexible and functional sequins and circuit boards for wearable textile applications using subtractive and additive technology is demonstrated. Applying these techniques, one-sided sequins and circuit boards are produced using wax printing and etching copper-clad foils, as well as using dual 3D printing of conventional isolating and electri- cally conductive materials. The resulting flexible and functional sequins are equipped with surface mounted devices, applied to textiles by an automated embroidery process and contacted with a Citation: Nolden, R.; Zöll, K.; conductive embroidery thread. Schwarz-Pfeiffer, A. Development of Flexible and Functional Sequins Keywords: 3D printing; additive manufacturing; circuit boards; functional sequins; subtractive Using Subtractive Technology and 3D technology; wearable electronics Printing for Embroidered Wearable Textile Applications. Materials 2021, 14, 2633. https://doi.org/10.3390/ ma14102633 1. -
Simultaneous Electrical Transport and Scanning Tunneling Spectroscopy
NANO LETTERS xxxx Simultaneous Electrical Transport and Vol. 0, No. 0 Scanning Tunneling Spectroscopy of A-E Carbon Nanotubes Brian J. LeRoy,*,† Iddo Heller, Vijay K. Pahilwani, Cees Dekker, and Serge G. Lemay KaVli Institute of Nanoscience, Delft UniVersity of Technology, Lorentzweg 1, 2628 CJ Delft, The Netherlands Received April 5, 2007; Revised Manuscript Received May 22, 2007 ABSTRACT We performed scanning tunneling spectroscopy measurements on suspended single-walled carbon nanotubes with independently addressable source and drain electrodes in the Coulomb blockade regime. This three-terminal configuration allows the resistance to the source and drain electrodes to be individually measured, which we exploit to demonstrate that electrons were added to spin-degenerate states of the carbon nanotube. Unexpectedly, the Coulomb peaks also showed a strong spatial dependence. By performing simultaneous scanning tunneling spectroscopy and electrical transport measurements we show that the probed states are extended between the source and drain electrodes. This indicates that the observed spatial dependence reflects a modulation of the contact resistance. Single-walled carbon nanotubes (SWCNTs) have extremely growing SWCNTs directly on Pt electrodes separated by a promising electrical transport properties. In a field-effect trench.10 A 100 nm trench was etched in a Si wafer with a transistor geometry, they have been shown to have a higher 250 nm SiO2 layer to create the separation between the two drive current and transconductance than can be found in Si Pt electrodes which were used as the source and drain devices.1 However, one of the major unresolved issues is electrode. 8 µm × 5 µm regions were defined by electron- the influence of the contacts on their transport properties.2-4 beam lithography at a distance of 1.5 µm from the trench.