Emerging Non-Volatile Memory 2020 | Sample | | ©2020 2 ABOUT the AUTHORS Biographies & Contacts

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Emerging Non- Volatile Memory 2020

Market and Technology Report 2020

Scope, Objectives and Methodologies 13 Emerging NVM Market Forecast (2019-2025) 181

Three Slides Summary 23 MRAM Market Forecast – in units, $M, Gb and 12’’ eq. wafers 195

Executive Summary 27 PCM Market Forecast – in units, $M, Gb and 12’’ eq. wafers 202

Context - Overview of the Memory Business 56 RRAM Market Forecast – in units, $M, Gb and 12’’ eq. wafers 216

Stand-Alone Memory – NAND, DRAM, NOR, (NV)SRAM 61 MRAM Technology, Roadmaps and Players 223 Technology description, time to market, key players, key products, main trends Embedded Memory – eFlash, eDRAM, SRAM 78 PCM Technology, Roadmaps and Players 248 Memory Market Players 88 Technology description, time to market, key players, key products, main trends Overview Emerging Non-Volatile Memory 104 RRAM Technology, Roadmaps and Players 271 Emerging Non-Volatile Memory Applications 118 Technology description, time to market, key players, key products, main trends Fast/Reliable Memory for Industry, Defense, etc. (NVRAM) 125 Other Emerging NVM Technologies (NRAM, FeFETs) 294

Code/Data Storage (NOR-like) 130 China Memory Landscape 302

Persistent Memory (NVDIMM) 134 Summary and Conclusions 314 Low-Latency Storage (SCM Drive) 141 Noteworthy News 2018-2019 323 Embedded NVM for Analog ICs (EEPROM/eFlash-like) 146 Players’ announcements, technical demonstrations, and highlights from IEDM ‘19

Embedded NVM for MCU, SoC, ASIC, etc. (Slow-SRAM/eFlash-like) 150 Mergers & Acquisitions, Partnerships and Funding 336

Embedded Cache Memory for CPU/APU (SRAM/eDRAM-like) 164 How should you use our data? 345

Embedded NVM for AI (In-Memory Computing) 174 Yole’s Presentation 346

Simone Bertolazzi, PhD Simone is a Technology & Market analyst at Yole Développement (Yole) working within the Semiconductor & Software division. He is member of Yole’s memory team and contributes on a day-to-day basis to the analysis of memory markets and technologies, their related materials and fabrication processes. Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging semiconducting materials and their device applications. He (co-) authored more than 15 papers in high-impact scientific journals (>3,000 citations) and was awarded the prestigious Marie Curie Intra-European Fellowship. Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developed novel flash memory cells based on heterostructures of 2D materials and high-κ dielectrics. Simone earned a double M.A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude. Contact: [email protected]

Emilie Jolivet Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement (Yole), part of Yole Group of Companies. Emilie manages the expansion of the technical and market expertise of her team. In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities. With previous collaborations at Freescale and EV Group, Emilie developed a core expertise dedicated to package & assembly, semiconductor manufacturing, memory and software & computing. Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France) and graduated with an MBA from IAE (Lyon, France).

Contact: [email protected]

4DS, Adesto, Aeroflex, Antaïos, Apple, Applied Materials, ARM, Avalanche, Buffalo, Canon Anelva, CEA Leti, ChangXin Memory Technologies, Cisco, Crocus Nanoelectronics, Crossbar, Cypress, Dell, eBay, EMC, Evaderis, Everspin, Facebook, Ferroelectric Memory Company, Fujitsu, Fusion IO, GigaDevice, GlobalFoundries, Google, H- Grace, Hikstor, HLMC, Honeywell, HP, HProbe, Huawei, IBM, Imec, Infineon, Intermolecular, Innovative Silicon, Intel, ITRI, Jiangsu Advanced Memory Technology, Kioxia, Lenovo, Macronix, Maxim, Materion, Mediatek, Microchip, Micron, Mythic, Nantero, Nanya, National Tsing Hua University, NEC, NetApp, Nike, Nokia, Numen, Numonyx, NXP, Panasonic, Qualcomm, Quantum, Rambus, Reliance, Renesas, Samsung, SanDisk, Seagate, SK Hynix, Smart Modular Technologies, SMIC, Sony, Spansion, Spin Memory, Spintec, Spreadtrum, STMicroelectronics, Stanford University, Syntiant, TDK, Tezzaron, Tohoku University, TEL, TEL Magnetic Solutions, Teledyne e2v, Toshiba, Towerjazz, TPSCo, Tsinghua Unigroup , TSMC, UMC, Violin Memory, Weebit, Western Digital, Winbond, XFab, XMC, YMTC, various emerging Chinese NVM players, and more.

• Present an overview of the semiconductor memory market: • Stand-alone (NAND, DRAM, NOR, etc.) and embedded memory (eFlash, SRAM): main markets, trends • Technology status, and roadmap for the coming years • Provide an understanding of emerging NVM applications: • Market drivers & challenges, technology roadmap, players, and main trends are provided for a total of 10 application fields: 5 for stand-alone and 5 for embedded.A roadmap with time-to-market (by application) is provided. • Offer market forecasts for emerging NVM business: • 2019-2025 market forecast in US$, M Gb, number of dies, wafer starts. • Price evolution, by application and technology • Forecast for 10 applications and 3 technologies (MRAM, RRAM, PCM) • Describe emerging NVM technologies: • Working principle, manufacturing methods, advantages/limitations, development status, price, time-to-market • Roadmap with technological nodes, and chip density evolution with main players • Latest product development status for each key market player • Detail and analyze the competitive landscape: • Recent acquisitions and funding • Latest company news • Key players, by technologies and applications

 Assessment of two newly-emerging market applications  Embedded non-volatile memory for Analog IC products (EEPROM/eFlash replacement)  Stand-alone code / data storage (NOR Flash replacement)  Re-definition of the storage class memory (SMC) market segment with breakdown into the following categories:  Persistent Memory, i.e. non-volatile memory modules based on emerging NVM media (e.g. 3D XPoint)  Low-latency storage, i.e. solid-state drive for datacenter and client applications  Updated analysis of the overall stand-alone and embedded memory markets  Updated market forecast and technical trends for PCM, MRAM, and RRAM  Updated analysis of China’s memory market, and a detailed list of emerging Chinese NVM players  Analysis of Intel Optane’s NVDIMM and SSD: market and technology, ecosystem, present and future competitors (e.g. Micron’s X100).  Description of the latest foundries’ technology processes and analysis of new IC products incorporating embedded emerging NVM.  Analysis of In-Memory-Computing (IMC) approaches Neural Network (NN) computation with emerging memories.  Update on newly-emerging technologies, including new ferroelectric memories and nanotube RAM (NRAM)  Updated analysis of new entrants and startup funding  Comprehensive list of companies’ announcements, press releases, industry news and highlights from the IEDM ’19 conference.

Preexisting information

Market Volume (in Munits) ASP (in $) Revenue (in $M)

Information Aggregation

IC manufacturers and vendors, and IP sellers: Open foundries and IDMs: o Spot new opportunities and define diversification strategies o Evaluate the market potential of future technologies and products for new applicative markets o Position your company in the future of memory technologies o Screen potential new suppliers for introducing new disruptive technologies o Monitor and benchmark your competitors’ Equipment & material manufacturers: advancements o Understand emerging memory business and ecosystem dynamics o Discern the differentiated value of your products and Memory players : technologies in this market o Evaluate the market potential of emerging memory o Identify new business opportunities and prospects technologies o Screen potential applications and partners o Monitor and benchmark your competitors’ Financial & strategic investors: advancements o See the potential of new memory technologies o Obtain a list of key companies and start-ups

• NAND and DRAM account for ≈XX% of the overall stand-alone memory market. • Combined NAND and DRAM revenue was ≈ $XXX billion in 2019, down XX% from 2019.

2019 Memory Market - Breakdown by Technology

GrowthRevenue of (%) Revenue in $B Revenue

Total Stand-Alone Market in 2019 ≈ $XXXB

• DRAM and NAND together represent ~XX% of the stand-alone memory market. • The remaining ~XX% of the market (~$XXB) consists of:

- Flash NOR (~$XX) - EEPROM, EPROM, Mask PROM/ROM, etc. (~$XX) - Volatile RAM (~$XX) • Asynchronous SRAM • Synchronous SRAM - Non-Volatile RAM (~$XX) • nvSRAM • BBSRAM • FeRAM - Stand-alone emerging NVMs (~$XX) Total Stand-Alone Market in 2019 ~ $XX billions • Compared to NAND and DRAM, these markets are much less volatile and relatively more stable.

o MCU memory business: Embedded Memory Market Breakdown by Technology oNVM: ~ $XX, equal to XX% of the MCU market

oSRAM: ~ $XXB, equal to XX% of the MCU market

o Mobile AP memory business:

oSRAM: ~ $XXB, equal to XX% of the AP market

o CPU and GPU memory business

oSRAM: ~ $XXB, equal to XX% of the CPU market

oSRAM: ~ $7B, equal to XX% of the GPU market Embedded Memory Market Estimate ~ $XXB • Total embedded memory market ~$XXB.

Emerging NVM applications Stand-alone Embedded

Cache Memory Fast / Reliable Code / Data Persistent Low-Latency NVM in NVM in MCU, NVM for AI Memory Storage Memory Storage Analog ICs SoC, ASIC, etc. (Last Level)

MCUs and SoCs CPU NVRAM NOR-like NVDIMM Drives EEPROM / eFlash-like • IoT / Wearables in Analog ICs • XIP memory • Client SSDs • General Purpose • Industrial • Datacenters In-Memory automation • Automotive • IoTs • Workstations • Enterprise: • Data/code storage and Computing ICs • Transport trimming in: • Consumer - SCM-based SSD • Aerospace -PMIC Mobile AP • Automotive - Storage Accelerators • AI inference • Medical - Sensors - Network cards - Audio ASICs and ASSPs: • Gaming - Write cache in SSD - LED drivers • Memory buffers: • Network & - Journaling, log, data Infrastructure buffering and streams - Display Driver ICs - CMOS Image Sensors Increasing capacity Increasing capacity

10,000

Fast/Reliable Memory Stand-alone Emerging NVM 1,000 Established stand-alone memory (NV)SRAM FRAM 100 EEPROM Code/Data Storage

10 NOR Persistent Memory

0.01 Note: the bubble size is NAND indicative of the market size

0.001

0.1Mb 1 Mb 10 Mb 100 Mb 1Gb 10Gb 100Gb 1 Tb

PCM: Phase-Change Memory

RRAM: Resistive Random-Access Memory

STT-MRAM: Spin-Transfer Torque Magnetic RAM

NAND DRAM NOR 3D XPoint

WD acquired Intel-Micron JV - IMFT SanDisk in 2016 (from 2006 to 2019) Micron is the In 2018, SK hynix and only player Alliance: Kioxia-WD Micron acquired Inotera memory from Nanya in 2016 Cypress entered into a JV for NAND Flash business focusing on all the four major stand- alone technologies

Cypress and Spansion JV SkyHigh Memory merged in 2014

. Strategic alliances are essential for mass adoption of emerging NVM

Other / To be Foundry / IDM announced

RRAM Players Bulk 22nm 22nm FinFET (sampling) (in development) Bulk 28/22nm 28/22nm (in development)

(STT-)MRAM 22nm FinFET Players (pre-production) 22nm bulk 22nm FD-SOI 28nm FD-SOI 28/22nm bulk (pre-production) (pre-production) (mass production) (in development) 28/22nm

PCM Players 28nm FD-SOI (sampling)

Contact our Sales Team for more information Neuromorphic Sensing DRAM & NAND Service and Computing 2019 – Memory Research

Contact our LPDDR4 Memory Sales Team Comparison 2019 for more information

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