Fairphone 2 Technical specifications

Operating System

 Android™ 6.0, Marshmallow

Base platform

 Processors: Snapdragon™ 801  Main SOC: ® MSM8974AB  Application Processor: Quad-Core 2.26 GHz Qualcomm® Krait 400  GPU: Qualcomm® 330 GPU  RAM: 2 GB LPDDR3  Flash Storage: 32GB eMMC5

Networks

 Configuration: Dual-SIM, Dual-Standby Main Camera (DSDS)  SIM Sockets: 2x Micro-SIM (3FF)  Main Camera: 12MP CMOS sensor with dual  Network Technology: / / 4G flash  GSM/GPRS/EDGE: Quad-band: 850, 900,  Sensor Type: Omnivision OV12870 – Back 1800, 1900 MHz Side Illuminated  WCDMA: Bands 1 (2100 MHz), 2 (1900 MHz),  Image sensor size: 1/2.8 inch 8 (900 MHz)  Pixel Size: 1.25μm x 1.25μm  3G Max Downlink Speed: Cat. 24 - 42.2 Mbps  F-number: f2.2  3G Max Uplink Speed: Cat. 6 - 5.76 Mbps (Cat. 7 capable)  LTE: Bands 3 (1800 MHz), 7 (2600 MHz), Front Camera 20 (800 MHz)  4G Max Downlink Speed: Cat. 4 - 150 Mbps  Front Camera: 5MP CMOS Sensor  4G Max Uplink Speed: Cat. 4 - 50 Mbps  Sensor Type: Omnivision OV2685  Specific Absorption Rate (SAR): 0,288 W/Kg (Head); 0,426 W/Kg (Body)  Image sensor size: 1/5 inch  Pixel Size: 1.12μm x 1.12μm  F-number: f 2.4 Connectivity

Audio  WLAN: IEEE 802.11 b/g/n/ac  WLAN Bands: 2.4 GHz and 5 GHz  WLAN Maximum Data Rate: Up to 433 Mbps  Speaker: Built-in, Rear-facing (802.11 ac)  Headset Jack: 3.5 mm  ®: 4.0 LE and earlier  Headset Jack configuration: CTIA-Standard  GPS / GNSS: GPS, A-GPS, Glonass (TRRS: LH/RH/GND/MIC)  FM Radio  Vibration Motor: with Haptics Feedback  Dual Microphones Display Interface and Connectors

 Display size: 5 inch Full HD  Cover Glass: Gorilla Glass 3 - 0.7mm (thick)  Buttons: Power, Volume, Camera (Programmable)  Display Type: LCD TFT/IPS  USB Port: Micro-B 2.0 with OTG support  Resolution: 1080 × 1920  MicroSD Support: SDHC, SDXC, UHS  Pixel Density: 446 ppi  Notification LED: 3-colour

1 | P a g e The Phone Co-op. Your voice counts