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Applied Materials 2004 Annual Report

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Applied Materials 2004 Annual Report APPLIEDMATERIALS TOGETHER WE BREAK THROUGH 2 0 0 4 ANNUAL REPORT FINANCIAL HIGHLIGHTS Fiscal year 2002 2003 2 0 0 4 (In thousands, except percentages and per share amounts) Net sales $ 5,062,312 $ 4,477,291 $ 8,013,053 Net income/(loss) $ 269,004 $ (149,147 ) $ 1,351,303 Net income/(loss) per diluted share $ 0.16 $ (0.09 ) $ 0.78 Weighted average common shares and equivalents 1,701,557 1,659,557 1,721,645 Stockholders’ equity $ 8,019,649 $ 8,068,034 $ 9,262,027 Return on equity* 3.4% (1.9)% 15.6% Order backlog $ 3,190,459 $ 2,495,115 $ 3,368,382 * Based on net income. NEW ORDERS NET SALES EARNINGS (In millions) (In millions) PER SHARE* 8 6 0.7 6,142 4,318 8,982 5,062 4,477 8,013 0.1 (0.09) $ $ $ $ $ $ $ $ $ 04 04 04 2002 2003 2002 2003 2002 2003 20 20 20 CORPORATE PROFILE Applied Materials is the largest supplier of manufacturing systems and wet cleaning; maskmaking equipment; CVD and test systems used to related services to the global semiconductor industry. The Company produce fl at panel displays (FPDs); and manufacturing execution supplies wafer fabrication systems that perform atomic layer deposition system (MES) software for semiconductor factory automation. Applied’s (ALD), chemical vapor deposition (CVD), physical vapor deposition (PVD), service products include equipment maintenance, materials supply epitaxial and polysilicon deposition, rapid thermal processing (RTP), and management, parts refurbishment, equipment remanufacturing, plasma etching, electrochemical plating (ECP), ion implantation, yield enhancement, and other solutions for increasing semiconductor metrology, inspection, chemical mechanical polishing (CMP) and wafer manufacturing productivity. TO OUR STOCKHOLDERS, Applied Materials’ performance for the 2004 fi scal year was outstanding. We made substantial gains in our agenda to grow our Company, broaden our served markets and deliver innovative new products and services. Thanks to the great work of our employees, PRODUCT MOMENTUM we developed breakthrough technologies The semiconductor and semiconductor that are changing the world by enabling new equipment industries continue to move at generations of more powerful and affordable a rapid pace. The changing needs of our semiconductor chips. We advanced our customers provide many opportunities for leadership position in both technology and continuing our growth. Our engineers and market share, enhanced our product quality technologists, the lifeblood of our Company, and delivered excellent fi nancial results. are solving the industry’s most diffi cult JAMES C. MORGAN MICHAEL R. SPLINTER In fi scal 2004, Applied Materials’ revenue technical problems. Our innovative solutions Chairman of the President and Board of Directors Chief Executive Offi cer accelerated to $8.01 billion, the second continue to drive Moore’s Law, which highest level in its history and 79 percent predicts the doubling of chip capability higher than our prior year’s performance. on average every two years. Driven by strong semiconductor demand, Increasing Market Share in Existing Products new orders increased 108 percent, to $8.98 While the wafer fab equipment market billion, as the industry continued a major grew approximately 60 percent last year, retooling and invested in 300 millimeter (mm) our Company outpaced the industry growth wafer fabrication equipment while still rate, increasing market share in our broad adding 200mm production capacity. Net product portfolio. Customers have already income for the year was $1.35 billion, or produced nearly a million wafers using $0.78 per diluted share, operating margin our advanced Applied Producer Black was 22 percent of revenue, and net income Diamond low κ dielectric system. We (after tax) reached 17 percent of revenue. achieved a key product milestone this year We enhanced our fi nancial position by gen- with the shipment of our 750th Applied erating $1.63 billion of cash from operations Producer CVD (chemical vapor deposition) and ended the year with $6.58 billion in system. Also, since its introduction in 1990, cash and short-term investments. In addition, we have delivered nearly 3,500 Applied we expanded the stock repurchase program, Endura systems to customers worldwide, buying back $650 million worth of our shares making it the industry’s most successful during the year. This is compared to an semiconductor processing system. Our average annual share repurchase of approxi- Company also made tremendous strides mately $200 million over the prior fi ve years. in etch, metrology, inspection and Building on our core strengths of a broad equipment for fl at panel displays. We and deep base of technology, products and accomplished this growth while winning services, an advanced global distribution recognition from customers around the system, and a solid fi nancial foundation, world for improved quality. Applied Materials ended fi scal 2004 as a stronger competitor and a proven partner for our customers. LETTER TO OUR STOCKHOLDERS (continued) APPLIED PRODUCER CVD APPLIED REFLEXION LK ECMP APPLIED SEMVISION G2 FIB Delivering Products for the Nanometer Era mechanical planarization capability to the needs of this market by expanding our This past year, the semiconductor industry provide an extendible, cost-effective solu- service product offerings to include fab-wide, moved into the realm of “nanotechnology,” tion for copper/low κ manufacturing at the multi-vendor capabilities for semiconductor producing chips with features 1,000 times 65nm node and below. During the year, we fab operation support. Our goal is to smaller than the diameter of a human hair. launched a new generation of our acclaimed provide increased value to customers with To meet these rigorous manufacturing Applied Endura platform, the Applied customized, quality solutions that combine requirements we launched ten breakthrough Endura2, which sets the standard for 300mm effi ciency and reliability with our equipment products, supplying an even broader set of high-volume manufacturing. and process expertise, while broadening technologies that will enable our customers’ our total served market. In metrology and inspection we launched products to reach sub-65nm dimensions. two products aimed at 65nm and below SOLUTIONS FOR A Moore’s Law continues to set the direction device structures. The Applied SEMVision CHANGING INDUSTRY for the semiconductor industry with G2 FIB (focused ion beam) system brings a The semiconductor industry continued to transistors becoming an even more critical unique capability to boost production experience new challenges in 2004 as a factor in extending chip dimensions to 65nm effi ciency, yield and fab productivity, while number of trends converged, adding to the and below. Applied Materials has taken a the Applied VeritySEM metrology system complexity of chipmaking. The move to leadership role in developing technologies improves customers’ ability to control critical larger-sized wafers is accelerating. These that the industry requires to stay on track. lithography dimensions and etch processes. 300mm systems now generate around Our recently introduced Applied Quantum X For fl at panel displays, we introduced 12 percent of total semiconductor manufac- single-wafer ion implanter and Applied breakthrough technology—a CVD system turing capacity and there are approximately Vantage RadiancePlus systems pave the way and an electron beam array tester—for 40 additional 300mm factory projects for transistor scaling to the 65nm node. manufacturing 7th generation substrates and underway or about to be launched. While Our benchmark Applied Centura RP helping our customers’ rapid penetration wafers are getting bigger, dimensions on (reduced pressure) Epi systems, along with into the large-screen fl at panel TV market. the chip continue to shrink into the realm our new Applied Producer HARP (high aspect Entering New Markets of nanotechnology and the number of pro- ratio process) systems, are being used for Strategic agreements with several companies cess steps required in chip manufacturing an exciting area in transistor performance and the acquisition of others have opened continues to rise. Leveraging these changes, optimization—strain engineering. Applied the door to new markets. The FlexStar system smaller feature sizes deliver more capability Materials’ ability to deposit precisely from Torrex, with its multi-wafer architecture, at ever-lower costs per unit area. engineered thin fi lms both above and below enhances our ability to compete in the the transistor gate area enables faster chip Customers in Asia, the source of more than expanding ALD (atomic layer deposition) speed and reduces power consumption on 70 percent of our revenue in fi scal 2004, market for advanced applications. These new the order of 30-70 percent. With our innova- are investing in new capabilities to gain the ventures, and others to come, will allow us tive equipment and process technologies, productivity advantages that 300mm systems to further broaden our relationships with our Company is in the unique position of deliver. China, which uses approximately customers while continuing to grow and supplying the broadest range of solutions 15 percent of the world’s semiconductors create long-term value for our stockholders. to boost semiconductor performance. but produces only 20 percent of its internal Today, our customers seek partners to help demand, is a strategic opportunity that We also continued to deliver breakthrough them improve the effectiveness of their is contributing to our growth.
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